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公开(公告)号：CN106457383B
公开(公告)日：2019-06-28
申请号：CN201580026546.7
申请日：2015-04-10
申请人： 阿尔法装配解决方案公司
CPC分类号： H01L24/29 , B22F1/0003 , B22F1/0014 , B22F1/0074 , B22F1/025 , B22F7/04 , B22F2007/047 , B22F2301/255 , B22F2302/45 , B23K1/0016 , B23K35/025 , B23K35/3006 , B23K35/3601 , B23K35/3613 , B23K35/3618 , B23K35/365 , B23K2101/40 , B23K2103/56 , H01B1/22 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L25/50 , H01L51/5246 , H01L2224/0401 , H01L2224/04026 , H01L2224/05155 , H01L2224/05644 , H01L2224/11003 , H01L2224/1132 , H01L2224/11334 , H01L2224/131 , H01L2224/13339 , H01L2224/13347 , H01L2224/13355 , H01L2224/13387 , H01L2224/1339 , H01L2224/13439 , H01L2224/1349 , H01L2224/13499 , H01L2224/16227 , H01L2224/27003 , H01L2224/271 , H01L2224/27332 , H01L2224/27436 , H01L2224/27505 , H01L2224/2929 , H01L2224/29339 , H01L2224/29347 , H01L2224/29355 , H01L2224/29387 , H01L2224/2939 , H01L2224/29439 , H01L2224/2949 , H01L2224/29499 , H01L2224/32145 , H01L2224/32146 , H01L2224/32225 , H01L2224/32245 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/81075 , H01L2224/81192 , H01L2224/81203 , H01L2224/8121 , H01L2224/8184 , H01L2224/81948 , H01L2224/83075 , H01L2224/83191 , H01L2224/83192 , H01L2224/83203 , H01L2224/8321 , H01L2224/83439 , H01L2224/83447 , H01L2224/8384 , H01L2224/83948 , H01L2224/92247 , H01L2224/94 , H01L2924/00014 , H01L2924/0665 , H01L2924/12041 , H01L2924/12044 , H01L2924/1461 , H01L2924/20102 , H01L2924/20103 , H01L2924/20104 , H01L2924/20105 , H01L2924/20106 , H01L2924/20107 , H01L2924/20108 , H01L2924/20109 , H01L2924/2011 , H01L2924/206 , H01L2924/2064 , H05K3/321 , H01L2924/00012 , H01L2224/83 , H01L2924/0105 , H01L2924/01046 , H01L2924/01047 , H01L2924/01029 , H01L2924/01028 , H01L2924/0103 , H01L2924/0493 , H01L2924/01004 , H01L2224/27 , H01L2924/01074 , H01L2224/81 , H01L2224/11436 , H01L2224/11 , H01L2224/45099 , H01L2924/00
摘要： 一种烧结粉末，其包含：具有从100nm至50μm的平均最长尺寸的第一类型的金属颗粒。
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公开(公告)号：CN101208799B
公开(公告)日：2011-08-31
申请号：CN200680022890.X
申请日：2006-06-30
申请人： 英特尔公司
发明人： F·华
IPC分类号： H01L23/498 , H01L21/48
CPC分类号： H01L23/49816 , H01L21/4846 , H01L21/486 , H01L23/36 , H01L23/49827 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/0401 , H01L2224/05554 , H01L2224/05571 , H01L2224/05573 , H01L2224/05647 , H01L2224/1141 , H01L2224/11436 , H01L2224/1147 , H01L2224/1152 , H01L2224/11848 , H01L2224/11849 , H01L2224/13 , H01L2224/13099 , H01L2224/131 , H01L2224/13111 , H01L2224/13144 , H01L2224/13294 , H01L2224/133 , H01L2224/13311 , H01L2224/13316 , H01L2224/13339 , H01L2224/13344 , H01L2224/13347 , H01L2224/13411 , H01L2224/13416 , H01L2224/13439 , H01L2224/13444 , H01L2224/13447 , H01L2224/13499 , H01L2224/16227 , H01L2224/16235 , H01L2224/27436 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2224/81191 , H01L2224/81815 , H01L2224/83191 , H01L2224/8385 , H01L2224/9211 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12044 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/16152 , H01L2224/16225 , H01L2924/00 , H01L2924/00014 , H01L2924/00012 , H01L2924/0105 , H01L2224/11 , H01L2224/27 , H01L2224/81 , H01L2224/83
