公开(公告)号：US20090096100A1

公开(公告)日：2009-04-16

申请号：US12246811

申请日：2008-10-07

Applicant: Ryoichi KAJIWARA ,  Kazutoshi Itou ,  Hiroi Oka ,  Takuya Nakajo ,  Yuichi Yato

Inventor： Ryoichi KAJIWARA ,  Kazutoshi Itou ,  Hiroi Oka ,  Takuya Nakajo ,  Yuichi Yato

IPC: H01L23/488 ,  H01L21/60 ,  H01B1/22

CPC classification number: H01L23/49562 ,  H01L23/49513 ,  H01L23/49524 ,  H01L24/16 ,  H01L24/29 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/0603 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/32013 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/40245 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/8184 ,  H01L2224/83455 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/1033 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/351 ,  H05K3/321 ,  H05K2201/0116 ,  H05K2201/0218 ,  H05K2201/0272 ,  H05K2201/10636 ,  H05K2203/1131 ,  H05K2203/121 ,  H05K2203/125 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01032 ,  H01L2924/3512 ,  H01L2924/00012

Abstract: A die bonding portion is metallically bonded by well-conductive Cu metal powders with a maximum particle diameter of about 15 μm to 200 μm and adhesive layers of Ag, and minute holes are evenly dispersed in a joint layer. With this structure, the reflow resistance of about 260° C. and reliability under thermal cycle test can be ensured without using lead.

Abstract translation: 芯片接合部分由具有约15μm至200μm的最大粒径和Ag的粘合剂层的良好导电的Cu金属粉末金属地结合，并且微孔均匀地分散在接合层中。 利用这种结构，可以在不使用铅的情况下确保约260℃的回流电阻和热循环试验下的可靠性。

公开(公告)号：US07467742B1

公开(公告)日：2008-12-23

申请号：US09512400

申请日：2000-02-24

Applicant: Jeffrey Donald Gelorme ,  Sung Kwon Kang ,  Konstantinos Papathomas ,  Sampath Purushothaman

Inventor： Jeffrey Donald Gelorme ,  Sung Kwon Kang ,  Konstantinos Papathomas ,  Sampath Purushothaman

IPC: B23K31/02

CPC classification number: H05K1/095 ,  C08K3/10 ,  C08L2666/54 ,  C09J163/00 ,  H01B1/22 ,  H05K3/4069 ,  H05K2201/0218 ,  H05K2203/0425

Abstract: Electrically conducting adhesives having a broader selectable range of properties are provided by having random sizes of micrometer diameter range particles coated with a low melting temperature metal. The coated particles are suspended in a vehicle of a mixture of thermosetting resins together with a flux resin selected for viscosity and low shrinkage, for screen printability, for electrical and for mechanical properties over a broad range of specification conditions. The vehicle or resin system includes thermosetting cyclo-aliphatic epoxy, thermosetting phenoxy polymer and thermosetting mono-functional limonene oxide. The low temperature melting coating system for the particles includes In, Sn, and alloys such as In—Sn, Sn—Pb, Bi—Sn—In and InAg. The micrometer diameter range particles includes Cu, Ni, Co, Ag, Pd, Pt, polymer and ceramic.

Abstract translation: 通过具有涂覆有低熔点金属的微米直径范围颗粒的随机尺寸来提供具有更广泛可选范围性质的导电粘合剂。 将涂覆的颗粒悬浮在热固性树脂的混合物与选择粘度和低收缩率的助焊剂树脂的车辆中，用于丝网印刷性，在宽范围的规格条件下用于电气和机械性能。 车辆或树脂系统包括热固性环脂族环氧树脂，热固性苯氧基聚合物和热固性单官能柠檬烯氧化物。 用于颗粒的低温熔融涂层系统包括In，Sn，以及In-Sn，Sn-Pb，Bi-Sn-In和InAg等合金。 微米直径范围的颗粒包括Cu，Ni，Co，Ag，Pd，Pt，聚合物和陶瓷。

公开(公告)号：US20080048009A1

公开(公告)日：2008-02-28

申请号：US10585729

申请日：2005-10-27

Applicant: Tadashi Maeda ,  Tadahiko Sakai

Inventor： Tadashi Maeda ,  Tadahiko Sakai

IPC: B23K1/20 ,  B23K35/22

CPC classification number: H05K3/3484 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/282 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/3613 ,  H05K3/3436 ,  H05K3/3463 ,  H05K3/3489 ,  H05K2201/0215 ,  H05K2201/0218 ,  H05K2201/10992 ,  Y02P70/613

Abstract: It provides metal-powder-contained flux disposed between bumps and circuit electrodes when electronic parts are mounted by soldering, the metal powder comprises a core metal formed of metal such as tin and zinc and a surface metal covering surfaces of the core metal formed of noble metal such as gold and silver. Accordingly, metal powder will not remain as residue that is liable to cause migration after the reflow process, and it is possible to assure both soldering effect and insulation effect.

