公开(公告)号：EP1863086A2

公开(公告)日：2007-12-05

申请号：EP07004088.6

申请日：2007-02-27

申请人： Broadcom Corporation

发明人： Zhao, Sam Ziqun ,  Khan, Rezaur Rahman

IPC分类号： H01L23/495 ,  H01L23/552

CPC分类号： H01L23/4334 ,  H01L23/49537 ,  H01L23/49558 ,  H01L23/49568 ,  H01L23/552 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49109 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in integrated circuit (IC) packages is described. A die-up or die-down package includes first and second caps defining a cavity, an IC die, and a leadframe. The leadframe includes a centrally located die attach pad, a plurality of leads, and a plurality of tie bars that couple the die attach pad to the leads. The IC die is mounted to the die attach pad. Planar rim portions of the first and second caps that surround the cavity are coupled to the leadframe. The first and second caps and the leadframe form an enclosure structure that substantially encloses the IC die, and shields EMI emanating from and radiating towards the IC die. The enclosure structure also dissipates heat generated by the IC die during operation.

摘要翻译： 描述了用于改善集成电路（IC）封装中的热性能和电磁干扰（EMI）屏蔽的方法和装置。 封装或封装的封装包括限定空腔的第一和第二盖，IC管芯和引线框架。 引线框架包括位于中心的管芯附接垫，多个引线和将管芯附接垫耦合到引线的多个连接条。 IC芯片安装在管芯附着垫上。 围绕空腔的第一和第二盖的平面边缘部分联接到引线框架。 第一和第二盖和引线框形成基本上封装IC管芯的外壳结构，并且屏蔽从IC管芯发出并向IC裸片辐射的EMI。 外壳结构还在运行期间散发IC芯片产生的热量。

公开(公告)号：EP1858080A2

公开(公告)日：2007-11-21

申请号：EP06026677.2

申请日：2006-12-22

申请人： Broadcom Corporation

发明人： Zhao, Sam Ziqun ,  Khan, Rezaur Rahman

IPC分类号： H01L23/495 ,  H01L23/433 ,  H01L23/552

CPC分类号： H01L23/552 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/4334 ,  H01L23/49503 ,  H01L23/49816 ,  H01L24/29 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48233 ,  H01L2224/48237 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/48257 ,  H01L2224/49109 ,  H01L2224/4911 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/92 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16151 ,  H01L2924/16152 ,  H01L2924/166 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/19107 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/0665 ,  H01L2924/00012 ,  H01L2224/92247 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/45099 ,  H01L2224/05599

摘要： Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in integrated circuit (IC) packages are described. A die-up or die-down package includes an IC die, a die attach pad, a heat spreader cap coupled to the die attach pad defining a cavity, and one or more peripheral rows of leads surrounding the die attach pad. The leads do not protrude substantially from the footprint of the encasing structure. The die attach pad and the heat spreader cap defines an encasing structure that substantially encloses the IC die, and shields EMI emanating from and radiating towards the IC die. The encasing structure also dissipates heat generated by the IC die during operation.

摘要翻译： 的方法和装置，以提高散热性能和电磁干扰（EMI）屏蔽在集成电路（IC）封装中描述。 阿片朝上或片朝下封装包括IC到其上的附连焊盘，耦合到所述管芯的散热器帽附接垫限定的腔，和包围该管芯附连焊盘引线的一个或多个外围行。 引线基本不自包覆结构的足迹突出。 管芯附装垫和散热器盖限定到包围结构确实基本上包围IC的是，和屏蔽EMI从发出并朝向IC该辐射。 在操作过程中包封结构从而消散由IC产生的热。

公开(公告)号：EP1818975A2

公开(公告)日：2007-08-15

申请号：EP07108462.8

申请日：2001-01-12

申请人： IBIDEN CO., LTD.

发明人： Sakamoto, H. c/o Ogaki-kita-kojou Ibiden Co., Ltd. ,  Sugiyama, T. c/o Ogaki-kita-kojou Ibiden Co., Ltd. ,  Wang, D. c/o Ogaki-kita-kojou Ibiden Co., Ltd. ,  Kariya, T. c/o Ogaki-kita-kojou Ibiden Co., Ltd.