摘要： 纳米金属微粒成分包括具有大约50纳米或者更小的微粒大小的第一金属。导线互连与回流纳米焊料接触，并且具有与回流纳米焊料相同的金属或合金成分。还公开了采用回流纳米焊料成分的微电子封装。一种组装微电子封装的方法包括制备导线互连模板。计算系统包括与导线互连耦合的纳米焊料成分。
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公开(公告)号：CN1914730A
公开(公告)日：2007-02-14
申请号：CN200580003454.3
申请日：2005-01-28
申请人： 阿利安科技有限公司
发明人： 苏珊·斯文德勒哈尔斯特 , 马克·A·哈德雷 , 保罗·S·德扎伊克 , 戈登·S·W·克雷格 , 格伦·甘格尔 , 斯科特·赫尔曼恩 , 阿里·图图彻 , 伦道夫·W·埃森哈尔特
IPC分类号： H01L25/16 , H01L23/498 , H01L23/538 , H01L21/60
CPC分类号： G06K19/07752 , G06K19/077 , H01L23/49855 , H01L23/5389 , H01L24/13 , H01L24/19 , H01L24/24 , H01L24/29 , H01L24/81 , H01L24/82 , H01L24/83 , H01L24/90 , H01L24/95 , H01L24/97 , H01L29/0657 , H01L2224/05568 , H01L2224/05573 , H01L2224/13019 , H01L2224/13099 , H01L2224/1319 , H01L2224/13499 , H01L2224/16225 , H01L2224/16227 , H01L2224/24011 , H01L2224/2402 , H01L2224/24137 , H01L2224/24225 , H01L2224/24227 , H01L2224/29101 , H01L2224/2929 , H01L2224/293 , H01L2224/29339 , H01L2224/73104 , H01L2224/73204 , H01L2224/76155 , H01L2224/81201 , H01L2224/81205 , H01L2224/81207 , H01L2224/81224 , H01L2224/81801 , H01L2224/81898 , H01L2224/81903 , H01L2224/82102 , H01L2224/83191 , H01L2224/83192 , H01L2224/838 , H01L2224/83865 , H01L2224/83868 , H01L2224/83871 , H01L2224/83874 , H01L2224/95085 , H01L2224/95136 , H01L2224/97 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01055 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/0781 , H01L2924/10158 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15155 , H01L2924/15165 , H01L2924/3011 , H01L2224/82 , H01L2924/00 , H01L2924/3512 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2924/00012 , H01L2224/05599
摘要： 一种结合了小特征尺寸组件和大特征尺寸组件的装置。该装置包括带片，该带片包括基片，基片中包含有集成电路。集成电路耦合到布置在基片上的第一导体，第一导体由包括导电填充物的热固性材料或热塑性材料制成。具有第二导体的大规模组件被电耦合到第一导体，以将大规模组件电耦合到集成电路。大规模组件包括第二基片。
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公开(公告)号：CN104160490B
公开(公告)日：2018-07-03
申请号：CN201380012394.6
申请日：2013-02-26
申请人： 纳美仕股份有限公司
CPC分类号： B23K35/3006 , B22F1/0018 , B22F1/0044 , B22F3/10 , B22F9/24 , B23K1/0016 , B23K35/365 , B82Y30/00 , C22C5/06 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L2224/13339 , H01L2224/13499 , H01L2224/165 , H01L2224/29339 , H01L2224/29499 , H01L2224/8184 , H01L2224/8384 , H01L2924/01047 , H01L2924/12042 , H01L2924/13091 , H01L2924/00 , H01L2924/207
摘要： 本发明的银微粒烧结体是用于接合半导体装置的部件的接合构件用银微粒烧结体，银微粒烧结体的蠕变活化能是块体银的晶格扩散活化能的0.4～0.75倍。
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公开(公告)号：CN101208799A
公开(公告)日：2008-06-25
申请号：CN200680022890.X
申请日：2006-06-30
申请人： 英特尔公司
发明人： F·华
IPC分类号： H01L23/498 , H01L21/48
