公开(公告)号：US5756021A

公开(公告)日：1998-05-26

申请号：US625789

申请日：1996-03-29

申请人： James Lupton Hedrick ,  Da-Yuan Shih

发明人： James Lupton Hedrick ,  Da-Yuan Shih

IPC分类号： C08J9/28 ,  C04B41/50 ,  G01R1/073 ,  G01R3/00 ,  H01B3/18 ,  H01B13/00 ,  H01R13/24 ,  H01R43/00 ,  H01B7/02

CPC分类号： H01R13/2414 ,  C04B41/5025 ,  G01R1/07307 ,  G01R3/00 ,  H01R12/52

摘要： The present invention relates to an electronic device for distributing electrical signals between electronic elements comprising a dielectric foamed thermoset polymer having a plurality of electrical circuits.

摘要翻译： 电子设备技术领域本发明涉及一种用于在电子元件之间分配电信号的电子设备，包括具有多个电路的电介质泡沫热固性聚合物。

公开(公告)号：US5386344A

公开(公告)日：1995-01-31

申请号：US9498

申请日：1993-01-26

申请人： Brian S. Beaman ,  Fuad E. Doany ,  Thomas J. Dudek ,  Alphonso P. Lanzetta ,  Da-Yuan Shih ,  William J. Tkazyik ,  George F. Walker

发明人： Brian S. Beaman ,  Fuad E. Doany ,  Thomas J. Dudek ,  Alphonso P. Lanzetta ,  Da-Yuan Shih ,  William J. Tkazyik ,  George F. Walker

IPC分类号： H01R12/71 ,  H01R12/79 ,  H01R24/00 ,  H01R23/68 ,  H01R4/58

CPC分类号： H01R12/714 ,  H01R12/79

摘要： A flex circuit card with an elastomeric cable connector assembly is provided for transmitting high speed signals between two or more printed circuit boards in a high performance computer system. The flex circuit card connects a cable assembly to a printed circuit board. A conductor trace in the flex circuit card extends into an elastomeric end and terminates with a ball shaped contact which is angled to wipe against mating pads on the printed circuit card for making electrical contact. The cable assembly uses multiple wires attached to a plurality of elastomeric connectors. At least one elastomeric connector is attached to each end of the cable assembly and each elastomeric connector has a plurality of contacts which are used to mate with a plurality of pads on the surface of the printed circuit board. The elastomeric connector described in the present invention provides a high density, cable-to-board interconnection that is perpendicular to the surface of the printed circuit board.

摘要翻译： 提供具有弹性体电缆连接器组件的柔性电路卡，用于在高性能计算机系统中的两个或多个印刷电路板之间传输高速信号。 柔性电路卡将电缆组件连接到印刷电路板。 柔性电路卡中的导体迹线延伸到弹性体端部并且终止于球形接触件，其成角度以擦拭印刷电路卡上的配合焊盘以进行电接触。 电缆组件使用连接到多个弹性体连接器的多根线。 至少一个弹性体连接器附接到电缆组件的每个端部，并且每个弹性体连接器具有多个触点，其用于与印刷电路板的表面上的多个焊盘配合。 本发明中描述的弹性体连接器提供垂直于印刷电路板表面的高密度电缆对板互连。

公开(公告)号：US5371654A

公开(公告)日：1994-12-06

申请号：US963346

申请日：1992-10-19

申请人： Brian S. Beaman ,  Fuad E. Doany ,  Keith E. Fogel ,  James L. Hedrick, Jr. ,  Paul A. Lauro ,  Maurice H. Norcott ,  John J. Ritsko ,  Leathen Shi ,  Da-Yuan Shih ,  George F. Walker

发明人： Brian S. Beaman ,  Fuad E. Doany ,  Keith E. Fogel ,  James L. Hedrick, Jr. ,  Paul A. Lauro ,  Maurice H. Norcott ,  John J. Ritsko ,  Leathen Shi ,  Da-Yuan Shih ,  George F. Walker

IPC分类号： H01L23/52 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/28 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18 ,  H05K7/00

