公开(公告)号：US06913468B2

公开(公告)日：2005-07-05

申请号：US10684094

申请日：2003-10-10

Applicant: Thomas H. Dozier, II ,  Benjamin N. Eldridge ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan L. Mathieu

Inventor： Thomas H. Dozier, II ,  Benjamin N. Eldridge ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan L. Mathieu

IPC: B23K20/00 ,  C23C18/16 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/28 ,  H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/603 ,  H01L21/66 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L25/065 ,  H01L25/16 ,  H05K1/14 ,  H05K3/20 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K7/10 ,  H01R12/00

CPC classification number: B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D21/02 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/07314 ,  G01R1/07357 ,  G01R1/07378 ,  G01R3/00 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/76897 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/16145 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K7/1069 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/48

Abstract: Surface-mount, solder-down sockets are described which permit electronic components such as semiconductor packages to be releasably mounted to a circuit board. Generally, the socket includes resilient contact structures extending from a top surface of a support substrate, and solder-ball (or other suitable) contact structures disposed on a bottom surface of the support substrate. Composite interconnection elements are described for use as the resilient contact structures disposed atop the support substrate. In use, the support substrate is soldered down onto the circuit board, the contact structures on the bottom surface of the support substrate contacting corresponding contact areas on the circuit board. In any suitable manner, selected ones of the resilient contact structures atop the support substrate are connected, via the support substrate, to corresponding ones of the contact structures on the bottom surface of the support substrate.

Abstract translation: 描述了允许诸如半导体封装的电子部件可释放地安装到电路板的表面贴装焊接插座。 通常，插座包括从支撑衬底的顶表面延伸的弹性接触结构以及设置在支撑衬底的底表面上的焊球（或其它合适的）接触结构。 复合互连元件被描述为用作设置在支撑基板顶上的弹性接触结构。 在使用中，支撑基板被焊接到电路板上，支撑基板的底表面上的接触结构接触电路板上的相应的接触区域。 以任何合适的方式，通过支撑衬底将支撑衬底上的弹性接触结构中的选定的接触结构连接到支撑衬底的底表面上的相应接触结构。

公开(公告)号：US06807734B2

公开(公告)日：2004-10-26

申请号：US10202768

申请日：2002-07-25

Applicant: Benjamin N. Eldridge ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan L. Mathieu

Inventor： Benjamin N. Eldridge ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan L. Mathieu

IPC: H01R4316

CPC classification number: G01R1/07314 ,  H01H1/0036 ,  H01L2224/02335 ,  H01L2924/00013 ,  Y10T29/49147 ,  Y10T29/49204 ,  Y10T29/49218 ,  Y10T29/49316 ,  H01L2224/13099

Abstract: Microelectronic contact structures are fabricated by separately forming, then joining together, various components thereof. Each contact structure has three components: a “post” component, a “beam” component, and a “tip” component. The resulting contact structure, mounted to an electronic component, is useful for making an electrical connection with another electronic component. The post component can be fabricated on a sacrificial substrate, joined to the electronic component and its sacrificial substrate removed. Alternatively, the post component can be formed on the electronic component. The beam and tip components can each be fabricated on a sacrificial substrate. The beam component is joined to the post component and its sacrificial substrate is removed, and the tip component is joined to the beam component and its sacrificial substrate is removed.

公开(公告)号：US06780001B2

公开(公告)日：2004-08-24

申请号：US09795772

申请日：2001-02-27

Applicant: Benjamin N. Eldridge ,  Stuart W. Wenzel

Inventor： Benjamin N. Eldridge ,  Stuart W. Wenzel

IPC: B29C4302

CPC classification number: G01R3/00 ,  B33Y80/00 ,  B81B2203/0118 ,  B81C1/00611 ,  B81C2201/0108 ,  B81C2201/0125 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/06716 ,  G01R1/06727 ,  G01R1/06733 ,  G01R1/07342 ,  H01L23/4822 ,  H01L24/72 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  H01R12/52 ,  H01R13/24 ,  H01R13/2407 ,  H05K3/4092 ,  H05K7/1069 ,  H01L2924/00

Abstract: A forming tool with one or more embossing tooth, and preferably, a plurality of such embossing teeth, arranged on a substantially planar substrate, is disclosed. Each embossing tooth is configured for forming a sacrificial layer to provide a contoured surface for forming a microelectronic spring structure. Each embossing tooth has a protruding area corresponding to a base of a microelectronic spring, and a sloped portion corresponding to a beam contour of a microelectronic spring. Numerous methods for making a forming tool are also disclosed. The methods include a material removal method, a molding method, a repetitive-stamping method, tang-bending methods, and segment-assembly methods.

