公开(公告)号：US07264997B2

公开(公告)日：2007-09-04

申请号：US10892483

申请日：2004-07-16

Applicant: Koujiro Kameyama ,  Kiyoshi Mita

Inventor： Koujiro Kameyama ,  Kiyoshi Mita

IPC: H01L21/00

CPC classification number: H01L21/6835 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2221/68331 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/181 ,  H05K3/3426 ,  H05K3/3442 ,  H05K2201/09154 ,  H05K2201/10772 ,  H05K2201/10931 ,  Y02P70/613 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A semiconductor device comprises a semiconductor element and electrodes electrically connected to the semiconductor element, the semiconductor element and the electrodes being sealed by a sealing agent having an insulating property, the electrodes being exposed around a mounting surface that is joined via a joining agent to an external mounting circuit board, wherein the electrodes are shaped so that the joining agent is visually identifiable from side surfaces surrounding the mounting surface when the mounting surface is joined via the joining agent to the mounting circuit board.

Abstract translation: 半导体器件包括半导体元件和电连接到半导体元件的电极，半导体元件和电极被具有绝缘性能的密封剂密封，电极暴露在通过接合剂连接到安装表面上 外部安装电路板，其中电极被成形为使得当安装表面经由接合剂连接到安装电路板时，接合剂可以从围绕安装表面的侧表面可视地识别。

公开(公告)号：US20070034994A1

公开(公告)日：2007-02-15

申请号：US11475276

申请日：2006-06-27

Applicant: Yoon-hwa Choi

Inventor： Yoon-hwa Choi

IPC: H01L23/495

CPC classification number: H05K3/3442 ,  H01L23/3107 ,  H01L23/4951 ,  H01L23/49548 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/181 ,  H05K3/341 ,  H05K2201/0979 ,  H05K2201/10931 ,  H05K2201/10969 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Provided are a lead frame and a semiconductor package which allows reliable attachment of a small-sized semiconductor chip requiring a large number of leads to a board while providing high heat dissipation capability. The semiconductor package includes leads, each having a top plate extending inward from the outside edge of a frame and a plurality of pillar-shaped portions supporting the top plates, a semiconductor chip attached onto edge portions of the leads, wires connecting the leads with corresponding bonding pad on the semiconductor chip, and a molding material encapsulating the semiconductor chip and the wires and parts of the leads so as to the bottom surfaces of the leads are exposed. Further, some embodiments have a conductive pad exhibiting higher heat dissipation.

Abstract translation: 提供了一种引线框架和半导体封装件，其允许将需要大量引线的小尺寸半导体芯片可靠地附接到板，同时提供高散热能力。 半导体封装包括引线，每个引线具有从框架的外边缘向内延伸的顶板和支撑顶板的多个柱状部分，附接到引线的边缘部分的半导体芯片，将引线与相应的引线连接 接合焊盘，以及封装半导体芯片的模制材料以及引线的引线和引线的引线的底面露出。 此外，一些实施例具有呈现较高散热的导电垫。

公开(公告)号：US20050156012A1

公开(公告)日：2005-07-21

申请号：US10759962

申请日：2004-01-16

Applicant: Ted Ju

Inventor： Ted Ju

IPC: B23K1/00 ,  B23K31/02 ,  H05K3/34

CPC classification number: H05K3/3426 ,  B23K1/0016 ,  B23K2101/40 ,  H05K2201/10424 ,  H05K2201/1078 ,  H05K2201/1084 ,  H05K2201/10931 ,  Y02P70/613

Abstract: A method of soldering an electrical connection is described. A plurality of terminals is formed on an insulating casing, a plurality of slots being formed on a bottom of the insulating casing to communicate respectively with the terminals. A solder material is applied over electrical contacts of a circuit board for bonding the electrical connection to the circuit board, wherein the slots in the bottom of the insulating casing correspond to the solder material. The solder material is melted by heating, and the height of the solder material increases due to a cohesion effect so as to extend into the slots and bond to the terminals. The terminals need not contact the solder material before being soldered. Therefore, soldering quality is improved, while problems of short circuits and soldering failure due to deformation of the terminals are eliminated.

