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公开(公告)号:CN104885217A
公开(公告)日:2015-09-02
申请号:CN201380067609.4
申请日:2013-10-18
申请人: 泰塞拉公司
IPC分类号: H01L25/065 , H01L23/00 , G06K19/077 , H01L23/495
CPC分类号: G06K19/07747 , H01L23/13 , H01L23/3121 , H01L23/4951 , H01L23/49575 , H01L23/49816 , H01L24/06 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/50 , H01L24/73 , H01L24/81 , H01L25/0652 , H01L25/0657 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/06155 , H01L2224/06156 , H01L2224/13017 , H01L2224/13082 , H01L2224/131 , H01L2224/13111 , H01L2224/13147 , H01L2224/14154 , H01L2224/16058 , H01L2224/16238 , H01L2224/26155 , H01L2224/291 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48227 , H01L2224/4824 , H01L2224/4826 , H01L2224/49111 , H01L2224/50 , H01L2224/73203 , H01L2224/73215 , H01L2224/73219 , H01L2224/73253 , H01L2224/73265 , H01L2224/81191 , H01L2224/81193 , H01L2224/81805 , H01L2225/0651 , H01L2225/06517 , H01L2225/06562 , H01L2225/06589 , H01L2924/00014 , H01L2924/01322 , H01L2924/07811 , H01L2924/1431 , H01L2924/1435 , H01L2924/1436 , H01L2924/1438 , H01L2924/15311 , H01L2924/3011 , H01L2924/00012 , H01L2924/014 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: 一种微电子封装(1310)可包括具有第一表面和第二表面(1341,1342)的衬底(1340),以及第一微电子元件和第二微电子元件(1320,1330)。衬底(1340)可具有在第一表面(1341)处的多个衬底触点(1347a,1347b)和在第二表面(1342)处的多个端子(1350)。微电子元件(1320,1330)的元件触点(1324,1334)可与相应的衬底触点(1347a,1347b)相联接。第二微电子元件(1330)的前表面(1331)可部分地覆盖且附接至第一微电子元件(1320)的后表面(1322)。第一微电子元件(1320)的元件触点(1324)可布置在面阵中且与衬底触点(1347a)倒装芯片键合。第二微电子元件(1330)的元件触点(1334)可通过导电块(1375)与衬底触点(1347b)相联接。
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公开(公告)号:CN103531560A
公开(公告)日:2014-01-22
申请号:CN201310533175.4
申请日:2013-10-31
申请人: 矽力杰半导体技术(杭州)有限公司
发明人: 谭小春
CPC分类号: H01L24/17 , H01L23/31 , H01L23/3107 , H01L23/49503 , H01L23/49548 , H01L23/49572 , H01L24/81 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/14154 , H01L2224/16245 , H01L2224/1703 , H01L2224/81193 , H01L2924/00014 , H01L2924/01029 , H01L2924/181 , H01L2924/182 , H01L2924/00 , H01L2224/818
摘要: 本发明提供了一种芯片的封装结构及其制造方法,包括:承载盘、芯片、多个第一导电块和塑封料;所述承载盘的正面具有多个凸起焊盘;所述芯片具有一有源面,所述第一导电块的一端与所述有源面电连接,所述第一导电块的另一端与所述凸起焊盘电连接;所述塑封料包围所述芯片并填满所述承载盘和所述芯片之间的空间。在本发明提供的芯片的封装结构及其制造方法中,通过刻蚀在承载盘的正面形成凸起焊盘,在凸起焊盘与芯片的有源面实现电连接的同时,增大了塑封料在芯片与承载盘之间的流通通道,使得塑封料能够填满芯片与承载盘之间的空间,因此塑封之前不必进行底部填充工艺,降低了封装成本。
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公开(公告)号:CN1988133A
公开(公告)日:2007-06-27
申请号:CN200610171222.5
申请日:2006-12-21
申请人: 三洋电机株式会社
发明人: 野间崇
IPC分类号: H01L21/82 , H01L27/146 , H01L23/48 , H04N5/225
