公开(公告)号：US20090134386A1

公开(公告)日：2009-05-28

申请号：US12195560

申请日：2008-08-21

申请人： Hideo Nakako ,  Kazunori Yamamoto ,  Yasushi Kumashiro ,  Masahiko Ando ,  Takeo Shiba

发明人： Hideo Nakako ,  Kazunori Yamamoto ,  Yasushi Kumashiro ,  Masahiko Ando ,  Takeo Shiba

IPC分类号： H01L51/05 ,  H01L51/40

CPC分类号： H01L51/052 ,  H01L51/0043 ,  H01L51/0545

摘要： An organic field-effect transistor has a gate insulating layer comprising a cured epoxy resin. The epoxy resin has a lower concentration of trapping centres compared with a conventional epoxy resin in which trapping centres are provided by hydroxyl (OH) groups. The lower concentration of trapping centres can be achieved by reducing the number of hydroxyl groups throughout the layer and/or by reducing the number of hydroxyl groups in a surface region.

摘要翻译： 有机场效应晶体管具有包含固化的环氧树脂的栅极绝缘层。 与其中由羟基（OH）基团提供捕集中心的常规环氧树脂相比，环氧树脂具有较低的捕集中心浓度。 通过减少整个层中的羟基数量和/或通过减少表面区域中的羟基数可以实现较低浓度的捕获中心。

公开(公告)号：US20120175147A1

公开(公告)日：2012-07-12

申请号：US13496550

申请日：2010-09-13

申请人： Hideo Nakako ,  Kazunori Yamamoto ,  Yasushi Kumashiro ,  Shunya Yokosawa ,  Katsuyuki Masuda ,  Yoshinori Ejiri ,  Maki Inada ,  Kyoko Kuroda

发明人： Hideo Nakako ,  Kazunori Yamamoto ,  Yasushi Kumashiro ,  Shunya Yokosawa ,  Katsuyuki Masuda ,  Yoshinori Ejiri ,  Maki Inada ,  Kyoko Kuroda

IPC分类号： H01B5/00 ,  B05D3/10 ,  B05D1/12 ,  C09D11/02 ,  B32B37/00 ,  B32B15/01 ,  B32B15/00 ,  B05D3/00 ,  B05D3/06

CPC分类号： B22F9/26 ,  B22F1/02 ,  B22F9/22 ,  B22F9/24 ,  B22F2201/01 ,  B22F2301/10 ,  B22F2302/25 ,  B22F2999/00 ,  B32B15/01 ,  C22C5/04 ,  C22C9/00 ,  H01B1/026 ,  H05K1/097 ,  H05K3/105 ,  H05K3/1283 ,  H05K2201/0224 ,  H05K2201/0272 ,  H05K2203/0315 ,  H05K2203/1131 ,  H05K2203/1157 ,  Y10T156/10 ,  Y10T428/12903 ,  B22F2201/013 ,  B22F2202/13

摘要： Disclosed are: a copper metal film which has good adhesion to a substrate, low volume resistivity, and good deep-part metal properties; and a method for producing a copper metal film, wherein the copper metal film can be produced by reducing a substrate to a deep part thereof without damaging the substrate. Specifically disclosed is a copper metal film obtained by treating a copper-based particle deposition layer containing both copper oxides and a metallic transition metal or alloy, or a transition metal complex containing a metal element, with gaseous formic acid and/or formaldehyde heated to 120° C. or higher. The copper oxide is preferably copper (I) oxide and/or copper (II) oxide. The transition metal, alloy or metal complex are preferably a metal selected from the group consisting of Cu, Pd, Pt, Ni, Ag, Au and Rh, an alloy containing the metal, or a complex containing the metal element, respectively.

