公开(公告)号：US20130181228A1

公开(公告)日：2013-07-18

申请号：US13617048

申请日：2012-09-14

申请人： Osamu USUI ,  Naoki YOSHIMATSU ,  Masao KIKUCHI

发明人： Osamu USUI ,  Naoki YOSHIMATSU ,  Masao KIKUCHI

IPC分类号： H01L25/07 ,  H01L21/98 ,  H01L29/161

CPC分类号： H01L24/97 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49541 ,  H01L23/49575 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/92 ,  H01L2224/06181 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/3755 ,  H01L2224/40137 ,  H01L2224/40139 ,  H01L2224/40247 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/73213 ,  H01L2224/73215 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2224/92246 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/1203 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/84

摘要： First chip main surfaces of first semiconductor chips are bonded to a heat spreader, and second chip main surfaces of the first semiconductor chips are bonded to a first electrode. First chip main surfaces of second semiconductor chips are bonded to a heat spreader, and second chip main surfaces of the second semiconductor chips are bonded to a first electrode. A plurality of electrodes are provided by a lead frame. An insulating member is provided on a side opposite to the chips when viewed from the heat spreader. An insulating substrate is provided on a side opposite to the chips when viewed from the first electrodes.

摘要翻译： 第一半导体芯片的第一芯片主表面被接合到散热器，并且第一半导体芯片的第二芯片主表面被接合到第一电极。 将第二半导体芯片的第一芯片主表面接合到散热器，并且将第二半导体芯片的第二芯片主表面接合到第一电极。 多个电极由引线框架提供。 当从散热器观察时，绝缘构件设置在与芯片相对的一侧上。 当从第一电极观察时，在与芯片相对的一侧上设置绝缘基板。

公开(公告)号：US20180331002A1

公开(公告)日：2018-11-15

申请号：US16033054

申请日：2018-07-11

申请人： Renesas Electronics Corporation

发明人： Koji BANDO ,  Akira MUTO

IPC分类号： H01L23/053 ,  H01L23/057 ,  H01L25/18 ,  H01L23/433 ,  H01L23/495 ,  H01L23/50 ,  H01L23/00 ,  H01L25/07 ,  H01L25/11 ,  H02M7/00 ,  H01L23/373 ,  H01L23/31 ,  H01L29/739 ,  H01L29/78 ,  H01L29/861

CPC分类号： H01L23/053 ,  H01L23/057 ,  H01L23/3107 ,  H01L23/3735 ,  H01L23/4334 ,  H01L23/49513 ,  H01L23/49524 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/50 ,  H01L24/32 ,  H01L24/33 ,  H01L24/40 ,  H01L24/48 ,  H01L24/73 ,  H01L25/072 ,  H01L25/115 ,  H01L25/18 ,  H01L29/7395 ,  H01L29/7802 ,  H01L29/8611 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/40101 ,  H01L2224/40137 ,  H01L2224/48091 ,  H01L2224/48175 ,  H01L2224/73213 ,  H01L2224/73215 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2924/12036 ,  H01L2924/13055 ,  H01L2924/13091 ,  H02M7/003

摘要： Each of first and second semiconductor devices mounted on a substrate includes an emitter terminal electrically connected with a front surface electrode of a semiconductor chip and exposed from a main surface of a sealing body located on a front surface side of the semiconductor chip. Each of the first and second semiconductor devices includes a collector terminal electrically connected with a back surface electrode of the semiconductor chip and exposed from the main surface of the sealing body located on a back surface side of the semiconductor chip. The collector terminal of the first semiconductor device is electrically connected with the emitter terminal of the second semiconductor device via a conductor pattern formed on an upper surface of the substrate.

公开(公告)号：US20170352629A1

公开(公告)日：2017-12-07

申请号：US15537466

申请日：2015-09-29

申请人： Mitsubishi Electric Corporation

发明人： Akihisa FUKUMOTO ,  Tetsu NEGISHI ,  Kei YAMAMOTO ,  Toshiaki SHINOHARA ,  Kazuyasu NISHIKAWA

IPC分类号： H01L23/00 ,  H01L23/373 ,  H01L23/29 ,  H01L23/31

CPC分类号： H01L23/562 ,  H01L23/051 ,  H01L23/293 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3735 ,  H01L23/48 ,  H01L24/29 ,  H01L24/32 ,  H01L24/37 ,  H01L24/40 ,  H01L24/73 ,  H01L25/072 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/29147 ,  H01L2224/29565 ,  H01L2224/29655 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/3754 ,  H01L2224/40095 ,  H01L2224/40137 ,  H01L2224/40155 ,  H01L2224/73213 ,  H01L2224/73263 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/351 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/37099

摘要： A power module includes a power semiconductor element, an interconnection material, a circuit board, an external terminal, a joining material, and a sealing resin. A clearance portion is continuously formed between the sealing resin and each of an end surface of the joining material and a surface of the interconnection material so as to extend from the end surface of the joining material to the surface of the interconnection material, the end surface of the joining material being located between the power semiconductor element and the interconnection material, the surface of the interconnection material being located between the end surface and a predetermined position of the interconnection material separated by a distance from the end surface.