CPC分类号： G01R1/07371 ,  G01R1/07307 ,  G01R1/07314 ,  G01R1/07342 ,  G01R3/00 ,  G01R31/2886 ,  H01L23/49827 ,  H01L23/5384 ,  H01L25/0652 ,  G01R1/06711 ,  G01R1/0675 ,  G01R1/07378 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45164 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/78301 ,  H01L2224/85205 ,  H01L2224/85214 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/1627 ,  H01L2924/19107 ,  H01L2924/3011 ,  Y10S29/029 ,  Y10T29/49004 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49158 ,  Y10T29/49162 ,  Y10T29/49192 ,  Y10T29/53174

摘要： The present invention is directed to a structure for packaging electronic devices, such as semiconductor chips, in a three dimensional structure which permits electrical signals to propagate both horizontally and vertically. The structure is formed from a plurality of assemblies. Each assembly is formed from a substrate having disposed on at least one surface a plurality of electronic devices. Each assembly is disposed in a stack of adjacent assemblies. Between adjacent assemblies there is an electrical interconnection electrically interconnecting each assembly. The electrical interconnection formed from an elastomeric interposer having a plurality of apertures extending therethrough. The array of apertures corresponds to the array of electronic devices on the substrates. The aperture and electrical interconnection is disposed over the array of electronic devices so that the electrical interconnection between adjacent electronic devices. The stack of assemblies is compressed thereby compressing the electrical interconnection between adjacent assemblies. Methods for fabricating the electrical interconnection as a stand alone elastomeric sheet are described.

摘要翻译： 本发明涉及用于将三维结构中的诸如半导体芯片的电子器件封装在一起的结构，其允许电信号水平和垂直地传播。 该结构由多个组件形成。 每个组件由在多个电子装置的至少一个表面上设置的基板形成。 每个组件设置在相邻组件的堆叠中。 在相邻组件之间存在电互连，每个组件电连接。 由具有延伸穿过其中的多个孔的弹性体插入件形成的电互连。 孔阵列对应于基片上的电子器件阵列。 孔和电互连布置在电子器件阵列上，使得相邻电子器件之间的电互连。 组合堆叠被压缩，从而压缩相邻组件之间的电互连。 描述了用于制造作为独立弹性片的电互连的方法。

公开(公告)号：US08927877B2

公开(公告)日：2015-01-06

申请号：US13570089

申请日：2012-08-08

申请人： Hsin-An Shen ,  Yung Ching Chen ,  Ming-Chung Sung ,  Chih-Hang Tung ,  Chien-Hsun Lee ,  Da-Yuan Shih

发明人： Hsin-An Shen ,  Yung Ching Chen ,  Ming-Chung Sung ,  Chih-Hang Tung ,  Chien-Hsun Lee ,  Da-Yuan Shih

IPC分类号： H05K1/11 ,  H05K3/30

CPC分类号： H05K3/4015 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2924/15311 ,  H01L2924/19107 ,  H05K3/3436 ,  H05K2201/10287 ,  H05K2203/049 ,  Y10T29/49147 ,  Y10T29/49204 ,  H01L2924/00014 ,  H01L2924/00

摘要： Disclosed herein is a system and method for mounting packages by forming one or more wire loop interconnects, optionally, with a wirebonder, and mounting the interconnects to a mounting pad on a first substrate. A first and second stud ball may each have at least one flat surface be disposed on a single mounting pad, and a wire having a bend region and forming a loop may be disposed between the stud balls. The stud balls may be formed from a deformed mouthing node formed on a wire. The loop may be mounted on a mounting pad on a first substrate and a second substrate may be mounted on the loop via a conductive material such as solder.

