公开(公告)号：US5864946A

公开(公告)日：1999-02-02

申请号：US839758

申请日：1997-04-15

Applicant: Benjamin N. Eldridge ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan L. Mathieu

Inventor： Benjamin N. Eldridge ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan L. Mathieu

IPC: B23K1/00 ,  B23K20/00 ,  C23C18/16 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R31/28 ,  H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/603 ,  H01L21/66 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L25/065 ,  H01L25/16 ,  H01R12/00 ,  H05K1/14 ,  H05K3/20 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K7/10 ,  H01R9/00

CPC classification number: H05K7/1069 ,  B23K1/0008 ,  B23K20/004 ,  C23C18/1605 ,  C23C18/165 ,  C25D7/12 ,  G01R1/07342 ,  G01R31/2884 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/6835 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/27 ,  H01L24/72 ,  H01L24/81 ,  H01L24/94 ,  H01L25/0652 ,  H01L25/16 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3426 ,  H05K3/4015 ,  B23K2201/40 ,  C25D21/02 ,  C25D5/08 ,  C25D5/22 ,  G01R31/2856 ,  G01R31/2863 ,  G01R31/2886 ,  H01L2223/54453 ,  H01L2224/02311 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/0558 ,  H01L2224/05599 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/11003 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/1147 ,  H01L2224/1184 ,  H01L2224/13022 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13582 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/16145 ,  H01L2224/274 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4556 ,  H01L2224/45572 ,  H01L2224/45599 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48724 ,  H01L2224/48844 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/83851 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2224/90 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L23/544 ,  H01L24/45 ,  H01L24/49 ,  H01L24/83 ,  H01L24/90 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  H05K3/20 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4092 ,  Y02P70/611 ,  Y02P70/613 ,  Y10S977/712 ,  Y10S977/723 ,  Y10T29/49004 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49169 ,  Y10T29/49171 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/4922 ,  Y10T29/49812 ,  Y10T428/12396 ,  Y10T428/12528

Abstract: Resilient contact structures are mounted directly to bond pads on semiconductor dies, prior to the dies being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies to be exercised (e.g., tested and/or burned-in) by connecting to the semiconductor dies with a circuit board or the like having a plurality of terminals disposed on a surface thereof. Subsequently, the semiconductor dies may be singulated from the semiconductor wafer, whereupon the same resilient contact structures can be used to effect interconnections between the semiconductor dies and other electronic components (such as wiring substrates, semiconductor packages, etc.). Using the all-metallic composite interconnection elements of the present invention as the resilient contact structures, burn-in can be performed at temperatures of at least 150.degree. C., and can be completed in less than 60 minutes.

Abstract translation: 弹性接触结构直接安装在半导体晶片上的接合焊盘上，在裸片与半导体晶片分离（分离）之前。 这使得半导体管芯能够通过具有设置在其表面上的多个端子的电路板等连接到半导体管芯来进行（例如，测试和/或烧入）。 接下来，半导体管芯可以从半导体晶片分离，因此可以使用相同的弹性接触结构来实现半导体管芯和其他电子部件（例如布线基板，半导体封装等）之间的互连。 使用本发明的全金属复合互连元件作为弹性接触结构，可以在至少150℃的温度下进行老化，并且可以在少于60分钟内完成。

公开(公告)号：US5601740A

公开(公告)日：1997-02-11

申请号：US573945

申请日：1995-12-18

Applicant: Benjamin N. Eldridge ,  Gaetan L. Mathieu

Inventor： Benjamin N. Eldridge ,  Gaetan L. Mathieu

IPC: B23K20/00 ,  C23C18/16 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R31/28 ,  H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/603 ,  H01L21/66 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L25/065 ,  H01L25/16 ,  H05K1/14 ,  H05K3/20 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K7/10 ,  B23K9/06

CPC classification number: B23K20/004 ,  C25D7/12 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H05K3/24 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3426 ,  H05K3/4015 ,  H05K7/1069 ,  B23K2201/40 ,  C25D21/02 ,  C25D5/08 ,  C25D5/22 ,  G01R3/00 ,  G01R31/2884 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16145 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45565 ,  H01L2224/456 ,  H01L2224/4569 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85043 ,  H01L2224/851 ,  H01L2224/85201 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L24/45 ,  H01L24/49 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  H05K3/20 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4092 ,  Y02P70/611 ,  Y02P70/613

Abstract: The efficacy of electrical discharges for severing bond wires and/or for forming balls at the ends of bond wires (including bond wires already severed by alternative mechanisms) is improved by performing the electrical discharges in the presence of ultraviolet light. A "spark gap" is formed between an EFO electrode and the wire, one of which serves as the cathode of the spark gap. Preferably, the ultraviolet light is directed at the element serving as the cathode of the spark gap. Providing photoemission at the cathode element of the spark gap stabilizes arc/plasma formation and produces more reliable and predictable results. This technique may be used in conjunction with negative EFO systems or with positive EFO systems, and may benefit from either direct or field-assisted photoemission.