公开(公告)号：US20170250126A1

公开(公告)日：2017-08-31

申请号：US15352393

申请日：2016-11-15

申请人： TEXAS INSTRUMENTS INCORPORATED

发明人： Gregory Thomas Ostrowicki

IPC分类号： H01L23/495 ,  H01L25/07 ,  H01L23/00

CPC分类号： H01L23/49575 ,  H01L23/3121 ,  H01L23/492 ,  H01L23/49541 ,  H01L23/49551 ,  H01L23/49562 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/73 ,  H01L25/074 ,  H01L2224/06181 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/37011 ,  H01L2224/37013 ,  H01L2224/37147 ,  H01L2224/40245 ,  H01L2224/73213 ,  H01L2224/73263 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/014 ,  H01L2924/00014

摘要： A power converter (300) has a first transistor chip (310) conductively stacked on top of a second transistor chip (320) attached to a substrate (301). A first metallic clip (360) has a plate portion (360a) and a ridge portion (360c) bent at an angle from the plate portion. The plate portion is attached to the terminal of the first transistor chip opposite the second transistor chip. The ridge portion extends to the substrate is and is configured as a plurality of parallel straight fingers (360d). Each finger is discretely attached to the substrate using attachment material (361), for instance solder, and operable as a spring-line cantilever to accommodate, under a force lying in the plane of the substrate, elastic elongation based upon inherent material characteristics.

公开(公告)号：US20160365295A1

公开(公告)日：2016-12-15

申请号：US15149207

申请日：2016-05-09

申请人： Infineon Technologies AG

发明人： Juergen HOEGERL ,  Edward FUERGUT

IPC分类号： H01L23/31 ,  H01L23/04 ,  H01L23/10 ,  H01L21/56 ,  H01L23/492

CPC分类号： H01L23/31 ,  H01L21/561 ,  H01L21/566 ,  H01L21/568 ,  H01L23/04 ,  H01L23/10 ,  H01L23/142 ,  H01L23/295 ,  H01L23/3121 ,  H01L23/3142 ,  H01L23/492 ,  H01L23/4924 ,  H01L23/4928 ,  H01L23/49562 ,  H01L23/49877 ,  H01L23/5386 ,  H01L23/544 ,  H01L24/06 ,  H01L24/24 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/40 ,  H01L24/48 ,  H01L24/50 ,  H01L24/66 ,  H01L24/69 ,  H01L24/73 ,  H01L24/82 ,  H01L24/83 ,  H01L24/86 ,  H01L24/89 ,  H01L24/92 ,  H01L24/97 ,  H01L29/7393 ,  H01L29/868 ,  H01L2223/54486 ,  H01L2224/04026 ,  H01L2224/06181 ,  H01L2224/24137 ,  H01L2224/2732 ,  H01L2224/291 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/29311 ,  H01L2224/29318 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/29499 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/40137 ,  H01L2224/48137 ,  H01L2224/73201 ,  H01L2224/73213 ,  H01L2224/73215 ,  H01L2224/73217 ,  H01L2224/73219 ,  H01L2224/73251 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83801 ,  H01L2224/83815 ,  H01L2224/83825 ,  H01L2224/8384 ,  H01L2224/8385 ,  H01L2224/83851 ,  H01L2224/83855 ,  H01L2224/84801 ,  H01L2224/8484 ,  H01L2224/8485 ,  H01L2224/92142 ,  H01L2224/92144 ,  H01L2224/92147 ,  H01L2224/92148 ,  H01L2224/92242 ,  H01L2224/92244 ,  H01L2224/92248 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/10155 ,  H01L2924/1016 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10272 ,  H01L2924/1032 ,  H01L2924/10329 ,  H01L2924/10331 ,  H01L2924/10332 ,  H01L2924/10335 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15162 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2924/0103 ,  H01L2924/014 ,  H01L2224/83 ,  H01L2224/84 ,  H01L2224/85 ,  H01L2224/32 ,  H01L2224/69 ,  H01L2224/89 ,  H01L2224/82 ,  H01L2224/86 ,  H01L2224/45099

摘要： A semiconductor arrangement is provided. The semiconductor arrangement may include an electrically conductive plate having a surface, a plurality of power semiconductor devices arranged on the surface of the electrically conductive plate, wherein a first controlled terminal of each power semiconductor device of the plurality of power semiconductor devices may be electrically coupled to the electrically conductive plate, a plurality of electrically conductive blocks, wherein each electrically conductive block may be electrically coupled with a respective second controlled terminal of each power semiconductor device of the plurality of power semiconductor devices; and encapsulation material encapsulating the plurality of power semiconductor devices, wherein at least one edge region of the surface of the electrically conductive plate may be free from the encapsulation material.