Abstract translation: 当通过焊接安装电子部件时，它提供设置在凸块和电路电极之间的金属粉末含量的金属，金属粉末包括由诸如锡和锌的金属形成的芯金属和由贵金属形成的芯金属的表面金属覆盖表面 金属如金和银。 因此，金属粉末不会残留在回流处理后容易引起迁移的残留物，并且可以确保焊接效果和绝缘效果。

公开(公告)号：US20070212562A1

公开(公告)日：2007-09-13

申请号：US11709242

申请日：2007-02-22

Applicant: In-Keun Shim ,  Young-Soo Oh ,  Jae-Woo Joung

Inventor： In-Keun Shim ,  Young-Soo Oh ,  Jae-Woo Joung

IPC: B22F9/24

CPC classification number: H05K1/097 ,  B01J13/02 ,  B22F1/0018 ,  B22F1/025 ,  B22F9/24 ,  B22F2999/00 ,  B82Y30/00 ,  H05K2201/0218 ,  Y10T428/12028 ,  B22F2207/15

Abstract: The present invention provides metal nanoparticles, containing copper core and thin layer of precious metals enclosing the core to prevent oxidization of copper, in which manufacturing the metal nanoparticles is economical efficiency because of increased copper content and since such metal nanoparticles contain a metal having high electrical conductivity such as silver for a thin layer, they can form a wiring having better conductivity than copper and there is little concern that silver migration may occur.

Abstract translation: 本发明提供金属纳米粒子，其包含铜芯和包覆芯的薄层贵金属以防止铜的氧化，其中由于铜含量增加，制造金属纳米粒子是经济的，并且由于这种金属纳米颗粒含有具有高电的金属 电导率如银用于薄层，它们可以形成具有比铜更好的导电性的布线，并且很少有人担心可能发生银迁移。

公开(公告)号：US07169327B2

公开(公告)日：2007-01-30

申请号：US10240266

申请日：2002-01-24

Applicant: Nobuyuki Ito ,  Hideaki Masuko ,  Satomi Hasegawa ,  Nakaatsu Yoshimura

Inventor： Nobuyuki Ito ,  Hideaki Masuko ,  Satomi Hasegawa ,  Nakaatsu Yoshimura

IPC: H01B1/22 ,  B32B33/00

CPC classification number: H01L24/49 ,  C08K9/02 ,  H01L23/145 ,  H01L23/49527 ,  H01L23/49589 ,  H01L23/49894 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/49109 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/0101 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01038 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01056 ,  H01L2924/01058 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01083 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/351 ,  H05K1/0373 ,  H05K1/162 ,  H05K3/0023 ,  H05K3/4644 ,  H05K3/4673 ,  H05K2201/0209 ,  H05K2201/0218 ,  H05K2201/0239 ,  H05K2201/0257 ,  H05K2201/0326 ,  H05K2201/0329 ,  H05K2201/0355 ,  H05K2201/09309 ,  H05K2203/135 ,  H01L2924/00 ,  H01L2224/45099

Abstract: The dielectric-forming composition according to the invention is characterized by consisting of: composite particles for dielectrics in which part or all of the surfaces of inorganic particles with permittivity of 30 or greater are coated with a conductive metal or a compound thereof, or a conductive organic compound or a conductive inorganic material; and (B) a resin component constituted of at least one of a polymerizable compound and a polymer. In addition, another dielectric-forming composition according to the invention is characterized by containing: ultrafine particle-resin composite particles composed of (J) inorganic ultrafine particles with the average particle size of 0.1 μm or smaller, and (B) a resin component constituted of at least one of a polymerizable compound and a polymer, wherein part or all of the surfaces of the inorganic ultrafine particles (J) are coated with the resin component (B), and the ultrafine particle-resin composite particles contain 20% by weight or more of the inorganic ultrafine particles (J); and inorganic particles with the average particle size of 0.1 to 2 μm and permittivity of 30 or greater, or inorganic composite particles in which a conductive metal or a compound thereof, or a conductive organic compound or a conductive inorganic material is deposited on the part or all of the surfaces of the inorganic particles.

