公开(公告)号：US07498199B2

公开(公告)日：2009-03-03

申请号：US11777368

申请日：2007-07-13

申请人： Seung Taek Yang

发明人： Seung Taek Yang

IPC分类号： H01L21/00

CPC分类号： H01L25/0657 ,  H01L21/563 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/481 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L25/50 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/13025 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83886 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2224/16225 ,  H01L2924/00

摘要： A method for fabricating a semiconductor package includes the steps of: forming a material layer containing conductive particles on a semiconductor chip having a plurality of bonding pads on the upper surface thereof, baking the material layers to a non-flowing state; attaching the semiconductor chip in a face down manner to a substrate having connecting pads on the location corresponding to the bonding pads by using the material layers containing conductive particles; applying voltage for a electrical signal exchange to the semiconductor chip and the substrate so that the conductive particles are gathered between the bonding pads of the semiconductor chip and the connecting pads of the substrate; and curing the conductive particles of the material layers so that the conductive particles gathered between the bonding pads of the semiconductor chip and the connecting pads of the substrate to an non-flowing state.

摘要翻译： 一种制造半导体封装的方法，包括以下步骤：在其上表面具有多个焊盘的半导体芯片上形成含有导电颗粒的材料层，将材料层烧成非流动状态; 通过使用含有导电颗粒的材料层，将半导体芯片以面朝下的方式附接到具有在与焊盘对应的位置处的连接焊盘的基板; 将电压施加到半导体芯片和衬底的电信号交换，使得导电颗粒聚集在半导体芯片的焊盘和衬底的连接焊盘之间; 以及固化所述材料层的导电颗粒，使得所述导电颗粒聚集在所述半导体芯片的焊盘和所述衬底的所述连接焊盘之间为非流动状态。

公开(公告)号：US20080128664A1

公开(公告)日：2008-06-05

申请号：US11793175

申请日：2005-12-14

申请人： Takashi Kitae ,  Seiji Karashima ,  Koichi Hirano ,  Toshiyuki Kojima ,  Seiichi Nakatani ,  Shingo Komatsu ,  Yoshihisa Yamashita

发明人： Takashi Kitae ,  Seiji Karashima ,  Koichi Hirano ,  Toshiyuki Kojima ,  Seiichi Nakatani ,  Shingo Komatsu ,  Yoshihisa Yamashita

IPC分类号： H01B1/02

CPC分类号： H05K3/323 ,  H01L21/6835 ,  H01L23/49838 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/06131 ,  H01L2224/06135 ,  H01L2224/11001 ,  H01L2224/11003 ,  H01L2224/1141 ,  H01L2224/11502 ,  H01L2224/11522 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/16058 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/165 ,  H01L2224/2741 ,  H01L2224/27436 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29291 ,  H01L2224/293 ,  H01L2224/29311 ,  H01L2224/29313 ,  H01L2224/29316 ,  H01L2224/73204 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83097 ,  H01L2224/83192 ,  H01L2224/832 ,  H01L2224/83856 ,  H01L2224/83862 ,  H01L2224/8388 ,  H01L2224/83886 ,  H01L2224/83887 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01061 ,  H01L2924/01065 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/381 ,  H01L2924/3841 ,  H05K3/3436 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/083 ,  H05K2203/087 ,  Y02P70/613 ,  H01L2924/00011 ,  H01L2924/066 ,  H01L2924/06 ,  H01L2924/0695 ,  H01L2924/062 ,  H01L2924/0615 ,  H01L2924/068 ,  H01L2924/0705 ,  H01L2924/0675 ,  H01L2924/07001 ,  H01L2924/0103 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01083 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2924/00014

摘要： There is provided a flip-chip mounting resin composition which can be used for a flip-chip mounting process that is high in productivity and reliability and thus can be applicable to a flip-chip mounting of a next-generation LSI. This flip-chip mounting resin composition comprises a resin, metal particles and a convection additive 12 that boils upon heating the resin 13. Upon the heating of the resin 13, the metal particles melt and the boiling convection additive 12 convects within the resin 13. This flip-chip mounting resin composition is supplied between a circuit substrate 10 and a semiconductor chip 20, and subsequently the resin 13 is heated so that the molten metal particles self-assemble into the region between each electrode of the circuit substrate and each electrode of the semiconductor chip. As a result, an electrical connection is formed between each electrode of the circuit substrate and each electrode of the semiconductor chip. Finally, the resin 13 is allowed to cure so that the semiconductor chip 20 is secured to the circuit substrate 10, which leads to in a formation of a flip chip assembly.