CPC分类号: H01L27/14618 , H01L23/3164 , H01L24/05 , H01L24/11 , H01L24/13 , H01L27/14687 , H01L2224/0401 , H01L2224/04042 , H01L2224/05124 , H01L2224/05147 , H01L2224/05571 , H01L2224/05573 , H01L2224/05644 , H01L2224/05655 , H01L2224/06154 , H01L2224/10125 , H01L2224/1131 , H01L2224/1132 , H01L2224/11462 , H01L2224/1148 , H01L2224/11849 , H01L2224/13022 , H01L2224/131 , H01L2224/13144 , H01L2224/14135 , H01L2224/14154 , H01L2224/16225 , H01L2224/16227 , H01L2224/48091 , H01L2224/48227 , H01L2224/81141 , H01L2924/00013 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01057 , H01L2924/01072 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/15788 , H04N5/2257 , H01L2924/00014 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2224/05552 , H01L2924/00
摘要: 一种封装型半导体装置及其制造方法,其谋求不使制造工序复杂化而提高可靠性及成品率。在形成平头电极(4)的半导体基板(2)的表面形成树脂层(6)及支承体(7)。蚀刻除去树脂层(6)及支承体(7)而露出平头电极(4)。如图3(c)所示,该蚀刻同时除去隔着切割线DL相向的两个导电端子形成区域(9)和其间连续区域上的支承体(7),而形成开口部(10)。之后,在开口部(10)露出的平头电极(4)上,形成金属层(11),进而形成导电端子(12)。最后,通过沿切割线DL切割而将半导体基板(2)分割为各个半导体芯片。
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公开(公告)号:CN103515305B
公开(公告)日:2017-05-24
申请号:CN201210558608.7
申请日:2012-12-20
申请人: 台湾积体电路制造股份有限公司
IPC分类号: H01L21/768 , H01L21/56 , H01L23/31 , H01L23/535
CPC分类号: H01L25/0652 , H01L21/561 , H01L21/563 , H01L21/568 , H01L21/76898 , H01L23/3135 , H01L23/3171 , H01L23/49816 , H01L23/5389 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/81 , H01L24/92 , H01L24/96 , H01L25/03 , H01L25/0657 , H01L25/50 , H01L2224/02372 , H01L2224/02379 , H01L2224/0401 , H01L2224/04105 , H01L2224/05569 , H01L2224/05571 , H01L2224/05572 , H01L2224/05655 , H01L2224/05666 , H01L2224/11002 , H01L2224/1132 , H01L2224/11334 , H01L2224/1134 , H01L2224/1145 , H01L2224/11462 , H01L2224/11849 , H01L2224/12105 , H01L2224/13023 , H01L2224/13024 , H01L2224/13082 , H01L2224/131 , H01L2224/13147 , H01L2224/14134 , H01L2224/14144 , H01L2224/14154 , H01L2224/14164 , H01L2224/14181 , H01L2224/17181 , H01L2224/2919 , H01L2224/73204 , H01L2224/81005 , H01L2224/81191 , H01L2224/81815 , H01L2224/81895 , H01L2224/83104 , H01L2224/9202 , H01L2224/96 , H01L2224/97 , H01L2225/06513 , H01L2225/06517 , H01L2225/06524 , H01L2225/06527 , H01L2225/06541 , H01L2225/06562 , H01L2225/06568 , H01L2924/15787 , H01L2924/181 , H01L2924/18162 , H01L2924/351 , H01L2224/11 , H01L2924/00014 , H01L2224/03 , H01L2224/81 , H01L2924/00 , H01L2924/014 , H01L2924/0665
摘要: 本发明提供了3D IC堆叠半导体器件及制造方法。在实施例中,两个或多个半导体管芯连接至载体并被封装。露出两个或更多半导体管芯的连接件,并且减薄两个或更多半导体管芯以在相对侧上形成连接件。然后,可以以偏离或悬突位置放置附加半导体管芯。
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公开(公告)号:CN100536111C
公开(公告)日:2009-09-02
申请号:CN200610171222.5
申请日:2006-12-21
申请人: 三洋电机株式会社
发明人: 野间崇
IPC分类号: H01L21/82 , H01L27/146 , H01L23/48 , H04N5/225
