公开(公告)号：WO9524730A3

公开(公告)日：1996-02-15

申请号：PCT/US9502678

申请日：1995-03-09

Applicant: PANDA PROJECT

Inventor： CRANE STANFORD W JR ,  PORTUONDO MARIA M

IPC: H05K1/18 ,  H01L23/498 ,  H05K1/11 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/46 ,  H01L

CPC classification number: H01L23/49861 ,  H01L23/49811 ,  H01L2924/0002 ,  H01L2924/181 ,  H05K1/112 ,  H05K3/308 ,  H05K3/321 ,  H05K3/3421 ,  H05K3/4623 ,  H05K2201/09472 ,  H05K2201/09536 ,  H05K2201/09645 ,  H05K2201/10189 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10704 ,  H05K2201/10772 ,  H05K2201/10893 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49149 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An apparatus comprising a multi-layer substrate (10) including a plurality of layers of insulative material (12), at least one well (15) formed in at least one of the layers, the well (15) extending from an outer surface of the multi-layer substrate to an inner surface of the multi-layer substrate, and an electrically conductive component (13) formed within the well (15) on the inner surface of the multi-layer substrate; and a device having at least one electrically conductive lead or wire (11) extending into the well (15) and being in direct physical contact with the electrically conductive component (13) formed on the inner surface of the multi-layer substrate. Also, a method of manufacturing an apparatus comprising the steps of forming a multi-layer substrate (10) including a plurality of layers of insulative material (12), at least one well (15) formed in at least one of the layers, the well (15) extending from an outer surface of the multi-layer substrate to an inner surface of the multi-layer substrate, and an electrically conductive component (13) formed within the well (15) on the inner surface of the multi-layer substrate; and extending at least one electrically conductive lead or wire (11) from a device into the well (15) such that the lead or wire is in direct physical contact with the electrically conductive component (13) formed on the inner surface of the multi-layer substrate.

Abstract translation: 半导体管芯封装（30）包括多个导电引线（11）和用于承载电信号的多层结构（10），所述多层结构（10）包括多层绝缘材料（12a-12d ），每个层包括在该层的相对侧上的第一表面和第二表面。 每个引线（11）延伸到完全延伸通过至少一个层的相应的阱（15），并且在一个层的一个表面上底部，阱（15）不通过该表面延伸并电耦合 涉及形成在其对应的井（15）内的导电接合结构（13）。

公开(公告)号：WO1995024730A2

公开(公告)日：1995-09-14

申请号：PCT/US1995002678

申请日：1995-03-09

Applicant: THE PANDA PROJECT

Inventor： THE PANDA PROJECT ,  CRANE, Stanford, W., Jr. ,  PORTUONDO, Maria, M.

IPC: H01L00/00

CPC classification number: H01L23/49861 ,  H01L23/49811 ,  H01L2924/0002 ,  H01L2924/181 ,  H05K1/112 ,  H05K3/308 ,  H05K3/321 ,  H05K3/3421 ,  H05K3/4623 ,  H05K2201/09472 ,  H05K2201/09536 ,  H05K2201/09645 ,  H05K2201/10189 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10704 ,  H05K2201/10772 ,  H05K2201/10893 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49149 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An apparatus comprising a multi-layer substrate including a plurality of layers of insulative material, at least one well formed in at least one of the layers, the well extending from an outer surface of the multi-layer substrate to an inner surface of the multi-layer substrate, and an electrically conductive component formed within the well on the inner surface of the multi-layer substrate; and a device having at least one electrically conductive lead or wire extending into the well and being in direct physical contact with the electrically conductive component formed on the inner surface of the multi-layer substrate. Also, a method of manufacturing an apparatus comprising the steps of forming a multi-layer substrate including a plurality of layers of insulative material, at least one well formed in at least one of the layers, the well extending from an outer surface of the multi-layer substrate to an inner surface of the multi-layer substrate, and an electrically conductive component formed within the well on the inner surface of the multi-layer substrate; and extending at least one electrically conductive lead or wire from a device into the well such that the lead or wire is in direct physical contact with the electrically conductive component formed on the inner surface of the multi-layer substrate.