摘要翻译： 提供了一种倒装芯片安装树脂组合物，其可用于生产率和可靠性高的倒装芯片安装工艺，因此可以应用于下一代LSI的倒装芯片安装。 这种倒装芯片安装树脂组合物包括在加热树脂13时沸腾的树脂，金属颗粒和对流添加剂12。 在加热树脂13时，金属颗粒熔化，沸腾对流添加剂12在树脂13内对流。 将该倒装芯片安装树脂组合物供给在电路基板10和半导体芯片20之间，随后加热树脂13，使得熔融金属颗粒自组装成电路基板的每个电极和电极的每个电极之间的区域 半导体芯片。 结果，在电路基板的每个电极和半导体芯片的每个电极之间形成电连接。 最后，使树脂13固化，使得半导体芯片20固定到电路基板10，这导致形成倒装芯片组件。

公开(公告)号：US20070216023A1

公开(公告)日：2007-09-20

申请号：US11683612

申请日：2007-03-08

申请人： Seiichi Nakatani ,  Seiji Karashima ,  Takashi Kitae ,  Susumu Sawada

发明人： Seiichi Nakatani ,  Seiji Karashima ,  Takashi Kitae ,  Susumu Sawada

IPC分类号： H01L23/34

CPC分类号： H05K3/3484 ,  B23K1/0016 ,  B23K35/025 ,  B23K35/262 ,  B23K35/264 ,  B23K35/268 ,  B23K35/3613 ,  C22C11/00 ,  C22C12/00 ,  C22C13/00 ,  H01L24/11 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16227 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29386 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/83855 ,  H01L2224/8388 ,  H01L2224/83886 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/351 ,  H05K3/323 ,  H05K2201/10674 ,  H05K2201/10977 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2224/29311 ,  H01L2924/00014 ,  H01L2224/1319 ,  H01L2224/133 ,  H01L2924/05442 ,  H01L2924/05432 ,  H01L2224/16225

摘要： The present invention provides a conductive resin composition for connecting electrodes electrically, in which metal particles are dispersed in a flowing medium, wherein the flowing medium includes a first flowing medium that has relatively high wettability with the metal particles and a second flowing medium that has relatively low wettability with the metal particles, and the first flowing medium and the second flowing medium are dispersed in a state of being incompatible with each other. Thereby, a flip chip packaging method that can be applied to flip chip packaging of LSI and has high productivity and high reliability is provided.

摘要翻译： 本发明提供一种导电树脂组合物，用于电连接电极，其中金属颗粒分散在流动介质中，其中流动介质包括与金属颗粒相比具有较高润湿性的第一流动介质和具有相对较高的第二流动介质 与金属颗粒的低润湿性，以及第一流动介质和第二流动介质在彼此不相容的状态下分散。 因此，提供了可以应用于LSI的倒装芯片封装并且具有高生产率和高可靠性的倒装芯片封装方法。

公开(公告)号：US20060037741A1

公开(公告)日：2006-02-23

申请号：US11012147

申请日：2004-12-16

申请人： Hideshi Tokuhira ,  Hiroaki Date ,  Hiroki Uchida ,  Minoru Ishinabe

发明人： Hideshi Tokuhira ,  Hiroaki Date ,  Hiroki Uchida ,  Minoru Ishinabe

IPC分类号： H05K7/20

CPC分类号： H01L23/433 ,  H01L23/3733 ,  H01L23/3737 ,  H01L23/42 ,  H01L24/28 ,  H01L2224/16225 ,  H01L2224/16257 ,  H01L2224/2929 ,  H01L2224/29309 ,  H01L2224/29311 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83886 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/10253 ,  H01L2924/351 ,  Y10S165/905 ,  Y10T29/4935 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2924/0133 ,  H01L2224/2919 ,  H01L2924/0665 ,  H01L2224/0401

摘要： A pattern is formed with an insulative resin on a bonding face of a silicon chip, which is a heat generating element, and a pattern is formed with the insulative resin on a bonding face of a heat sink, which is a heat dissipating element, in alignment with the insulative resin parts formed on the silicon chip. The silicon chip and the heat sink are bonded to each other via a heat transfer sheet. The silicon chip and the heat sink are bonded to each other by a metal to form metal connection portions in a region where no insulative resin parts are formed, while the silicon ship and the heat sink are bonded to each other by a resin to form resin connection portions in a region where the insulative resin parts are formed.

