Conductive powder and method for preparing the same
    71.
    发明授权
    Conductive powder and method for preparing the same 有权
    导电粉及其制备方法

    公开(公告)号:US07083859B2

    公开(公告)日:2006-08-01

    申请号:US10885478

    申请日:2004-07-07

    申请人: Hideji Kuwajima

    发明人: Hideji Kuwajima

    IPC分类号: B22F1/02 B22F1/00 B32B15/02

    摘要: Disclosed are conductive powder having a packing density of 68% by volume or more with a relative value preferably comprising 60 to 92% by weight of roughly spherical and silver-plated copper powder part of the surface of which has been coated with 3 to 30% by weight of silver based on an amount of roughly spherical copper powder with exposing at least a surface of a portion of an alloy of copper with silver, and the surface of which is coated with 0.02 to 1.0% by weight of an aliphatic acid based on an amount of the roughly spherical and silver-plated copper powder, and 8 to 40% by weight of silver powder, and a method for preparing the same.

    摘要翻译: 公开了一种填充密度为68体积%以上的导电粉末,其相对值优选包含60〜92重量%的大致球形和镀银铜粉,其表面部分涂覆有3〜30重量% 基于一定量的大致球形的铜粉末,暴露至少一部分铜与银的合金的表面,并且其表面涂覆有0.02-1.0重量%的脂肪酸​​,基于 一定量的大致球形和镀银铜粉,以及8〜40重量%的银粉,及其制备方法。

    Surface-treated ultrafine metal powder, method for producing the same, conductive metal paste of the same, and multilayer ceramic capacitor using said paste
    74.
    发明授权
    Surface-treated ultrafine metal powder, method for producing the same, conductive metal paste of the same, and multilayer ceramic capacitor using said paste 有权
    表面处理超细金属粉末,其制造方法,导电性金属糊剂,以及使用该糊料的多层陶瓷电容器

    公开(公告)号:US06982047B2

    公开(公告)日:2006-01-03

    申请号:US10712092

    申请日:2003-11-14

    申请人: Morishige Uchida

    发明人: Morishige Uchida

    IPC分类号: H01B1/02 B22D39/00 H01G4/008

    摘要: The present invention improves the oxidation resistance of an ultrafine metal powder for use in the internal electrode of a multilayer ceramic capacitance and suppresses an increase in the thickness of a metal internal electrode film resulting from the spheroidization of the molten metal under surface tension during the formation of the metal internal electrode film. The ultrafine metal powder has a sulfur-containing compound of not less than one element selected from the group consisting of Y, Zr, and La present on the surface of the particle thereof and is produced by performing an ultrafine metal powder purification step of dispersing the ultrafine metal powder in a slurry, a surface treatment step of adding an aqueous solution containing a sulfate of not less than one element selected from the group consisting of Y, Zr, and La to the slurry to form the compound on the surface of the metal particle, a filtering step, and a drying step.

    摘要翻译: 本发明提高了在多层陶瓷电容的内部电极中使用的超细金属粉末的抗氧化性,并且抑制了在形成期间在表面张力下熔融金属的球化产生的金属内部电极膜的厚度增加 的金属内部电极膜。 超细金属粉末具有不少于一种元素的含硫化合物,该化合物在其颗粒表面上存在的Y,Zr和La中存在的一种元素,并且通过进行超分散金属粉末的超细金属粉末纯化步骤 在浆料中的超细金属粉末,将含有不少于一种选自Y,Zr和La的元素的硫酸盐的水溶液加入到浆料中以在金属表面上形成化合物的表面处理步骤 颗粒,过滤步骤和干燥步骤。

    Multilayer wiring board, base for multilayer wiring board, printed wiring board and its manufacturing method
    77.
    发明申请
    Multilayer wiring board, base for multilayer wiring board, printed wiring board and its manufacturing method 失效
    多层布线板,多层布线基板,印刷线路板及其制造方法

    公开(公告)号:US20050155792A1

    公开(公告)日:2005-07-21

    申请号:US10505094

    申请日:2003-02-21

    摘要: A multilayer wiring board assembly component comprises: an insulating substrate component (the insulating resin layer 111); a conductive layer 112 formed on one surface of said insulating substrate component 111 in the form of an electrode pattern; an adhesive layer 113 formed on the other surface of said insulating substrate component 111; and a conductive resin composition 115 with which is filled a through hole passing through said insulating substrate component 111, said adhesive layer and said conductive layer in order to make interlayer interconnection. The bore diameter of the conductive layer portion 114b of the through hole 114 is smaller than the bore diameter of the insulating resin layer portion and the adhesive layer portion 114a to establish electrical connection between the conductive resin composition 115 and the conductive layer 112 by the rare surface 112a of the conductive layer 112.

    摘要翻译: 多层布线基板组件包括:绝缘基板部件(绝缘树脂层111)。 以电极图案的形式形成在所述绝缘基板部件111的一个表面上的导电层112; 形成在所述绝缘基板部件111的另一个表面上的粘合层113; 以及导电树脂组合物115,其填充有穿过所述绝缘基板部件111,所述粘合剂层和所述导电层的通孔,以形成层间互连。 通孔114的导电层部分114b的孔径小于绝缘树脂层部分和粘合剂层部分114a的孔径,以通过以下方式建立导电树脂组合物115和导电层112之间的电连接: 导电层112的稀有表面112a。