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    Method of manufacturing metal clad laminate for printed circuit board
    52.
    发明申请
    Method of manufacturing metal clad laminate for printed circuit board 审中-公开
    制造印刷电路板用金属覆层压板的方法

    公开(公告)号：US20030222379A1

    公开(公告)日：2003-12-04

    申请号：US10375915

    申请日：2003-02-21

    Inventor： Eun Song Baik ,  Jong Seok Song ,  Rae Ook Cho ,  Yu Cheol Yang

    IPC: B29D009/00

    CPC classification number: H05K3/381 ,  B32B15/08 ,  B32B37/04 ,  B32B37/08 ,  B32B38/0012 ,  B32B2037/0092 ,  B32B2038/0016 ,  B32B2311/00 ,  B32B2327/12 ,  B32B2457/08 ,  H05K1/034 ,  H05K3/382

    Abstract: The present invention relates to a method of manufacturing a metal clad laminate for printed circuit board, characterized by direct adhesion of a conductive metal foil without use of a thermosetting resin having low melting points, an adherent film or an adhesive. The method includes forming fine protrusions on at least one surface of a fluorine-based resin insulation layer, roughening one surface of a conductive metal foil, laminating the fluorine-based resin insulation layer having fine protrusions on the roughened metal foil so that the roughened surface of the metal foil and the protrusion-formed surface of the insulation layer face each other to form a laminated body, and compressing the laminated body under vacuum, pressure and heat. The method of manufacturing the metal clad laminate by directly adhering the conductive metal foil with a single dielectric structure has advantages in terms of lower manufacturing costs compared to conventional dual dielectric structures, and very stable operation of the metal clad laminate in high frequency regions due to minimized variations of electrical and mechanical properties. Thus, the present method is effective in manufacturing the printed circuit board usable in the high frequency regions.

    Abstract translation: 本发明涉及一种制造印刷电路板用金属叠层叠体的方法，其特征在于不使用具有低熔点的热固性树脂，粘附膜或粘合剂直接粘附导电金属箔。 该方法包括在氟基树脂绝缘层的至少一个表面上形成微细突起，使导电金属箔的一个表面粗糙化，在粗糙金属箔上层叠具有微细突起的氟基树脂绝缘层，使得粗糙表面 的金属箔和所述绝缘层的突起形成面彼此相对地形成层叠体，并且在真空，压力和热下压缩层压体。 通过使用单个电介质结构直接粘接导电金属箔来制造金属覆层叠层的方法与传统的双电介质结构相比具有较低的制造成本的优点，并且由于由于金属箔层压板在高频区域的非常稳定的操作 最小化电气和机械性能的变化。 因此，本方法在制造可用于高频区域的印刷电路板方面是有效的。

    Selectively roughening conductors for high frequency printed wiring boards
    54.
    发明授权
    Selectively roughening conductors for high frequency printed wiring boards 有权
    高频印刷电路板选用粗糙导体

    公开(公告)号：US06596384B1

    公开(公告)日：2003-07-22

    申请号：US10119458

    申请日：2002-04-09

    Applicant: Richard Allen Day ,  Kevin Taylor Knadle ,  Kristen Ann Stauffer

    Inventor： Richard Allen Day ,  Kevin Taylor Knadle ,  Kristen Ann Stauffer

    IPC: B32B300

    CPC classification number: H05K1/0242 ,  H05K3/382 ,  H05K3/384 ,  H05K3/385 ,  H05K3/429 ,  H05K2201/09309 ,  H05K2203/0315 ,  H05K2203/0361 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T428/24917 ,  Y10T428/24942

    Abstract: A printed wiring board is formed from two or more layers, one of which has circuit lines formed thereon, and wherein the surfaces of the circuit lines are roughened only in areas that require good copper to laminate adhesion. The remainder of the circuit line surfaces are smooth. Thus, those areas for propagation of the signal on signal lines have the circuit lines smooth to maximize the signal propagation effect, while those areas where the signal propagation is not critical are rough, which improves the adhesion of one layer to another. On the voltage planes, the surface in those regions opposite the smooth surfaces of the signal planes is smooth. Thus, these areas of the voltage planes can be maintained smooth while the other areas of the surface of the voltage planes can be roughened, providing good adhesion to the adjoining dielectric material.

    Abstract translation: 印刷电路板由两层或多层形成，其中一层具有形成在其上的电路线，并且其中电路线的表面仅在需要良好铜以覆盖层压粘合的区域中粗糙化。 电路线路表面的其余部分是光滑的。 因此，用于信号线上的信号传播的那些区域具有平滑的电路线以使信号传播效应最大化，而信号传播不重要的那些区域是粗糙的，这改善了一层到另一层的粘附。 在电压平面上，与信号平面光滑表面相反的区域中的表面是平滑的。 因此，电压平面的这些区域可以保持平滑，而电压平面表面的其它区域可以被粗糙化，从而为邻接的介电材料提供良好的附着力。

    Electrodeposited copper foil with its surface prepared, process for producing the same and use thereof
    57.
    发明授权
    Electrodeposited copper foil with its surface prepared, process for producing the same and use thereof 失效
    其表面电沉积铜箔，其制备方法及其用途

