公开(公告)号：US08362611B2

公开(公告)日：2013-01-29

申请号：US12679595

申请日：2008-09-25

申请人： Yasuyuki Yanase ,  Yoshio Okayama ,  Ryosuke Usui

发明人： Yasuyuki Yanase ,  Yoshio Okayama ,  Ryosuke Usui

IPC分类号： H01L23/488

CPC分类号： H01L24/11 ,  H01L2224/0231 ,  H01L2224/02313 ,  H01L2224/02319 ,  H01L2224/02333 ,  H01L2224/0236 ,  H01L2224/024 ,  H01L2224/0401 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2224/29099 ,  H01L2924/00

摘要： A semiconductor module is of a structure such that a wiring layer, an insulating resin layer and a semiconductor device are stacked in this order by bonding them together with compression. In the wiring layer, bump electrodes each having a base and a tip portion are provided in positions corresponding respectively to device electrodes of the semiconductor device. The bump electrodes penetrate the insulating resin layer and are electrically coupled to the corresponding device electrodes.

摘要翻译： 半导体模块具有这样的结构，使得布线层，绝缘树脂层和半导体器件通过将它们压缩在一起而依次堆叠。 在布线层中，各自具有基底和尖端部分的凸起电极设置在分别对应于半导体器件的器件电极的位置。 凸块电极穿透绝缘树脂层并电耦合到相应的器件电极。

公开(公告)号：US08258620B2

公开(公告)日：2012-09-04

申请号：US12673409

申请日：2008-08-08

申请人： Mayumi Nakasato ,  Ryosuke Usui ,  Kiyoshi Shibata

发明人： Mayumi Nakasato ,  Ryosuke Usui ,  Kiyoshi Shibata

IPC分类号： H01L23/053 ,  H01L23/12

CPC分类号： H01L23/145 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49827 ,  H01L24/16 ,  H01L24/81 ,  H01L24/83 ,  H01L24/90 ,  H01L29/0657 ,  H01L2221/68345 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05026 ,  H01L2224/0508 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05569 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13021 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81136 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2224/83104 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/351 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/113 ,  H05K3/002 ,  H05K3/305 ,  H05K3/4007 ,  H05K2201/0209 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09509 ,  H05K2201/09527 ,  H05K2201/09563 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/1152 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2224/05599

摘要： A circuit device includes an insulating base provided with a resin layer mixed with a fibrous filler, bumps provided in the insulating base and functioning as electrodes for connection, a semiconductor device that is flip-chip mounted, and an underfill filling a gap between the semiconductor device and the insulating base. By allowing the fibrous filler projecting through the top surface of the resin layer to be in contact with the underfill, strength of adhesion between the underfill and the insulating base is improved.

摘要翻译： 电路装置包括：绝缘基体，设置有与纤维填料混合的树脂层，设置在绝缘基底中的凸起，用作连接用电极，倒装芯片安装的半导体器件，以及填充半导体之间的间隙的底部填充物 设备和绝缘基座。 通过使通过树脂层的上表面突出的纤维状填料与底部填充剂接触，提高了底部填充剂和绝缘基材之间的粘合强度。

公开(公告)号：US08258409B2

公开(公告)日：2012-09-04

申请号：US12058040

申请日：2008-03-28

申请人： Yasuhiro Kohara ,  Kiyoshi Shibata ,  Masayuki Nagamatsu ,  Ryosuke Usui ,  Toshiya Shimizu

发明人： Yasuhiro Kohara ,  Kiyoshi Shibata ,  Masayuki Nagamatsu ,  Ryosuke Usui ,  Toshiya Shimizu

IPC分类号： H05K1/00

CPC分类号： H05K3/383 ,  H01L23/3128 ,  H01L23/498 ,  H01L23/49838 ,  H01L23/564 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/056 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/351 ,  H05K3/243 ,  H05K3/3452 ,  H05K2201/09727 ,  H05K2201/09772 ,  H05K2201/0989 ,  H05K2203/0307 ,  H05K2203/0361 ,  H05K2203/049 ,  H05K2203/0542 ,  H05K2203/0723 ,  H05K2203/1152 ,  H05K2203/1476 ,  Y10T29/49155 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599

