公开(公告)号：US09148957B2

公开(公告)日：2015-09-29

申请号：US14002346

申请日：2012-03-01

Applicant: Takashi Matsui ,  Motoji Shiota ,  Hiroki Nakahama

Inventor： Takashi Matsui ,  Motoji Shiota ,  Hiroki Nakahama

IPC: H05K7/00 ,  H05K1/18 ,  H01L23/00 ,  H05K1/11 ,  G02F1/1345 ,  H01L23/498

CPC classification number: H05K1/18 ,  G02F1/13454 ,  H01L23/49811 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/10165 ,  H01L2224/13013 ,  H01L2224/13144 ,  H01L2224/14132 ,  H01L2224/14133 ,  H01L2224/16237 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/8114 ,  H01L2224/81191 ,  H01L2224/81385 ,  H01L2224/81903 ,  H01L2224/83851 ,  H01L2224/9211 ,  H01L2924/07802 ,  H01L2924/15788 ,  H01L2924/351 ,  H05K1/111 ,  H05K2201/09436 ,  H05K2201/09709 ,  H05K2201/09745 ,  H05K2201/09909 ,  H05K2201/10674 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00

Abstract: A wiring substrate (11) includes: a substrate; and, formed upon the substrate, a plurality of wiring lines, a plurality of circuit elements, and a plurality of connecting terminals (51) connected via the plurality of wiring lines. Each of the plurality of connecting terminals (51) includes a pair of protrusion parts (50), forming a depression part (60) between the pair of protrusion parts (50), and a depression electrode (52) that is disposed in the depression part (60) and that at least partially covers each protrusion of the pair of protrusion parts (50).

Abstract translation: 布线基板（11）包括：基板; 并且在所述基板上形成有多条布线，多个电路元件以及经由所述多根布线连接的多个连接端子（51）。 多个连接端子（51）中的每一个包括在一对突出部（50）之间形成有凹部（60）的一对突出部（50），设置在该凹部 部分（60）并且至少部分地覆盖所述一对突出部分（50）中的每个突起。

公开(公告)号：US09142501B2

公开(公告)日：2015-09-22

申请号：US14447908

申请日：2014-07-31

Applicant: International Business Machines Corporation

Inventor： Charles L. Arvin ,  Minhua Lu ,  Eric D. Perfecto ,  David J. Russell ,  Wolfgang Sauter ,  Krystyna Semkow ,  Thomas A. Wassick

IPC: H01L21/44 ,  H01L23/48 ,  H01L23/52 ,  H01L23/498 ,  H01L21/768 ,  H05K1/09 ,  H05K3/40 ,  H05K3/34

CPC classification number: H01L23/49816 ,  H01L21/76843 ,  H01L21/76885 ,  H01L23/49866 ,  H01L2224/11 ,  H05K1/09 ,  H05K3/3478 ,  H05K3/4007 ,  H05K2201/0338 ,  H05K2201/0341 ,  H05K2201/0344 ,  H05K2201/09745 ,  H05K2203/041

Abstract: An interconnect structure that includes a substrate having an electrical component present therein, and a under-bump metallurgy (UBM) stack that is present in contact with a contact pad to the electrical component that is present in the substrate. The UBM stack includes a metallic adhesion layer that is direct contact with the contact pad to the electrical component, a copper (Cu) seed layer that is in direct contact with the metallic adhesion layer layer, a first nickel (Ni) barrier layer that is present in direct contact with copper (Cu) seed layer, and a layered structure of at least one copper (Cu) conductor layer and at least one second nickel (Ni) barrier layer present on the first nickel (Ni) barrier layer. A solder ball may be present on second nickel (Ni) barrier layer.