Abstract translation: 根据本发明的电介质形成组合物的特征在于：电介质复合颗粒，其中介电常数为30或更大的无机颗粒的部分或全部表面涂覆有导电金属或其化合物，或导电 有机化合物或导电无机材料; 和（B）由聚合性化合物和聚合物中的至少一种构成的树脂成分。 此外，根据本发明的另一种电介质形成组合物的特征在于包含：由（J）平均粒径为0.1μm以下的（J）无机超微粒子构成的超微粒子 - 树脂复合粒子，（B）构成的树脂成分 的可聚合化合物和聚合物中的至少一种，其中无机超细颗粒（J）的一部分或全部表面涂覆有树脂组分（B），超细颗粒 - 树脂复合颗粒含有20重量％ 或更多的无机超细颗粒（J）; 和平均粒径为0.1〜2μm，介电常数为30以上的无机粒子，或其中导电性金属或其化合物或导电性有机化合物或导电性无机材料沉积在该部分上的无机复合粒子，或 无机颗粒的所有表面。

公开(公告)号：US20060168803A1

公开(公告)日：2006-08-03

申请号：US11392532

申请日：2006-03-30

Applicant: Takashi Kanda ,  Kenji Fukuzono ,  Manabu Watanabe

Inventor： Takashi Kanda ,  Kenji Fukuzono ,  Manabu Watanabe

IPC: H05K3/36

CPC classification number: H05K3/462 ,  H05K3/321 ,  H05K3/4069 ,  H05K3/4602 ,  H05K2201/0218 ,  H05K2201/068 ,  H05K2203/0425 ,  Y10T29/49126 ,  Y10T428/24917

Abstract: A layered board includes a core layer that serves as a printed board, a buildup layer that is electrically connected to the core layer, the buildup layer including an insulation part and a wiring part, and a junction layer that electrically connects and bonds the core layer with the buildup layer, wherein the junction layer includes an adhesive and metallic particles contained in the adhesive, wherein each of the metallic particles has a first melting point, serves as a filler, and is plated with solder having a second melting point lower than the first melting point.

Abstract translation: 分层板包括用作印刷电路板的芯层，与芯层电连接的积层，积层层包括绝缘部分和布线部分，以及将芯层电连接和结合的接合层 其中所述接合层包括粘合剂和包含在所述粘合剂中的金属颗粒，其中所述金属颗粒具有第一熔点，用作填料，并且镀有第二熔点低于所述粘合剂的焊料 第一熔点

公开(公告)号：US20050230667A1

公开(公告)日：2005-10-20

申请号：US11073099

申请日：2005-03-03

Applicant: Michinori Komagata ,  Yukio Shirai ,  Kenichi Suzuki ,  Katsuaki Suganuma

Inventor： Michinori Komagata ,  Yukio Shirai ,  Kenichi Suzuki ,  Katsuaki Suganuma

IPC: C08K3/08 ,  C09J9/02 ,  C09J11/04 ,  H01B1/22 ,  H05K3/32 ,  H01B1/00

CPC classification number: H01B1/22 ,  C08K3/08 ,  C09J9/02 ,  C09J2205/102 ,  H05K3/321 ,  H05K2201/0218 ,  H05K2201/0272

Abstract: The present invention provides a conductive adhesive comprising conductive particles and a resin wherein 30% by weight or more of the conductive particles substantially comprise silver and tin, and a molar ratio of silver and tin in the metal components of the conductive adhesive is in the range of 77.5:22.5 to 0:100; and a circuit connected by using the conductive adhesive.

Abstract translation: 本发明提供一种导电性粘合剂，其包含导电性粒子和树脂，其中导电性粒子的30重量％以上基本上含有银和锡，并且导电性粘合剂的金属成分中的银和锡的摩尔比在该范围内 为77.5:22.5至0：100; 以及通过使用导电粘合剂连接的电路。

公开(公告)号：US06924971B2

公开(公告)日：2005-08-02

申请号：US10212750

申请日：2002-08-07

Applicant: Yuichi Satsu ,  Akio Takahashi ,  Tadashi Fujieda ,  Takumi Ueno ,  Haruo Akahoshi

Inventor： Yuichi Satsu ,  Akio Takahashi ,  Tadashi Fujieda ,  Takumi Ueno ,  Haruo Akahoshi

IPC: H05K3/46 ,  H01B3/00 ,  H01B3/30 ,  H01L23/12 ,  H01L23/14 ,  H01L23/498 ,  H01L23/64 ,  H01L23/66 ,  H05K1/16 ,  H01G4/06