摘要： Provided are a circuit board with enhanced moisture resist and the method of manufacturing the circuit board, and a circuit device and a method of manufacturing the circuit device. A circuit board of the present invention includes: a substrate; wirings formed on the main surface of the substrate; a cover layer covering the wirings excluding the regions to be connectors; back electrodes formed on the bottom surface of the substrate; and through-hole electrodes formed so as to penetrate the substrate, and thereby connecting the wirings and the back electrodes. On surfaces of each of the wirings in this circuit board, convex portions on the periphery of the substrate are set larger in width than convex portions in a center portion of the substrate. With this configuration, adhesion reliability between the wirings and the cover layer under a thermal cycle load can be enhanced.

摘要翻译： 提供了一种具有增强的抗湿性的电路板和制造该电路板的方法，以及电路装置和该电路装置的制造方法。 本发明的电路板包括：基板; 在基板的主表面上形成的布线; 覆盖除了作为连接器的区域的布线的覆盖层; 形成在基板的底面上的背面电极; 以及形成为穿透基板的通孔电极，从而连接布线和背面电极。 在该电路基板的各配线的表面上，基板周边的凸部的宽度比基板的中央部的凸部的宽度大。 利用这种结构，可以提高热循环负载下的布线与覆盖层之间的粘附可靠性。

公开(公告)号：US08166643B2

公开(公告)日：2012-05-01

申请号：US12702865

申请日：2010-02-09

申请人： Kiyoshi Shibata ,  Ryosuke Usui ,  Yasunori Inoue

发明人： Kiyoshi Shibata ,  Ryosuke Usui ,  Yasunori Inoue

IPC分类号： H05K3/36

CPC分类号： H05K3/445 ,  H01L2224/16 ,  H01L2924/01019 ,  H01L2924/01078 ,  H05K1/056 ,  H05K3/0047 ,  H05K3/44 ,  H05K2201/0382 ,  H05K2201/09054 ,  H05K2201/09609 ,  H05K2201/0969 ,  H05K2203/0323 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49165

摘要： A method of manufacturing a circuit apparatus includes forming a plurality of pierced holes in a metal substrate. A first wiring layer is formed on one side of the metal substrate via a first insulating layer, and a second wiring layer is formed on the other side of the metal substrate via a second insulating layer. A conductor layer is formed in at least some of the plurality of pierced holes to establish a connection between the first wiring layer and the second wiring layer. A circuit element is connected to the first wiring layer on the one side of the metal substrate. When a plurality of pierced holes are formed, protrusions are formed on a surface of the metal substrate at least along either edge of each of the pierced holes provided with the conductor layer to protrude in a convex manner from the surface of the metal substrate.

摘要翻译： 电路装置的制造方法包括在金属基板上形成多个穿孔。 第一布线层经由第一绝缘层在金属基板的一侧上形成，并且第二布线层经由第二绝缘层形成在金属基板的另一侧上。 在多个穿孔中的至少一些穿孔中形成导体层，以建立第一布线层和第二布线层之间的连接。 电路元件连接到金属基板的一侧上的第一布线层。 当形成多个穿孔时，至少沿着设置有导体层的每个穿孔的任一边缘，在金属基板的表面上形成突起，以从金属基板的表面凸出突出。

公开(公告)号：US08097946B2

公开(公告)日：2012-01-17

申请号：US12263174

申请日：2008-10-31

申请人： Kouichi Saitou ,  Mayumi Nakasato ,  Ryosuke Usui

发明人： Kouichi Saitou ,  Mayumi Nakasato ,  Ryosuke Usui

IPC分类号： H01L23/053 ,  H01L23/12

CPC分类号： H01L23/49811 ,  H01L23/145 ,  H01L23/3733 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H05K1/0366 ,  H05K1/112 ,  H05K3/0041 ,  H05K3/3436 ,  H05K3/3457 ,  H05K2201/09509 ,  H05K2201/09527 ,  H05K2203/1152 ,  H01L2224/05599

摘要： A device mounting board includes an insulating layer formed of an insulating resin, a glass cloth covering the surface of the insulating layer, and an electrode provided in a through hole extending through the glass cloth. The angle of contact with solder of the glass cloth is larger than that of the resin. Thus, solder bumps are formed on the electrode 14 of the device mounting board 10 with high precision.