Abstract translation: 一种包括多层衬底的装置，所述多层衬底包括多层绝缘材料，至少一个阱形成在至少一层中，所述阱从所述多层衬底的外表面延伸到所述多层衬底的内表面 以及在所述多层基板的内表面上的所述阱内形成的导电部件; 以及具有延伸到阱中的至少一个导电引线或导线并与形成在多层基板的内表面上的导电部件直接物理接触的器件。 另外，制造装置的方法包括以下步骤：形成包括多层绝缘材料的多层基板，至少一层形成在至少一层中的阱，所述阱从多层的外表面延伸 在多层基板的内表面上形成有在多层基板的内表面上的导电部件， 并且将至少一个导电引线或线从器件延伸到阱中，使得引线或引线与形成在多层衬底的内表面上的导电部件直接物理接触。

公开(公告)号：WO1995014314A1

公开(公告)日：1995-05-26

申请号：PCT/US1994013373

申请日：1994-11-16

Applicant: FORMFACTOR, INC.

Inventor： FORMFACTOR, INC. ,  KHANDROS, Igor, Y. ,  MATHIEU, Gaetan, L.

IPC: H01R09/00

CPC classification number: H05K7/1069 ,  B23K2101/40 ,  G01R1/0466 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/06716 ,  G01R1/06761 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07357 ,  G01R3/00 ,  G01R31/2884 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/67138 ,  H01L21/6715 ,  H01L22/20 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/06153 ,  H01L2224/1134 ,  H01L2224/13083 ,  H01L2224/13099 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/136 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85045 ,  H01L2224/85205 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01055 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49124 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49162 ,  Y10T29/49169 ,  Y10T29/49217 ,  Y10T29/49224 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/81205

Abstract: An interconnection contact structure assembly including an electronic component (102) having a surface and a conductive contact terminal (103) carried by the electronic component (102) and accessible at the surface. The contact structure (101) includes an internal flexible elongate member (106) having first (107) and second ends (108) and with the first end (107) forming a first intimate bond to the surface of the conductive contact terminal (103) without the use of a separate bonding material. An electrically conductive shell (116) is provided and is formed of at least one layer of a conductive material enveloping the elongate member (106) and forming a second intimate bond with at least a portion of the conductive contact terminal immediately adjacent the first intimate bond.

Abstract translation: 一种互连接触结构组件，包括具有表面的电子部件（102）和由所述电子部件（102）承载且可在所述表面处接近的导电接触端子（103）。 接触结构（101）包括具有第一（107）和第二端（108）的内部柔性细长构件（106），并且第一端（107）形成与导电接触端子（103）的表面的第一紧密接合， 而不使用单独的粘合材料。 提供导电外壳（116）并且由至少一层导电材料形成，该导电材料包围细长构件（106），并形成与紧邻第一紧密接合点的导电接触端子的至少一部分的第二紧密接合 。

公开(公告)号：WO1994008442A1

公开(公告)日：1994-04-14

申请号：PCT/US1993009190

申请日：1993-09-27

Applicant: IRVINE SENSORS CORPORATION

Inventor： IRVINE SENSORS CORPORATION ,  PEPE, Angel, A. ,  REINKER, David, M. ,  MINAHAN, Joseph, A.

IPC: H05K03/36

CPC classification number: H01L24/16 ,  H01L24/75 ,  H01L24/81 ,  H01L25/50 ,  H01L27/14634 ,  H01L27/1465 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/16237 ,  H01L2224/75 ,  H01L2224/81141 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  Y10T29/49144 ,  Y10T29/49149 ,  H01L2224/13099 ,  H01L2224/29099 ,  H01L2924/00

Abstract: A method and product are disclosed in which multiple solder bumps (76) on a first planar surface (66) are guided into engagement with terminals (76) on a second planar surface (72) by means of holes (80) formed (by a photolithographic process) in a dielectric layer (78), which has been added to the second surface (72) to provide the holes (80) (or sockets) through which the solder bumps (76) (or plugs) extend. The perforated (hole-providing) layer may be formed of one of several materials. The preferred perforated layer material is a photo-definable polyamide, which is hardened by heating after the holes have been formed. Small solder bumps (84) may be formed inside the holes (80) on the second surface (72), in order to facilitate bonding between the solder bumps (76) on the first surface (66) and the terminals (70) on the second surface (72).