公开(公告)号：US20050199989A1

公开(公告)日：2005-09-15

申请号：US11075421

申请日：2005-03-09

申请人： Hideo Aoki ,  Yoshiaki Sugizaki ,  Naoko Yamaguchi ,  Chiaki Takubo

发明人： Hideo Aoki ,  Yoshiaki Sugizaki ,  Naoko Yamaguchi ,  Chiaki Takubo

IPC分类号： H01L23/12 ,  H01L21/60 ,  H01L23/02 ,  H01L23/48 ,  H01L23/52 ,  H01L25/00

CPC分类号： H01L23/49883 ,  H01L21/4867 ,  H01L21/563 ,  H01L22/14 ,  H01L22/20 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/81 ,  H01L24/98 ,  H01L25/0655 ,  H01L2224/0401 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05572 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/1134 ,  H01L2224/1146 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/14135 ,  H01L2224/14156 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/26175 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48647 ,  H01L2224/48655 ,  H01L2224/48664 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/81026 ,  H01L2224/81097 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/814 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/818 ,  H01L2224/83886 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2224/05599

摘要： According to one aspect of the present invention, a semiconductor device, comprising a wiring board provided with wires and electrodes; a semiconductor element which is mounted on the wiring board and has plural connection electrodes formed on its surface; and a metal layer of fine metal particles aggregated and bonded which is interposed between the electrodes on the wiring board and the connection electrodes of the semiconductor element to connect between the electrodes and the connection electrodes, is provided.

摘要翻译： 根据本发明的一个方面，提供了一种半导体器件，包括：布线板，其配有导线和电极; 半导体元件，其安装在所述布线板上，并且在其表面上形成有多个连接电极; 并且设置介于导线板上的电极和半导体元件的连接电极之间聚集和结合的金属微粒金属层，以连接电极和连接电极。

公开(公告)号：US5958590A

公开(公告)日：1999-09-28

申请号：US414070

申请日：1995-03-31

申请人： Sung Kwon Kang ,  Sampath Purushothaman ,  George Frederick Walker

发明人： Sung Kwon Kang ,  Sampath Purushothaman ,  George Frederick Walker

IPC分类号： H05K1/14 ,  H01B1/00 ,  H01B1/02 ,  H01B1/22 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  B32B5/16

CPC分类号： H01B1/02 ,  H01B1/026 ,  H01B1/22 ,  H05K3/321 ,  H01L2224/293 ,  H01L2224/29499 ,  H01L2224/83101 ,  H01L2224/83886 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/07811 ,  H05K2201/0218 ,  H05K2203/0307 ,  H05K2203/0425 ,  H05K3/3457 ,  H05K3/4007 ,  Y10T428/12181 ,  Y10T428/12229 ,  Y10T428/2991

摘要： Pastes of dendrite particles coated with an electrically conductive coating are described. A surface is placed in contact with an electrolytic or electroless plating solution. Dendrites are formed on the surface. The dendrites are exposed to another plating solution to plate a coating on the surface of the dendrites. The coated dendrites are removed from the surface to form a powder of coated dendrites. The powder is added to a polymer material to form a paste. The paste is disposed between electrical contacts on adjacent surfaces. The paste is heated to fuse the dendrite surfaces to form a network of fused dendrites which are also fused to the electrical contacts. The paste is further heated to cure the polymer to form electrical interconnections between the electrical contacts on the adjacent surfaces.