Abstract translation: 一种互连结构，其包括其中存在电气部件的基板以及与接触焊盘接触的凸起下冶金（UBM）堆叠，所述凸块冶金（UBM）堆叠存在于所述基板中的所述电气部件。 UBM堆叠包括与接触焊盘直接接触电气部件的金属粘合层，与金属粘附层层直接接触的铜（Cu）种子层，第一镍（Ni）阻挡层， 存在于铜（Cu）种子层的直接接触中，以及存在于第一镍（Ni）阻挡层上的至少一个铜（Cu）导体层和至少一个第二镍（Ni）阻挡层的层状结构。 第二镍（Ni）阻挡层上可能存在焊球。

公开(公告)号：US20150250054A1

公开(公告)日：2015-09-03

申请号：US14633864

申请日：2015-02-27

Applicant: IBIDEN CO., LTD.

Inventor： Kazuhiro YOSHIKAWA ,  Takashi KARIYA

IPC: H05K1/11 ,  H05K1/09 ,  H05K3/18 ,  H05K3/46 ,  H05K3/22 ,  H05K3/02 ,  H01L23/00 ,  H05K1/14

CPC classification number: H05K1/111 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/09 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/13101 ,  H01L2224/16225 ,  H01L2224/81192 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H05K1/144 ,  H05K3/28 ,  H05K3/3436 ,  H05K3/3452 ,  H05K3/3478 ,  H05K3/4007 ,  H05K3/4644 ,  H05K2201/042 ,  H05K2201/068 ,  H05K2201/09745 ,  H05K2201/098 ,  H05K2201/10977 ,  H05K2201/2072 ,  H05K2203/0353 ,  H05K2203/0361 ,  H05K2203/0405 ,  H05K2203/0594 ,  H05K2203/0597 ,  H05K2203/1184 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00014

Abstract: A printed wiring board includes an uppermost insulating layer, first pads positioned to mount an IC chip on the insulating layer, second pads positioned to mount a second printed wiring board on the insulating layer, metal posts formed on the second pads, respectively, such that the metal posts mount the second board over the chip, and a solder resist layer formed on the uppermost insulating layer and having first and second openings such that the first openings exposes the first pads and that the second openings exposes the second pads, respectively. The metal posts are formed such that each of the metal posts has a diameter which is smaller than a diameter of each of the second opening portions, and the second opening portions are formed such that the diameter of each of the second opening portions is smaller than a diameter of each of the second pads.

Abstract translation: 印刷布线板包括最上层的绝缘层，位于绝缘层上的IC芯片安装的第一焊盘，位于绝缘层上的第二印刷电路板安装的第二焊盘，分别形成在第二焊盘上的金属柱，使得 金属柱将第二板安装在芯片上，以及形成在最上层绝缘层上并具有第一和第二开口的阻焊层，使得第一开口暴露第一焊盘，并且第二开口分别暴露第二焊盘。 金属柱形成为使得每个金属柱的直径小于每个第二开口部的直径，并且第二开口部形成为使得每个第二开口部的直径小于 每个第二垫的直径。

公开(公告)号：US09084378B2

公开(公告)日：2015-07-14

申请号：US13829242

申请日：2013-03-14

Applicant: International Business Machines Corporation

Inventor： Charles L. Arvin ,  Minhua Lu ,  Eric D. Perfecto ,  Krystyna W. Semkow ,  Thomas A. Wassick

IPC: H01L21/44 ,  H01L23/48 ,  H01L23/52 ,  H05K3/40 ,  H01L23/31 ,  H05K3/34 ,  H01L23/00

CPC classification number: H05K3/4007 ,  H01L23/3192 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0345 ,  H01L2224/03462 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05572 ,  H01L2224/0558 ,  H01L2224/05647 ,  H01L2224/11334 ,  H01L2224/11849 ,  H01L2224/13005 ,  H01L2224/13022 ,  H01L2224/13111 ,  H01L2924/12042 ,  H01L2924/3656 ,  H05K3/3463 ,  H05K2201/0338 ,  H05K2201/09745 ,  H05K2203/041 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/207 ,  H01L2924/01074 ,  H01L2924/00

