-
公开(公告)号：US20240234364A9
公开(公告)日：2024-07-11
申请号：US18269172
申请日：2022-01-18
申请人： LG INNOTEK CO., LTD.
发明人： Tae Sup CHOI , Woon KANG , Jin Ho YOON
CPC分类号： H01L24/81 , H01L21/563 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/83 , H01L24/92 , H01L2224/16227 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2224/81192 , H01L2224/8121 , H01L2224/81395 , H01L2224/81447 , H01L2224/8149 , H01L2224/81815 , H01L2224/81862 , H01L2224/81906 , H01L2224/83102 , H01L2224/83191 , H01L2224/8321 , H01L2224/83862 , H01L2224/9211 , H01L2924/0665 , H01L2924/069
摘要： A semiconductor package comprises: a printed circuit board including a connection portion; an IC chip arranged on the printed circuit board; a solder portion arranged on the lower surface of the IC chip and coupled to the connection portion; a. bonding layer arranged between the solder portion and the connection portion; and an underfill arranged between the IC chip and the printed circuit board, wherein the bonding layer includes thermosetting resin, and the underfill include thermoplastic resin.
-
公开(公告)号：US09603295B2
公开(公告)日：2017-03-21
申请号：US14007808
申请日：2012-04-02
CPC分类号： H05K13/0465 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/10126 , H01L2224/13111 , H01L2224/16058 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2224/81192 , H01L2224/81193 , H01L2224/81411 , H01L2224/81413 , H01L2224/8149 , H01L2224/8159 , H01L2224/81613 , H01L2224/81815 , H01L2224/81862 , H01L2224/81885 , H01L2924/01006 , H01L2924/01029 , H01L2924/01049 , H01L2924/0105 , H01L2924/01322 , H01L2924/014 , H01L2924/15311 , H01L2924/15788 , H01L2924/19105 , H01L2924/20106 , H01L2924/351 , H05K1/141 , H05K1/181 , H05K3/3436 , H05K3/3463 , H05K2201/10977 , H05K2203/047 , Y02P70/613 , H01L2924/00 , H01L2924/01047 , H01L2924/00012 , H01L2924/0665
摘要： In a case where a first mounted substrate to which a semiconductor element is bounded by solder is mounted on a second substrate, connection strength becomes low, when the first mounted substrate is bonded to the second substrate by using a solder having a low melting point. A mounted structure, in which a first mounted substrate on which a semiconductor element is bonded by using a first solder having a melting point of 217° C. or more, is mounted on a second substrate, includes plural bonding parts bonding the first mounted substrate to the second substrate; and a reinforcing member formed around the bonding part. Each of the bonding parts contains a second solder having a melting point, that is lower than the melting point of the first solder, and a space exists, in which the reinforcing members do not exist, between the bonding parts neighboring each other.
-
公开(公告)号：US08980692B2
公开(公告)日：2015-03-17
申请号：US14156671
申请日：2014-01-16
发明人： Kenichi Sasaki , Norio Fukasawa
IPC分类号： H01L21/82 , H01L23/00 , H01L25/065 , H01L23/495 , H01L23/498
CPC分类号： H01L24/80 , H01L23/495 , H01L23/49575 , H01L23/49811 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/81 , H01L24/85 , H01L24/92 , H01L25/0657 , H01L2224/0401 , H01L2224/04042 , H01L2224/06135 , H01L2224/06136 , H01L2224/0614 , H01L2224/06177 , H01L2224/1134 , H01L2224/13082 , H01L2224/16145 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/45144 , H01L2224/48227 , H01L2224/49171 , H01L2224/73207 , H01L2224/73253 , H01L2224/73265 , H01L2224/81191 , H01L2224/81395 , H01L2224/8149 , H01L2224/81901 , H01L2224/8592 , H01L2224/92163 , H01L2225/0651 , H01L2225/06575 , H01L2924/00014 , H01L2924/01327 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/05599
摘要： A semiconductor device includes a circuit substrate, a first semiconductor chip disposed on the circuit substrate, a plurality of first spacers disposed on the first semiconductor chip, a second semiconductor chip which includes a first adhesive agent layer on a lower face thereof and is disposed on upper portions of the plurality of spacers, a wire which connects the circuit substrate to the first semiconductor chip, and a first sealing material which seals a gap between the first semiconductor chip and the first adhesive agent layer, wherein each height of the plurality of the first spacers is greater than height of the wire relative to an upper face of the first semiconductor chip.