摘要翻译： 装置安装板包括由绝缘树脂形成的绝缘层，覆盖绝缘层表面的玻璃布和设置在穿过玻璃布的通孔中的电极。 玻璃布与焊料的接触角大于树脂的接触角。 因此，在装置安装基板10的电极14上高精度地形成焊锡凸块。

公开(公告)号：US07915737B2

公开(公告)日：2011-03-29

申请号：US11957030

申请日：2007-12-14

申请人： Mayumi Nakasato ,  Yoshio Okayama ,  Ryosuke Usui

发明人： Mayumi Nakasato ,  Yoshio Okayama ,  Ryosuke Usui

IPC分类号： H01L23/48

CPC分类号： H01L23/3114 ,  H01L23/525 ,  H01L24/11 ,  H01L24/12 ,  H01L2224/0231 ,  H01L2224/02313 ,  H01L2224/02319 ,  H01L2224/02333 ,  H01L2224/0401 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/351 ,  H01L2924/00

摘要： A manufacturing technology is provided capable of improving the reliability of a semiconductor module having a via contact connected to an electrode part of a semiconductor component. The semiconductor module includes: a semiconductor component provided with an electrode part on a mounting surface; an insulating layer provided on the mounting surface of the semiconductor component; a wiring layer formed on the insulating layer; a first conductor part which is embedded in the insulating layer and which is in contact with the electrode part; and a second conductor part which is formed in an aperture provided in the insulating layer above the first conductor part and which electrically connects the first conductor part and the wiring layer.

摘要翻译： 提供一种制造技术，其能够提高具有连接到半导体部件的电极部分的通孔接触的半导体模块的可靠性。 半导体模块包括：在安装表面上设置有电极部分的半导体部件; 设置在所述半导体部件的安装面上的绝缘层; 形成在所述绝缘层上的布线层; 第一导体部，其嵌入绝缘层中并与电极部接触; 以及第二导体部，其形成在设置在所述第一导体部分上方的所述绝缘层中的孔中，并且将所述第一导体部和所述布线层电连接。

公开(公告)号：US07822302B2

公开(公告)日：2010-10-26

申请号：US12578952

申请日：2009-10-14

申请人： Makoto Murai ,  Ryosuke Usui

发明人： Makoto Murai ,  Ryosuke Usui

IPC分类号： G02B6/12 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H05K1/00 ,  H05K1/18 ,  H05K7/00 ,  H01R9/00

CPC分类号： H05K3/0032 ,  H05K1/0366 ,  H05K3/0035 ,  H05K3/421 ,  H05K2201/029 ,  H05K2203/065 ,  Y10T29/49155 ,  Y10T29/49204

摘要： Provided is a circuit board which suppresses abnormal formation of plated layer inside a via, caused by core materials of glass fibers or the like projected from a side wall of the via and which helps to improve the connection reliability of the via. An insulating layer, which is formed of thermoset resin and embedded with glass fibers, is provided between a first wiring layer and a second wiring layer. The glass fibers projected into a via hole side from a side wall of the via hole in different positions are embedded into a via conductor in such a state that the glass fibers are jointed with each other.