Abstract translation: 描述了焊接电连接的方法。 多个端子形成在绝缘壳体上，多个槽形成在绝缘壳体的底部上，分别与端子相通。 焊接材料被施加在电路板的电触头上，用于将电连接连接到电路板，其中绝缘壳体的底部中的槽对应于焊料材料。 焊料通过加热熔化，焊料的高度由于内聚效应而增加，从而延伸到槽中并结合到端子上。 在焊接之前，端子不需要接触焊料。 因此，提高了焊接质量，而消除了由于端子的变形导致的短路和焊接故障的问题。

公开(公告)号：US6058020A

公开(公告)日：2000-05-02

申请号：US221787

申请日：1998-12-28

Applicant: Jurgen Winterer ,  Gottfried Beer ,  Bernd Stadler

Inventor： Jurgen Winterer ,  Gottfried Beer ,  Bernd Stadler

IPC: H01L23/28 ,  H01L23/047 ,  H01L23/13 ,  H01L23/24 ,  H01L23/31 ,  H01L23/498 ,  H05K1/18 ,  H05K3/30 ,  H05K7/02 ,  H01L41/053

CPC classification number: H01L23/047 ,  H01L23/13 ,  H01L23/24 ,  H01L23/3107 ,  H01L23/49861 ,  H05K3/303 ,  H01L2224/05554 ,  H01L2224/056 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16195 ,  H01L2924/181 ,  H05K1/181 ,  H05K2201/09036 ,  H05K2201/10568 ,  H05K2201/10689 ,  H05K2201/10931 ,  Y02P70/613

Abstract: A component housing for surface mounting of a semiconductor component on a component-mounting surface of a printed circuit board. The component housing including a chip carrier made of an electrically insulating material and having an approximately planar chip carrier area, a semiconductor chip, preferably having an integrated electronic circuit, secured on the chip carrier area, and electrode terminals having a surface-mountable configuration. The electrode terminals penetrating through the chip carrier and electrically connected to the semiconductor chip. A distance between the component-mounting surface of the printed circuit board and outer delimiting areas of the chip carrier which face the component-mounting surface of the printed circuit board increases continuously from an edge region to a central region of the chip carrier.

Abstract translation: 一种用于将半导体部件表面安装在印刷电路板的部件安装表面上的部件壳体。 所述部件壳体包括由电绝缘材料制成并且具有大致平坦的芯片载体区域的芯片载体，固定在芯片载体区域上的优选具有集成电子电路的半导体芯片，以及具有可表面安装的构造的电极端子。 电极端子穿过芯片载体并电连接到半导体芯片。 印刷电路板的部件安装面与面向印刷电路板的部件安装面的芯片载体的外部限定区域之间的距离从芯片载体的边缘区域到中心区域连续地增加。

公开(公告)号：US5898215A

公开(公告)日：1999-04-27

申请号：US766653

申请日：1996-12-16

Applicant: Dennis Brian Miller ,  Grace M. O'Malley ,  Brian R. Kemper

Inventor： Dennis Brian Miller ,  Grace M. O'Malley ,  Brian R. Kemper

IPC: G06K19/077 ,  H01L21/60 ,  H01L23/498 ,  H05K1/18 ,  H05K3/28 ,  H05K3/32 ,  H05K3/34 ,  H01L23/02 ,  H01L23/48

CPC classification number: H01L24/80 ,  G06K19/07745 ,  G06K19/0775 ,  H01L23/49855 ,  H05K3/321 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/183 ,  H05K2201/0367 ,  H05K2201/09472 ,  H05K2201/10477 ,  H05K2201/10689 ,  H05K2201/10931 ,  H05K3/28 ,  H05K3/3426