摘要翻译： 描述了涂覆有导电涂层的枝晶颗粒的浆料。 将表面放置成与电解或化学镀溶液接触。 树皮在表面形成。 将树突暴露于另一种电镀溶液以在树枝状表面上铺上涂层。 将涂覆的枝晶从表面除去以形成涂覆的树枝状粉末。 将粉末加入到聚合物材料中以形成糊状物。 糊料设置在相邻表面上的电触点之间。 加热糊状物以使枝晶表面熔合以形成融合的枝晶网络，其也与电触点融合。 进一步加热糊料以固化聚合物以在相邻表面上的电接触之间形成电互连。

公开(公告)号：US09230830B2

公开(公告)日：2016-01-05

申请号：US14616983

申请日：2015-02-09

申请人： International Business Machines Corporation

发明人： Thomas J. Brunschwiler ,  Javier V. Goicochea ,  Cyrill Kuemin ,  Walter H. Riess ,  Heiko Wolf

IPC分类号： H01L23/488 ,  H01L21/60 ,  H01L21/56 ,  H01L23/29 ,  H01L23/00 ,  H01L25/065

CPC分类号： H01L21/56 ,  H01L21/563 ,  H01L23/295 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29294 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/2936 ,  H01L2224/29388 ,  H01L2224/29393 ,  H01L2224/29499 ,  H01L2224/3201 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/83102 ,  H01L2224/83886 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06589 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/10253 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/05442 ,  H01L2924/053 ,  H01L2924/01006 ,  H01L2924/014 ,  H01L2924/3512

摘要： A bridging arrangement for coupling a first terminal to a second terminal includes a plurality of particles of a first type forming at least one path between the first terminal and the second terminal, wherein the particles of the first type are attached to each other; a plurality of particles of a second type arranged in a vicinity of a contact region between a first particle of the first type and a second particle of the first type, wherein at least a portion of the plurality of particles of the second type is attached to the first particle of the first type and the second particle of the first type.

公开(公告)号：US20150228617A1

公开(公告)日：2015-08-13

申请号：US14338050

申请日：2014-07-22

申请人： Electronics and Telecommunications Research Institute

发明人： Haksun LEE ,  KWANG-SEONG CHOI ,  Yong Sung EOM ,  Hyun-cheol BAE

IPC分类号： H01L23/00

CPC分类号： H01L24/83 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/16238 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/32501 ,  H01L2224/32505 ,  H01L2224/73204 ,  H01L2224/81002 ,  H01L2224/811 ,  H01L2224/83224 ,  H01L2224/83851 ,  H01L2224/83859 ,  H01L2224/83886 ,  H01L2224/83948 ,  H01L2224/83986 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/00 ,  H01L2924/014

摘要： Provided is a semiconductor device and a method of manufacturing the same. In the method of manufacturing a semiconductor device, a substrate is prepared which is transparent and has a plurality of first electrodes thereon, and a semiconductor chip having a plurality of second electrodes thereon is disposed on the substrate to allow the first and second electrodes to respectively face each other. A polymer layer including solder particles and an oxidizing agent is formed between the substrate and the semiconductor chip, and the solder particles is locally fused between the first and second electrodes by using a laser beam and a fused solder layer is formed which electrically connects between the first and second electrodes.

摘要翻译： 提供一种半导体器件及其制造方法。 在制造半导体器件的方法中，准备透明的衬底并且在其上具有多个第一电极，并且其上具有多个第二电极的半导体芯片设置在衬底上以允许第一和第二电极分别 面对面 在衬底和半导体芯片之间形成包括焊料颗粒和氧化剂的聚合物层，并且通过使用激光束将焊料颗粒局部融合在第一和第二电极之间，并且形成熔融焊料层， 第一和第二电极。

公开(公告)号：US20140252607A1

公开(公告)日：2014-09-11

申请号：US14353495

申请日：2012-10-26

申请人： Hitachi Chemical Company, Ltd.

发明人： Kazuhiro Miyauchi ,  Naoya Suzuki ,  Nozomu Takano ,  Yukihiko Yamashita

IPC分类号： B23K35/362 ,  B23K1/00 ,  B23K1/06 ,  H01L23/498

CPC分类号： B23K35/362 ,  B23K1/0016 ,  B23K1/012 ,  B23K1/06 ,  B23K1/203 ,  B23K35/0244 ,  B23K35/26 ,  B23K35/262 ,  B23K35/3006 ,  B23K35/302 ,  B23K35/3613 ,  B23K2101/40 ,  B23K2101/42 ,  C22C12/00 ,  C22C13/00 ,  C22C28/00 ,  H01L21/4853 ,  H01L21/563 ,  H01L23/488 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/11005 ,  H01L2224/11436 ,  H01L2224/11522 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16238 ,  H01L2224/81075 ,  H01L2224/81101 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81205 ,  H01L2224/81815 ,  H01L2224/83815 ,  H01L2224/83886 ,  H01L2224/8391 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/12042 ,  H05K3/3436 ,  H05K3/3478 ,  H05K2201/10977 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00