Abstract: An interconnect structure that includes a substrate having an electrical component present therein, and a under-bump metallurgy (UBM) stack that is present in contact with a contact pad to the electrical component that is present in the substrate. The UBM stack includes a metallic adhesion layer that is direct contact with the contact pad to the electrical component, a copper (Cu) seed layer that is in direct contact with the metallic adhesion layer, a first nickel (Ni) barrier layer that is present in direct contact with copper (Cu) seed layer, and a layered structure of at least one copper (Cu) conductor layer and at least one second nickel (Ni) barrier layer present on the first nickel (Ni) barrier layer. A solder ball may be present on second nickel (Ni) barrier layer.

Abstract translation: 一种互连结构，其包括其中存在电气部件的基板以及与接触焊盘接触的凸起下冶金（UBM）堆叠，所述凸块冶金（UBM）堆叠存在于所述基板中的所述电气部件。 UBM堆叠包括与接触焊盘直接接触电气部件的金属粘附层，与金属粘附层直接接触的铜（Cu）种子层，存在的第一镍（Ni）阻挡层 与铜（Cu）种子层直接接触，以及存在于第一镍（Ni）阻挡层上的至少一个铜（Cu）导体层和至少一个第二镍（Ni）阻挡层的层状结构。 第二镍（Ni）阻挡层上可能存在焊球。

公开(公告)号：US20150107882A1

公开(公告)日：2015-04-23

申请号：US14407074

申请日：2013-06-14

Applicant: OSRAM GmbH

Inventor： Jianghui Yang ,  Chuanpeng Zhong ,  Hao Li ,  Xiaomian Chen

IPC: H05K1/05 ,  H05K1/18 ,  H05K3/10 ,  H05K1/02

CPC classification number: H05K1/053 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K1/0201 ,  H05K1/0203 ,  H05K1/0204 ,  H05K1/0284 ,  H05K1/0306 ,  H05K1/056 ,  H05K1/142 ,  H05K1/181 ,  H05K3/10 ,  H05K2201/048 ,  H05K2201/06 ,  H05K2201/09745 ,  H05K2201/10106 ,  H05K2201/10416 ,  Y10T29/49155 ,  H01L2924/00014

Abstract: Various embodiments relate to a circuit board, including a base and a heat-conducting layer. The base has a first region and a second region on one side thereof facing the heat-conducting layer, the first region is recessed with respect to the second region, a first insulating layer is accommodated in the first region, a second insulating layer is formed on the second region, and the first insulating layer and the second insulating layer have different thermal conductivities. In addition, various embodiments further relate to an electronic module and an illuminating device including such circuit board. Various embodiments also relate to a method for manufacturing such circuit board.

Abstract translation: 各种实施例涉及包括基底和导热层的电路板。 所述基座的一侧面对所述导热层具有第一区域和第二区域，所述第一区域相对于所述第二区域凹陷，所述第一绝缘层容纳在所述第一区域中，形成第二绝缘层 在第二区域上，第一绝缘层和第二绝缘层具有不同的热导率。 此外，各种实施例还涉及电子模块和包括这种电路板的照明装置。 各种实施例还涉及一种用于制造这种电路板的方法。

公开(公告)号：US08981418B2

公开(公告)日：2015-03-17

申请号：US13572684

申请日：2012-08-12

Applicant: Chih-Chen Lai

Inventor： Chih-Chen Lai

IPC: H01L33/00 ,  H01L33/48 ,  H05K1/11 ,  H05K3/30 ,  H05K3/34

CPC classification number: H01L33/005 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2933/0033 ,  H01L2933/005 ,  H05K1/111 ,  H05K3/303 ,  H05K3/3431 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2201/09745 ,  H05K2201/10106 ,  H05K2201/10984 ,  Y02P70/611 ,  Y02P70/613

Abstract: An SMT LED device includes an LED and a circuit board supporting the LED. A pair of first solder pads are formed on the circuit board and spaced from each other. The LED includes two solder slugs extending downwardly from a bottom the LED. A positioning hole is formed at each first solder pad corresponding a position of a corresponding solder slug. A second solder pad is received in the positioning hole. Each solder slug is received in one corresponding positioning hole and electrically connected to corresponding first and second solder pads by a reflow soldering process. The present disclosure also provides a method for manufacturing the SMT LED device.