摘要翻译： 提供了半导体布置。 半导体布置可以包括具有表面的导电板，布置在导电板的表面上的多个功率半导体器件，其中多个功率半导体器件中的每个功率半导体器件的第一受控端可以电耦合 导电板，多个导电块，其中每个导电块可以与多个功率半导体器件中的每个功率半导体器件的相应的第二受控端电耦合; 以及封装所述多个功率半导体器件的封装材料，其中所述导电板的表面的至少一个边缘区域可以不含所述封装材料。

公开(公告)号：US09496208B1

公开(公告)日：2016-11-15

申请号：US15053453

申请日：2016-02-25

申请人： Texas Instruments Incorporated

发明人： Gregory Thomas Ostrowicki

IPC分类号： H01L23/495 ,  H01L25/07 ,  H01L23/00

CPC分类号： H01L23/49575 ,  H01L23/3121 ,  H01L23/492 ,  H01L23/49541 ,  H01L23/49551 ,  H01L23/49562 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/73 ,  H01L25/074 ,  H01L2224/06181 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/37011 ,  H01L2224/37013 ,  H01L2224/37147 ,  H01L2224/40245 ,  H01L2224/73213 ,  H01L2224/73263 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/014 ,  H01L2924/00014

摘要： A power converter (300) has a first transistor chip (310) conductively stacked on top of a second transistor chip (320) attached to a substrate (301). A first metallic clip (360) has a plate portion (360a) and a ridge portion (360c) bent at an angle from the plate portion. The plate portion is attached to the terminal of the first transistor chip opposite the second transistor chip. The ridge portion extends to the substrate is and is configured as a plurality of parallel straight fingers (360d). Each finger is discretely attached to the substrate using attachment material (361), for instance solder, and operable as a spring-line cantilever to accommodate, under a force lying in the plane of the substrate, elastic elongation based upon inherent material characteristics.

摘要翻译： 电源转换器（300）具有导电地堆叠在附接到衬底（301）的第二晶体管芯片（320）的顶部上的第一晶体管芯片（310）。 第一金属夹（360）具有从板部弯曲成一定角度的板部（360a）和脊部（360c）。 板部附接到与第二晶体管芯片相对的第一晶体管芯片的端子。 延伸到基板的脊部被构造成多个平行的直指（360d）。 每个手指使用附接材料（361）离散地附接到基底，例如焊料，并且可用作弹簧线悬臂，以在位于基底平面内的力下容纳基于固有材料特性的弹性伸长。

公开(公告)号：US09379046B2

公开(公告)日：2016-06-28

申请号：US14752295

申请日：2015-06-26

申请人： Infineon Technologies AG

发明人： Ralf Otremba ,  Xaver Schloegel ,  Khai Huat Jeffrey Low ,  Chee Soon Law

IPC分类号： H01L21/00 ,  H01L23/495 ,  H01L23/00 ,  B81C1/00

CPC分类号： H01L23/49503 ,  B81C1/00301 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/49562 ,  H01L23/49582 ,  H01L24/00 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/78 ,  H01L24/84 ,  H01L24/85 ,  H01L24/91 ,  H01L2224/05553 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/0603 ,  H01L2224/37144 ,  H01L2224/40245 ,  H01L2224/4103 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45624 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48472 ,  H01L2224/48624 ,  H01L2224/48647 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48744 ,  H01L2224/48747 ,  H01L2224/48824 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/73213 ,  H01L2224/78301 ,  H01L2224/7865 ,  H01L2224/84801 ,  H01L2224/85045 ,  H01L2224/85099 ,  H01L2224/851 ,  H01L2224/85205 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85801 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1301 ,  H01L2924/1304 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/2075 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2924/01016 ,  H01L2924/01026 ,  H01L2924/01201

摘要： A module includes a semiconductor chip having at least a first terminal contact surface and a second terminal contact surface. A first bond element made of a material on the basis of Cu is attached to the first terminal contact surface, and a second bond element is attached to the second terminal contact surface. The second bond element is made of a material different from the material of the first bond element or is made of a type of bond element different from the type of the first bond element.