Abstract: A microelectronic assembly (10), such as a smart card, is formed by attaching a component subassembly (34) to a substrate (12). The substrate (12) includes a face (26) and defines a via (28) having a via opening (30) at the face (26). The substrate (12) further defines a component cavity (32) at the face (26) that is spaced apart from the via (28). An electrical element (14), such as a wound antenna, is disposed within the substrate (12) and includes a terminal (24) at the via (28). The component subassembly (34) is formed by mounting an integrated circuit component (16) onto a metallic lead (18). The integrated circuit component (16) is electrically connected to the metallic lead (18) by a wire lead (36). A protuberance (20) is connected to the metallic lead (18), preferably by forming a loop from a wire bond. A polymeric body (56) is formed about the component (16) and wire leads (36). The component subassembly (34) is superposed onto the substrate (12), and the component (16) is received in the component cavity (32). The metallic lead (18) is affixed to the face (26) and overlies the via opening (30). The protuberance (20) extends into the via (28) and contacts a conductive body (22) within the via (28). The conductive body (22) electrically connects the protuberance (20) and the terminal (24).

Abstract translation: 诸如智能卡的微电子组件（10）通过将部件子组件（34）附接到基板（12）而形成。 衬底（12）包括面（26）并且限定了在面（26）处具有通孔开口（30）的通孔（28）。 基板（12）还在与通孔（28）间隔开的面（26）处限定一个部件空腔（32）。 诸如伤口天线的电气元件（14）设置在衬底（12）内，并且在通孔（28）处包括端子（24）。 组件子组件（34）通过将集成电路部件（16）安装到金属引线（18）上而形成。 集成电路部件（16）通过引线（36）与金属引线（18）电连接。 突起（20）连接到金属引线（18），优选地通过从引线接合形成环。 围绕组件（16）和导线（36）形成聚合体（56）。 组件子组件（34）重叠在基板（12）上，并且部件（16）被容纳在部件空腔（32）中。 金属引线（18）固定在面（26）上并覆盖通孔（30）。 突起（20）延伸到通孔（28）中并与通孔（28）内的导电体（22）接触。 导电体（22）电连接突起（20）和端子（24）。

公开(公告)号：US5608265A

公开(公告)日：1997-03-04

申请号：US207697

申请日：1994-03-09

Applicant: Makoto Kitano ,  Asao Nishimura ,  Akihiro Yaguchi ,  Nae Yoneda ,  Ryuji Kohno ,  Naotaka Tanaka ,  Tetsuo Kumazawa

Inventor： Makoto Kitano ,  Asao Nishimura ,  Akihiro Yaguchi ,  Nae Yoneda ,  Ryuji Kohno ,  Naotaka Tanaka ,  Tetsuo Kumazawa

IPC: H01L21/56 ,  H01L23/12 ,  H01L23/13 ,  H01L23/28 ,  H01L23/31 ,  H01L23/495 ,  H01L23/50 ,  H01L25/10 ,  H01L25/11 ,  H01L25/16 ,  H01L25/18 ,  H05K1/18 ,  H05K3/34 ,  H01L23/48 ,  H01L23/02 ,  H01L29/40

CPC classification number: H01L23/3107 ,  H01L21/565 ,  H01L23/13 ,  H01L23/4951 ,  H01L23/49541 ,  H01L25/105 ,  H01L25/16 ,  H05K1/181 ,  H05K3/3436 ,  H01L2224/16145 ,  H01L2224/16237 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H05K2201/09472 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10818 ,  H05K2201/10931 ,  H05K3/3426 ,  H05K3/3431 ,  Y02P70/611 ,  Y02P70/613

Abstract: A semiconductor device, provided in a plastic encapsulated package, having a semiconductor chip, a lead and a member for electrically connecting them together. The semiconductor device has one or more first holes respectively extending from one surface of the package to a first side of the lead which is provided inside of the package, and has one or more second holes formed which are aligned with the first holes, respectively, in a manner such that each second hole is extended from the opposing surface of the package to a corresponding location on a second side of the lead and is aligned with a corresponding, opposing first hole, in the package, extending to the first side of the lead. These holes are provided as a plurality of sets of individual pairs of aligned holes respectively extending inwardly, from opposing surfaces of the package, to opposite sides of the corresponding leads. In the device the leads or the leads with resin act as partitions thereby effecting isolation between the first and second holes of each pair aligned holes.