摘要翻译： 公开了一种对基板具有良好粘合性的铜金属膜，体积电阻率小，以及良好的深部金属性质; 以及铜金属膜的制造方法，其中可以通过将基板还原到其深部而不损坏基板来制造铜金属膜。 具体公开了通过将含有氧化铜和金属过渡金属或合金的铜基颗粒沉积层或含有金属元素的过渡金属络合物与加热至120℃的气态甲酸和/或甲醛处理而获得的铜金属膜 ℃以上。 氧化铜优选为氧化铜（I）和/或氧化铜（II）。 过渡金属，合金或金属络合物优选为分别选自Cu，Pd，Pt，Ni，Ag，Au和Rh的金属，含金属的合金或含金属元素的复合物。

公开(公告)号：US06621170B2

公开(公告)日：2003-09-16

申请号：US09842441

申请日：2001-04-26

申请人： Kazunori Yamamoto ,  Yasushi Shimada ,  Yasushi Kumashiro ,  Teiichi Inada ,  Hiroyuki Kuriya ,  Aizo Kaneda ,  Takeo Tomiyama ,  Yoshihiro Nomura ,  Yoichi Hosokawa ,  Hiroshi Kirihara ,  Akira Kageyama

发明人： Kazunori Yamamoto ,  Yasushi Shimada ,  Yasushi Kumashiro ,  Teiichi Inada ,  Hiroyuki Kuriya ,  Aizo Kaneda ,  Takeo Tomiyama ,  Yoshihiro Nomura ,  Yoichi Hosokawa ,  Hiroshi Kirihara ,  Akira Kageyama

IPC分类号： H01L2348

CPC分类号： H01L23/49827 ,  C09J163/00 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/50 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83856 ,  H01L2224/92247 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/15159 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/351 ,  Y10T428/28 ,  Y10T428/2848 ,  Y10T428/2852 ,  Y10T428/287 ,  Y10T428/31511 ,  Y10T428/31515 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012

摘要： The present invention aims at an improvement in temperature-cycle resistance after packaging in semiconductor devices and also an improvement in moisture-absorbed reflow resistance, and provides an adhesive having a storage elastic modulus at 25° C. of from 10 to 2,000 MPa and a storage elastic modulus at 260° C. of from 3 to 50 MPa as measured with a dynamic viscoelastic spectrometer, and also a double-sided adhesive film, a semiconductor device and a semiconductor chip mounting substrate which make use of the adhesive, and their production process.

摘要翻译： 本发明旨在提高半导体器件中的封装后的耐温循环性，并且提高吸湿回流焊性，并提供在25℃下的储能弹性模量为10〜2000MPa的粘合剂和 使用动态粘弹性光谱仪测量的260℃下的储存弹性模量为3至50MPa，以及使用粘合剂的双面粘合膜，半导体器件和半导体芯片安装基板，以及它们的生产 处理。

公开(公告)号：US06197149B1

公开(公告)日：2001-03-06

申请号：US09057522

申请日：1998-04-09

申请人： Kazuhito Kobayashi ,  Yasushi Kumashiro ,  Atsushi Takahashi ,  Koji Morita ,  Takahiro Tanabe ,  Kazunori Yamamoto ,  Akishi Nakaso ,  Shigeharu Arike ,  Kazuhisa Otsuka ,  Naoyuki Urasaki ,  Daisuke Fujimoto ,  Nozomu Takano

发明人： Kazuhito Kobayashi ,  Yasushi Kumashiro ,  Atsushi Takahashi ,  Koji Morita ,  Takahiro Tanabe ,  Kazunori Yamamoto ,  Akishi Nakaso ,  Shigeharu Arike ,  Kazuhisa Otsuka ,  Naoyuki Urasaki ,  Daisuke Fujimoto ,  Nozomu Takano

IPC分类号： C09J500

CPC分类号： H05K3/4655 ,  C09D5/00 ,  H05K1/0373 ,  H05K3/4652 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0248 ,  H05K2201/0355 ,  H05K2201/0358 ,  Y10T428/24994 ,  Y10T428/249944 ,  Y10T428/249946 ,  Y10T428/249952

摘要： An insulating varnish comprising a resin component, electrical insulating whiskers, and if necessary, one or more additives such as an ion adsorbent, and/or an organic reagent for preventing injury from copper, produced by adding the additives to the resin component and the whiskers, or filtering the whiskers, or milled by using a beads mill or a three-roll mill, or the like, is excellent for producing a multilayer printed circuit board having high wiring density, high reliability and excellent other electrical properties.

