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    Method for producing metal/ceramic bonding substrate
    92.
    发明申请
    Method for producing metal/ceramic bonding substrate 有权
    金属/陶瓷接合基板的制造方法

    公开(公告)号：US20040262367A1

    公开(公告)日：2004-12-30

    申请号：US10805768

    申请日：2004-03-22

    发明人： Junji Nakamura

    IPC分类号： B23K031/02

    CPC分类号： H01L23/3735 ,  C04B37/026 ,  C04B2237/125 ,  C04B2237/126 ,  C04B2237/127 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/407 ,  C04B2237/64 ,  C04B2237/704 ,  C04B2237/706 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/06 ,  H05K3/067 ,  H05K3/26 ,  H05K3/38 ,  H05K2201/0761 ,  H05K2203/1476 ,  H01L2924/00

    摘要： There is provided a method for producing a reliable metal/ceramic bonding substrate at low costs by forming a desired fillet on the peripheral portion of a metal circuit by a small number of steps. After an active metal containing brazing filler metal 12 is applied on a ceramic substrate 10 to bond a metal member 14 thereto, a resist 16 is applied on a predetermined portion of a surface of the metal member 14 to etch unnecessary portions, and then the resist is removed. Thereafter, unnecessary part of a metal layer 12b, which is formed of a metal other than an active metal of the active metal containing brazing filler metal 12, is etched with a chemical to be removed. Then, unnecessary part of an active metal layer 12a, which is formed of the active metal and a compound thereof, is selectively etched with a chemical, which inhibits the metal member 14 and the metal layer 12b from being etched and which selectively etch the active metal layer 12b, to form a metal circuit on the ceramic substrate 10. This metal circuit is chemically polished to form a fillet on the peripheral portion of the metal circuit.

    摘要翻译： 提供了一种通过以少量的步骤在金属电路的周边部分上形成所需的圆角而以低成本制造可靠的金属/陶瓷接合基板的方法。 在将含有活性金属的钎料12施加到陶瓷基板10上以将金属构件14接合到其上之后，将抗蚀剂16施加在金属构件14的表面的预定部分上以蚀刻不需要的部分，然后将抗蚀剂 被删除。 此后，用除去活性金属的活性金属以外的金属形成的金属层12b的不需要的部分被除去。 然后，用化学物质选择性地蚀刻由活性金属形成的活性金属层12a的不必要部分和其化合物，这种化学物质抑制金属部件14和金属层12b被蚀刻并选择性地蚀刻活性物质 金属层12b，以在陶瓷基板10上形成金属电路。该金属电路被化学抛光以在金属电路的周边部分上形成圆角。

    Active brazing solder for brazing alumina-ceramic parts
    93.
    发明授权
    Active brazing solder for brazing alumina-ceramic parts 失效
    用于钎焊氧化铝陶瓷零件的活性钎焊焊料

    公开(公告)号：US06770377B2

    公开(公告)日：2004-08-03

    申请号：US10170852

    申请日：2002-06-12

    申请人： Frank Hegner ,  Elke Maria Schmidt ,  Volker Güther ,  Anobecs Allo ,  Jürgen Breme ,  Heinz Müller ,  Jürgen Peter Turnsek

    发明人： Frank Hegner ,  Elke Maria Schmidt ,  Volker Güther ,  Anobecs Allo ,  Jürgen Breme ,  Heinz Müller ,  Jürgen Peter Turnsek

    IPC分类号： C22C1600

    CPC分类号： B23K35/32 ,  B22F9/023 ,  C04B37/006 ,  C04B2237/122 ,  C04B2237/127 ,  C04B2237/343

    摘要： The active brazing solder for brazing ceramic parts of alumina, particularly of high-purity alumina, contains a maximum of 12 wt. % Ti, a maximum of 8 wt. % Be, and less than 16.5 wt. % Fe, the remainder being Zr and any impurities that may be present. The active brazing solder has the following behaviour/features: Brazing temperature: lower than 1,000° C.; the brazed joint is high-vacuum-tight over a long period of time; the coefficient of thermal expansion of the active brazing alloy is substantially identical to that of the alumina ceramic in the entire temperature range covered during the brazing process; the strength of the brazed joint between the two ceramic parts is so high that under tensile loading, fracture will result not at the joint, but in the adjacent ceramic; the pressure resistance of the active brazing solder is greater than 2 GPa; the active brazing solder is very good processable into powders having particle sizes on the order of 10 &mgr;m.

    摘要翻译： 用于钎焊氧化铝陶瓷部件，特别是高纯度氧化铝的活性钎焊焊料最多含有12wt。 ％Ti，最多8wt。 ％Be，小于16.5wt。 ％Fe，其余为Zr和可能存在的任何杂质。 活性钎焊焊料具有以下特点：钎焊温度低于1000℃。 钎焊接头长时间高真空密封; 活性钎焊合金的热膨胀系数在钎焊过程中覆盖的整个温度范围内基本上与氧化铝陶瓷的热膨胀系数相同; 两个陶瓷部件之间的钎焊接头的强度如此之高，以至于在拉伸载荷下，不会在接头处产生断裂，而是在相邻的陶瓷中产生断裂; 活性钎焊焊料的耐压大于2 GPa; 活性钎焊焊料可以非常好地加工成具有10um数量级的粒度的粉末。