公开(公告)号：US20070292667A1

公开(公告)日：2007-12-20

申请号：US11810758

申请日：2007-06-06

Applicant: Lucien Laude ,  Robert Greenberg

Inventor： Lucien Laude ,  Robert Greenberg

IPC: B32B3/00

CPC classification number: H05K3/185 ,  A61N1/0543 ,  C23C18/1639 ,  C23C18/1653 ,  C23C18/1692 ,  C23C18/1868 ,  C23C18/1882 ,  C23C18/31 ,  H05K1/032 ,  H05K3/0035 ,  H05K3/107 ,  H05K3/465 ,  H05K3/4661 ,  H05K2201/0162 ,  H05K2201/096 ,  H05K2203/107 ,  Y10T428/24917 ,  Y10T428/31663

Abstract: The present invention provides a flexible electrode array, comprising a silicone containing body, at least one metal trace layer and at least one electrode pad on the surface. The present invention further provides a process of manufacturing a flexible electrode array, comprising: a) irradiating a surface area of a molded silicone containing layer yielding traces with a light beam emitted by a pulsed UV laser source, b) immersing said irradiated molded silicone layer for inducing the deposit of metal ions to form metal traces, c) applying a silicone containing layer on said silicone containing layer and said metal traces, d) irradiating the surface for drilling holes into the surface of the molded silicone containing layer, and e) immersing said irradiated molded silicone layer for inducing the deposit of metal ions to form metal electrode pads.

Abstract translation: 本发明提供了一种柔性电极阵列，其包括硅氧烷容纳体，至少一个金属迹线层和表面上的至少一个电极焊盘。 本发明还提供一种制造柔性电极阵列的方法，包括：a）照射模制的含硅氧烷层的表面积，产生具有由脉冲UV激光源发射的光束的痕迹，b）将所述照射的模制硅氧烷层 用于诱导金属离子的沉积以形成金属迹线，c）在所述含硅层和所述金属迹线上施加含硅氧烷层，d）将所述表面照射到所述模制的含硅氧烷层的表面中，e） 浸渍所述照射的模制的硅氧烷层以诱导金属离子的沉积形成金属电极焊盘。

公开(公告)号：US20070256859A1

公开(公告)日：2007-11-08

申请号：US11777354

申请日：2007-07-13

Applicant: Hiromichi KAWAKAMI ,  Iwao FUJITA ,  Makoto TOSE ,  Yoshifumi SAITO ,  Masahiro KIMURA

Inventor： Hiromichi KAWAKAMI ,  Iwao FUJITA ,  Makoto TOSE ,  Yoshifumi SAITO ,  Masahiro KIMURA

IPC: H05K1/16

CPC classification number: H01L24/81 ,  H01L21/4807 ,  H01L21/481 ,  H01L23/15 ,  H01L23/24 ,  H01L23/3135 ,  H01L23/315 ,  H01L23/3185 ,  H01L23/49894 ,  H01L24/48 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/81011 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81355 ,  H01L2224/81395 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15174 ,  H01L2924/181 ,  H01L2924/19105 ,  H05K1/0306 ,  H05K3/282 ,  H05K3/284 ,  H05K2201/0162 ,  H05K2201/0179 ,  H05K2203/1316 ,  H05K2203/1322 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A ceramic multilayer substrate having excellent migration resistance and high bonding strength between a resin sealing material and a ceramic multilayer substrate body, includes a laminated substrate body having lands, and external electrodes, and covered with a siloxane film formed by a PVD process. The thickness of the siloxane film is lower than about 100 nm. After that, external electrodes of a mounting component are electrically connected and firmly hold to the lands of the laminated substrate body via solder. Next, a resin sealing material for sealing the mounting component is formed on the laminated substrate body.

Abstract translation: 具有优异的耐迁移性和树脂密封材料与陶瓷多层基板本体之间的高粘合强度的陶瓷多层基板包括具有焊盘的层叠基板主体和外部电极，并被通过PVD工艺形成的硅氧烷膜覆盖。 硅氧烷膜的厚度低于约100nm。 此后，安装部件的外部电极通过焊料电连接并牢固地保持在层叠基板主体的焊盘上。 接下来，在层叠基板主体上形成用于密封安装部件的树脂密封材料。