摘要翻译： 本文公开了一种用于通过形成一个或多个线环互连件（可选地，使用引线键合器）并将互连件安装到第一基板上的安装焊盘来安装封装件的系统和方法。 第一和第二螺柱球可以各自具有设置在单个安装垫上的至少一个平坦表面，并且具有弯曲区域并形成环的线可以设置在螺柱球之间。 螺柱球可以由形成在线上的变形的口部节点形成。 环可以安装在第一基板上的安装焊盘上，并且第二基板可以经由诸如焊料的导电材料安装在环上。

公开(公告)号：US08754514B2

公开(公告)日：2014-06-17

申请号：US13206694

申请日：2011-08-10

申请人： Chun Hui Yu ,  Chih-Hang Tung ,  Tung-Liang Shao ,  Chen-Hua Yu ,  Da-Yuan Shih

发明人： Chun Hui Yu ,  Chih-Hang Tung ,  Tung-Liang Shao ,  Chen-Hua Yu ,  Da-Yuan Shih

IPC分类号： H01L23/02 ,  H01L21/00 ,  H01L23/48 ,  H01L23/522 ,  H01L23/538 ,  H01L23/00 ,  H01L21/768 ,  H01L25/065

CPC分类号： H01L23/481 ,  H01L21/563 ,  H01L21/568 ,  H01L21/76805 ,  H01L21/76838 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/5226 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/19 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/73267 ,  H01L2224/81005 ,  H01L2224/8203 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06524 ,  H01L2225/06548 ,  H01L2225/06568 ,  H01L2924/01029 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18162 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/03 ,  H01L2224/83005

摘要： A multi-chip wafer level package comprises three stacked semiconductor dies. A first semiconductor die is embedded in a first photo-sensitive material layer. A second semiconductor die is stacked on top of the first semiconductor die wherein the second semiconductor die is face-to-face coupled to the first semiconductor die. A third semiconductor die is back-to-back attached to the second semiconductor die. Both the second semiconductor die and the third semiconductor die are embedded in a second photo-sensitive material layer. The multi-chip wafer level package further comprises a plurality of through assembly vias formed in the first photo-sensitive material layer and the second photo-sensitive material layer.

摘要翻译： 多芯片晶片级封装包括三个堆叠的半导体管芯。 第一半导体管芯被嵌入在第一光敏材料层中。 第二半导体管芯堆叠在第一半导体管芯的顶部上，其中第二半导体管芯与第一半导体管芯面对面连接。 第三半导体管芯背靠背连接到第二半导体管芯。 第二半导体管芯和第三半导体管芯都嵌入第二光敏材料层。 多芯片晶片级封装还包括形成在第一光敏材料层和第二光敏材料层中的多个通过组装通孔。

公开(公告)号：US08703274B2

公开(公告)日：2014-04-22

申请号：US12244067

申请日：2008-10-02

申请人： Russell A. Budd ,  Bing Dang ,  William S. Graham ,  Peter Alfred Gruber ,  Richard Levine ,  Da-Yuan Shih

发明人： Russell A. Budd ,  Bing Dang ,  William S. Graham ,  Peter Alfred Gruber ,  Richard Levine ,  Da-Yuan Shih

IPC分类号： B32B3/00

CPC分类号： B23K1/0016 ,  B23K1/20 ,  B23K26/364 ,  B23K2101/40 ,  H05K1/111 ,  H05K3/3457 ,  H05K2201/09381 ,  H05K2201/0969 ,  H05K2201/09745 ,  H05K2203/043 ,  Y02P70/611 ,  Y10T428/24479

摘要： A microcavity structure is provided. The structure comprises a cavity layout that enables centering of reflowed solder at each of one or more interconnect locations and protrusion of the reflowed solder sufficiently from the cavity to facilitate wetting. Techniques are also provided for producing a microcavity structure, for using injection molded solder (IMS) for micro bumping, as well as for using injection molded solder (IMS) for three-dimensional (3D) packaging.

摘要翻译： 提供微腔结构。 该结构包括空腔布局，其能够使一个或多个互连位置中的每一个处的回流焊料居中并且使回流焊料从空腔充分突出以促进润湿。 还提供了用于制造微腔结构的技术，用于使用用于微型凸起的注射成型焊料（IMS）以及用于三维（3D）封装的注射成型焊料（IMS）。

