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942 条记录 (耗时 0.032 秒)

    Method of manufacturing build-up printed circuit board
    92.
    发明申请
    Method of manufacturing build-up printed circuit board 失效
    制造印刷电路板的方法

    公开(公告)号：US20070261234A1

    公开(公告)日：2007-11-15

    申请号：US11709215

    申请日：2007-02-22

    申请人： Jong Seok Song ,  Taehoon Kim ,  Dong Sun Kim ,  Hye Yeon Cha

    发明人： Jong Seok Song ,  Taehoon Kim ,  Dong Sun Kim ,  Hye Yeon Cha

    IPC分类号： H01K3/10 ,  H05K3/10 ,  H05K3/02

    CPC分类号： H05K3/381 ,  H05K3/108 ,  H05K3/146 ,  H05K3/4069 ,  H05K3/426 ,  H05K3/4602 ,  H05K2201/0959 ,  H05K2203/092 ,  H05K2203/1152 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165

    摘要： Disclosed is a method of manufacturing a build-up printed circuit board, in which the circuit of a build-up printed circuit board including a core layer and an outer layer is realized by forming the metal seed layer of the core layer using a dry process, consisting of ion beam surface treatment and vacuum deposition, instead of a conventional wet process, including a wet surface roughening process and electroless plating. When the wet process is replaced with the dry process in the method of the invention, the circuit layer can be formed in an environmentally friendly manner, and as well, all circuit layers of the substrate including the core layer and the outer layer can be manufactured through a semi-additive process. Further, the peel strength between the resin substrate and the metal layer can be increased, thus realizing a highly reliable fine circuit.

    摘要翻译： 公开了一种积层印刷电路板的制造方法，其中通过使用干法形成芯层的金属种子层来实现包括芯层和外层的积层印刷电路板的电路 ，由离子束表面处理和真空沉积组成，代替常规的湿法，包括湿表面粗糙化处理和无电镀。 当在本发明的方法中用干法代替湿法时，电路层可以以环境友好的方式形成，并且可以制造包括芯层和外层的基片的所有电路层 通过半加成过程。 此外，可以提高树脂基板和金属层之间的剥离强度，从而实现高可靠性的精细电路。

    Process of fabricating conductive column
    94.
    发明授权
    Process of fabricating conductive column 有权
    制造导电柱的工艺

    公开(公告)号：US07284323B2

    公开(公告)日：2007-10-23

    申请号：US10711863

    申请日：2004-10-11

    申请人： David C. H. Cheng

    发明人： David C. H. Cheng

    IPC分类号： H01K3/10

    CPC分类号： H05K3/0047 ,  H05K3/0032 ,  H05K3/423 ,  H05K3/427 ,  H05K2201/09563 ,  H05K2201/09827 ,  H05K2203/1476 ,  H05K2203/1572 ,  Y10T29/49156 ,  Y10T29/49167

    摘要： A fabrication process of a conductive column suitable for a fabrication of a circuit board. The circuit board comprises a dielectric layer. A first blind hole is formed in the dielectric layer from a second surface opposite to the first surface, wherein the blind end of the first blind hole connects to the blind end of the second blind hole. The first blind hole and the second blind hole constitute a through hole. The through hole is formed in an hourglass shape such that an inner diameter of the through hole near the first or the second surface is substantially larger than an inner diameter of the through hole near a middle portion of the through hole. A conductive material is filled in the though hole to form a conductive column.

    摘要翻译： 适用于制造电路板的导电柱的制造工艺。 电路板包括电介质层。 从与第一表面相对的第二表面在电介质层中形成第一盲孔，其中第一盲孔的盲端连接到第二盲孔的盲端。 第一个盲孔和第二个盲孔构成一个通孔。 通孔形成为沙漏形状，使得在第一或第二表面附近的通孔的内径基本上大于通孔的中间部分附近的通孔的内径。 导电材料填充在通孔中以形成导电柱。

    Manufacture method of a flexible multilayer wiring board
    97.
    发明授权
    Manufacture method of a flexible multilayer wiring board 失效
    柔性多层布线板的制造方法

    公开(公告)号：US07185429B2

    公开(公告)日：2007-03-06

    申请号：US11350032

    申请日：2006-02-09

    申请人： Hidetoshi Kusano ,  Shinji Kumon

    发明人： Hidetoshi Kusano ,  Shinji Kumon

    IPC分类号： H01K3/10 ,  H05K1/00

    CPC分类号： H05K3/4652 ,  H01L23/4985 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/205 ,  H05K3/28 ,  H05K3/4007 ,  H05K3/423 ,  H05K3/4682 ,  H05K2201/0367 ,  H05K2203/0376 ,  H05K2203/0733 ,  H05K2203/1383 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

    摘要： A flexible multilayer wiring board manufactured by laminating a metal foil via an insulating layer to cover the first layer circuit wiring formed on a conductive substrate, and a resist layer is formed to cover the second layer circuit wiring formed by pattern-etching the metal foil. Using the conductive substrate as a power feeding layer, a conductive material is filled, by electrolytic plating, into interlayer via holes each formed applying a laser beam to the resist layer to establish interlayer connection between the first and second layer circuit wirings. Using the conductive substrate as a power feeding layer, a conductive material is filled, by electrolytic plating, into hole portions of an insulating layer formed to cover the second layer circuit wiring to form external connection terminals. Then, the conductive substrate is removed entirely or partly to expose the first layer circuit wiring.

    摘要翻译： 通过绝缘层层叠金属箔以覆盖形成在导电性基板上的第一层电路布线而形成的柔性多层布线基板和抗蚀剂层形成为覆盖通过图案蚀刻金属箔形成的第二层电路布线。 使用导电性基板作为供电层，通过电解电镀将导电材料填充到各自形成的层间通孔中，所述层间通孔形成在抗蚀剂层上施加激光束，以在第一和第二层电路布线之间建立层间连接。 使用导电性基板作为供电层，通过电解电镀将导电性材料填充到形成为覆盖第二层电路布线的绝缘层的孔部，形成外部连接端子。 然后，全部或部分地去除导电基板，露出第一层电路布线。