    公开(公告)号：US06475638B1

    公开(公告)日：2002-11-05

    申请号：US09654769

    申请日：2000-09-05

    Applicant: Masakazu Mitsuhashi ,  Yasuaki Mashiko ,  Hitoshi Kurabe

    Inventor： Masakazu Mitsuhashi ,  Yasuaki Mashiko ,  Hitoshi Kurabe

    IPC: B32B1508

    CPC classification number: C25D1/04 ,  C25D5/48 ,  H05K3/382 ,  Y10T428/12431 ,  Y10T428/12438 ,  Y10T428/12472 ,  Y10T428/12569 ,  Y10T428/1291 ,  Y10T428/12993

    Abstract: A process for producing an electrodeposited copper foil with its surface prepared, comprising the steps of: subjecting an electrodeposited copper foil having a shiny side and a matte side whose average surface roughness (Rz) is in the range of 2.5 to 10 &mgr;m to at least one mechanical polishing so that the average surface roughness (Rz) of the matte side becomes in the range of 1.5 to 3.0 &mgr;m; and subjecting the matte side having undergone the mechanical polishing to a selective chemical polishing so that the average surface roughness (Rz) of the matte side becomes in the range of 0.8 to 2.5 &mgr;m. The invention further provides an electrodeposited copper foil with its surface prepared, produced by the above process, and still further provides PWBs and a multilayer laminate of PWBs, produced with the use of the above electrodeposited copper foil with its surface prepared. The mechanical polishing followed by chemical polishing of the matte side enables obtaining an electrodeposited copper foil with its surface prepared, the matte side of which exhibits excellent properties, and hence enables obtaining PWBs and a multilayer PWBs which have excellent properties.

    Abstract translation: 一种制备其表面的电沉积铜箔的方法，包括以下步骤：将平均表面粗糙度（Rz）在2.5至10μm的范围内的平均表面粗糙度（Rz）的光致侧面和无光泽面的电解铜箔至少 一次机械抛光使得无光面的平均表面粗糙度（Rz）在1.5-3.0μm的范围内; 并对经过机械抛光的磨砂面进行选择性化学抛光，使得无光面的平均表面粗糙度（Rz）在0.8〜2.5μm的范围内。 本发明还提供了通过上述方法制备的其表面的电沉积铜箔，并且还进一步提供PWB和PWB的多层层压体，其使用其上制备的上述电沉积铜箔制备。 机械抛光后，通过无光泽化学抛光，可以得到其表面准备的电沉积铜箔，其哑光面具有优异的性能，因此能够获得具有优异性能的PWB和多层PWB。

    Surface for use on an implantable device
    59.
    发明授权
    Surface for use on an implantable device 失效
    用于植入式装置的表面

    公开(公告)号：US06193762B1

    公开(公告)日：2001-02-27

    申请号：US09324695

    申请日：1999-06-02

    Applicant: Donald J. Wagner ,  Gary Reed

    Inventor： Donald J. Wagner ,  Gary Reed

    IPC: A61F202

    CPC classification number: C23F1/04 ,  A61F2/28 ,  A61F2/30767 ,  A61F2/30771 ,  A61F2/3094 ,  A61F2002/30719 ,  A61F2002/30838 ,  A61F2002/30906 ,  A61F2002/30925 ,  A61F2002/30927 ,  A61F2250/0092 ,  A61F2310/00023 ,  A61F2310/00029 ,  A61F2310/00796 ,  A61L27/32 ,  A61L27/50 ,  A61L2400/18 ,  A61L2430/02 ,  C09J5/02 ,  C09J2400/166 ,  C23F1/02 ,  H05K3/382 ,  H05K3/44 ,  Y10S623/901 ,  Y10S623/92 ,  Y10T428/24355

    Abstract: An attachment surface for an implantable device has a random irregular pattern formed through a repetitive masking and chemical milling process. Additionally, an attachment surface for an implantable device has a random irregular pattern formed through a repetitive masking and electrochemical milling process. The electrochemical milling process is particularly well suited for use with substrate materials which have high chemical inertness which makes them resistant to chemical etching. Surface material is removed from the implant surface without stress on the adjoining material and the process provides fully dimensional fillet radii at the base of the surface irregularities. This irregular surface is adapted to receive the ingrowth of bone material and to provide a strong anchor for that bone material. The unitary nature of the substrate and surface features provides a strong anchoring surface with is resistant to cracking or breaking. The surface is prepared through an etching process which utilizes the random application of a maskant and subsequent etching of the metallic substrate in areas unprotected by the maskant. This chemical etching process is repeated a number of times as necessitated by the nature of the irregularities required in the surface. The etching characteristics are controlled by the time, temperature and number of repetitions utilized in the etching process.

    Abstract translation: 用于可植入装置的附接表面具有通过重复掩蔽和化学研磨工艺形成的无规不规则图案。 此外，用于可植入装置的附接表面具有通过重复屏蔽和电化学研磨工艺形成的随机不规则图案。 电化学研磨工艺特别适用于具有高化学惰性的基材，使其耐化学腐蚀。 将表面材料从植入物表面上移除，而不会在相邻的材料上产生应力，并且该工艺在表面不规则的基部处提供完全尺寸的圆角半径。 该不规则表面适于接收骨材料的向内生长并为该骨材料提供强锚。 基体和表面特征的单一性质提供了一种牢固的锚固表面，具有抗开裂或破裂的特性。 通过蚀刻工艺制备表面，其利用掩蔽剂的随机施加和随后在未被掩蔽剂保护的区域中对金属基底进行蚀刻。 这种化学蚀刻工艺重复多次，这是由于表面所需的不规则性质所必需的。 蚀刻特性由蚀刻工艺中使用的时间，温度和重复次数来控制。

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