公开(公告)号：US20130241083A1

公开(公告)日：2013-09-19

申请号：US13421040

申请日：2012-03-15

申请人： Chen-Hua Yu ,  Da-Yuan Shih ,  Chih-Hang Tung

发明人： Chen-Hua Yu ,  Da-Yuan Shih ,  Chih-Hang Tung

IPC分类号： H01L23/48 ,  H01L21/50

CPC分类号： H01L23/49811 ,  H01L21/44 ,  H01L21/441 ,  H01L21/4853 ,  H01L23/48 ,  H01L23/52 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/42 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/81 ,  H01L24/85 ,  H01L2224/02166 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05124 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05184 ,  H01L2224/05567 ,  H01L2224/05572 ,  H01L2224/05611 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05664 ,  H01L2224/1134 ,  H01L2224/13005 ,  H01L2224/13011 ,  H01L2224/13016 ,  H01L2224/13027 ,  H01L2224/13078 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/1411 ,  H01L2224/16147 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/48465 ,  H01L2224/48611 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48664 ,  H01L2224/4911 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2224/83411 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/3841 ,  H01L2924/00012 ,  H01L2224/45124 ,  H01L2924/00011 ,  H01L2924/206 ,  H01L2224/05147 ,  H01L2224/05144 ,  H01L2224/05164 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2224/13099 ,  H01L2224/05099 ,  H01L2224/05599 ,  H01L2924/00 ,  H01L2224/05552

摘要： Disclosed embodiments include wire joints and methods of forming wire joints that can enable realization of fine pitch joints and collapse control for various packages. A first embodiment is a structure comprising a first substrate, a second substrate, and a wire joint. The first substrate comprises a first bonding surface, and the second substrate comprises a second bonding surface. The first bonding surface is opposite and faces the second bonding surface. The wire joint is attached to and between the first bonding surface and the second bonding surface.

摘要翻译： 公开的实施例包括线接头和形成线接头的方法，其可以实现细间距接头和各种包装件的塌陷控制。 第一实施例是包括第一基板，第二基板和线接头的结构。 第一衬底包括第一接合表面，并且第二衬底包括第二接合表面。 第一接合表面相对并面向第二接合表面。 线接头附接到第一接合表面和第二接合表面之间。

公开(公告)号：US08476770B2

公开(公告)日：2013-07-02

申请号：US13178345

申请日：2011-07-07

申请人： Tung-Liang Shao ,  Chih-Hang Tung ,  Chen-Hua Yu ,  Hao-Yi Tsai ,  Mirng-Ji Lii ,  Da-Yuan Shih

发明人： Tung-Liang Shao ,  Chih-Hang Tung ,  Chen-Hua Yu ,  Hao-Yi Tsai ,  Mirng-Ji Lii ,  Da-Yuan Shih

IPC分类号： H01L23/48

CPC分类号： H01L21/76802 ,  B29C43/04 ,  B29C43/18 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/13 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05572 ,  H01L2224/12105 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2224/19 ,  H01L2224/2939 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/014 ,  H01L2224/05552 ,  H01L2924/00 ,  H01L2224/83005

摘要： Methods and apparatus for forming through vias in an integrated circuit package are disclosed. An apparatus is disclosed, having a substrate having one or more bond pad terminals for receiving electrical connections on at least one surface; an encapsulation layer covering the at least one surface of the substrate and having a first thickness; a plurality of through vias extending through the encapsulation layer and positioned in correspondence with at least one of the one or more bond pad terminals; conductor material disposed within the plurality of through vias to form electrical connectors within the plurality of through vias; and at least one external terminal disposed on a surface of the encapsulation layer, electrically coupled to one of the one or more bond pad terminals by an electrical connector in at least one of the plurality of through vias. Package arrangements and methods for the through vias are disclosed.

摘要翻译： 公开了用于在集成电路封装中形成通孔的方法和装置。 公开了一种装置，其具有一个基板，该基板具有一个或多个接合焊盘端子，用于在至少一个表面上接收电连接; 覆盖所述衬底的所述至少一个表面并具有第一厚度的封装层; 多个通孔，其延伸穿过所述封装层并且与所述一个或多个接合焊盘端子中的至少一个相对应地定位; 导体材料设置在所述多个通孔内，以在所述多个通孔内形成电连接器; 以及设置在所述封装层的表面上的至少一个外部端子，通过所述多个通孔中的至少一个通孔中的电连接器电耦合到所述一个或多个接合焊盘端子中的一个。 公开了通孔的封装结构和方法。