Abstract translation: 公开了一种具有一个或多个压花齿的成形工具，优选地，布置在基本平坦的基底上的多个这样的压花齿。 每个压花齿构造成用于形成牺牲层以提供用于形成微电子弹簧结构的轮廓表面。 每个压花齿具有对应于微电子弹簧的基部的突出区域和对应于微电子弹簧的光束轮廓的倾斜部分。 还公开了用于制造成形工具的许多方法。 这些方法包括材料去除方法，成型方法，重复冲压方法，弯曲方法和段组装方法。

公开(公告)号：US06764869B2

公开(公告)日：2004-07-20

申请号：US09955258

申请日：2001-09-12

Applicant: Benjamin N. Eldridge

Inventor： Benjamin N. Eldridge

IPC: G01R3126

CPC classification number: G01R31/31926 ,  G01R1/07314 ,  G01R31/318505 ,  G01R31/31905 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2924/00013 ,  Y10T29/49002 ,  Y10T29/49004 ,  Y10T29/49128 ,  Y10T29/4913 ,  H01L2924/00014

Abstract: An electronics module is assembled by demountably attaching integrated circuits to a module substrate. The module is then tested at a particular operating speed. If the module fails to operate correctly at the tested speed, the integrated circuit or circuits that caused the failure are removed and replaced with new integrated circuits, and the module is retested. Once it is determined that the module operates correctly at the tested speed, the module may be rated to operate at the tested speed and sold, or the module may be tested at a higher speed.

Abstract translation: 通过可拆卸地将集成电路连接到模块基板来组装电子模块。 然后以特定的操作速度测试模块。 如果模块在测试速度下无法正常工作，则会导致故障的集成电路或电路被更换为新的集成电路，并重新测试模块。 一旦确定模块以测试速度正确运行，模块可能被评定为以测试速度运行并出售，或者模块可以以更高的速度进行测试。

公开(公告)号：US06759311B2

公开(公告)日：2004-07-06

申请号：US10001437

申请日：2001-10-31

Applicant: Benjamin N. Eldridge ,  Igor Y. Khandros

Inventor： Benjamin N. Eldridge ,  Igor Y. Khandros

IPC: H01L21301

CPC classification number: H01L21/6836 ,  H01L21/304 ,  H01L21/78 ,  H01L23/4822 ,  H01L24/11 ,  H01L24/14 ,  H01L2221/68327 ,  H01L2224/02335 ,  H01L2224/056 ,  H01L2224/1134 ,  H01L2224/13008 ,  H01L2224/13016 ,  H01L2224/131 ,  H01L2224/1403 ,  H01L2224/1415 ,  H01L2224/4554 ,  H01L2224/48095 ,  H01L2224/49171 ,  H01L2224/854 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/45099

Abstract: An unsingulated semiconductor wafer is provided. Electrical interconnect elements are formed on the unsingulated wafer such that the interconnect elements are electrically connected to terminals of the semiconductor dice composing the wafer. At least a portion of the interconnect elements extend beyond the boundaries of the dice into the scribe streets separating the individual dice. Thereafter, the wafer is singulated into individual dice.

Abstract translation: 提供了一种不带绝缘的半导体晶片。 电气互连元件形成在未胶化的晶片上，使得互连元件电连接到构成晶片的半导体晶片的端子。 互连元件的至少一部分延伸超过骰子的边界进入划分各个骰子的划线路。 此后，将晶片分割成单独的骰子。

公开(公告)号：US06713374B2

公开(公告)日：2004-03-30

申请号：US09752640

申请日：2000-12-29

Applicant: Benjamin N. Eldridge ,  Gaetan Mathieu

Inventor： Benjamin N. Eldridge ,  Gaetan Mathieu

IPC: H01L2144

CPC classification number: H01L23/4822 ,  H01L24/01 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00