CPC分类号： H01L23/49816 , H01L21/4846 , H01L21/486 , H01L23/36 , H01L23/49827 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/0401 , H01L2224/05554 , H01L2224/05571 , H01L2224/05573 , H01L2224/05647 , H01L2224/1141 , H01L2224/11436 , H01L2224/1147 , H01L2224/1152 , H01L2224/11848 , H01L2224/11849 , H01L2224/13 , H01L2224/13099 , H01L2224/131 , H01L2224/13111 , H01L2224/13144 , H01L2224/13294 , H01L2224/133 , H01L2224/13311 , H01L2224/13316 , H01L2224/13339 , H01L2224/13344 , H01L2224/13347 , H01L2224/13411 , H01L2224/13416 , H01L2224/13439 , H01L2224/13444 , H01L2224/13447 , H01L2224/13499 , H01L2224/16227 , H01L2224/16235 , H01L2224/27436 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2224/81191 , H01L2224/81815 , H01L2224/83191 , H01L2224/8385 , H01L2224/9211 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12044 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/16152 , H01L2224/16225 , H01L2924/00 , H01L2924/00014 , H01L2924/00012 , H01L2924/0105 , H01L2224/11 , H01L2224/27 , H01L2224/81 , H01L2224/83
摘要： 纳米金属微粒成分包括具有大约50纳米或者更小的微粒大小的第一金属。导线互连与回流纳米焊料接触，并且具有与回流纳米焊料相同的金属或合金成分。还公开了采用回流纳米焊料成分的微电子封装。一种组装微电子封装的方法包括制备导线互连模板。计算系统包括与导线互连耦合的纳米焊料成分。
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公开(公告)号：CN107771354A
公开(公告)日：2018-03-06
申请号：CN201680018886.X
申请日：2016-03-31
申请人： 爱法组装材料公司
IPC分类号： H01L23/488 , H01L23/29 , H01L21/60 , H01L21/48 , B23K1/00 , B23K1/20 , B23K35/02 , B23K35/36 , C08K3/00 , C08K3/04 , C08K5/00 , C08K5/092 , C08K5/18 , C08K5/49 , C08K7/02 , C08L63/00 , C08L83/04
CPC分类号： C08K3/04 , B23K1/0016 , B23K1/20 , B23K35/00 , B23K35/0244 , B23K35/025 , B23K35/3602 , B23K2101/42 , C08K3/013 , C08K3/042 , C08K5/00 , C08K7/02 , H01L23/295 , H01L23/296 , H01L24/11 , H01L24/13 , H01L24/27 , H01L24/29 , H01L24/81 , H01L24/83 , H01L2224/1131 , H01L2224/11312 , H01L2224/1132 , H01L2224/1141 , H01L2224/11418 , H01L2224/11422 , H01L2224/1301 , H01L2224/131 , H01L2224/13111 , H01L2224/13144 , H01L2224/1329 , H01L2224/133 , H01L2224/13311 , H01L2224/13339 , H01L2224/13344 , H01L2224/13347 , H01L2224/13386 , H01L2224/13387 , H01L2224/13393 , H01L2224/13439 , H01L2224/13444 , H01L2224/13447 , H01L2224/13486 , H01L2224/13487 , H01L2224/1349 , H01L2224/13499 , H01L2224/2731 , H01L2224/27312 , H01L2224/2732 , H01L2224/2741 , H01L2224/27418 , H01L2224/27422 , H01L2224/27436 , H01L2224/27602 , H01L2224/2929 , H01L2224/29294 , H01L2224/293 , H01L2224/29311 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29386 , H01L2224/29387 , H01L2224/2939 , H01L2224/29393 , H01L2224/29439 , H01L2224/29444 , H01L2224/29447 , H01L2224/29486 , H01L2224/29487 , H01L2224/2949 , H01L2224/29499 , H01L2224/73204 , H01L2224/8184 , H01L2224/81856 , H01L2224/81862 , H01L2224/81874 , H01L2224/8321 , H01L2224/83851 , H01L2224/83856 , H01L2224/83862 , H01L2224/83874 , H01L2924/12041 , H01L2924/3841 , C08L63/00 , C08L83/04 , C08K5/092 , C08K5/18 , C08K5/49 , C08L2205/025 , H01L2924/014 , H01L2924/00014 , H01L2924/0105 , H01L2924/01047 , H01L2924/01029 , H01L2924/01006 , H01L2924/00012 , H01L2924/05341 , H01L2924/07001 , H01L2924/0715 , H01L2924/0675 , H01L2924/0665 , H01L2924/06 , H01L2924/01079 , H01L2924/053 , H01L2924/01102 , H01L2924/01103 , H01L2924/01109 , H01L2924/01009 , H01L2924/0503 , H01L2924/01005 , H01L2924/066 , H01L2924/0635 , H01L2924/061 , H01L2924/05432 , H01L2924/04642 , H01L2924/05032 , H01L2924/05442 , H01L2924/0542 , H01L2924/0103 , C08K3/00