Abstract translation: 通过在紫外光的存在下进行放电，提高了在接合线（包括已被替代机构切断的接合线）的端部切断接合线和/或形成球的放电功效。 在EFO电极和导线之间形成“火花隙”，其中一个用作火花隙的阴极。 优选地，紫外线指向用作火花隙的阴极的元件。 在火花间隙的阴极元件处提供光电发射使电弧/等离子体形成稳定，并产生更可靠和可预测的结果。 这种技术可以与负EFO系统或正EFO系统结合使用，并可从直接或场辅助光电发射中受益。

公开(公告)号：US09030222B2

公开(公告)日：2015-05-12

申请号：US12852337

申请日：2010-08-06

Applicant: Benjamin N. Eldridge ,  Gary W. Grube ,  Igor Y. Khandros ,  Alex Madsen ,  Gaetan L. Mathieu

Inventor： Benjamin N. Eldridge ,  Gary W. Grube ,  Igor Y. Khandros ,  Alex Madsen ,  Gaetan L. Mathieu

IPC: G01R31/00 ,  H01R13/24 ,  G01R1/067 ,  H01R4/26 ,  H01R12/00

CPC classification number: H01R13/2407 ,  G01R1/06711 ,  G01R1/06727 ,  H01R4/26 ,  H01R9/091 ,  H01R12/57 ,  H01R13/2442 ,  H01R2201/20 ,  Y10T29/49004 ,  Y10T29/49128 ,  Y10T29/49165

Abstract: An apparatus and method providing improved interconnection elements and tip structures for effecting pressure connections between terminals of electronic components is described. The tip structure of the present invention has a sharpened blade oriented on the upper surface of the tip structure such that the length of the blade is substantially parallel to the direction of horizontal movement of the tip structure as the tip structure deflects across the terminal of an electronic component. In this manner, the sharpened substantially parallel oriented blade slices cleanly through any non-conductive layer(s) on the surface of the terminal and provides a reliable electrical connection between the interconnection element and the terminal of the electrical component.

Abstract translation: 描述了提供改进的互连元件和尖端结构以实现电子部件的端子之间的压力连接的装置和方法。 本发明的尖端结构具有尖端结构的上表面上定向的锋利的叶片，使得叶片的长度基本上平行于尖端结构的水平移动方向，因为尖端结构偏转穿过端部 电子元件 以这种方式，锋利的基本上平行的定向叶片切片通过终端表面上的任何非导电层清洁，并且在互连元件和电气部件的端子之间提供可靠的电连接。

公开(公告)号：US08130007B2

公开(公告)日：2012-03-06

申请号：US11872008

申请日：2007-10-13

Applicant: Benjamin N. Eldridge ,  John K. Gritters ,  Rodney I. Martens ,  Alexander H. Slocum ,  Onnik Yaglioglu

Inventor： Benjamin N. Eldridge ,  John K. Gritters ,  Rodney I. Martens ,  Alexander H. Slocum ,  Onnik Yaglioglu

IPC: G01R31/26

CPC classification number: G01R1/06716 ,  G01R1/06744 ,  G01R1/0675 ,  G01R1/06755 ,  G01R3/00 ,  H01L2924/0002 ,  Y10T29/49004 ,  Y10T29/49147 ,  Y10T29/49204 ,  H01L2924/00

Abstract: Columns comprising a plurality of vertically aligned carbon nanotubes can be configured as electromechanical contact structures or probes. The columns can be grown on a sacrificial substrate and transferred to a product substrate, or the columns can be grown on the product substrate. The columns can be treated to enhance mechanical properties such as stiffness, electrical properties such as electrical conductivity, and/or physical contact characteristics. The columns can be mechanically tuned to have predetermined spring properties. The columns can be used as electromechanical probes, for example, to contact and test electronic devices such as semiconductor dies, and the columns can make unique marks on terminals of the electronic devices.