Abstract translation: 设置在塑料封装封装中的半导体器件具有半导体芯片，引线和用于将它们电连接在一起的部件。 半导体器件具有分别从封装的一个表面延伸到设置在封装内部的引线的第一侧的一个或多个第一孔，并且分别具有与第一孔对准的一个或多个第二孔， 以使得每个第二孔从包装的相对表面延伸到引线的第二侧上的对应位置并且与包装中的相应的相对的第一孔对准，延伸到包装的第一侧 铅。 这些孔被设置为多组对齐的对齐的孔，分别从包装的相对表面向内延伸到相应引线的相对侧。 在装置中，引线或具有树脂的引线作为隔板，从而实现每对对齐的孔的第一和第二孔之间的隔离。

公开(公告)号：US5445995A

公开(公告)日：1995-08-29

申请号：US994421

申请日：1992-12-21

Applicant: Paolo Casati ,  Pierangelo Magni

Inventor： Paolo Casati ,  Pierangelo Magni

IPC: B29C45/14 ,  B29C45/26 ,  H01L21/00 ,  H01L21/56 ,  H01L23/29 ,  H01L23/433 ,  H05K3/34

CPC classification number: H01L21/67126 ,  H01L21/565 ,  H01L23/4334 ,  H05K3/341 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L24/73 ,  H01L2924/14 ,  H05K2201/10689 ,  H05K2201/10931 ,  H05K2201/10969 ,  Y02P70/613 ,  Y10T29/49121

Abstract: A mold is disclosed for semiconductor devices intended for surface mounting, being of a type which comprises a metal plate and a body of solidified plastic resin. It consists of two plates which delimit at least one hollow adapted to receive the plate and to contain resin for forming the device body. Two elements of the mold push the plate from opposed sides against the bottom of the hollow. The hollow has two side extensions which are delimited by the side surfaces of the plate edges, thereby solidified projections are formed thereon which separate readily after the molding process. Thus, a structure is obtained wherein the plate has its bottom surface and two side edge portions fully exposed to allow optimum and controllable soldering to a printed circuit board.

Abstract translation: 公开了用于表面安装的半导体器件的模具，其是包括金属板和固化塑料树脂体的类型。 它包括两个板，它们限定至少一个适于容纳板的中空孔，并容纳用于形成装置主体的树脂。 模具的两个元件将板从相对的侧面推压到中空的底部。 中空具有由板边缘的侧表面限定的两个侧延伸部，由此在模制工艺之后容易地形成固化的突起。 因此，获得了其中板具有其底表面并且两个侧边缘部分完全暴露以允许对印刷电路板进行最佳和可控焊接的结构。

公开(公告)号：US20180007777A1

公开(公告)日：2018-01-04

申请号：US15332060

申请日：2016-10-24

Applicant: Hyundai Motor Company

Inventor： Jeong Min Son ,  Sung Won Park

IPC: H05K1/02 ,  H05K3/32 ,  H05K1/05 ,  H05K3/46 ,  H05K1/18

CPC classification number: H05K1/0203 ,  H01L23/29 ,  H01L23/3135 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/40 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/84 ,  H01L24/85 ,  H01L24/92 ,  H01L2224/04026 ,  H01L2224/04034 ,  H01L2224/04042 ,  H01L2224/06181 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/40137 ,  H01L2224/40139 ,  H01L2224/40247 ,  H01L2224/48095 ,  H01L2224/48139 ,  H01L2224/48247 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2224/8492 ,  H01L2224/8592 ,  H01L2224/92244 ,  H01L2224/92246 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/1815 ,  H05K1/05 ,  H05K1/185 ,  H05K3/32 ,  H05K3/46 ,  H05K2201/10931 ,  H05K2201/10977 ,  H01L2924/00012