IPC分类号： H01L21/48 ,  H01L23/538

CPC分类号： H01L24/29 ,  H01L21/4846 ,  H01L21/4857 ,  H01L23/13 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5389 ,  H01L23/544 ,  H01L24/19 ,  H01L24/24 ,  H01L24/32 ,  H01L24/83 ,  H01L25/03 ,  H01L25/18 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2223/5448 ,  H01L2223/54486 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16 ,  H01L2224/16227 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73267 ,  H01L2224/83192 ,  H01L2224/92 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01043 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/18162 ,  H01L2924/30107 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/09036 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09918 ,  H05K2201/10674 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/3512 ,  H01L2924/00

摘要： A multilayer printed circuit board has an IC chip 20 included in a core substrate 30 in advance and a transition layer 38 provided on a pad 24 of the IC chip 20. Due to this, it is possible to electrically connect the IC chip to the multilayer printed circuit board without using lead members and a sealing resin. Also, by providing the transition layer 38 made of copper on the die pad 24, it is possible to prevent resin residues on the pad 24 and to improve connection characteristics between the pad 24 and a via hole 60 and reliability.

摘要翻译： 多层印刷电路板预先包括在芯基板30中的IC芯片20和设置在IC芯片20的焊盘24上的过渡层38.由此，可以将IC芯片电连接到多层 印刷电路板，不使用引线部件和密封树脂。 此外，通过在芯片焊盘24上设置由铜制成的过渡层38，可以防止焊盘24上的树脂残留，并且改善焊盘24和通孔60之间的连接特性以及可靠性。

公开(公告)号：EP1432021A3

公开(公告)日：2007-04-04

申请号：EP03257934.4

申请日：2003-12-16

申请人： OMRON CORPORATION

发明人： Kawai, Wakahiro, Omron Corp., 801 Minamifudodo-cho ,  Sato, Noriaki, Omron Corp., 801 Minamifudodo-cho

IPC分类号： H01L21/60 ,  G06K19/077 ,  H01L21/56 ,  H05K3/06

CPC分类号： H01L23/49855 ,  G06K19/07745 ,  G06K19/0775 ,  H01L21/563 ,  H01L24/81 ,  H01L24/83 ,  H01L2223/6677 ,  H01L2224/136 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/29082 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/29388 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81205 ,  H01L2224/81395 ,  H01L2224/8183 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83851 ,  H01L2224/83862 ,  H01L2224/8388 ,  H01L2224/83885 ,  H01L2224/9211 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/19041 ,  H05K3/061 ,  H05K3/305 ,  H05K3/328 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/0571 ,  H05K2203/1189 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/05442 ,  H01L2924/0665 ,  H01L2224/0401

摘要： A semiconductor bear chip (9) having a bump (10) subjected to high temperatures is pressed, from the upper side, onto a wiring board (8) including a wiring pattern, a thermosetting resin film (4) covering an electrode area on the wiring pattern and having insulating particles dispersed and included and a thermoplastic resin film (7) covering the thermosetting resin film (4), while applying a ultrasonic wave, thereby inserting the bumps (10) of the semiconductor bear chip (9) through the thermoplastic resin film and the thermosetting resin film to bond the top end portion of the bump (10) with the electrode area.

摘要翻译： 将具有高温的凸块（10）的半导体支承片（9）从上侧按压到包括布线图案的布线基板（8）上，覆盖电极区域的热固性树脂膜（4） 布线图案并且分散并包括绝缘颗粒和覆盖热固性树脂膜（4）的热塑性树脂膜（7），同时施加超声波，从而将半导体支承芯片（9）的凸块（10）插入热塑性塑料 树脂膜和热固性树脂膜，以将凸块（10）的顶端部分与电极区域结合。

公开(公告)号：EP1759422A2

公开(公告)日：2007-03-07

申请号：EP05755193.9

申请日：2005-06-02

申请人： THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS

发明人： NUZZO, Ralph, G. ,  ROGERS, John, A. ,  MENARD, Etienne ,  LEE, Keon Jae ,  KHANG, Dahl-Young ,  SUN, Yugang ,  MEITL, Matthew ,  ZHU, Zhengtao