摘要翻译： 一种绝缘漆，其包括树脂组分，电绝缘晶须，并且如果需要，可以使用一种或多种添加剂，例如离子吸附剂和/或用于防止铜损伤的有机试剂，其通过将添加剂添加到树脂组分和晶须 或过滤晶须，或通过使用珠磨机或三辊研磨机等进行研磨，对于制造具有高布线密度，高可靠性和优异的其它电性能的多层印刷电路板是优异的。

公开(公告)号：US5965269A

公开(公告)日：1999-10-12

申请号：US930512

申请日：1997-10-03

申请人： Teiichi Inada ,  Kazunori Yamamoto ,  Yasushi Shimada ,  Yasushi Kumashiro

发明人： Teiichi Inada ,  Kazunori Yamamoto ,  Yasushi Shimada ,  Yasushi Kumashiro

IPC分类号： B32B7/12 ,  B32B15/08 ,  C09J163/00 ,  H05K3/38 ,  B32B27/38

CPC分类号： B32B15/08 ,  B32B7/12 ,  C09J163/00 ,  H05K3/386 ,  Y10S525/93 ,  Y10T428/31511 ,  Y10T428/31529

摘要： An adhesive comprising (1) 100 parts by weight of a combination of an epoxy resin having a weight average molecular weight of less than 5,000 and a curing agent, (2) 10 to 40 parts by weight of a high-molecular weight component being compatible with the epoxy resin and having a weight average molecular weight of 30,000 or above, (3) 20 to 100 parts by weight of a high-molecular weight component being incompatible with the epoxy resin and having a weight average molecular weight of 30,000 or above, and (4) 0.1 to 5 parts by weight of a cure accelerator. The adhesive is excellent not only in moisture resistance, heat resistance, adhesive strength at high temperature, heat dissipation, reliability of insulation, crack resistance and flexibility but also in circuit filling and tight adhesion, and exhibits suitable flow properties.

摘要翻译： PCT No.PCT / JP96 / 00798 Sec。 371日期1997年10月3日第 102（e）日期1997年10月3日PCT 1996年3月27日PCT公布。 出版物WO96 / 31574 日期：1996年10月10日粘合剂包含（1）100重量份的重均分子量小于5,000的环氧树脂和固化剂的组合，（2）10至40重量份的高分子量聚合物， 分子量成分与环氧树脂相容，重均分子量为30,000以上，（3）20〜100重量份与环氧树脂不相容的高分子量成分，重均分子量 30,000以上，（4）0.1〜5重量份的固化促进剂。 粘合剂不仅在耐湿性，耐热性，高温粘合强度，散热性，绝缘可靠性，抗裂性和柔韧性以及电路填充和紧密粘合方面都是优异的，并且表现出合适的流动性能。

公开(公告)号：US09676969B2

公开(公告)日：2017-06-13

申请号：US14236343

申请日：2012-07-30

申请人： Hideo Nakako ,  Kazunori Yamamoto ,  Yasushi Kumashiro ,  Shunya Yokosawa ,  Takaaki Noudou ,  Maki Inada ,  Kyoko Kuroda

发明人： Hideo Nakako ,  Kazunori Yamamoto ,  Yasushi Kumashiro ,  Shunya Yokosawa ,  Takaaki Noudou ,  Maki Inada ,  Kyoko Kuroda

IPC分类号： H01B1/00 ,  B05D5/12 ,  C09J9/00 ,  C09J9/02 ,  C09J11/04 ,  H01B1/22 ,  H05K3/38 ,  C09J7/02 ,  H01B13/00 ,  H05K3/10 ,  H05K1/09 ,  H05K3/12 ,  H05K1/03 ,  C08K3/08 ,  C08K3/22 ,  C08K7/18

CPC分类号： C09J9/02 ,  B05D5/12 ,  C08K3/08 ,  C08K3/22 ,  C08K7/18 ,  C09J7/28 ,  C09J11/04 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2205/102 ,  H01B1/22 ,  H01B13/00 ,  H05K1/0306 ,  H05K1/095 ,  H05K1/097 ,  H05K3/105 ,  H05K3/1208 ,  H05K3/1283 ,  H05K3/38 ,  H05K2203/1157 ,  Y10T428/24967 ,  Y10T428/25

摘要： The invention provides a composition set comprising: a conductor layer-forming composition comprising a dispersing medium and inorganic particles comprising a metallic oxide; and a conductive adhesive composition comprising a binder and conductive particles having a number average particle size of from 1 nm to 3000 nm.

