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187 条记录 (耗时 0.033 秒)

    Method of making microelectronic spring contact array
    132.
    发明授权
    Method of making microelectronic spring contact array 失效
    制造微电子弹簧接触阵列的方法

    公开(公告)号：US07047638B2

    公开(公告)日：2006-05-23

    申请号：US10202712

    申请日：2002-07-24

    申请人： Benjamin N. Eldridge ,  Gaetan L. Mathieu ,  Carl V. Reynolds

    发明人： Benjamin N. Eldridge ,  Gaetan L. Mathieu ,  Carl V. Reynolds

    IPC分类号： H01R43/00

    CPC分类号： G01R1/06744 ,  G01R1/06733 ,  G01R3/00 ,  Y10T29/49139 ,  Y10T29/49155 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/49222 ,  Y10T29/49224

    摘要： A method of making a microelectronic spring contact array comprises forming a plurality of spring contacts on a sacrificial substrate and then releasing the spring contacts from the sacrificial substrate. Each of the spring contacts has an elongated beam having a base end. The method of making the array includes attaching the spring contacts at their base ends to a base substrate after they have been released entirely from the sacrificial substrate, so that each contact extends from the base substrate to a distal end of its beams. The distal ends are aligned with a predetermined array of tip positions. In an embodiment of the invention, the spring contacts are formed by patterning contours of the spring contacts in a sacrificial layer on the sacrificial substrate. The walls of patterned recesses in the sacrificial layer define side profiles of the spring contacts, and a conductive material is deposited in the recesses to form the elongated beams of the spring contacts.

    摘要翻译： 制造微电子弹簧接触阵列的方法包括在牺牲衬底上形成多个弹簧触点，然后从牺牲衬底释放弹簧触头。 每个弹簧触点具有带有基端的细长梁。 制造阵列的方法包括在它们已经从牺牲基板完全释放之后将其基端处的弹簧触点附接到基底基板，使得每个触点从基底延伸到其波束的远端。 远端与预定阵列的尖端位置对准。 在本发明的一个实施例中，通过在牺牲衬底上的牺牲层中图形地形成弹簧触点的轮廓来形成弹簧触点。 牺牲层中的图案化凹槽的壁限定弹簧触点的侧面轮廓，并且导电材料沉积在凹部中以形成弹簧触点的细长梁。

    Transceiver with isolated power rails for ground bounce reduction
    136.
    发明授权
    Transceiver with isolated power rails for ground bounce reduction 失效
    带有隔离电源轨的收发器，用于地面反弹

    公开(公告)号：US5173621A

    公开(公告)日：1992-12-22

    申请号：US728988

    申请日：1991-07-12

    申请人： Dana Fraser ,  Ray A. Mentzer ,  Jerry Gray ,  Geoff Hannington ,  Susan M. Keown ,  Gaetan L. Mathieu

    发明人： Dana Fraser ,  Ray A. Mentzer ,  Jerry Gray ,  Geoff Hannington ,  Susan M. Keown ,  Gaetan L. Mathieu

    IPC分类号： H01L23/495 ,  H01L23/50 ,  H01L23/64 ,  H03K19/003 ,  H03K19/018

    CPC分类号： H01L23/50 ,  H01L23/49541 ,  H01L23/645 ,  H03K19/00353 ,  H03K19/01806 ,  H01L2924/0002 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011

    摘要： Circuit configurations are described for use with split lead leadframes and relatively isolated quiet and noisy power rails to reduce power rail noise and circuit noise. An octal register transceiver circuit incorporates a latch (300) coupled to relatively quiet power rails (42,44) and an output buffer circuit (400) having an input circuit coupled to the latch (300) and relatively quiet power rails (42,44). The output driver transistors (Q433,Q434) of the output buffer circuit (400) are coupled to the relatively noisy output power rails (52,54) to isolate the latch circuit from power rail noise and minimize erroneous operation of the latch. A DC Miller Killer circuit (450) is constructed with delay control components (D456,D457,R460) and an alternative discharge path (R458,D459) to reduce aggravation of power rail noise during operation of DCMK.

    摘要翻译： 电路配置被描述用于分离引线引线框架和相对隔离的安静和噪声电源轨，以减少电力轨道噪声和电路噪声。 八进制寄存器收发器电路包括耦合到相对安静的电源轨（42,44）的锁存器（300）和具有耦合到锁存器（300）和相对安静的电源轨（42,44）的输入电路的输出缓冲器电路（400） ）。 输出缓冲电路（400）的输出驱动晶体管（Q433，Q434）耦合到相对较嘈杂的输出电源轨（52,54），以将锁存电路与电源轨噪声隔离开来并最大限度地减小锁存器的错误操作。 DC Miller Killer电路（450）由延迟控制组件（D456，D457，R460）和替代放电路径（R458，D459）构成，以减少DCMK运行期间电源轨噪声的恶化。

    WIRING SUBSTRATE WITH CUSTOMIZATION LAYERS
    137.
    发明申请
    WIRING SUBSTRATE WITH CUSTOMIZATION LAYERS 有权
    带有自定义层的布线基板