Abstract translation: SMT LED器件包括LED和支撑LED的电路板。 一对第一焊盘形成在电路板上并彼此间隔开。 LED包括从LED的底部向下延伸的两个焊料块。 在对应于相应焊料块的位置的每个第一焊盘处形成定位孔。 第二焊垫被容纳在定位孔中。 每个焊料块被接收在一个对应的定位孔中，并通过回流焊接工艺电连接到对应的第一和第二焊盘。 本公开还提供了一种用于制造SMT LED器件的方法。

公开(公告)号：US08975116B2

公开(公告)日：2015-03-10

申请号：US13515137

申请日：2010-12-14

Applicant: Andreas Ostmann ,  Dionysios Manessis ,  Lars Böttcher ,  Stefan Karaszkiewicz

Inventor： Andreas Ostmann ,  Dionysios Manessis ,  Lars Böttcher ,  Stefan Karaszkiewicz

IPC: H01L21/00 ,  H05K1/18 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H05K3/02

CPC classification number: H05K1/188 ,  H01L21/4832 ,  H01L21/56 ,  H01L23/3107 ,  H01L24/16 ,  H01L24/24 ,  H01L24/28 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/82 ,  H01L24/83 ,  H01L2221/68377 ,  H01L2223/54426 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/136 ,  H01L2224/2402 ,  H01L2224/2919 ,  H01L2224/81121 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/92 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H05K3/025 ,  H05K2201/0969 ,  H05K2201/09745 ,  H05K2203/0353 ,  H01L2224/81 ,  H01L2224/82 ,  H01L2224/83 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/014

Abstract: An electronic unit is produced including at least one electronic component at least partially embedded in an insulating material. A film assembly is provided with at least one conductive layer and a carrier layer. The conductive layer includes openings in the form of holes for receiving bumps, which are connected to contact surfaces of the at least one electronic component. The at least one component is placed on the film assembly such that the bumps engage with the openings of the conductive layer. The at least one component is partially embedded from the side opposite of the bumps into a dielectric layer. The carrier layer of the film assembly is removed such that the surface of the bumps is exposed. A metallization layer is then deposited on the side of the remaining conductive layer having the exposed bumps and so as to produce conductor tracks that overlap with the bumps.

Abstract translation: 制造的电子单元包括至少部分地嵌入绝缘材料中的至少一个电子部件。 膜组件设置有至少一个导电层和载体层。 导电层包括用于接收凸块形式的开口，凸起连接到至少一个电子部件的接触表面。 将至少一个部件放置在胶片组件上，使得凸块与导电层的开口接合。 所述至少一个部件从与所述凸块相对的一侧部分嵌入到电介质层中。 除去膜组件的载体层，使得凸块的表面露出。 然后在具有暴露的凸块的剩余导电层的侧面上沉积金属化层，以便产生与凸块重叠的导体轨迹。

公开(公告)号：US20150034704A1

公开(公告)日：2015-02-05

申请号：US14339628

申请日：2014-07-24

Applicant: ANTAYA TECHNOLOGIES CORP.