公开(公告)号：US08801971B2

公开(公告)日：2014-08-12

申请号：US12808768

申请日：2008-12-17

申请人： Hideo Nakako ,  Kazunori Yamamoto ,  Yasushi Kumashiro ,  Youichi Machii ,  Shunya Yokozawa ,  Yoshinori Ejiri ,  Katsuyuki Masuda

发明人： Hideo Nakako ,  Kazunori Yamamoto ,  Yasushi Kumashiro ,  Youichi Machii ,  Shunya Yokozawa ,  Yoshinori Ejiri ,  Katsuyuki Masuda

IPC分类号： H01B1/00 ,  H01B1/12 ,  C22C9/00 ,  C21B11/10 ,  B05D5/12 ,  B28B19/00 ,  B29B15/00 ,  C23C18/00 ,  C23C20/00 ,  C23C24/00 ,  C23C26/00 ,  C23C28/00 ,  C23C30/00 ,  H01C17/06 ,  H05K3/00 ,  B22F3/00 ,  B22F3/26 ,  B22F5/00 ,  B22F7/00 ,  C22C28/00 ,  C22C29/00 ,  B32B15/20

CPC分类号： H05K3/182 ,  C23C18/1601 ,  C23C18/1603 ,  C23C18/1633 ,  C23C18/1635 ,  C23C18/1637 ,  C23C18/1824 ,  C23C18/1872 ,  C23C18/30 ,  C23C18/40 ,  H01L24/29 ,  H01L2224/29 ,  H01L2224/2919 ,  H01L2224/29294 ,  H01L2224/29347 ,  H01L2224/8384 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/0106 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/19043 ,  H01L2924/203 ,  H05K3/105 ,  H05K3/1241 ,  H05K2203/0315 ,  H05K2203/0709 ,  H05K2203/1157 ,  H05K2203/125 ,  Y10T428/12014 ,  Y10T428/12903 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2924/0002

摘要： Provided are a copper conductor film and manufacturing method thereof, and patterned copper conductor wiring, which have superior conductivity and wiring pattern formation, and with which there is no decrease in insulation between circuits, even at narrow wiring widths and narrow inter-wiring spacing. Disclosed are a copper conductor film and manufacturing method thereof in which a copper-based particle-containing layer, which contains both a metal having catalytic activity toward a reducing agent and copper oxide, is treated using a treatment solution that contains a reagent that ionizes or complexes copper oxide and a reducing agent that reduces copper ions or copper complex to form metallic copper in a single solution, and patterned copper conductor wiring that is obtained by patterning a copper-based particle-containing layer using printing and by said patterned particle-containing layer being treated by a treatment method using a solution that contains both a reagent that ionizes or complexes copper oxide and a reducing agent that reduces copper ions or copper complexes to form metallic copper in a single solution.

摘要翻译： 提供一种铜导体膜及其制造方法，并且具有优良的导电性和布线图案形成的图案化的铜导体布线，即使在窄的布线宽度和窄的布线间距下也不会降低电路之间的绝缘。 公开了一种铜导体膜及其制造方法，其中含有对还原剂具有催化活性的金属和含有氧化铜的两者的铜基颗粒含有层使用含有电离的试剂的处理溶液或 复合铜氧化物和还原剂，其在单一溶液中还原铜离子或铜络合物以形成金属铜，以及通过使用印刷图案化含铜基颗粒的层和通过所述图案化的含有颗粒的图案形成的图案化的铜导体布线 层通过使用包含电离或复合氧化铜的试剂和还原剂的溶液进行处理，所述试剂在单一溶液中还原铜离子或铜络合物以形成金属铜。