CPC分类号: H01L27/14618 , H01L23/3164 , H01L24/05 , H01L24/11 , H01L24/13 , H01L27/14687 , H01L2224/0401 , H01L2224/04042 , H01L2224/05124 , H01L2224/05147 , H01L2224/05571 , H01L2224/05573 , H01L2224/05644 , H01L2224/05655 , H01L2224/06154 , H01L2224/10125 , H01L2224/1131 , H01L2224/1132 , H01L2224/11462 , H01L2224/1148 , H01L2224/11849 , H01L2224/13022 , H01L2224/131 , H01L2224/13144 , H01L2224/14135 , H01L2224/14154 , H01L2224/16225 , H01L2224/16227 , H01L2224/48091 , H01L2224/48227 , H01L2224/81141 , H01L2924/00013 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01057 , H01L2924/01072 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/15788 , H04N5/2257 , H01L2924/00014 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2224/05552 , H01L2924/00
摘要: 一种封装型半导体装置及其制造方法,其谋求不使制造工序复杂化而提高可靠性及成品率。在形成平头电极(4)的半导体基板(2)的表面形成树脂层(6)及支承体(7)。蚀刻除去树脂层(6)及支承体(7)而露出平头电极(4)。如图3(c)所示,该蚀刻同时除去隔着切割线DL相向的两个导电端子形成区域(9)和其间连续区域上的支承体(7),而形成开口部(10)。之后,在开口部(10)露出的平头电极(4)上,形成金属层(11),进而形成导电端子(12)。最后,通过沿切割线DL切割而将半导体基板(2)分割为各个半导体芯片。
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公开(公告)号:CN107731773A
公开(公告)日:2018-02-23
申请号:CN201611010456.1
申请日:2016-11-17
申请人: 艾马克科技公司
IPC分类号: H01L23/492 , H01L23/498
CPC分类号: H01L24/14 , H01L23/49816 , H01L23/49838 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/81 , H01L2224/06051 , H01L2224/06177 , H01L2224/11849 , H01L2224/119 , H01L2224/13012 , H01L2224/13014 , H01L2224/13015 , H01L2224/13016 , H01L2224/13017 , H01L2224/131 , H01L2224/14051 , H01L2224/14131 , H01L2224/14133 , H01L2224/14135 , H01L2224/14141 , H01L2224/14151 , H01L2224/14153 , H01L2224/14154 , H01L2224/14177 , H01L2224/81815 , H01L2924/10156 , H01L2924/15311 , H01L21/78 , H01L2924/00012 , H01L2924/00014 , H01L2924/014 , H01L23/492
摘要: 一种用于半导体装置的衬底。所提供为用于优化芯片/衬底上的半导体装置的数目的揭示。所述优化包括有效率地布置、切割和包装所述装置。
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公开(公告)号:CN105931954A
公开(公告)日:2016-09-07
申请号:CN201610104398.2
申请日:2016-02-25
申请人: 株式会社日立功率半导体
CPC分类号: H02M7/537 , H01L21/283 , H01L21/78 , H01L23/4827 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/94 , H01L25/0657 , H01L25/16 , H01L25/50 , H01L29/45 , H01L2224/0345 , H01L2224/03462 , H01L2224/039 , H01L2224/03901 , H01L2224/0401 , H01L2224/04026 , H01L2224/05083 , H01L2224/05124 , H01L2224/05166 , H01L2224/05558 , H01L2224/05624 , H01L2224/05655 , H01L2224/06181 , H01L2224/13022 , H01L2224/13387 , H01L2224/1403 , H01L2224/14131 , H01L2224/14135 , H01L2224/14154 , H01L2224/14177 , H01L2224/16145 , H01L2224/16238 , H01L2224/29147 , H01L2224/29387 , H01L2224/32227 , H01L2224/32245 , H01L2224/33181 , H01L2224/81447 , H01L2224/8184 , H01L2224/83065 , H01L2224/83203 , H01L2224/83447 , H01L2224/8384 , H01L2224/92 , H01L2224/94 , H01L2225/06513 , H01L2225/06517 , H01L2924/01013 , H01L2924/1203 , H01L2924/13055 , H01L2924/3511 , H02M7/003 , H01L2924/00014 , H01L2924/01014 , H01L2224/03 , H01L2924/0541 , H01L2924/01029 , H01L2924/00012 , H01L2224/1413 , H01L2224/1415 , H01L2224/03464 , H01L21/304 , H01L21/22 , H01L21/28 , H02M7/00