Abstract translation: 公开了一种方法和产品，其中第一平面表面（66）上的多个焊料凸块（76）通过孔（80）引导到与第二平坦表面（72）上的端子（76）接合，所述孔（80）形成 已经添加到第二表面（72）中以提供焊料凸块（76）（或插塞）延伸穿过的孔（或插座）的电介质层（78）中的光刻工艺。 穿孔（空穴提供）层可以由几种材料之一形成。 优选的穿孔层材料是光可定义的聚酰胺，其在形成孔之后通过加热而硬化。 可以在第二表面（72）上的孔（80）内部形成小的焊料凸点（84），以便促进第一表面（66）上的焊料凸点（76）与第一表面（66）上的端子 第二表面（72）。

公开(公告)号：WO1991011833A1

公开(公告)日：1991-08-08

申请号：PCT/US1991000359

申请日：1991-01-17

Applicant: COMMTECH INTERNATIONAL

Inventor： COMMTECH INTERNATIONAL ,  MADOU, Marc, J. ,  GAISFORD, Scott

IPC: H01R09/00

CPC classification number: H01L25/50 ,  H01L23/481 ,  H01L23/49827 ,  H01L2224/16237 ,  H05K3/3436 ,  H05K2201/0367 ,  H05K2201/09472 ,  Y02P70/613 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49149 ,  Y10T29/53174

Abstract: A solder interconnection for forming vias between first and second substrates (12, 14) comprises a plurality of solder containing wells (16) extending into a flat surface (18) of the first substrate (12), the solder (20) in each well (16) being soldered to one of a corresponding plurality of conductor posts (22) extending outwardly from a flat surface (23) of the second substrate (14). The plurality of the wells (16) are created in a pattern, an aliquot of solder (20) is deposited in each well (16), with the aliquot being of substantially no greater volume than that of the well (16) it occupies, the posts (22) are provided in aligned array with the pattern, the solder (20) is melted, the posts (22) are inserted and the solder (20) solidifies. Very closely placed vias can be formed.

公开(公告)号：WO2015191261A1

公开(公告)日：2015-12-17

申请号：PCT/US2015/031728

申请日：2015-05-20

Applicant: HONEYWELL INTERNATIONAL INC.

Inventor： ARUL, Antony ,  RANGARAJULU, Gopalakrishnan ,  MEIJER, Bart

IPC: H01R31/06 ,  H01R24/38

CPC classification number: H01R13/6625 ,  H01Q1/002 ,  H01R24/48 ,  H01R43/005 ,  H04B5/0012 ,  Y10T29/49149

Abstract: An intrinsic safe in-line adaptor with an integrated capacitive barrier for connecting a wireless module with an antenna. The in-line adaptor (e.g., N-type to N- type) can be designed to include an intrinsic safe circuit and the integrated capacitive barrier. The intrinsic safe circuit further includes a multi-layer PCB and the PCB can be potted and sealed with a mechanical metal casing. The intrinsic safe capacitive barrier can be integrated with a coaxial connector and mounted as part of a flameproof enclosure to meet an explosion safety standard and an intrinsic safety requirement. The mechanical metal casing can be isolated by the enclosure (e.g., rubber) to meet isolation requirements. The wireless module can be directly connected with the antenna utilizing the in-line adaptor via the coaxial connector and without any specific cable assembly.

Abstract translation: 具有集成电容性屏障的固有安全在线适配器，用于将无线模块与天线连接起来。 在线适配器（例如，N型至N型）可以被设计为包括本征安全电路和集成电容屏障。 本征安全电路还包括多层PCB，PCB可以用机械金属外壳进行封装和密封。 本征安全电容屏障可与同轴连接器集成，并作为防火外壳的一部分安装，以符合爆炸安全标准和本质安全要求。 机械金属外壳可以通过外壳（例如橡胶）隔离，以满足隔离要求。 无线模块可以通过同轴连接器直接与天线直接连接，并且不需要任何特定的电缆组件。

公开(公告)号：WO2014104516A1

公开(公告)日：2014-07-03

申请号：PCT/KR2013/006651

申请日：2013-07-24

Applicant: 하나마이크론㈜

Inventor： 옥진영

IPC: H01L25/16 ,  H01L23/64

CPC classification number: H05K1/14 ,  H01L21/486 ,  H01L21/568 ,  H01L23/147 ,  H01L23/5384 ,  H01L24/19 ,  H01L24/96 ,  H01L25/0652 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/2518 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19104 ,  H01L2924/19105 ,  H05K1/115 ,  H05K1/181 ,  H05K1/185 ,  H05K3/181 ,  H05K3/26 ,  H05K3/303 ,  H05K3/32 ,  H05K3/4038 ,  H05K3/4602 ,  H05K2201/10159 ,  H05K2201/10378 ,  H05K2201/1053 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2203/0191 ,  H05K2203/1469 ,  Y02P70/611 ,  Y10T29/49131 ,  Y10T29/49149 ,  H01L2924/00

Abstract: 본 발명의 인터포저가 임베디드 되는 회로 보드는 제1관통 전극이 탑사이드와 백사이드를 전기적으로 연결하는 인터포저, 및 상기 인터포저가 임베디드 되되 상기 인터포저의 탑사이드와 백사이드는 노출되는 몰딩 부재를 포함한다. 본 발명에 의하면, 요구되는 관통 홀(through hole)의 파인 피치에 따라 절연체의 몰딩 부재와 반도체의 인터포저를 적절하게 선택하여 결합할 수 있고, 인터포저가 반도체 칩과 실질적으로 동일 레벨에서 몰딩되기 때문에, 인터포저를 임베디드 하기 위한 별도의 공정이 추가되지 않는다.