公开(公告)号：US20120170241A1

公开(公告)日：2012-07-05

申请号：US13496528

申请日：2010-09-13

申请人： Hideo Nakako ,  Kazunori Yamamoto ,  Yasushi Kumashiro ,  Shunya Yokosawa ,  Yoshinori Ejiri ,  Katsuyuki Masuda ,  Kyoko Kuroda ,  Maki Inada

发明人： Hideo Nakako ,  Kazunori Yamamoto ,  Yasushi Kumashiro ,  Shunya Yokosawa ,  Yoshinori Ejiri ,  Katsuyuki Masuda ,  Kyoko Kuroda ,  Maki Inada

IPC分类号： H05K7/02 ,  C09D11/02 ,  B82Y30/00

CPC分类号： C09D11/52 ,  C09D11/322 ,  H05K1/097

摘要： Disclosed is a printing ink comprising Cu- and/or CuO-containing metal nanoparticles, which obtains excellent dispersion properties and successive dispersion stability without using additives such as dispersing agents. Specifically disclosed is a printing ink that comprises Cu- and/or CuO-containing metal nanoparticles and has no more than 2,600 ppm of ionic impurities in the total solid content. The printing ink is obtained by dispersing the Cu- and/or CuO-containing metal nanoparticles, which have no more than 2,600 ppm of ionic impurities in the total solid content, in a dispersion medium.

摘要翻译： 公开了一种包含含有Cu和/或CuO的金属纳米颗粒的印刷油墨，其不需使用分散剂等添加剂，可获得优异的分散性和连续的分散稳定性。 具体公开了一种包含含Cu和/或CuO的金属纳米颗粒并且在总固体含量中不超过2600ppm的离子杂质的印刷油墨。 印刷油墨是通过在分散介质中分散具有不超过2600ppm的总固体含量的离子杂质的含Cu和/或CuO的金属纳米颗粒而获得的。

公开(公告)号：US20120125659A1

公开(公告)日：2012-05-24

申请号：US12808768

申请日：2008-12-17

申请人： Hideo Nakako ,  Kazunori Yamamoto ,  Yasushi Kumashiro ,  Youichi Machii ,  Shunya Yokozawa ,  Yoshinori Ejiri ,  Katsuyuki Masuda

发明人： Hideo Nakako ,  Kazunori Yamamoto ,  Yasushi Kumashiro ,  Youichi Machii ,  Shunya Yokozawa ,  Yoshinori Ejiri ,  Katsuyuki Masuda

IPC分类号： H01B5/00 ,  C22B15/00 ,  C09K3/00 ,  B05D3/00 ,  B32B15/20 ,  C22C9/00 ,  B05D5/12

CPC分类号： H05K3/182 ,  C23C18/1601 ,  C23C18/1603 ,  C23C18/1633 ,  C23C18/1635 ,  C23C18/1637 ,  C23C18/1824 ,  C23C18/1872 ,  C23C18/30 ,  C23C18/40 ,  H01L24/29 ,  H01L2224/29 ,  H01L2224/2919 ,  H01L2224/29294 ,  H01L2224/29347 ,  H01L2224/8384 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/0106 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/19043 ,  H01L2924/203 ,  H05K3/105 ,  H05K3/1241 ,  H05K2203/0315 ,  H05K2203/0709 ,  H05K2203/1157 ,  H05K2203/125 ,  Y10T428/12014 ,  Y10T428/12903 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2924/0002

摘要： Provided are a copper conductor film and manufacturing method thereof, and patterned copper conductor wiring, which have superior conductivity and wiring pattern formation, and with which there is no decrease in insulation between circuits, even at narrow wiring widths and narrow inter-wiring spacing. Disclosed are a copper conductor film and manufacturing method thereof in which a copper-based particle-containing layer, which contains both a metal having catalytic activity toward a reducing agent and copper oxide, is treated using a treatment solution that contains a reagent that ionizes or complexes copper oxide and a reducing agent that reduces copper ions or copper complex to form metallic copper in a single solution, and patterned copper conductor wiring that is obtained by patterning a copper-based particle-containing layer using printing and by said patterned particle-containing layer being treated by a treatment method using a solution that contains both a reagent that ionizes or complexes copper oxide and a reducing agent that reduces copper ions or copper complexes to form metallic copper in a single solution.