Abstract: A power module is provided. The power module includes a substrate, a power conversion chip that is disposed on the substrate and an insulating film that is formed on a structure in which the power conversion chip is disposed on the substrate. Additionally, the power module includes a metal mold that encases the structure that is coated with the insulating film. Additionally, the power module provides a simplified structure and improved heat dissipation performance compared to conventional power modules.

公开(公告)号：US20150270593A1

公开(公告)日：2015-09-24

申请号：US14637898

申请日：2015-03-04

Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.

Inventor： CHIH-HENG CHUO ,  GWUN-JIN LIN ,  KUO-FU SU

IPC: H01P1/22 ,  H05K1/02 ,  H05K1/11

CPC classification number: H01P1/227 ,  H03H7/38 ,  H05K1/0225 ,  H05K1/0251 ,  H05K1/116 ,  H05K1/189 ,  H05K3/3447 ,  H05K2201/0715 ,  H05K2201/093 ,  H05K2201/09381 ,  H05K2201/0939 ,  H05K2201/09718 ,  H05K2201/10931

Abstract: Disclosed is an attenuation reduction structure for high-frequency connection pads of a circuit board with an insertion component. The circuit board includes at least one pair of differential mode signal lines formed thereon. A substrate has upper and lower surfaces respectively provided with at least one pair of upper connection pads and lower connection pads. A first metal layer is formed on the lower surface of the substrate. The first metal layer includes an attenuation reduction grounding pattern structure. The attenuation reduction grounding pattern structure includes a hollow area and at least one protruded portion. The protruded portion extends from the first metal layer in a direction toward the lower connection pads.

Abstract translation: 公开了一种具有插入部件的电路板的高频连接焊盘的衰减减小结构。 电路板包括形成在其上的至少一对差模信号线。 衬底具有分别设置有至少一对上连接焊盘和下连接焊盘的上表面和下表面。 第一金属层形成在基板的下表面上。 第一金属层包括衰减减小接地图案结构。 衰减降低接地图案结构包括中空区域和至少一个突出部分。 突出部分沿着朝向下连接焊盘的方向从第一金属层延伸。

公开(公告)号：US08319319B2

公开(公告)日：2012-11-27

申请号：US12235739

申请日：2008-09-23

Applicant: Young-Cheol Jang

Inventor： Young-Cheol Jang

IPC: H01L23/495

CPC classification number: H01L23/3107 ,  H01L23/49503 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/181 ,  H05K3/341 ,  H05K3/3442 ,  H05K2201/0373 ,  H05K2201/10931 ,  Y02P70/613 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor package and mounting method of improving reliability by strengthening adhesive strength of both a printed circuit board and a surface mounting package, includes a chip pad on which a semiconductor device is disposed, and lead terminals, wherein at least one of the chip pad and the lead terminals have a plurality of grooves. Accordingly, in comparison with a typical package, since a plurality of grooves are formed on both a chip pad and lead terminals of a package adhering to a printed circuit, an adhesive area of both the package and the cream solder is widened so that the shearing strength may be improved and greater solder joint reliability can be acquired.

Abstract translation: 通过增强印刷电路板和表面安装封装的粘合强度来提高可靠性的半导体封装和安装方法包括其上设置有半导体器件的芯片焊盘和引线端子，其中芯片焊盘和 引线端子具有多个槽。 因此，与典型的封装相比，由于在附接到印刷电路的封装的芯片焊盘和引线端子上形成多个槽，所以封装和膏状焊料的粘合区域变宽，使得剪切 可以提高强度并且可以获得更大的焊点可靠性。