Abstract translation: 包括多个垂直排列的碳纳米管的柱可以被配置为机电接触结构或探针。 柱可以在牺牲衬底上生长并转移到产物基底，或者可以在产物基底上生长柱。 可以处理柱以增强诸如刚度，电性能如导电性和/或物理接触特性的机械性能。 柱可以被机械调节以具有预定的弹簧性质。 这些列可以用作机电探针，例如用于接触和测试诸如半导体管芯的电子器件，并且这些列可以在电子器件的端子上形成独特的标记。

公开(公告)号：US20110193583A1

公开(公告)日：2011-08-11

申请号：US13092709

申请日：2011-04-22

Applicant: Gaetan L. Mathieu ,  Benjamin N. Eldridge ,  Gary W. Grube

Inventor： Gaetan L. Mathieu ,  Benjamin N. Eldridge ,  Gary W. Grube

IPC: G01R1/073

CPC classification number: G01R1/07307 ,  G01R3/00

Abstract: A planarizer for a probe card assembly. A planarizer includes a first control member extending from a substrate in a probe card assembly. The first control member extends through at least one substrate in the probe card assembly and is accessible from an exposed side of an exterior substrate in the probe card assembly. Actuating the first control member causes a deflection of the substrate connected to the first control member.

Abstract translation: 用于探针卡组件的平面化器。 平面化器包括从探针卡组件中的衬底延伸的第一控制构件。 第一控制构件延伸穿过探针卡组件中的至少一个衬底，并且可从探针卡组件中的外部衬底的暴露侧进入。 驱动第一控制构件导致连接到第一控制构件的衬底的偏转。

公开(公告)号：US07990164B2

公开(公告)日：2011-08-02

申请号：US12134993

申请日：2008-06-06

Applicant: Benjamin N. Eldridge

Inventor： Benjamin N. Eldridge

IPC: G01R31/20

CPC classification number: G01R1/07364 ,  G01R1/07378 ,  G01R3/00 ,  Y10T29/49117

Abstract: A probe card apparatus is configured to have a desired overall amount of compliance. The compliance of the probes of the probe card apparatus is determined, and an additional, predetermined amount of compliance is designed into the probe card apparatus so that the sum of the additional compliance and the compliance of the probes total the overall desired compliance of the probe card apparatus.

Abstract translation: 探针卡装置被配置为具有期望的总体顺应性。 确定探针卡装置的探针的符合性，并且将另外的预定量的顺应性设计到探针卡装置中，使得附加顺应性和探针的顺应性的总和达到探针的总体期望顺应性 卡装置。

公开(公告)号：US07967621B2

公开(公告)日：2011-06-28

申请号：US12783379

申请日：2010-05-19

Applicant: Benjamin N. Eldridge

Inventor： Benjamin N. Eldridge

IPC: H01R4/60

CPC classification number: G01R31/2887 ,  G01R1/0735 ,  G01R31/2886

Abstract: An electrical interconnect assembly and methods for making an electrical interconnect assembly. In one embodiment, an interconnect assembly includes a flexible wiring layer having a plurality of first contact elements and a fluid containing structure which is coupled to the flexible wiring layer. The fluid, when contained in the fluid containing structure, presses the flexible wiring layer towards a device under test to form electrical interconnections between the first contact elements and corresponding second contact elements on the device under test. In a further embodiment, an interconnect assembly includes a flexible wiring layer having a plurality of first contact terminals and a semiconductor substrate which includes a plurality of second contact terminals. A plurality of freestanding, resilient contact elements, in one embodiment, are mechanically coupled to one of the flexible wiring layers or the semiconductor substrate and make electrical contacts between corresponding ones of the first contact terminals and the second contact terminals. In another embodiment, a method of making electrical interconnections includes joining a flexible wiring layer and a substrate together in proximity and causing a pressure differential between a first side and a second side of the flexible wiring layer. The pressure differential deforms the flexible wiring layer and causes a plurality of first contact terminals on the flexible wiring layer to electrically connect with a corresponding plurality of second contact terminals on the substrate.

