公开(公告)号：US20230164906A1

公开(公告)日：2023-05-25

申请号：US18157157

申请日：2023-01-20

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Dai NAKAGAWA ,  Takanori UEJIMA ,  Yuji TAKEMATSU ,  Yukiya YAMAGUCHI

IPC: H05K1/02 ,  H03F3/24 ,  H04B1/40

CPC classification number: H05K1/0216 ,  H05K1/0243 ,  H05K1/0203 ,  H03F3/245 ,  H04B1/40 ,  H05K2201/1006 ,  H03F2200/165 ,  H03F2200/451

Abstract: Improvement in heat dissipation capability is intended. A radio-frequency module includes a mounting substrate, a first transmission filter, a second transmission filter, a resin layer, and a shield layer. The second transmission filter is higher in power class than the first transmission filter. The resin layer covers at least part of an outer peripheral surface of the first transmission filter and covers at least part of an outer peripheral surface of the second transmission filter. The shield layer overlaps at least part of the second transmission filter in plan view in a thickness direction of the mounting substrate. At least part of a major surface of the second transmission filter on an opposite side to the mounting substrate side is in contact with the shield layer.

公开(公告)号：US20230155636A1

公开(公告)日：2023-05-18

申请号：US18154433

申请日：2023-01-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Danbi JEON ,  Bonmin KOO ,  Jonghwa KIM ,  Jihye KIM ,  Inho NA ,  Dongsik SHIN ,  Seunghwan YOON ,  Jongwook ZEONG

IPC: H04B7/0413 ,  H01P1/207 ,  H05K1/02 ,  H05K1/11

CPC classification number: H04B7/0413 ,  H01P1/207 ,  H05K1/0243 ,  H05K1/115 ,  H05K2201/1006 ,  H05K2201/10098

Abstract: The disclosure relates to a 5th generation (5G) or pre-5G communication system for supporting a higher data transfer rate than a 4th generation (4G) communication system, such as long-term evolution (LTE). An antenna module is provided. The antenna module includes a filter for filtering a radio frequency (RF) signal, and a sub printed circuit board (PCB), the sub-PCB comprises a passive circuit for processing the RF signal, and, the sub-PCB may be coupled to the filter such that the filter operates as a bumper when being coupled to a filter board.

公开(公告)号：US20180255643A1

公开(公告)日：2018-09-06

申请号：US15889491

申请日：2018-02-06

Applicant: Skyworks Solutions, Inc.

Inventor： Darren Roger Frenette ,  George Khoury ,  Leslie Paul Wallis ,  Lori Ann DeOrio

IPC: H05K1/18 ,  H03F3/195 ,  H03H7/06 ,  H01L25/18 ,  H01L23/31 ,  H01L23/00 ,  H01L23/66 ,  H04B1/40 ,  H03F3/213

CPC classification number: H05K1/181 ,  H01L23/3107 ,  H01L23/66 ,  H01L24/16 ,  H01L24/48 ,  H01L25/16 ,  H01L25/18 ,  H01L41/0475 ,  H01L41/113 ,  H01L2223/6644 ,  H01L2224/04042 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48195 ,  H01L2224/48225 ,  H01L2924/00014 ,  H01L2924/1421 ,  H01L2924/146 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/19107 ,  H03B5/32 ,  H03F3/195 ,  H03F3/213 ,  H03F2200/451 ,  H03H7/06 ,  H03H9/0547 ,  H03H2001/0021 ,  H04B1/40 ,  H05K2201/1006 ,  H05K2201/10098 ,  H05K2201/10674 ,  H01L2224/45099

Abstract: A packaged module for use in a wireless communication device has a substrate supporting an integrated circuit die that includes at least a microprocessor and radio frequency receiver circuitry and a stacked filter assembly configured as a filter circuit that is in communication with the radio frequency receiver circuitry. The stacked filter assembly includes a plurality of passive components, where each passive component is packaged as a surface mount device. At least one passive component is in direct communication with the substrate and at least another passive component is supported above the substrate by the at least one passive component that is in the direct communication with the substrate.

公开(公告)号：US20180095125A1

公开(公告)日：2018-04-05

申请号：US15821403

申请日：2017-11-22

Applicant: International Business Machines Corporation

Inventor： Paul S. Andry ,  Qianwen Chen ,  Bing Dang ,  John U. Knickerbocker ,  Minhua Lu ,  Robert J. Polastre ,  Bucknell C. Webb

IPC: G01R31/28 ,  G01R31/309 ,  H05K1/11 ,  H05K1/18 ,  H05K1/03 ,  H05K1/02 ,  H05K3/34 ,  H05K3/30 ,  H05K3/00

CPC classification number: G01R31/2818 ,  G01R31/309 ,  H05K1/0268 ,  H05K1/0274 ,  H05K1/0393 ,  H05K1/111 ,  H05K1/189 ,  H05K3/0026 ,  H05K3/305 ,  H05K3/341 ,  H05K3/3494 ,  H05K13/0069 ,  H05K2201/09072 ,  H05K2201/10015 ,  H05K2201/10037 ,  H05K2201/1006 ,  H05K2201/10098 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10522 ,  H05K2203/107 ,  H05K2203/162

Abstract: An electro-optical module assembly is provided that includes a flexible substrate having a first surface and a second surface opposite the first surface, wherein the flexible substrate contains an opening located therein that extends from the first surface to the second surface. An optical component is located on the second surface of the flexible substrate and is positioned to have a surface exposed by the opening. At least one electronic component is located on a first portion of the first surface of the flexible substrate, and at least one micro-energy source is located on a second portion of the first surface of the flexible substrate.