摘要翻译： 半导体器件包括电路基板，布置在电路基板上的第一半导体芯片，设置在第一半导体芯片上的多个第一间隔物，第二半导体芯片，其下表面上包括第一粘合剂层， 多个间隔物的上部，将电路基板连接到第一半导体芯片的线以及密封第一半导体芯片和第一粘合剂层之间的间隙的第一密封材料，其中， 第一间隔物相对于第一半导体芯片的上表面大于导线的高度。
-
公开(公告)号：US06596634B2
公开(公告)日：2003-07-22
申请号：US10077820
申请日：2002-02-20
申请人： Kazushige Umetsu , Yohei Kurashima , Jun Amako
发明人： Kazushige Umetsu , Yohei Kurashima , Jun Amako
IPC分类号： H01L2144
CPC分类号： H01L21/486 , H01L21/76882 , H01L21/76898 , H01L23/481 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L2224/0345 , H01L2224/0401 , H01L2224/051 , H01L2224/05563 , H01L2224/05567 , H01L2224/0557 , H01L2224/05572 , H01L2224/056 , H01L2224/1132 , H01L2224/11334 , H01L2224/1134 , H01L2224/1181 , H01L2224/11849 , H01L2224/13009 , H01L2224/1319 , H01L2224/13411 , H01L2224/13444 , H01L2224/13483 , H01L2224/16146 , H01L2224/16225 , H01L2224/16227 , H01L2224/16237 , H01L2224/17181 , H01L2224/811 , H01L2224/81191 , H01L2224/81193 , H01L2224/814 , H01L2224/8149 , H01L2224/81815 , H01L2224/8185 , H01L2224/9202 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06565 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01079 , H01L2924/014 , H01L2924/09701 , H01L2924/1016 , H01L2924/1017 , H01L2924/12042 , H01L2924/14 , H05K3/3494 , H05K3/4038 , H05K2201/0305 , H05K2201/096 , H05K2203/041 , H05K2203/082 , H05K2203/107 , H01L2924/0105 , H01L2224/05552 , H01L2924/00
摘要： A conductive material is provided to an open end of a penetrating hole penetrating through at least a semiconductor element, on the side of a first surface of the semiconductor element. The conductive material is melted to flow into the penetrating hole. The conductive material is made to flow into the penetrating hole in a state that an atmospheric pressure on the side of a second surface of the semiconductor element opposite to the first surface is lower than an atmospheric pressure on the side of the first surface.
-
公开(公告)号：US20240136322A1
公开(公告)日：2024-04-25
申请号：US18269172
申请日：2022-01-18
申请人： LG INNOTEK CO., LTD.
发明人： Tae Sup CHOI , Woon KANG , Jin Ho YOON
CPC分类号： H01L24/81 , H01L21/563 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/83 , H01L24/92 , H01L2224/16227 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2224/81192 , H01L2224/8121 , H01L2224/81395 , H01L2224/81447 , H01L2224/8149 , H01L2224/81815 , H01L2224/81862 , H01L2224/81906 , H01L2224/83102 , H01L2224/83191 , H01L2224/8321 , H01L2224/83862 , H01L2224/9211 , H01L2924/0665 , H01L2924/069
摘要： A semiconductor package comprises: a printed circuit board including a connection portion; an IC chip arranged on the printed circuit board; a solder portion arranged on the lower surface of the IC chip and coupled to the connection portion; a. bonding layer arranged between the solder portion and the connection portion; and an underfill arranged between the IC chip and the printed circuit board, wherein the bonding layer includes thermosetting resin, and the underfill include thermoplastic resin.
-
公开(公告)号：US09820391B2
公开(公告)日：2017-11-14
申请号：US14613591
申请日：2015-02-04
IPC分类号： H05K1/02 , H05K3/46 , H05K1/11 , H01L23/15 , H01L23/538 , H01L23/498 , H01L23/00 , H01L25/065 , H01L25/10 , H01L25/18
CPC分类号： H05K3/4682 , H01L23/15 , H01L23/49816 , H01L23/5383 , H01L23/5389 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L25/0652 , H01L25/0655 , H01L25/105 , H01L25/18 , H01L2224/10156 , H01L2224/11462 , H01L2224/13014 , H01L2224/13082 , H01L2224/13083 , H01L2224/13084 , H01L2224/131 , H01L2224/13111 , H01L2224/13116 , H01L2224/13144 , H01L2224/13155 , H01L2224/13164 , H01L2224/13565 , H01L2224/1357 , H01L2224/13666 , H01L2224/13687 , H01L2224/16227 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2224/81191 , H01L2224/81193 , H01L2224/81395 , H01L2224/81444 , H01L2224/81447 , H01L2224/8149 , H01L2225/1023 , H01L2225/1058 , H01L2924/15311 , H01L2924/1533 , H01L2924/15331 , H05K1/111 , H05K1/115 , H05K2201/0352 , H05K2203/025 , H01L2924/00014 , H01L2924/014 , H01L2924/01029 , H01L2924/01047 , H01L2924/04941
摘要： A wiring board includes first insulating layers; first wiring layers; first via wirings; second insulating layers; second wiring layers; second via wirings; and a solder resist layer, wherein the first insulating layers are composed of non-photosensitive resin, wherein the second insulating layers, and the solder resist layer are composed of photosensitive resin, respectively, wherein the first surface of the uppermost first insulating layer and the first end surface of the first via wiring embedded in the uppermost first insulating layer are polished surfaces, wherein the first end surface of the first via wiring embedded in the uppermost first insulating layer is flush with the first surface of the uppermost first insulating layer, and wherein the wiring density of the second wiring layers is higher than the wiring density of the first wiring layers.