IPC分类号： H01L31/0312

CPC分类号： H01L29/76 ,  B81C2201/0185 ,  B82Y10/00 ,  H01L21/02521 ,  H01L21/02603 ,  H01L21/02628 ,  H01L21/308 ,  H01L21/322 ,  H01L21/6835 ,  H01L23/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/08 ,  H01L24/29 ,  H01L24/32 ,  H01L24/80 ,  H01L24/83 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0753 ,  H01L27/1285 ,  H01L27/1292 ,  H01L29/04 ,  H01L29/06 ,  H01L29/0665 ,  H01L29/0673 ,  H01L29/0676 ,  H01L29/068 ,  H01L29/12 ,  H01L29/78603 ,  H01L29/78681 ,  H01L29/78696 ,  H01L31/0392 ,  H01L31/03926 ,  H01L31/1804 ,  H01L31/1864 ,  H01L31/1896 ,  H01L33/007 ,  H01L33/0079 ,  H01L33/32 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/03 ,  H01L2224/0332 ,  H01L2224/0345 ,  H01L2224/03614 ,  H01L2224/0362 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05555 ,  H01L2224/05644 ,  H01L2224/05666 ,  H01L2224/08225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/80 ,  H01L2224/80006 ,  H01L2224/80121 ,  H01L2224/80862 ,  H01L2224/80895 ,  H01L2224/83 ,  H01L2224/83005 ,  H01L2224/83121 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2224/95 ,  H01L2224/97 ,  H01L2924/00012 ,  H01L2924/01032 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12032 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13063 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15159 ,  H01L2924/15162 ,  H01L2924/15788 ,  H01L2924/1579 ,  Y02E10/547 ,  Y02P70/521 ,  Y10S977/707 ,  Y10S977/724 ,  H01L2924/00014 ,  H01L2924/00

摘要： The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.

公开(公告)号：EP1367645A3

公开(公告)日：2006-12-27

申请号：EP03253279.8

申请日：2003-05-23

申请人： FUJITSU LIMITED

发明人： Fujisawa, Tetsuya, c/o Fujitsu Limited ,  Matsuki, Hirohisa, c/o Fujitsu Limited ,  Igawa, Osamu, c/o Fujitsu Limited ,  Aiba, Yoshitaka, c/o Fujitsu Limited ,  Ikumo, Masamitsu, c/o Fujitsu Limited ,  Sato, Mitsutaka, c/o Fujitsu Limited

IPC分类号： H01L23/538 ,  H01L21/60 ,  H01L23/498 ,  H01L25/065 ,  H01L21/98 ,  H01L21/58 ,  H01L23/31

CPC分类号： H01L24/29 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/5389 ,  H01L23/544 ,  H01L24/19 ,  H01L24/24 ,  H01L24/27 ,  H01L24/48 ,  H01L24/82 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2223/54426 ,  H01L2223/5446 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/05599 ,  H01L2224/12105 ,  H01L2224/16145 ,  H01L2224/24137 ,  H01L2224/24145 ,  H01L2224/24155 ,  H01L2224/24195 ,  H01L2224/24265 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48227 ,  H01L2224/4847 ,  H01L2224/73209 ,  H01L2224/73253 ,  H01L2224/73267 ,  H01L2224/83005 ,  H01L2224/83132 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83856 ,  H01L2224/85399 ,  H01L2224/92 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19103 ,  H01L2924/19104 ,  H01L2924/19107 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： In a semiconductor device (10) circuit formation surfaces of each of a plurality of semiconductor chips (12, 13) can be easily located at even level when the semiconductor chips are arranged side by side so that a process of forming rearrangement wiring is simplified. The semiconductor chips are mounted on a substrate (11) via an adhesive layer (15) in a two-dimensional arrangement. A resin layer (14) is formed on the substrate (11) and located around the semiconductor elements. The resin layer (14) has the same thickness as a thickness of the semiconductor elements (12, 13). An organic insulating layer (16) is formed over a surface of the resin layer and circuit formation surfaces of the semiconductor elements. A
rearrangement wiring layer (17) is formed on the organic insulating layer (16) and electrodes of the semiconductor chips. External connection terminals are electrically connected to the circuit formation surfaces of the semiconductor elements through wiring in the rearrangement wiring layer.

公开(公告)号：EP1730792A2

公开(公告)日：2006-12-13

申请号：EP05721530.3

申请日：2005-03-18

申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

发明人： NISHIMOTO, Keiji c/o Matsuhita Elect. Ind.Co.Ltd ,  NAGAI, Hideo Matsushita Elect.Indust.Co.Ltd

IPC分类号： H01L33/00

CPC分类号： H01L24/97 ,  F21K9/23 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01067 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/81 ,  H01L2924/00

摘要： The following explains an LED module that can achieve favorable light extraction efficiency without increasing a cost. An LED module (100) includes LED devices (110), an LED mounting module (120) on which the LED devices (110) are mounted, and a lens board (130) attached to a front surface of the LED mounting module (120). The LED mounting module (120) includes a printed wiring board (123) and a reflecting board (126). The printed wiring board (123) is an insulation board (122) on which a wiring pattern (124), used to mount the LED devices (110), is formed. The reflecting board (126) is made of a resin material, and has therein reflecting holes (126a) provided in correspondence with locations, on the printed wiring board (123), where the LED devices (110) are mounted. The reflecting board (126) and the printed wiring board (123) are directly adhered to each other at their surfaces that face each other.