Abstract translation: 本发明涉及一种嵌入其中的内插器的电路板，包括：插入件，其顶侧和背面通过第一通孔电连接; 以及嵌入在其中并且插入件的顶侧和背面暴露的模制构件。 根据本发明，绝缘体的成型构件和半导体的插入件可以根据通孔的所需精细间距适当地选择和耦合，并且插入器被模制在与半导体芯片基本相同的水平上 ，因此不需要添加用于嵌入插件的附加处理。

公开(公告)号：WO2014092248A1

公开(公告)日：2014-06-19

申请号：PCT/KR2013/002165

申请日：2013-03-18

Applicant: 하나마이크론(주)

Inventor： 임재성 ,  김주형

IPC: H01L23/50 ,  H01L23/12

CPC classification number: H05K1/028 ,  H01L23/5387 ,  H01L2924/0002 ,  H05K1/117 ,  H05K1/118 ,  H05K1/189 ,  H05K3/323 ,  H05K3/40 ,  H05K5/0004 ,  H05K2201/10159 ,  Y10T29/49149 ,  H01L2924/00

Abstract: 메모리 카드 시스템은 유연 집적 회로 소자 패키지, 상부 유연 케이스, 하부 유연 케이스, 배선 구조, 이방성 전도 필름 등을 포함할 수 있다. 집적 회로 소자 패키지는 휘어질 수 있는 물질을 포함할 수 있고, 접속 패드를 가질 수 있다. 상부 케이스는 휘어질 수 있는 물질을 포함할 수 있고, 유연 집적 회로 소자 패키지를 덮을 수 있다. 하부 케이스는 휘어질 수 있는 물질을 포함할 수 있고, 유연 집적 회로 소자 패키지가 고정될 수 있다. 배선 구조는 휘어질 수 있는 물질을 포함할 수 있고, 상부 케이스의 내측 표면에 구비되는 연결 배선, 상부 케이스의 외측 표면에 구비되는 접속 핀 및 상부 케이스를 관통하는 비아 배선을 포함할 수 있다. 이방성 전도 필름은 집적 회로 소자 패키지와 상부 케이스 사이에 배치될 수 있고, 접속 패드와 연결 배선을 전기적으로 연결할 수 있다.

Abstract translation: 本发明涉及一种存储卡系统，其可以包括柔性集成电路元件封装，柔性上壳体，柔性下壳体，布线结构，各向异性导电膜等。 集成电路元件封装可以包括可弯曲材料，并且可以具有连接焊盘。 上壳体可以包括可弯曲材料，并且可以覆盖柔性集成电路元件封装。 下壳体可以包括可弯曲材料，并且可以使柔性集成电路元件封装件固定到其上。 布线结构可以包括可弯曲材料，并且可以包括布置在上壳体的内表面上的连接线，布置在上壳体的外表面上的连接销和穿过上壳体的通孔线。 各向异性导电膜可以插入在集成电路元件封装和上壳体之间，并且可以将连接焊盘和连接线电连接。

公开(公告)号：WO2013059181A1

公开(公告)日：2013-04-25

申请号：PCT/US2012/060402

申请日：2012-10-16

Applicant: INVENSAS CORPORATION

Inventor： CHAU, Ellis ,  CO, Reynaldo ,  ALATORRE, Roseann ,  DAMBERG, Philip ,  WANG, Wei-shun ,  YANG, Se, Young ,  ZHAO, Zhijun

IPC: H01L25/10 ,  H01L23/31 ,  H01L23/495 ,  H01L23/498 ,  H01L21/48

CPC classification number: H01L24/85 ,  H01L21/4853 ,  H01L21/56 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/3677 ,  H01L23/4334 ,  H01L23/49517 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/06 ,  H01L24/16 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/78 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/45565 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/48997 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/851 ,  H01L2224/8518 ,  H01L2224/85399 ,  H01L2224/85951 ,  H01L2224/85986 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06558 ,  H01L2225/06562 ,  H01L2225/06565 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1029 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2225/1094 ,  H01L2924/00011 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/12042 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/1715 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/3511 ,  H05K3/3436 ,  H05K2201/10515 ,  H05K2201/1053 ,  Y10T29/49149 ,  Y10T29/49151 ,  H01L2224/45664 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076