-
公开(公告)号：US20160020163A1
公开(公告)日：2016-01-21
申请号：US14791670
申请日：2015-07-06
发明人： Noriyoshi SHIMIZU , Yusuke GOZU , Jun FURUICHI , Akio ROKUGAWA , Takashi Ito
IPC分类号： H01L23/498 , H05K1/18
CPC分类号： H01L23/49822 , H01L23/49811 , H01L23/49816 , H01L23/49827 , H01L23/49833 , H01L23/49894 , H01L23/5389 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L24/92 , H01L25/0655 , H01L25/105 , H01L2224/131 , H01L2224/13111 , H01L2224/13116 , H01L2224/13144 , H01L2224/16227 , H01L2224/16237 , H01L2224/16238 , H01L2224/26175 , H01L2224/2919 , H01L2224/32225 , H01L2224/32237 , H01L2224/73204 , H01L2224/81191 , H01L2224/81444 , H01L2224/81447 , H01L2224/8149 , H01L2224/81801 , H01L2224/83104 , H01L2224/83855 , H01L2224/92125 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2924/15311 , H01L2924/3511 , H05K1/095 , H05K1/111 , H05K1/112 , H05K1/114 , H05K1/115 , H05K3/0073 , H05K3/383 , H05K3/4644 , H05K2201/0195 , H05K2201/09845 , H05K2203/0392 , H01L2924/00014 , H01L2924/014 , H01L2924/01079 , H01L2924/01029 , H01L2924/01047 , H01L2924/0665
摘要： A wiring substrate includes a first wiring structure and a second wiring structure. The first wiring structure includes a first insulating layer, which covers a first wiring layer, and a via wiring. A first through hole of the first insulating layer is filled with the via wiring. The second wiring structure includes a second wiring layer and a second insulating layer. The second wiring layer is formed on an upper surface of the first insulating layer and an upper end surface of the via wiring. The second wiring layer partially includes a roughened surface. The second insulating layer is stacked on the upper surface of the first insulating layer and covers the second wiring layer. The second wiring structure has a higher wiring density than the first wiring structure. The roughened surface of the second wiring layer has a smaller surface roughness than the first wiring layer.
摘要翻译： 布线基板包括第一布线结构和第二布线结构。 第一布线结构包括覆盖第一布线层的第一绝缘层和通孔布线。 第一绝缘层的第一通孔填充有通孔布线。 第二布线结构包括第二布线层和第二绝缘层。 第二布线层形成在第一绝缘层的上表面和通孔布线的上端面上。 第二布线层部分地包括粗糙表面。 第二绝缘层堆叠在第一绝缘层的上表面上并覆盖第二布线层。 第二布线结构具有比第一布线结构更高的布线密度。 第二布线层的粗糙化表面的表面粗糙度比第一布线层小。
-
公开(公告)号：US20150282307A1
公开(公告)日：2015-10-01
申请号：US14613591
申请日：2015-02-04
CPC分类号： H05K3/4682 , H01L23/15 , H01L23/49816 , H01L23/5383 , H01L23/5389 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L25/0652 , H01L25/0655 , H01L25/105 , H01L25/18 , H01L2224/10156 , H01L2224/11462 , H01L2224/13014 , H01L2224/13082 , H01L2224/13083 , H01L2224/13084 , H01L2224/131 , H01L2224/13111 , H01L2224/13116 , H01L2224/13144 , H01L2224/13155 , H01L2224/13164 , H01L2224/13565 , H01L2224/1357 , H01L2224/13666 , H01L2224/13687 , H01L2224/16227 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2224/81191 , H01L2224/81193 , H01L2224/81395 , H01L2224/81444 , H01L2224/81447 , H01L2224/8149 , H01L2225/1023 , H01L2225/1058 , H01L2924/15311 , H01L2924/1533 , H01L2924/15331 , H05K1/111 , H05K1/115 , H05K2201/0352 , H05K2203/025 , H01L2924/00014 , H01L2924/014 , H01L2924/01029 , H01L2924/01047 , H01L2924/04941
摘要： A wiring board includes first insulating layers; first wiring layers; first via wirings; second insulating layers; second wiring layers; second via wirings; and a solder resist layer, wherein the first insulating layers are composed of non-photosensitive resin, wherein the second insulating layers, and the solder resist layer are composed of photosensitive resin, respectively, wherein the first surface of the uppermost first insulating layer and the first end surface of the first via wiring embedded in the uppermost first insulating layer are polished surfaces, wherein the first end surface of the first via wiring embedded in the uppermost first insulating layer is flush with the first surface of the uppermost first insulating layer, and wherein the wiring density of the second wiring layers is higher than the wiring density of the first wiring layers.