公开(公告)号：US20150294926A1

公开(公告)日：2015-10-15

申请号：US14752295

申请日：2015-06-26

申请人： Infineon Technologies AG

发明人： Ralf Otremba ,  Xaver Schloegel ,  Khai Huat Jeffrey Low ,  Chee Soon Law

IPC分类号： H01L23/495 ,  B81C1/00 ,  H01L23/00

CPC分类号： H01L23/49503 ,  B81C1/00301 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/49562 ,  H01L23/49582 ,  H01L24/00 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/78 ,  H01L24/84 ,  H01L24/85 ,  H01L24/91 ,  H01L2224/05553 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/0603 ,  H01L2224/37144 ,  H01L2224/40245 ,  H01L2224/4103 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45624 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48472 ,  H01L2224/48624 ,  H01L2224/48647 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48744 ,  H01L2224/48747 ,  H01L2224/48824 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/73213 ,  H01L2224/78301 ,  H01L2224/7865 ,  H01L2224/84801 ,  H01L2224/85045 ,  H01L2224/85099 ,  H01L2224/851 ,  H01L2224/85205 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85801 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1301 ,  H01L2924/1304 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/2075 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2924/01016 ,  H01L2924/01026 ,  H01L2924/01201

摘要： A module includes a semiconductor chip having at least a first terminal contact surface and a second terminal contact surface. A first bond element made of a material on the basis of Cu is attached to the first terminal contact surface, and a second bond element is attached to the second terminal contact surface. The second bond element is made of a material different from the material of the first bond element or is made of a type of bond element different from the type of the first bond element.

摘要翻译： 模块包括具有至少第一端子接触表面和第二端子接触表面的半导体芯片。 由基于Cu的材料制成的第一接合元件附接到第一端子接触表面，并且第二接合元件附接到第二端子接触表面。 第二结合元件由与第一结合元件的材料不同的材料制成，或者由不同于第一粘结元件的类型的粘结元件制成。

公开(公告)号：US20140110829A1

公开(公告)日：2014-04-24

申请号：US14144192

申请日：2013-12-30

申请人： Infineon Technologies AG

发明人： Ralf Otremba ,  Xaver Schloegel ,  Khai Huat Jeffrey Low ,  Chee Soon Law

IPC分类号： H01L23/495

CPC分类号： H01L23/49503 ,  B81C1/00301 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/49562 ,  H01L23/49582 ,  H01L24/00 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/78 ,  H01L24/84 ,  H01L24/85 ,  H01L24/91 ,  H01L2224/05553 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/0603 ,  H01L2224/37144 ,  H01L2224/40245 ,  H01L2224/4103 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45624 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48472 ,  H01L2224/48624 ,  H01L2224/48647 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48744 ,  H01L2224/48747 ,  H01L2224/48824 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/73213 ,  H01L2224/78301 ,  H01L2224/7865 ,  H01L2224/84801 ,  H01L2224/85045 ,  H01L2224/85099 ,  H01L2224/851 ,  H01L2224/85205 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85801 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1301 ,  H01L2924/1304 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/2075 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2924/01016 ,  H01L2924/01026 ,  H01L2924/01201

摘要： A module includes a semiconductor chip having at least a first terminal contact surface and a second terminal contact surface. A first bond element made of a material on the basis of Cu is attached to the first terminal contact surface, and a second bond element is attached to the second terminal contact surface. The second bond element is made of a material different from the material of the first bond element or is made of a type of bond element different from the type of the first bond element.

摘要翻译： 模块包括具有至少第一端子接触表面和第二端子接触表面的半导体芯片。 由基于Cu的材料制成的第一接合元件附接到第一端子接触表面，并且第二接合元件附接到第二端子接触表面。 第二结合元件由与第一结合元件的材料不同的材料制成，或者由不同于第一粘结元件的类型的粘结元件制成。

公开(公告)号：US08039959B2

公开(公告)日：2011-10-18

申请号：US11580750

申请日：2006-10-13

申请人： Masud Beroz

发明人： Masud Beroz

IPC分类号： H01L23/48

CPC分类号： H01L23/49805 ,  H01L23/3114 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/40 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/02379 ,  H01L2224/04034 ,  H01L2224/04042 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/06181 ,  H01L2224/06182 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16238 ,  H01L2224/1703 ,  H01L2224/171 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/401 ,  H01L2224/40145 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48149 ,  H01L2224/48465 ,  H01L2224/73207 ,  H01L2224/73213 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/73271 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012 ,  H01L2924/014

摘要： A microelectronic connection component includes a substrate having a first surface, a second surface and a peripheral edge. First and second terminals are exposed at the first surface of the substrate. Wire bond pads are exposed proximate the peripheral edge of the substrate at the first surface. First conductive paths couple the first terminals to the wire bond pads. Bonding leads extend beyond the peripheral edge of the substrate. Second conductive paths couple the second terminals to the bonding leads.

摘要翻译： 微电子连接部件包括具有第一表面，第二表面和外围边缘的基板。 第一和第二端子在基板的第一表面处露出。 引线接合焊盘在第一表面附近暴露于基板的周边边缘。 第一导电路径将第一端子耦合到引线接合焊盘。 接合引线延伸超过衬底的周缘。 第二导电路径将第二端子耦合到接合引线。