Inventor： Alexandra Mary Mackin ,  John Pereira ,  Matthew J. Scherer

IPC: B23K1/20 ,  H01B5/00 ,  H05K13/04

CPC classification number: B23K1/203 ,  B23K35/22 ,  H01B5/002 ,  H05K3/3489 ,  H05K13/0465 ,  H05K2201/09745

Abstract: A presoldered prefluxed electrical component or connector, which can protect the flux from wearing off the surface of solder during shipping and handling. The electrical component can include a terminal pad. A layer of solder can be on the terminal pad. The layer of solder can have a surface with a series of generally equally spaced apart flux wells formed in the surface of the solder for protectively storing and retaining flux therein. The flux wells can have a lateral dimension of at least 0.05 mm and a depth of at least 0.023 mm that is deep enough for retaining a quantity of flux therein when flux on the surface of the layer of solder wears off during shipping and/or handling.

Abstract translation: 一种预铸的预先焊接的电气部件或连接器，其可以在运输和处理期间保护焊剂免受焊料表面的磨损。 电气部件可以包括终端焊盘。 一层焊料可以在端子垫上。 焊料层可以具有在焊料的表面中形成的一系列通常等间隔开的焊剂阱的表面，用于在其中保护性地存储和保持焊剂。 焊剂孔​​可具有至少0.05mm的横向尺寸和至少0.023mm的深度，其深度足以在运输和/或处理期间在焊料层的表面上的焊剂磨损时保持一定量的焊剂 。

公开(公告)号：US20150029689A1

公开(公告)日：2015-01-29

申请号：US14328765

申请日：2014-07-11

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Kei IMAFUJI ,  Katsumi YAMAZAKI ,  Noritaka KATAGIRI ,  Teruaki CHINO

IPC: H05K1/11 ,  H05K1/18 ,  H01B5/00

CPC classification number: H05K1/111 ,  H01L2224/16225 ,  H05K1/181 ,  H05K3/3426 ,  H05K3/4007 ,  H05K2201/09427 ,  H05K2201/09745 ,  H05K2201/09827 ,  H05K2201/10704 ,  Y02P70/611 ,  Y02P70/613

Abstract: A bump structure provided on an electrode pad includes a solder member, and a metal layer having a cylindrical portion covering a side surface of the solder member, the metal layer being made of a metal which is higher in melting point than the solder member. An upper part of the cylindrical portion of the metal layer is opened wide.

Abstract translation: 设置在电极焊盘上的凸块结构包括焊料构件和金属层，该金属层具有覆盖焊料构件的侧面的圆筒部，金属层由熔点高于焊料构件的金属制成。 金属层的圆筒部的上部开口宽。

公开(公告)号：US20150009633A1

公开(公告)日：2015-01-08

申请号：US14321995

申请日：2014-07-02

Applicant: AU Optronics Corporation

Inventor： Chih-Hung CHEN ,  Po-Fu HUANG ,  Chih-Hao WANG

IPC: H05K1/11 ,  H05K1/14

CPC classification number: H05K3/361 ,  H05K1/0269 ,  H05K3/323 ,  H05K3/4015 ,  H05K2201/0233 ,  H05K2201/09745 ,  H05K2201/09781 ,  H05K2201/10136

Abstract: A circuit board module includes a first circuit board, an electrically conductive structure, a first bump, a second circuit board and an electrically conductive film. The electrically conductive structure and the first bump are disposed on the supporting surface of the first circuit board. The electrically conductive structure and the first bump respectively have a first maximal thickness T1 and a second maximal thickness T2 along the normal direction of the supporting surface. The second circuit board is disposed on the electrically conductive structure and the first bump. The electrically conductive film is disposed between the second circuit board and the electrically conductive structure, and it has a plurality of electrically conductive particles. An average particle diameter D of the electrically conductive particles when undeformed satisfies: 0

Abstract translation: 电路板模块包括第一电路板，导电结构，第一凸块，第二电路板和导电膜。 导电结构和第一凸块设置在第一电路板的支撑表面上。 导电结构和第一凸块分别具有沿着支撑表面的法线方向的第一最大厚度T1和第二最大厚度T2。 第二电路板设置在导电结构和第一凸块上。 导电膜设置在第二电路板和导电结构之间，并且其具有多个导电颗粒。 当未变形时导电颗粒的平均粒径D满足：0