公开(公告)号：EP1719156A1

公开(公告)日：2006-11-08

申请号：EP05715007.0

申请日：2005-02-22

申请人： Infineon Technologies AG

发明人： LEHNER, Rudolf

IPC分类号： H01L21/00 ,  B23K20/00 ,  H05K3/06

CPC分类号： H01L24/92 ,  H01L21/6835 ,  H01L21/6836 ,  H01L24/45 ,  H01L24/48 ,  H01L24/75 ,  H01L24/78 ,  H01L24/83 ,  H01L24/85 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48724 ,  H01L2224/48744 ,  H01L2224/78301 ,  H01L2224/78302 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/83805 ,  H01L2224/8385 ,  H01L2224/85001 ,  H01L2224/85181 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/9222 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01072 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/00015 ,  H01L2224/83205

摘要： The invention relates to a device for singulating and bonding semiconductor chips (1). Said device comprises a singulating station (2) and a fitting station (11). In the singulating station (2), a semiconductor chip (1) is provided with a bonding wire with the aid of a bonding tool (4) and is lifted from a carrier foil (7). In the fitting station (11), the semiconductor chip (1) is then placed on a chip assembly surface (13) and is fixed thereupon, and the bonding wire (5) is directed to a contacting terminal face (15) of the circuit support (12) and is bonded thereto.

公开(公告)号：EP1248291A3

公开(公告)日：2006-05-31

申请号：EP02252237.9

申请日：2002-03-27

申请人： Lintec Corporation

发明人： Yamazaki, Osamu ,  Ebe, Kazuyoshi

IPC分类号： H01L21/60

CPC分类号： H01L21/6835 ,  C09J7/20 ,  C09J2201/28 ,  C09J2203/326 ,  H01L21/561 ,  H01L21/563 ,  H01L21/6836 ,  H01L23/10 ,  H01L24/11 ,  H01L24/27 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L24/94 ,  H01L24/97 ,  H01L2221/68327 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/11003 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/29111 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2224/83851 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/15787 ,  Y10T156/1052 ,  Y10T156/1062 ,  H01L2224/73203 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/13111 ,  H01L2924/00012 ,  H01L2224/2919 ,  H01L2924/00014

摘要： A semiconductor device, which is obtained by sticking a conductor bodies attached adhesive sheet 1 comprising a base material 2, an adhesive agent layer 3 formed on the base material 2 and conductor bodies 4 buried in the adhesive agent layer 3 to a semiconductor wafer, removing the base material from the adhesive agent layer of the conductor bodies attached adhesive sheet 1, then, the adhesive agent layer 3 and a substrate are aligned and the semiconductor wafer and the substrates are adhered via the adhesive agent layer 3, has no defects caused by fluidity of an under filling material.

公开(公告)号：EP1602131A1

公开(公告)日：2005-12-07

申请号：EP04720556.2

申请日：2004-03-15

申请人： COMMONWEALTH SCIENTIFIC AND INDUSTRIAL RESEARCH ORGANISATION

发明人： CUNNINGHAM, Shaun, Joseph

IPC分类号： H01L23/52 ,  H01L23/36 ,  H01L23/66 ,  H01L21/76

CPC分类号： H01L21/4871 ,  H01L21/2007 ,  H01L21/302 ,  H01L21/76898 ,  H01L23/142 ,  H01L23/481 ,  H01L23/50 ,  H01L23/66 ,  H01L24/24 ,  H01L24/32 ,  H01L24/82 ,  H01L24/83 ,  H01L24/97 ,  H01L25/072 ,  H01L2224/24226 ,  H01L2224/32506 ,  H01L2224/8319 ,  H01L2224/83801 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  Y10S438/975 ,  Y10S438/977 ,  H01L2224/82 ,  H01L2224/83 ,  H01L2924/00

摘要： A compound semiconductor substrate, such as a GaAs substrate, is eutectically bonded to a metallic substrate (400). The semiconductor substrate is optionally thinned, and vias or trenches (601) are formed from the front side for making easily aligned interconnects to the metal substrate (400). The mechanical support given by the metallic substrate (400) permits the vias or trenches (601) to be any shape. Trenches (601) can surround a particular circuit element, to provide thermal isolation or heat spreading, or (in combination with metallic air bridges) to provide electromagnetic screening. Trench structures (601) also provide lower impedance ground connections at very high frequencies, in comparison to standard via holes. The metallic substrate (600) can be used as a ground plane or as a heat sink.