公开(公告)号：US20070184289A1

公开(公告)日：2007-08-09

申请号：US11349842

申请日：2006-02-08

Applicant: Sundaram Kumar ,  Gary Sites ,  Bhavik Patel

Inventor： Sundaram Kumar ,  Gary Sites ,  Bhavik Patel

IPC: B32B9/04 ,  B05D3/02 ,  C08L83/04

CPC classification number: B32B15/20 ,  B32B15/08 ,  B32B27/18 ,  B32B27/26 ,  B32B27/283 ,  B32B37/003 ,  B32B2264/105 ,  B32B2307/202 ,  B32B2307/302 ,  B32B2307/3065 ,  B32B2309/022 ,  B32B2457/08 ,  F28F2013/006 ,  H05K3/0061 ,  H05K3/321 ,  H05K2201/0162 ,  H05K2203/0191 ,  H05K2203/068 ,  Y10T29/49124 ,  Y10T428/31663

Abstract: A thermally and electrically conductive material is provided as a mixture of a dimethylpolysiloxane, metal (or one metal coated with another metal) flakes and/or granules, a peroxide-based and/or a dimethyl hexane based catalyst, PTFE powder and a platinum based fire retardant. The thermally and electrically conductive material may be pre-formed into a film or pad and each side of the film protected with removable release layers. The thermally and electrically conductive material may alternatively be produced in a screen-printable paste. As such, a layer of the thermally and electrically conductive paste may be screen-printed on the metal surface in a complete sheet form or as a patterned film by using a stencil patterned screen mesh. Processes for manufacturing high- and low-frequency circuits that include the interface material are also provided.

Abstract translation: 提供导热和导电的材料作为二甲基聚硅氧烷，金属（或涂覆有另一种金属的金属）薄片和/或颗粒，基于过氧化物的和/或二甲基己烷基催化剂，PTFE粉末和铂基的混合物 阻燃剂。 导热材料可以预先形成薄膜或垫片，并且薄膜的每一侧均用可移除的隔离层保护。 可替代地，导电材料和导电材料可以用可印刷网印的浆料制成。 因此，可以通过使用模板图案的筛网将导热性和导电性糊剂的一层丝网印刷在金属表面上，或者作为图案化的薄膜。 还提供了用于制造包括界面材料的高频和低频电路的工艺。

公开(公告)号：US07223652B2

公开(公告)日：2007-05-29

申请号：US11048556

申请日：2005-02-01

Applicant: Kiyoshi Ooi ,  Yasuyoshi Horikawa ,  Tomoo Yamasaki

Inventor： Kiyoshi Ooi ,  Yasuyoshi Horikawa ,  Tomoo Yamasaki

IPC: H01L21/338 ,  H01L51/40 ,  H01L21/8244 ,  H01L21/8242

CPC classification number: H01G4/224 ,  H01L21/6835 ,  H01L23/50 ,  H01L23/642 ,  H01L2221/68345 ,  H01L2221/68363 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/05172 ,  H01L2224/05184 ,  H01L2224/05571 ,  H01L2224/056 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12044 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/19041 ,  H05K1/162 ,  H05K2201/0162 ,  H05K2201/09763 ,  H01L2924/00014 ,  H01L2224/05147 ,  H01L2224/05166

Abstract: A capacitor includes a capacitor part formed of a dielectric film sandwiched by a pair of electrodes and a support body formed of a film of an organic polysilane. The support body is provided so as to support the capacitor part thereon.

Abstract translation: 电容器包括由夹在一对电极之间的电介质膜和由有机聚硅烷膜形成的支撑体形成的电容器部分。 支撑体设置成在其上支撑电容器部分。

公开(公告)号：US20070104944A1

公开(公告)日：2007-05-10

申请号：US11506617

申请日：2006-08-17

Applicant: Lucien Laude ,  Robert Greenberg

Inventor： Lucien Laude ,  Robert Greenberg

IPC: B32B27/20 ,  C08L83/04 ,  B05D1/38

CPC classification number: H05K3/185 ,  C08J7/12 ,  C08J2383/04 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1657 ,  C23C18/204 ,  C23C18/206 ,  H05K3/28 ,  H05K3/387 ,  H05K2201/0133 ,  H05K2201/0162 ,  H05K2201/0209 ,  H05K2201/0236 ,  H05K2203/107 ,  H05K2203/1105 ,  Y10T428/26 ,  Y10T428/31663