摘要: 本发明提供能减低成膜的Ni电极膜的膜缺损的半导体装置、半导体装置的制造方法以及电力变换装置。半导体装置(100)在形成半导体元件(150)的半导体基板(108)的n+型半导体层(108c)的第1表面(108d)具备:第1半导体芯片的电极结构体(151),其与该半导体元件(150)电连接,按照Al或Al合金所构成的第1Al金属层(105)、Cu扩散防止层(107)、Al或Al合金所构成的第2Al金属层(106)、以及Ni层(104)的顺序将它们形成;和导电构件(102),其配置在Ni层(104)的表面(104a),经由铜烧结层(103)与第1半导体芯片的电极结构体(151)接合,第2Al金属层(106)的表面(106a)的Al晶粒的结晶面方位主要为(110)面。
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公开(公告)号:CN103515305A
公开(公告)日:2014-01-15
申请号:CN201210558608.7
申请日:2012-12-20
申请人: 台湾积体电路制造股份有限公司
IPC分类号: H01L21/768 , H01L21/56 , H01L23/31 , H01L23/535
CPC分类号: H01L25/0652 , H01L21/561 , H01L21/563 , H01L21/568 , H01L21/76898 , H01L23/3135 , H01L23/3171 , H01L23/49816 , H01L23/5389 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/81 , H01L24/92 , H01L24/96 , H01L25/03 , H01L25/0657 , H01L25/50 , H01L2224/02372 , H01L2224/02379 , H01L2224/0401 , H01L2224/04105 , H01L2224/05569 , H01L2224/05571 , H01L2224/05572 , H01L2224/05655 , H01L2224/05666 , H01L2224/11002 , H01L2224/1132 , H01L2224/11334 , H01L2224/1134 , H01L2224/1145 , H01L2224/11462 , H01L2224/11849 , H01L2224/12105 , H01L2224/13023 , H01L2224/13024 , H01L2224/13082 , H01L2224/131 , H01L2224/13147 , H01L2224/14134 , H01L2224/14144 , H01L2224/14154 , H01L2224/14164 , H01L2224/14181 , H01L2224/17181 , H01L2224/2919 , H01L2224/73204 , H01L2224/81005 , H01L2224/81191 , H01L2224/81815 , H01L2224/81895 , H01L2224/83104 , H01L2224/9202 , H01L2224/96 , H01L2224/97 , H01L2225/06513 , H01L2225/06517 , H01L2225/06524 , H01L2225/06527 , H01L2225/06541 , H01L2225/06562 , H01L2225/06568 , H01L2924/15787 , H01L2924/181 , H01L2924/18162 , H01L2924/351 , H01L2224/11 , H01L2924/00014 , H01L2224/03 , H01L2224/81 , H01L2924/00 , H01L2924/014 , H01L2924/0665
摘要: 本发明提供了3D IC堆叠半导体器件及制造方法。在实施例中,两个或多个半导体管芯连接至载体并被封装。露出两个或更多半导体管芯的连接件,并且减薄两个或更多半导体管芯以在相对侧上形成连接件。然后,可以以偏离或悬突位置放置附加半导体管芯。
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公开(公告)号:CN206558494U
公开(公告)日:2017-10-13
申请号:CN201621232512.1
申请日:2016-11-17
申请人: 艾马克科技公司
IPC分类号: H01L23/48 , H01L23/488
CPC分类号: H01L24/14 , H01L23/49816 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/81 , H01L2224/06051 , H01L2224/06177 , H01L2224/11849 , H01L2224/119 , H01L2224/13012 , H01L2224/13014 , H01L2224/13015 , H01L2224/13016 , H01L2224/13017 , H01L2224/131 , H01L2224/14051 , H01L2224/14131 , H01L2224/14133 , H01L2224/14135 , H01L2224/14141 , H01L2224/14151 , H01L2224/14153 , H01L2224/14154 , H01L2224/14177 , H01L2224/81815 , H01L2924/10156 , H01L2924/15311 , H01L21/78 , H01L2924/00012 , H01L2924/00014 , H01L2924/014
摘要: 一种衬底及包括互连件的衬底。本实用新型提供一种包括互连件的衬底,其中所述互连件包括沿着所述衬底的边缘的边缘互连件,且所述边缘中的至少一个为非线性。所提供为用于优化芯片/衬底上的半导体装置的数目的揭示。所述优化包括有效率地布置、切割和包装所述装置。
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