Abstract: A microelectronic package (10) can include wire bonds (32) having bases (34) bonded to respective conductive elements (28) on a substrate (12) and ends (36) opposite the bases (34). A dielectric encapsulation layer (42) extends from the substrate (12) and covers portions of the wire bonds (32) such that covered portions of the wire bonds (32) are separated from one another by the encapsulation layer (42), wherein unencapsulated portions (39) of the wire bonds (32) are defined by portions of the wire bonds (32) which are uncovered by the encapsulation layer (42). Unencapsulated portions (39) can be disposed at positions in a pattern having a minimum pitch which is greater than a first minimum pitch between bases (34) of adjacent wire bonds (32).

Abstract translation: 微电子封装（10）可以包括具有接合到衬底（12）上的相应导电元件（28）的基部（34）和与基底（34）相对的端部（36）的引线接合（32）。 电介质封装层（42）从衬底（12）延伸并且覆盖引线接合部分（32），使得引线键合的被覆部分（32）通过封装层（42）彼此分开，其中未封装 引线键合（32）的部分（39）由未被封装层（42）覆盖的引线键合（32）的部分限定。 未包封部分（39）可以布置在具有最小间距的图案的位置处，该最小间距大于相邻引线键合（32）的基部（34）之间的第一最小间距。

公开(公告)号：WO2011158666A1

公开(公告)日：2011-12-22

申请号：PCT/JP2011/062779

申请日：2011-06-03

Applicant: ソニーケミカル&インフォメーションデバイス株式会社 ,  五十嵐 智

Inventor： 五十嵐　智

IPC: H01L21/60 ,  C09J5/06 ,  C09J9/02 ,  C09J11/04 ,  C09J133/00 ,  H01R11/01 ,  H01R43/00 ,  H05K3/32

CPC classification number: H01R43/0242 ,  C08F2230/085 ,  C08G2650/56 ,  C09J163/00 ,  C09J163/10 ,  C09J171/00 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29311 ,  H01L2224/29313 ,  H01L2224/83855 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01R4/04 ,  H05K3/323 ,  H05K2203/0425 ,  Y10T29/49149 ,  Y10T428/24826 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2924/01048 ,  H01L2924/00012 ,  H01L2224/29309 ,  H01L2924/00014

Abstract: 　電気素子を配線基板にハンダ粒子を利用して異方性導電接続する際、熱硬化性接着剤の本加熱温度を低下させ、良好な接続信頼性を実現するために、配線基板と電気素子とを異方性導電接続により接続構造体の製造をする際に、異方性導電接着剤として、溶融温度Ｔｓのハンダ粒子が最低溶融粘度温度Ｔｖの絶縁性のアクリル系熱硬化性樹脂中に分散したものを使用する。第１加熱加圧工程では、異方性導電接着剤を溶融流動させて配線基板と電気素子との間隙からプレスアウトさせ、予備硬化させる。第２加熱加圧工程では、ハンダ粒子を溶融させて配線基板の電極と電気素子の電極との間に金属結合を形成させ、異方性導電接着剤を本硬化させる。第１加熱加圧工程の加熱温度をＴ１、加圧圧力をＰ１、第２加熱加圧工程の加熱温度をＴ２、加圧圧力をＰ２としたときに、Ｔｖ＜Ｔ１＜Ｔｓ＜Ｔ２、Ｐ１＞Ｐ２を満足する。

Abstract translation: 在通过布线基板的各向异性导电连接到电气元件的连接结构的制造中，为了通过降低在各向异性导电连接中的热可固化粘合剂的主加热的温度来实现良好的连接可靠性 使用焊料粒子的布线基板的电气元件，将具有熔融温度（Ts）的焊料粒子分散在具有最低熔融粘度温度（Tv）的绝缘丙烯酸系热固性树脂中制造的材料用作各向异性导电粘合剂。 在第一加热/加压步骤中，各向异性导电粘合剂被熔融流化以使粘合剂从布线基板和电气元件之间的间隙压出，并且粘合剂被预固化。 在第二加热/加压步骤中，焊料颗粒熔化以在布线基板的电极和电气元件的电极之间形成金属接合，并且各向异性导电粘合剂固化。 满足以下公式的要求：Tv P2，其中T1表示所用的加热温度，P1表示在第一加热/加压步骤中施加的压力，T2表示加热温度 P2表示在第二加热/加压步骤中施加的压力。