摘要翻译： 提供一种铜导体膜及其制造方法，并且具有优良的导电性和布线图案形成的图案化的铜导体布线，即使在窄的布线宽度和窄的布线间距下也不会降低电路之间的绝缘。 公开了一种铜导体膜及其制造方法，其中含有对还原剂具有催化活性的金属和含有氧化铜的两者的铜基颗粒含有层使用含有电离的试剂的处理溶液或 复合铜氧化物和还原剂，其在单一溶液中还原铜离子或铜络合物以形成金属铜，以及通过使用印刷图案化含铜基颗粒的层和通过所述图案化的含有颗粒的图案形成的图案化的铜导体布线 层通过使用包含电离或复合氧化铜的试剂和还原剂的溶液进行处理，所述试剂在单一溶液中还原铜离子或铜络合物以形成金属铜。

公开(公告)号：US06838170B2

公开(公告)日：2005-01-04

申请号：US10351430

申请日：2003-01-27

申请人： Yuko Tanaka ,  Yasushi Shimada ,  Teiichi Inada ,  Hiroyuki Kuriya ,  Kazunori Yamamoto ,  Yasushi Kumashiro ,  Keiji Sumiya

发明人： Yuko Tanaka ,  Yasushi Shimada ,  Teiichi Inada ,  Hiroyuki Kuriya ,  Kazunori Yamamoto ,  Yasushi Kumashiro ,  Keiji Sumiya

IPC分类号： C08G59/34 ,  C08G59/68 ,  C08K5/00 ,  C08L63/00 ,  C09J7/02 ,  C09J133/00 ,  C09J133/06 ,  C09J163/00 ,  H01L21/52 ,  H01L21/58 ,  H01L23/14 ,  H05K3/32 ,  H05K3/34 ,  B32B27/38

CPC分类号： H01L24/83 ,  C08G59/027 ,  C08G59/686 ,  C08L63/00 ,  C08L2666/02 ,  C08L2666/04 ,  C08L2666/22 ,  C09J7/22 ,  C09J7/26 ,  C09J7/35 ,  C09J133/068 ,  C09J163/00 ,  C09J2203/326 ,  C09J2427/006 ,  C09J2433/00 ,  C09J2463/00 ,  C09J2477/006 ,  C09J2479/086 ,  C09J2481/006 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/05548 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/50 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/83855 ,  H01L2224/92247 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01051 ,  H01L2924/01058 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/351 ,  Y10S428/901 ,  Y10T428/287 ,  Y10T428/2891 ,  Y10T428/31511 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/05432 ,  H01L2924/05442 ,  H01L2924/0532 ,  H01L2924/05032 ,  H01L2924/0503 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/29298 ,  H01L2924/00012 ,  H01L2224/05599

摘要： An adhesive which comprises (1) 100 parts by weight of an epoxy resin and a hardener therefor, (2) 75 to 300 parts by weight of an epoxidized acrylic copolymer having a glycidyl (meth)acrylate unit content of 0.5 to 6 wt. %, a glass transition temperature of −10° C. or higher and a weight average molecular weight of 100,000 or more and (3) 0.1 to 20 parts by weight of a latent curing accelerator; an adhesive member having a layer of the adhesive; an interconnecting substrate for semiconductor mounting having the adhesive member; and a semiconductor device containing the same.

摘要翻译： 一种粘合剂，其包含（1）100重量份的环氧树脂及其硬化剂，（2）75〜300重量份具有0.5〜6重量％的（甲基）丙烯酸缩水甘油酯单元含量的环氧化丙烯酸共聚物。 ％，玻璃化转变温度为-10℃以上，重均分子量为100,000以上，（3）为0.1〜20重量份的潜伏性固化促进剂; 具有粘合剂层的粘合构件; 用于半导体安装的互连衬底，具有所述粘合构件; 以及包含该半导体器件的半导体器件。