公开(公告)号：US20180049313A1

公开(公告)日：2018-02-15

申请号：US15439803

申请日：2017-02-22

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Jia LIU ,  Motochika OKANO

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0237 ,  G06K7/00 ,  H01Q1/243 ,  H01Q1/38 ,  H01Q5/50 ,  H01Q9/40 ,  H01Q13/10 ,  H01Q21/0006 ,  H01Q21/08 ,  H04W4/80 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/1006 ,  H05K2201/10098 ,  H05K2201/10636 ,  Y02P70/611

Abstract: A coupler for proximity wireless communication primarily based on an electric induction field generated therein, includes a substrate, a ground layer formed on a first region of the substrate and surrounding a second region of the substrate on three sides of the second region, a fourth side of the second region being defined by an edge of the substrate, and a coupling element electrically isolated from the ground layer and formed on the second region of the substrate. The coupling element includes a first portion that extends adjacent to and along the edge of the substrate and a second portion that is electrically connected to the first portion, extends inwardly from the edge of the substrate, and includes an inductor.

公开(公告)号：US20170345560A1

公开(公告)日：2017-11-30

申请号：US15605623

申请日：2017-05-25

Applicant: TDK CORPORATION

Inventor： TOSHIO TOMONARI ,  TSUTOMU KOBAYASHI ,  EMI ITO ,  YUMA KOMAYA

IPC: H01F27/38 ,  H03H1/00 ,  H03H7/42 ,  H05K1/11 ,  H01F27/28 ,  H01F27/29 ,  H05K1/18

CPC classification number: H03H7/427 ,  H01F27/2823 ,  H01F27/29 ,  H01F27/292 ,  H01F27/38 ,  H01F2017/0093 ,  H03H1/00 ,  H03H2001/0085 ,  H03H2001/0092 ,  H05K1/0225 ,  H05K1/0233 ,  H05K1/0245 ,  H05K1/111 ,  H05K1/181 ,  H05K2201/1003 ,  H05K2201/1006

Abstract: Disclosed herein is an electronic circuit module that includes a circuit board and a common mode filter mounted on the circuit board. The common mode filter includes first and second terminal electrodes constituting a first pair of terminal electrodes and third and fourth electrodes constituting a second pair of terminal electrodes. The circuit board includes: a first wiring layer having first, second, third, and fourth land patterns connected to the first, second, third, and fourth terminal electrodes, respectively, and first, second, third, and fourth wiring patterns connected to the first, second, third, and fourth land patterns, respectively; and a second wiring layer having a ground pattern that overlaps the first, second, third, and fourth wiring patterns without overlapping the first and second land patterns.

公开(公告)号：US09711288B2

公开(公告)日：2017-07-18

申请号：US14258711

申请日：2014-04-22

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Min Cheol Park ,  Sang Soo Park

IPC: H01G4/40 ,  H01F27/28 ,  H05K1/18 ,  H01G2/06 ,  H05K1/02 ,  H05K3/34

CPC classification number: H01G4/40 ,  H01F17/0013 ,  H01F27/2804 ,  H01F2027/2809 ,  H01G2/06 ,  H05K1/0233 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/1006 ,  H05K2201/10636 ,  H05K2201/2045 ,  Y02P70/611

Abstract: A composite electronic component may include: a composite body including a combination of a capacitor formed of a ceramic body including a plurality of dielectric layers and first and second internal electrodes disposed to face one another with the dielectric layers interposed therebetween, and an inductor formed of a magnetic body including a coil unit; a first external electrode formed on the first lateral surface of the ceramic body and electrically connected to the first internal electrodes and a second external electrode formed on the second lateral surface of the ceramic body and electrically connected to the second internal electrodes; third and fourth external electrodes formed on first and second end surfaces of the magnetic body and connected to the coil unit, and first and second dummy electrodes formed on first and second end surfaces of the magnetic body.