摘要翻译： 布线板包括第一绝缘层; 第一布线层; 首先通过布线; 第二绝缘层; 第二布线层; 第二条通过布线; 以及阻焊层，其中，所述第一绝缘层由非感光性树脂构成，所述第二绝缘层和所述阻焊层分别由感光性树脂构成，其中，所述第一绝缘层和所述第二绝缘层的第一表面 嵌入在最上面的第一绝缘层中的第一通孔布线的第一端面是抛光表面，其中嵌入在最上面的第一绝缘层中的第一通孔布线的第一端面与最上面的第一绝缘层的第一表面齐平， 其中所述第二布线层的布线密度高于所述第一布线层的布线密度。
-
公开(公告)号：US20140334120A1
公开(公告)日：2014-11-13
申请号：US14339477
申请日：2014-07-24
申请人： Eagantu Ltd.
发明人： Michael Dakhiya , Eran Shaked
CPC分类号： H05K1/183 , H01C17/22 , H01L22/14 , H01L22/20 , H01L23/04 , H01L23/13 , H01L23/15 , H01L23/5381 , H01L23/5383 , H01L23/5384 , H01L23/66 , H01L24/16 , H01L24/81 , H01L25/0652 , H01L25/105 , H01L2223/6655 , H01L2224/16225 , H01L2224/81439 , H01L2224/81447 , H01L2224/8149 , H01L2224/81493 , H01L2225/1023 , H01L2225/1047 , H01L2924/12042 , H01L2924/14 , H01L2924/15156 , H01L2924/15311 , H01L2924/15313 , H01L2924/15787 , H01L2924/1579 , H01L2924/16195 , H01L2924/1627 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/3011 , H05K3/32 , H05K2203/16 , H05K2203/171 , Y10T29/49004 , Y10T29/4913 , Y10T29/53022 , Y10T29/53174 , H01L2924/00
摘要： An electronic module includes a substrate, which includes a dielectric material having multiple sides, including first and second sides, and first and second cavities indented respectively within the first and second sides. First and second conductive contacts within the first and second cavities are configured for contact with at least first and second electronic components that are mounted respectively in the first and second cavities. Conductive traces within the substrate are in electrical communication with the first and second conductive contacts.
-
公开(公告)号：US20130032942A1
公开(公告)日：2013-02-07
申请号：US13553084
申请日：2012-07-19
申请人： Kenichi Sasaki , Norio Fukasawa
发明人： Kenichi Sasaki , Norio Fukasawa
IPC分类号： H01L23/498 , H01L23/48
CPC分类号： H01L24/80 , H01L23/495 , H01L23/49575 , H01L23/49811 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/81 , H01L24/85 , H01L24/92 , H01L25/0657 , H01L2224/0401 , H01L2224/04042 , H01L2224/06135 , H01L2224/06136 , H01L2224/0614 , H01L2224/06177 , H01L2224/1134 , H01L2224/13082 , H01L2224/16145 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/45144 , H01L2224/48227 , H01L2224/49171 , H01L2224/73207 , H01L2224/73253 , H01L2224/73265 , H01L2224/81191 , H01L2224/81395 , H01L2224/8149 , H01L2224/81901 , H01L2224/8592 , H01L2224/92163 , H01L2225/0651 , H01L2225/06575 , H01L2924/00014 , H01L2924/01327 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/05599
摘要： A semiconductor device includes a circuit substrate, a first semiconductor chip disposed on the circuit substrate, a plurality of first spacers disposed on the first semiconductor chip, a second semiconductor chip which includes a first adhesive agent layer on a lower face thereof and is disposed on upper portions of the plurality of spacers, a wire which connects the circuit substrate to the first semiconductor chip, and a first sealing material which seals a gap between the first semiconductor chip and the first adhesive agent layer, wherein each height of the plurality of the first spacers is greater than height of the wire relative to an upper face of the first semiconductor chip.
摘要翻译： 半导体器件包括电路基板，布置在电路基板上的第一半导体芯片，设置在第一半导体芯片上的多个第一间隔物，第二半导体芯片，其下表面上包括第一粘合剂层， 多个间隔物的上部，将电路基板连接到第一半导体芯片的线以及密封第一半导体芯片和第一粘合剂层之间的间隙的第一密封材料，其中， 第一间隔物相对于第一半导体芯片的上表面大于导线的高度。
-
-
-
-
-
-
-
-
-
搜索结果
41 条记录 (耗时 0.016 秒)