CPC classification number: H05K1/162 ,  H01L23/145 ,  H01L23/49894 ,  H01L23/642 ,  H01L23/66 ,  H01L2924/0002 ,  H05K2201/0209 ,  H05K2201/0215 ,  H05K2201/0218 ,  Y10T428/249921 ,  Y10T428/25 ,  Y10T428/254 ,  Y10T428/256 ,  Y10T428/26 ,  Y10T428/269 ,  Y10T428/2982 ,  Y10T428/2991 ,  Y10T428/2998 ,  Y10T428/31 ,  H01L2924/00

Abstract: A high dielectric composite material obtained by subjecting submicron particles of an inorganic filler containing a metal as its essential component to an insulating treatment such as a chemical treatment, further subjecting to a surface treatment for improving their compatibility with organic resins, and then dispersing in an organic resin, has a dielectric constant of 15 or above, with its dielectric loss tangent in the frequency region of from 100 MHz to 80 GHz being 0.1 or less, and can therefore be used effectively for multilayer wiring boards and module substrates.

Abstract translation: 通过将含有金属的无机填料的亚微米颗粒作为必要组分进行绝缘处理如化学处理获得的高介电复合材料，进一步进行表面处理以提高其与有机树脂的相容性，然后分散在 有机树脂的介电常数为15以上，在100MHz〜80GHz的频率范围内的介电损耗角正切为0.1以下，因此能够有效地用于多层布线基板和模块基板。

公开(公告)号：US20050100743A1

公开(公告)日：2005-05-12

申请号：US10702280

申请日：2003-11-06

Applicant: Gareth Hougham ,  Xiao Liu ,  S. Chey ,  James Doyle ,  Joseph Zinter ,  Michael Rooks ,  Brian Sundlof ,  Jon Casey

Inventor： Gareth Hougham ,  Xiao Liu ,  S. Chey ,  James Doyle ,  Joseph Zinter ,  Michael Rooks ,  Brian Sundlof ,  Jon Casey

IPC: B32B15/08 ,  B32B27/00 ,  H01R13/24 ,  H01R43/00 ,  H05K1/02 ,  H05K3/32

CPC classification number: H01R13/2414 ,  B32B15/08 ,  H01R43/007 ,  H05K1/0271 ,  H05K3/321 ,  H05K3/325 ,  H05K2201/0218 ,  H05K2201/068 ,  Y10T428/12028 ,  Y10T428/12181 ,  Y10T428/12535 ,  Y10T428/249971 ,  Y10T428/249974 ,  Y10T428/31609

Abstract: A negative coefficient of thermal expansion particle includes a first bilayer having a first bilayer inner layer and a first bilayer outer layer, and a second bilayer having a second bilayer inner layer and a second bilayer outer layer. The first and second bilayers are joined together along perimeters of the first and second bilayer outer layers and first and second bilayer inner layers, respectively. The first bilayer inner layer and the second bilayer inner layer are made of a first material and the first bilayer outer layer and the second bilayer outer layer are made of a second material. The first material has a greater coefficient of thermal expansion than that of the second material.

Abstract translation: 负系数的热膨胀粒子包括具有第一双层内层和第一双层外层的第一双层和具有第二双层内层和第二双层外层的第二双层。 第一和第二双层分别沿着第一和第二双层外层以及第一和第二双层内层的周边连接在一起。 第一双层内层和第二双层内层由第一材料制成，第一双层外层和第二双层外层由第二材料制成。 第一种材料具有比第二种材料更大的热膨胀系数。

公开(公告)号：US20040161906A1

公开(公告)日：2004-08-19

申请号：US10779824

申请日：2004-02-17

Inventor： S. Kumar Khanna

IPC: H01L021/76 ,  H01L021/30 ,  H01L021/46

CPC classification number: H01L24/31 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29355 ,  H01L2224/29388 ,  H01L2224/29393 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/83192 ,  H01L2224/8321 ,  H01L2224/8322 ,  H01L2224/83222 ,  H01L2224/838 ,  H01L2224/83951 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H05K3/323 ,  H05K2201/0218 ,  H05K2201/083 ,  H05K2201/10727 ,  H05K2203/104 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: Conductive material or particles of an anisotropic conductive compound or material sandwiched between at least two aligned conductive contacts are vibrated mechanically, magnetically, or both mechanically and magnetically while the anisotropic conductive compound is curing. The conductive material is subjected to a static, substantially homogeneous DC magnetic field (i) before, (ii) following or (iii) at least partially during the time the conductive material is being vibrated.

Abstract translation: 夹杂在至少两个对准的导电接触件之间的各向异性导电化合物或材料的导电材料或颗粒在各向异性导电化合物固化期间机械地，磁性地或机械地和磁性地振动。 导电材料在导电材料振动之前至少部分地经受静电的，基本上均匀的直流磁场（i），（ii）之后或（iii））。