摘要： 一种用于电子组装方法的组合物，该组合物包含分散在有机介质中的填料，其中：该有机介质包含聚合物；该填料包含石墨烯、官能化石墨烯、氧化石墨烯、多面体低聚倍半硅氧烷、石墨、二维材料、氧化铝、氧化锌、氮化铝、氮化硼、银、纳米纤维、碳纤维、金刚石、碳纳米管、二氧化硅和金属涂布的颗粒中的一种或多种，并且，基于组合物的总重量，该组合物包含0.001～40重量％的填料。
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公开(公告)号：CN106457383A
公开(公告)日：2017-02-22
申请号：CN201580026546.7
申请日：2015-04-10
申请人： 阿尔法金属公司
CPC分类号： H01L24/29 , B22F1/0003 , B22F1/0014 , B22F1/0074 , B22F1/025 , B22F7/04 , B22F2007/047 , B22F2301/255 , B22F2302/45 , B23K1/0016 , B23K35/025 , B23K35/3006 , B23K35/3601 , B23K35/3613 , B23K35/3618 , B23K35/365 , B23K2101/40 , B23K2103/56 , H01B1/22 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L25/50 , H01L51/5246 , H01L2224/0401 , H01L2224/04026 , H01L2224/05155 , H01L2224/05644 , H01L2224/11003 , H01L2224/1132 , H01L2224/11334 , H01L2224/131 , H01L2224/13339 , H01L2224/13347 , H01L2224/13355 , H01L2224/13387 , H01L2224/1339 , H01L2224/13439 , H01L2224/1349 , H01L2224/13499 , H01L2224/16227 , H01L2224/27003 , H01L2224/271 , H01L2224/27332 , H01L2224/27436 , H01L2224/27505 , H01L2224/2929 , H01L2224/29339 , H01L2224/29347 , H01L2224/29355 , H01L2224/29387 , H01L2224/2939 , H01L2224/29439 , H01L2224/2949 , H01L2224/29499 , H01L2224/32145 , H01L2224/32146 , H01L2224/32225 , H01L2224/32245 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/81075 , H01L2224/81192 , H01L2224/81203 , H01L2224/8121 , H01L2224/8184 , H01L2224/81948 , H01L2224/83075 , H01L2224/83191 , H01L2224/83192 , H01L2224/83203 , H01L2224/8321 , H01L2224/83439 , H01L2224/83447 , H01L2224/8384 , H01L2224/83948 , H01L2224/92247 , H01L2224/94 , H01L2924/00014 , H01L2924/0665 , H01L2924/12041 , H01L2924/12044 , H01L2924/1461 , H01L2924/20102 , H01L2924/20103 , H01L2924/20104 , H01L2924/20105 , H01L2924/20106 , H01L2924/20107 , H01L2924/20108 , H01L2924/20109 , H01L2924/2011 , H01L2924/206 , H01L2924/2064 , H05K3/321 , H01L2924/00012 , H01L2224/83 , H01L2924/0105 , H01L2924/01046 , H01L2924/01047 , H01L2924/01029 , H01L2924/01028 , H01L2924/0103 , H01L2924/0493 , H01L2924/01004 , H01L2224/27 , H01L2924/01074 , H01L2224/81 , H01L2224/11436 , H01L2224/11 , H01L2224/45099 , H01L2924/00 , B22F1/0062 , B22F1/0007 , B22F9/24
摘要： 一种烧结粉末，其包含：具有从100nm至50μm的平均最长尺寸的第一类型的金属颗粒。
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公开(公告)号：CN104160490A
公开(公告)日：2014-11-19
申请号：CN201380012394.6
申请日：2013-02-26
申请人： 纳美仕股份有限公司
CPC分类号： B23K35/3006 , B22F1/0018 , B22F1/0044 , B22F3/10 , B22F9/24 , B23K1/0016 , B23K35/365 , B82Y30/00 , C22C5/06 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L2224/13339 , H01L2224/13499 , H01L2224/165 , H01L2224/29339 , H01L2224/29499 , H01L2224/8184 , H01L2224/8384 , H01L2924/01047 , H01L2924/12042 , H01L2924/13091 , H01L2924/00 , H01L2924/207
摘要： 本发明的银微粒烧结体是用于接合半导体装置的部件的接合构件用银微粒烧结体，银微粒烧结体的蠕变活化能是块体银的晶格扩散活化能的0.4～0.75倍。
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