公开(公告)号：US20130009319A1

公开(公告)日：2013-01-10

申请号：US13178345

申请日：2011-07-07

申请人： Tung-Liang Shao ,  Chih-Hang Tung ,  Chen-Hua Yu ,  Hao-Yi Tsai ,  Mirng-Ji Lii ,  Da-Yuan Shih

发明人： Tung-Liang Shao ,  Chih-Hang Tung ,  Chen-Hua Yu ,  Hao-Yi Tsai ,  Mirng-Ji Lii ,  Da-Yuan Shih

IPC分类号： H01L23/48 ,  B29C43/04 ,  H01L21/56

CPC分类号： H01L21/76802 ,  B29C43/04 ,  B29C43/18 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/13 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05572 ,  H01L2224/12105 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2224/19 ,  H01L2224/2939 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/014 ,  H01L2224/05552 ,  H01L2924/00 ,  H01L2224/83005

摘要： Methods and apparatus for forming through vias in an integrated circuit package are disclosed. An apparatus is disclosed, having a substrate having one or more bond pad terminals for receiving electrical connections on at least one surface; an encapsulation layer covering the at least one surface of the substrate and having a first thickness; a plurality of through vias extending through the encapsulation layer and positioned in correspondence with at least one of the one or more bond pad terminals; conductor material disposed within the plurality of through vias to form electrical connectors within the plurality of through vias; and at least one external terminal disposed on a surface of the encapsulation layer, electrically coupled to one of the one or more bond pad terminals by an electrical connector in at least one of the plurality of through vias. Package arrangements and methods for the through vias are disclosed.

摘要翻译： 公开了用于在集成电路封装中形成通孔的方法和装置。 公开了一种装置，其具有一个基板，该基板具有一个或多个接合焊盘端子，用于在至少一个表面上接收电连接; 覆盖所述衬底的所述至少一个表面并具有第一厚度的封装层; 多个通孔，其延伸穿过所述封装层并且与所述一个或多个接合焊盘端子中的至少一个相对应地定位; 导体材料设置在所述多个通孔内，以在所述多个通孔内形成电连接器; 以及设置在所述封装层的表面上的至少一个外部端子，通过所述多个通孔中的至少一个通孔中的电连接器电耦合到所述一个或多个接合焊盘端子中的一个。 公开了通孔的封装结构和方法。

公开(公告)号：US07731079B2

公开(公告)日：2010-06-08

申请号：US12143289

申请日：2008-06-20

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Bruce K. Furman ,  Madhusudan K. Iyengar ,  Paul A. Lauro ,  Roger R. Schmidt ,  Da-Yuan Shih ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Bruce K. Furman ,  Madhusudan K. Iyengar ,  Paul A. Lauro ,  Roger R. Schmidt ,  Da-Yuan Shih ,  Robert E. Simons

IPC分类号： B23K31/02

CPC分类号： H01L23/4735 ,  H01L23/473 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00

摘要： A cooling apparatus and method of fabrication are provided for facilitating removal of heat from a heat-generating electronic device. The method of fabrication includes: obtaining a solder material; disposing the solder material on a surface to be cooled; and reflowing and shaping the solder material disposed on the surface to be cooled to configure the solder material as a base with a plurality of fins extending therefrom. In addition to being in situ-configured on the surface to be cooled, the base is simultaneously metallurgically bonded to the surface to be cooled. The solder material, configured as the base with a plurality of fins extending therefrom, is a single, monolithic structure thermally attached to the surface to be cooled via the metallurgical bonding thereof to the surface to be cooled.

摘要翻译： 提供冷却装置和制造方法以便于从发热电子装置中除去热量。 制造方法包括：获得焊料材料; 将焊料材料设置在要冷却的表面上; 回流和成形设置在待冷却表面上的焊料材料，以将焊料材料构成为具有从其延伸的多个翅片的基底。 除了在待冷却的表面上原位配置，基底同时冶金结合到待冷却的表面上。 构造为具有从其延伸的多个翅片的基底的焊料材料是通过其被冶金结合到要冷却的表面热连接到要冷却的表面的单个整体结构。