    公开(公告)号：US20110214910A1

    公开(公告)日：2011-09-08

    申请号：US12719136

    申请日：2010-03-08

    申请人： Benjamin N. Eldridge ,  Gaetan L. Mathieu

    发明人： Benjamin N. Eldridge ,  Gaetan L. Mathieu

    IPC分类号： H05K1/00 ,  H05K1/11 ,  H05K3/12 ,  H05K3/42 ,  H05K3/46

    CPC分类号： H05K3/4664 ,  H05K3/1241 ,  H05K3/4015 ,  H05K3/4046 ,  H05K3/4647 ,  H05K2203/049 ,  Y10T29/49155 ,  Y10T29/49165

    摘要： One or more customization layers can be added to a wiring substrate. The customization layers can provide customized electrical connections from electrical contacts of the base wiring substrate to electrical contacts at an outer surface of the customization layers, which can allow the contacts at the outer surface of the customization layers can be in a different pattern than the contacts at the surface of the base wiring substrate. The customization layers can comprise electrically insulating material, electrically conductive via structures through the insulating material, electrically conductive traces, electrically conductive jumpers electrically connecting two traces without contacting a trace disposed between the two traces, and/or other such elements. A jumper can be formed by making a relatively small deposit of electrically insulating material between the two traces to be connected and then making a relatively small deposit of electrically conductive material on parts of the two traces and the insulating material. Via structures can be coupled to traces and an insulating material can be cast around the via structures. Alternatively, via structures can be formed in openings with sloped side walls in an insulating layer.

    摘要翻译： 可以将一个或多个定制层添加到布线基板。 定制层可以提供从基底布线基板的电触点到定制层外表面处的电触点的定制电连接，这允许定制层外表面处的触点可以与触点不同的图案 在基极配线基板的表面。 定制层可以包括电绝缘材料，通过绝缘材料的导电通孔结构，导电迹线，电连接两个迹线的导电跳线，而不接触设置在两个迹线之间的迹线和/或其它这样的元件。 可以通过在要连接的两个迹线之间形成相对较小的电绝缘材料沉积，然后在两个迹线和绝缘材料的部分上形成相对较小的导电材料沉积物来形成跳线。 通孔结构可以耦合到迹线，并且绝缘材料可以围绕通孔结构铸造。 或者，通孔结构可以形成在具有绝缘层中的倾斜侧壁的开口中。

    Component assembly and alignment
    138.
    发明授权
    Component assembly and alignment 失效
    组件组装和对齐

    公开(公告)号：US07808259B2

    公开(公告)日：2010-10-05

    申请号：US11861559

    申请日：2007-09-26

    申请人： Benjamin N. Eldridge ,  Eric D. Hobbs ,  Gaetan L. Mathieu

    发明人： Benjamin N. Eldridge ,  Eric D. Hobbs ,  Gaetan L. Mathieu

    IPC分类号： G01R31/02

    CPC分类号： G01R31/2891 ,  G01R1/06716 ,  G01R1/07342 ,  G11C29/56 ,  G11C29/56016 ,  G11C2029/5602 ,  H01L21/682 ,  Y10T29/49002

    摘要： A method or an apparatus for aligning a plurality of structures can include applying a first force in a first plane to a first structure. The method can also include constraining in the first plane the first structure with respect to a second structure such that the first structure is in a position with respect to the second structure that aligns first features on the first structure with second features on the second structures. The second feature can be in a second plane that is generally parallel to the first plane. The first and second structures can be first and second electronic components, which can be components of a probe card assembly.

    摘要翻译： 用于对准多个结构的方法或设备可以包括将第一平面中的第一力施加到第一结构。 该方法还可以包括在第一平面中约束相对于第二结构的第一结构，使得第一结构相对于将第一结构上的第一特征与第二结构上的第二特征对准的第二结构处于相对位置。 第二特征可以在通常平行于第一平面的第二平面中。 第一和第二结构可以是第一和第二电子部件，其可以是探针卡组件的部件。

    Air bridge structures and methods of making and using air bridge structures
    139.
    发明授权
    Air bridge structures and methods of making and using air bridge structures 失效
    空中桥梁结构及制造和使用空气桥梁结构的方法

    公开(公告)号：US07729878B2

    公开(公告)日：2010-06-01

    申请号：US12259791

    申请日：2008-10-28

    申请人： Gaetan L. Mathieu

    发明人： Gaetan L. Mathieu

    IPC分类号： G06F11/30 ,  G06F17/40 ,  G06F19/00

    CPC分类号： G06F11/30 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/00 ,  B33Y70/00 ,  G01R1/07378 ,  G01R3/00 ,  G01R31/2889 ,  H01L2224/48091 ,  H01L2224/48464 ,  H01L2924/00014

    摘要： A probe card assembly, according to some embodiments of the invention, can comprise a tester interface configured to make electrical connections with a test controller, a plurality of electrically conductive probes disposed to contact terminals of an electronic device to be tested, and a plurality of electrically conductive data paths connecting the tester interface and the probes. At least one of the data paths can comprise an air bridge structure trace comprising an electrically conductive trace spaced away from an electrically conductive plate by a plurality of pylons.

    摘要翻译： 根据本发明的一些实施例的探针卡组件可以包括测试器接口，其被配置为与测试控制器进行电连接，多个导电探针被设置成接触要测试的电子设备的端子，以及多个 连接测试仪接口和探头的导电数据路径。 数据路径中的至少一个可以包括空气桥结构迹线，其包括通过多个塔架与导电板间隔开的导电迹线。