公开(公告)号：US20170118844A1

公开(公告)日：2017-04-27

申请号：US15175378

申请日：2016-06-07

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Bruce J. CHAMBERLIN ,  Andreas HUBER ,  Harald HUELS ,  Thomas STRACH ,  Thomas-Michael WINKEL

IPC: H05K3/34 ,  H05K3/40 ,  B23K1/00 ,  H05K3/00 ,  B23K1/20 ,  H05K3/46 ,  H05K1/11

CPC classification number: H05K1/184 ,  B23K1/0016 ,  H05K1/0298 ,  H05K1/092 ,  H05K1/111 ,  H05K1/113 ,  H05K1/116 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167 ,  H05K1/185 ,  H05K1/186 ,  H05K3/0047 ,  H05K3/3447 ,  H05K3/429 ,  H05K3/46 ,  H05K3/4644 ,  H05K3/4697 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/09327 ,  H05K2201/09345 ,  H05K2201/09381 ,  H05K2201/09518 ,  H05K2201/09545 ,  H05K2201/096 ,  H05K2201/09845 ,  H05K2201/10 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/1006 ,  H05K2201/10174

Abstract: Embedding a discrete electrical device in a printed circuit board (PCB) includes: providing a vertical via as a blind hole from a horizontal surface of the PCB to an electrically conductive structure in a first layer, the first layer being one layer of a first core section of a plurality of core sections vertically arranged above each other, each core section including lower and upper conductive layers, and a non-conductive layer in between; inserting the electrical device into the via, with the device extending within at least two of the core sections; establishing a first electrical connection between a first electrical device contact device and the electrically conductive structure in the first layer; and establishing a second electrical connection between a second electrical device contact and a second layer, the second layer being one of the electrically conductive layers of a second horizontal core section.

公开(公告)号：US09478488B2

公开(公告)日：2016-10-25

申请号：US14154291

申请日：2014-01-14

Applicant: Intel Corporation

Inventor： Damion T. Searls ,  Edward P. Osburn

IPC: H05K1/11 ,  H05K1/14 ,  H01L23/498 ,  H05K1/02 ,  H05K1/18

CPC classification number: H01L23/49844 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/13091 ,  H01L2924/1531 ,  H01L2924/19106 ,  H05K1/023 ,  H05K1/0231 ,  H05K1/0262 ,  H05K1/181 ,  H05K2201/1006 ,  H05K2201/10166 ,  H05K2201/10325 ,  H05K2201/10515 ,  H05K2201/10545 ,  H05K2201/10704 ,  Y10T29/4913 ,  Y10T29/49147 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401

Abstract: In one embodiment, the present invention includes a semiconductor device mounted to a first side of a circuit board; and at least one voltage regulator device mounted to a second side of the circuit board, the second side opposite to the first side. Examples of the voltage regulator devices include output filters, inductors, capacitors, and the like. In certain embodiments, the devices may be located directly underneath the semiconductor device.

Abstract translation: 在一个实施例中，本发明包括安装到电路板的第一侧的半导体器件; 以及安装到电路板的第二侧的至少一个电压调节器装置，第二侧与第一侧相对。 电压调节器装置的示例包括输出滤波器，电感器，电容器等。 在某些实施例中，器件可以位于半导体器件的正下方。

公开(公告)号：US09360378B2

公开(公告)日：2016-06-07

申请号：US14395467

申请日：2013-04-03

Applicant: CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE (C.N.R.S.) ,  UNIVERSITE DE FRANCHE-COMTE

Inventor： Sylvain Ballandras ,  Bruno Francois

IPC: H05K7/00 ,  G01K11/26 ,  H05K1/02 ,  B23K1/00 ,  H05K1/18 ,  H05K3/28 ,  H05K1/03 ,  H05K1/05 ,  H05K3/10 ,  H05K3/34

CPC classification number: G01K11/265 ,  B23K1/0016 ,  B23K2101/38 ,  H01L2224/45014 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/48091 ,  H01L2224/8592 ,  H01L2924/181 ,  H05K1/0293 ,  H05K1/0306 ,  H05K1/053 ,  H05K1/181 ,  H05K3/103 ,  H05K3/285 ,  H05K3/3426 ,  H05K2201/1006 ,  H05K2201/10068 ,  H05K2201/10075 ,  H05K2201/10083 ,  H05K2201/10098 ,  H05K2201/10151 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/10977 ,  H05K2203/049 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An electrical device includes a first electrical component and a second electrical component connected to each other via an electrical connection having an electrically insulating support plate and a weld joint deposited on the support plate. The weld joint has a melting temperature (Ta) significantly lower than an ambient operating temperature (Ta) to which at least one of the two electrical components and the electrical connection are subjected. The electrical device includes cement that completely covers the exposed weld joint. The material of the cement is chosen to maintain its adhesion and its tightness with respect to the weld joint when the Ta is applied.

Abstract translation: 电气设备包括通过电连接彼此连接的第一电气部件和第二电气部件，该电气连接具有电绝缘支撑板和沉积在支撑板上的焊接接头。 焊接接头具有明显低于两个电气部件和电连接中的至少一个所承受的环境工作温度（Ta）的熔化温度（Ta）。 电气设备包括完全覆盖暴露的焊接接头的水泥。 当施加Ta时，选择水泥的材料以保持其粘合性和相对于焊接接头的密封性。