Abstract translation: 电互连组件和用于制造电互连组件的方法。 在一个实施例中，互连组件包括具有多个第一接触元件和耦合到柔性布线层的流体容纳结构的柔性布线层。 当容纳在流体容纳结构中时，流体将柔性布线层压向被测器件，以在被测器件上的第一接触元件和对应的第二接触元件之间形成电互连。 在另一实施例中，互连组件包括具有多个第一接触端子的柔性布线层和包括多个第二接触端子的半导体衬底。 在一个实施例中，多个独立的弹性接触元件机械耦合到柔性布线层或半导体衬底中的一个，并且在对应的第一接触端子和第二接触端子之间形成电接触。 在另一个实施例中，制造电互连的方法包括将柔性布线层和基板接合在一起并在柔性布线层的第一侧和第二侧之间形成压差。 压差使柔性布线层变形，使柔性布线层上的多个第一接触端子与基板上的对应的多个第二接触端子电连接。

公开(公告)号：US07936177B2

公开(公告)日：2011-05-03

申请号：US12044893

申请日：2008-03-07

Applicant: Keith J. Breinlinger ,  David P. Pritzkau ,  Benjamin N. Eldridge

Inventor： Keith J. Breinlinger ,  David P. Pritzkau ,  Benjamin N. Eldridge

IPC: G01R31/20

CPC classification number: G01R1/06772 ,  G01R1/06716 ,  G01R1/06744 ,  G01R1/07342 ,  Y10T29/49147

Abstract: Devices and methods for providing, making, and/or using an electronic apparatus having a wall structure adjacent a resilient contact structure on a substrate. The electronic apparatus can include a substrate and a plurality of electrically conductive resilient contact structures, which can extend from the substrate. A first of the contact structures can be part of an electrical path through the electronic apparatus. A first electrically conductive wall structure can also extend from the substrate, and the first wall structure can be disposed adjacent one of the contact structures. The first wall structure can be electrically connected to a return current path within the electronic apparatus for an alternating current signal or power on the first contact structure.

Abstract translation: 用于提供，制造和/或使用具有邻近基板上的弹性接触结构的壁结构的电子设备的设备和方法。 电子设备可以包括基板和可从基板延伸的多个导电弹性接触结构。 接触结构中的第一个可以是通过电子设备的电路径的一部分。 第一导电壁结构也可以从衬底延伸，并且第一壁结构可以邻近一个接触结构设置。 第一壁结构可以电连接到电子设备内的回流电路，用于交流信号或第一接触结构上的功率。

公开(公告)号：US07880489B2

公开(公告)日：2011-02-01

申请号：US12264751

申请日：2008-11-04

Applicant: Benjamin N. Eldridge ,  Yoshikazu Hatsukano ,  Igor Y. Khandros ,  Gaetan L. Mathieu

Inventor： Benjamin N. Eldridge ,  Yoshikazu Hatsukano ,  Igor Y. Khandros ,  Gaetan L. Mathieu

IPC: G01R31/02

CPC classification number: G01R3/00 ,  B33Y10/00 ,  B33Y80/00 ,  G01R1/06716 ,  G01R1/07342 ,  H05K3/1241 ,  H05K3/4664 ,  Y10T29/49126 ,  Y10T29/49147

Abstract: A probe substrate for use in testing semiconductor devices can include a base substrate that can have first electrical terminals at a first pitch. One or more redistribution layers on the base substrate can include droplets of a conductive material that form redistribution traces extending from the first terminals to second electrical terminals at a second pitch different from the first pitch.

Abstract translation: 用于测试半导体器件的探针衬底可以包括可以具有第一间距的第一电端子的基底衬底。 基底衬底上的一个或多个再分配层可以包括形成以不同于第一间距的第二间距从第一端子延伸到第二电端子的再分布迹线的导电材料的液滴。

公开(公告)号：US07821255B2

公开(公告)日：2010-10-26

申请号：US12485677

申请日：2009-06-16

Applicant: Igor Y. Khandros ,  Benjamin N. Eldridge ,  Charles A. Miller ,  A. Nicholas Sporck

Inventor： Igor Y. Khandros ,  Benjamin N. Eldridge ,  Charles A. Miller ,  A. Nicholas Sporck

IPC: G01R31/02

CPC classification number: G01R1/0491 ,  G01R1/073 ,  G01R31/3025

Abstract: A test system for testing electronic devices can include a plurality of testers and a test station. The test station can include probes to contact the devices and the tester can control testing. Test data can be received by the test station from the testers using wireless communications links.

Abstract translation: 用于测试电子设备的测试系统可以包括多个测试器和测试台。 测试站可以包括与设备接触的探头，测试仪可以控制测试。 测试台可以使用无线通信链路从测试人员接收测试数据。