Abstract: The present invention provides a process for embedding at least one layer of at least one metal trace in a silicone-containing polymer, comprising: a) applying a polymer layer on a substrate; b) thermally treating the polymer; c) irradiating at least one surface area of the polymer with a light beam emitted by an excimer laser; d) immersing the irradiated polymer in at least one autocatalytic bath containing ions of at least one metal, and metallizing the polymer; e) thermally treating the metallized polymer; f) applying a polymer layer covering the thermally treated metallized polymer; and g) thermally treating the metallized covered polymer. The present invention further provides a polymer layer comprising silicone containing oxide particles of SiO2, TiO2, Sb2O3, SnO2, Al2O3, ZnO, Fe2O3, Fe3O4, talc, hydroxyapatite or mixtures thereof and at least one metal trace embedded in said polymer layer. The present invention further provides a flexible electrode array comprising silicone containing oxide particles of SiO2, TiO2, Sb2O3, SnO2, A1203, ZnO, Fe2O3, Fe3O4, talc, hydroxyapatite or mixtures thereof and at least one metal trace embedded in said polymer layer.

Abstract translation: 本发明提供了一种在含硅酮聚合物中嵌入至少一层至少一种金属痕迹的方法，包括：a）在基底上施加聚合物层; b）热处理聚合物; c）用由准分子激光器发射的光束照射所述聚合物的至少一个表面积; d）将经辐射的聚合物浸入至少一种含有至少一种金属的离子的自催化浴中，并对该聚合物进行金属化; e）热处理金属化聚合物; f）涂覆覆盖热处理的金属化聚合物的聚合物层; 和g）热处理金属化被覆聚合物。 本发明还提供一种聚合物层，其包含含硅氧烷的SiO 2，TiO 2，Sb 2 O 3， N 2，N 2 O 3，N 2，N 2 O 3， Fe 3 O 3，滑石，羟基磷灰石或其混合物，以及嵌入所述聚合物层中的至少一种金属迹线。 本发明还提供了一种柔性电极阵列，其包括含硅氧烷的SiO 2，TiO 2，Sb 2 O 3， / SUB>，SnO 2，Al 2 O 3，ZnO，Fe 2 O 3， Fe 3 O 3，滑石，羟基磷灰石或其混合物，以及嵌入所述聚合物层中的至少一种金属迹线。

公开(公告)号：US20060276584A1

公开(公告)日：2006-12-07

申请号：US11445279

申请日：2006-06-02

Applicant: Daichi Todoroki ,  Tsutomu Nakamura

Inventor： Daichi Todoroki ,  Tsutomu Nakamura

IPC: C08L83/04 ,  B32B27/00

CPC classification number: H01B1/22 ,  C08G77/20 ,  C08L83/04 ,  H05K3/323 ,  H05K2201/0162 ,  H05K2201/0209 ,  H05K2201/0314 ,  C08L83/00 ,  C08L2666/54

Abstract: A press-bonding anisotropic conductive resin composition comprising (A) an organopolysiloxane having on the average at least two alkenyl groups per molecule, (B) an adhesion promoter, (C) finely divided silica, (D) metallized conductive particles, and (E) a curing agent becomes an anisotropic conductor by press bonding. The conductive particles accommodate height variations among electrode terminals, allowing the composition to achieve stable interconnects between all electrode terminals.

公开(公告)号：US20060257672A1

公开(公告)日：2006-11-16

申请号：US11279955

申请日：2006-04-17

Applicant: Jun HORIKOSHI ,  Tsuneo Kimura

Inventor： Jun HORIKOSHI ,  Tsuneo Kimura

IPC: B32B27/00 ,  C08L83/04 ,  C08G77/00

CPC classification number: H05K3/285 ,  C08G77/16 ,  C08G77/18 ,  C08K5/17 ,  C08K5/5419 ,  C08L83/04 ,  H01L23/296 ,  H01L2924/0002 ,  H05K3/284 ,  H05K2201/0162 ,  Y10T428/31663 ,  C08L2666/28 ,  C08L2666/44 ,  C08L2666/36 ,  H01L2924/00

Abstract: RTV silicone rubber compositions are provided comprising (A) an organopolysiloxane, (B) an organosilicon compound or partial hydrolytic condensate thereof, and (C) a non-aromatic amino-bearing compound. The compositions, when electric and electronic parts having a copper, silver or other metal portion on their surface are encapsulated or sealed therewith, can prevent or retard the parts from corrosion with sulfur-containing gas.