摘要翻译： 提供一种电路板，其抑制由通孔的侧壁突出的玻璃纤维等的芯材引起的通孔内的镀层的异常形成，有助于提高通孔的连接可靠性。 在第一布线层和第二布线层之间设置由热固性树脂形成并嵌入玻璃纤维的绝缘层。 玻璃纤维在玻璃纤维彼此接合的状态下嵌入到通孔导体中，从通孔的侧壁在不同位置投影到通孔侧的玻璃纤维。

公开(公告)号：US20100244171A1

公开(公告)日：2010-09-30

申请号：US12727913

申请日：2010-03-19

申请人： Masayuki Nagamatsu ,  Ryosuke Usui ,  Yasunori Inoue

发明人： Masayuki Nagamatsu ,  Ryosuke Usui ,  Yasunori Inoue

IPC分类号： H01L31/02

CPC分类号： H01L27/14618 ,  H01L24/48 ,  H01L24/49 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14643 ,  H01L2224/05554 ,  H01L2224/48 ,  H01L2224/49175 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/3025 ,  H04N5/2257 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor module includes a lower wiring substrate having a semiconductor device mounted and an upper wiring substrate having an opening in a position corresponding to the semiconductor device and having a packaging-component mountable region around the opening. The lower wiring substrate and the upper wiring substrate are electrically connected to each other via a plurality of solder balls provided around the semiconductor device. The solder balls are covered with light blocking under-fills.

摘要翻译： 半导体模块包括具有安装的半导体器件的下布线基板和在与半导体器件相对应的位置处具有开口的上布线基板，并且在开口周围具有封装部件安装区域。 下布线基板和上布线基板通过设置在半导体器件周围的多个焊球彼此电连接。 焊球被遮光不足的填充物覆盖。

公开(公告)号：US07796845B2

公开(公告)日：2010-09-14

申请号：US11678321

申请日：2007-02-23

申请人： Makoto Murai ,  Ryosuke Usui

发明人： Makoto Murai ,  Ryosuke Usui

IPC分类号： G02B6/12 ,  H01L23/52 ,  H01L23/40 ,  H01L23/48 ,  H05K1/18 ,  H05K1/00 ,  H01R12/04 ,  H01L21/4763

CPC分类号： H05K3/0032 ,  H05K1/0366 ,  H05K3/0035 ,  H05K3/421 ,  H05K2201/029 ,  H05K2203/065 ,  Y10T29/49155 ,  Y10T29/49204

摘要： Provided is a circuit board which suppresses abnormal formation of plated layer inside a via, caused by core materials of glass fibers or the like projected from a side wall of the via and which helps to improve the connection reliability of the via. An insulating layer, which is formed of thermoset resin and embedded with glass fibers, is provided between a first wiring layer and a second wiring layer. The glass fibers projected into a via hole side from a side wall of the via hole in different positions are embedded into a via conductor in such a state that the glass fibers are jointed with each other.

公开(公告)号：US20100193937A1

公开(公告)日：2010-08-05

申请号：US12697803

申请日：2010-02-01

申请人： Masayuki Nagamatsu ,  Yasuhiro Kohara ,  Ryosuke Usui

发明人： Masayuki Nagamatsu ,  Yasuhiro Kohara ,  Ryosuke Usui

IPC分类号： H01L23/48

CPC分类号： H01L23/49816 ,  H01L21/4846 ,  H01L23/3128 ,  H01L23/498 ,  H01L24/13 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/04042 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48644 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01031 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/01044 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A wiring layer including external connection regions is provided on a main surface of an insulating resin layer on a side opposite to that of a semiconductor device mounting face. The wiring layer is coated with a protection layer. An opening is provided to the protection layer such that each external connection region is exposed. Each external connection region has a curved surface recessed toward the insulating resin layer side. The entire area of each opening is filled with a solder ball for mounting a substrate, and the recess of each external connection region is filled with the solder ball, thereby connecting each solder ball to the intermediate layer.

摘要翻译： 在绝缘树脂层的与半导体器件安装面相反一侧的主表面上设置包括外部连接区域的布线层。 布线层涂有保护层。 向保护层提供开口，使得每个外部连接区域被暴露。 每个外部连接区域具有朝向绝缘树脂层侧凹入的弯曲表面。 每个开口的整个区域填充有用于安装基板的焊球，并且每个外部连接区域的凹部填充有焊球，从而将每个焊球连接到中间层。