摘要： The present invention relates to a reflow film containing a thermoplastic resin which is dissolvable in a solvent, and solder particles, wherein the solder particles are dispersed in the film, and also relates to a solder bump formation method which comprises: (A) a step of mounting the reflow film on the electrode surface side of a substrate, (B) a step of mounting and fixing a flat plate, (C) a step of heating, and (D) a step of dissolving and removing the reflow film, and herewith, a reflow film is provided which, by causing localization of the solder component on the electrodes of the substrate by self-assembly, exhibits excellent storage properties, transportability and handling properties during use, and can form solder bumps or solder joints selectively on only the electrodes.

摘要翻译： 本发明涉及一种含有可溶解于溶剂中的热塑性树脂的回流膜和其中焊料颗粒分散在膜中的焊料颗粒，还涉及一种焊料凸块形成方法，其包括：（A）步骤 将回流膜安装在基板的电极表面侧，（B）安装和固定平板的步骤，（C）加热步骤，（D）溶解和去除回流膜的步骤，以及 因此，提供了一种回流膜，其通过自组装使焊料成分在基板的电极上的定位，在使用期间表现出优异的储存性能，输送性和操作性能，并且可以仅选择性地形成焊料凸块或焊点 电极。

公开(公告)号：US08691683B2

公开(公告)日：2014-04-08

申请号：US13046151

申请日：2011-03-11

申请人： Koichi Hirano ,  Seiji Karashima ,  Takashi Ichiryu ,  Yoshihiro Tomita ,  Seiichi Nakatani

发明人： Koichi Hirano ,  Seiji Karashima ,  Takashi Ichiryu ,  Yoshihiro Tomita ,  Seiichi Nakatani

IPC分类号： H01L21/56

CPC分类号： H01L21/563 ,  B23K35/0244 ,  H01L21/67144 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/1131 ,  H01L2224/13099 ,  H01L2224/1319 ,  H01L2224/133 ,  H01L2224/16 ,  H01L2224/75 ,  H01L2224/83192 ,  H01L2224/8321 ,  H01L2224/83815 ,  H01L2224/83886 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/18161 ,  H01L2924/30105 ,  H05K3/323 ,  H05K3/3436 ,  H05K3/3484 ,  H05K2201/10977 ,  H05K2203/1361 ,  Y02P70/613 ,  Y10T29/53178 ,  H01L2224/05599

摘要： [Means for Solving Problem] A semiconductor chip 20 having a plurality of electrode terminals 12 is held to oppose a circuit board 21 having a plurality of connection terminals 11 with a given gap provided therebetween, and the semiconductor chip 20 and the circuit board 21 in this state are dipped in a dipping bath 40 containing a melted resin 14 including melted solder particles for a given period of time. In this dipping process, the melted solder particles self-assemble between the connection terminals 11 of the circuit board 21 and the electrode terminals 12 of the semiconductor chip 20, so as to form connectors 22 between these terminals. Thereafter, the semiconductor chip 20 and the circuit board 21 are taken out of the dipping bath 40, and the melted resin 14 having permeated into the gap between the semiconductor chip 20 and the circuit board 21 is cured, so as to complete a flip-chip mounting body.

摘要翻译： 解决问题的手段具有多个电极端子12的半导体芯片20被保持为具有多个连接端子11的电路板21，其间设置有给定的间隙，半导体芯片20和电路板21 将该状态浸渍在包含熔融的焊料颗粒的熔融树脂14的浸渍浴40中一段给定的时间。 在该浸渍过程中，熔融的焊料颗粒自组装在电路板21的连接端子11和半导体芯片20的电极端子12之间，从而在这些端子之间形成连接器22。 此后，半导体芯片20和电路板21从浸渍浴40中取出，并且已经渗透到半导体芯片20和电路板21之间的间隙中的熔融树脂14固化， 芯片安装体。