Abstract translation: 提供RTV硅橡胶组合物，其包含（A）有机聚硅氧烷，（B）有机硅化合物或其部分水解缩合物，和（C）非芳香族含氨基化合物。 当其表面上具有铜，银或其他金属部分的电气和电子部件被封装或密封时，组合物可以防止或阻止部件被含硫气体腐蚀。

公开(公告)号：US20050173780A1

公开(公告)日：2005-08-11

申请号：US11039378

申请日：2005-01-19

Applicant: Murali Sethumadhavan ,  Vincent Landi ,  Luis Borges

Inventor： Murali Sethumadhavan ,  Vincent Landi ,  Luis Borges

IPC: C08G77/04 ,  H05K1/03 ,  H05K3/46 ,  H01L23/58 ,  H01L21/4763

CPC classification number: H05K1/032 ,  H05K1/0366 ,  H05K3/4626 ,  H05K2201/0162 ,  H05K2201/0212 ,  Y10T428/31663

Abstract: An electrical circuit material having a conductive layer disposed a substrate, wherein the substrate comprises an organic or inorganic polymer comprising a covalently bound polyhedral silsesquioxane (POSS). The substrate may further comprise an additional dispersed POSS, any other fillers including fibrous webs. Use of covalently bound POSS allows for flame retardancy in compositions having acceptable dielectric constants and dissipation factors.

Abstract translation: 一种具有设置在基底上的导电层的电路材料，其中所述基底包含包含共价结合的多面体倍半硅氧烷（POSS）的有机或无机聚合物。 基材还可以包含另外的分散POSS，任何其它填料，包括纤维网。 使用共价结合的POSS可以在具有可接受的介电常数和耗散因子的组合物中具有阻燃性。

公开(公告)号：US20050003076A1

公开(公告)日：2005-01-06

申请号：US10893938

申请日：2004-07-20

Applicant: Toshiyuki Toyoshima ,  Satoshi Yanaura ,  Yasuo Furuhashi ,  Hirofumi Fujioka

Inventor： Toshiyuki Toyoshima ,  Satoshi Yanaura ,  Yasuo Furuhashi ,  Hirofumi Fujioka

IPC: H05K3/00 ,  H05K3/40 ,  H05K3/46 ,  H01L23/02 ,  H05K3/42

CPC classification number: H05K3/4069 ,  H05K3/0023 ,  H05K3/4661 ,  H05K2201/0133 ,  H05K2201/0162 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/09581 ,  H05K2201/096 ,  H05K2203/1461 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: Method of producing a multi-layered wiring board comprising the steps of subjecting the photosensitive resin to exposure- and development-treatment to form the holes having a predetermined size and shape; depositing and forming the curable resin to the insulating layer having the holes formed therein in such a manner as to bury the holes, and conducting heat-treatment to form the cured thin film of the curable resin on the surface of the insulating layer; and so removing the curable resin as to leave the cured thin film to obtain the via-holes having the reduced opening size by the cured thin film.

Abstract translation: 制造多层布线板的方法包括以下步骤：对感光树脂进行曝光和显影处理以形成具有预定尺寸和形状的孔; 在形成有孔的绝缘层上沉积和形成固化树脂，以便掩埋孔，进行热处理以在绝缘层的表面上形成固化树脂的固化薄膜; 从而除去固化树脂以留下固化的薄膜，以通过固化的薄膜获得具有减小的开口尺寸的通孔。

公开(公告)号：US5114757A

公开(公告)日：1992-05-19

申请号：US604702

申请日：1990-10-26

Applicant: Harold G. Linde ,  Rosemary A. Previti-Kelly

Inventor： Harold G. Linde ,  Rosemary A. Previti-Kelly

IPC: C08G73/10 ,  B32B15/08 ,  B32B15/088 ,  B32B37/00 ,  C08J5/12 ,  C09D183/04 ,  C09D183/08 ,  H01L21/312 ,  H05K1/03 ,  H05K3/38 ,  H05K3/46

CPC classification number: H01L21/02222 ,  H01L21/02126 ,  H01L21/02211 ,  H01L21/02282 ,  H01L21/3121 ,  H01L21/3125 ,  H05K3/386 ,  H05K1/036 ,  H05K2201/0154 ,  H05K2201/0162 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2203/0759 ,  H05K3/4644

Abstract: In order to improve the adhesion of a polyimide layer to an underlying metal surface, an organic solution which cures to a silsesquioxane copolymer is applied to the surface. The polyimide and the copolymer are formed during a simultaneous curing step.