Abstract: An interconnect assembly and methods for making and using the assembly. An exemplary embodiment of an aspect of the invention includes a contact element which includes a base portion adapted to be adhered to a substrate and a beam portion connected to and extending from the base portion. The beam portion is designed to have a geometry which substantially optimizes stress across the beam portion when deflected (e.g. it is triangular in shape) and is adapted to be freestanding. An exemplary embodiment of another aspect of the invention involves a method for forming a contact element. This method includes forming a base portion to adhere to a substrate of an electrical assembly and forming a beam portion connected to the base portion. The beam portion extends from the base portion and is designed to have a geometry which substantially evenly distributes stress across the beam portion when deflected and is adapted to be freestanding. It will be appreciated that in certain embodiments of the invention, a plurality of contact elements are used together to create an interconnect assembly. Various other assemblies and methods are also described below in conjunction with the following figures.

Abstract translation: 互连组件和用于制造和使用组件的方法。 本发明的一个方面的示例性实施例包括接触元件，其包括适于粘附到基底的基部和连接到基部并从基部延伸的梁部。 梁部分被设计成具有几何形状，当偏转（例如，其形状为三角形）时，几何形状基本上优化横梁部分上的应力，并且适于独立。 本发明的另一方面的示例性实施例涉及形成接触元件的方法。 该方法包括形成基部以粘附到电气组件的基板并形成连接到基部的梁部分。 梁部分从基部延伸并且被设计成具有几何形状，当几何形状偏转时基本上均匀地分布横梁部分的应力，并适于独立。 应当理解，在本发明的某些实施例中，多个接触元件一起用于产生互连组件。 下面结合以下附图描述各种其它组件和方法。

公开(公告)号：US06672875B1

公开(公告)日：2004-01-06

申请号：US09474788

申请日：1999-12-29

Applicant: Gaetan L. Mathieu ,  Benjamin N. Eldridge ,  Gary W. Grube ,  Richard A. Larder

Inventor： Gaetan L. Mathieu ,  Benjamin N. Eldridge ,  Gary W. Grube ,  Richard A. Larder

IPC: H01R1200

CPC classification number: H01L24/72 ,  G01R1/06727 ,  G01R1/06733 ,  G01R1/06761 ,  G01R1/07342 ,  G01R3/00 ,  H01H1/0036 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01055 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15787 ,  H01L2924/30105 ,  H05K3/326 ,  H05K3/4092 ,  H01L2924/00

Abstract: An interconnection element of a spring (body) including a first resilient element with a first contact region and a second contact region and a first securing region and a second resilient element, with a third contact region and a second securing region. The second resilient element is coupled to the first resilient element through respective securing regions and positioned such that upon sufficient displacement of the first contact region toward the second resilient element, the second contact region will contact the third contact region. The interconnection, in one aspect, is of a size suitable for directly contacting a semiconductor device. A large substrate with a plurality of such interconnection elements can be used as a wafer-level contactor. The interconnection element, in another aspect, is of a size suitable for contacting a packaged semiconductor device, such as in an LGA package.

公开(公告)号：US06657455B2

公开(公告)日：2003-12-02

申请号：US10206276

申请日：2002-07-25

Applicant: Benjamin N. Eldridge ,  Charles A. Miller

Inventor： Benjamin N. Eldridge ,  Charles A. Miller

IPC: G01R3126

CPC classification number: G06F1/26 ,  G01R31/2851 ,  G01R31/31721 ,  G01R31/31905 ,  G01R31/31924

Abstract: A main power source supplies current through path impedance to a power terminal of an integrated circuit device under test (DUT). The DUT's demand for current at the power input terminal temporarily increases following edges of a clock signal applied to the DUT during a test as transistors within the IC switch in response to the clock signal edges. To limit variation (noise) in voltage at the power input terminal, an auxiliary power supply supplies an additional current pulse to the power input terminal to meet the increased demand during each cycle of the clock signal. The magnitude of the current pulse is a function of a predicted increase in current demand during that clock cycle, and of the magnitude of an adaption signal controlled by a feedback circuit provided to limit variation in voltage developed at the DUT's power input terminal.

公开(公告)号：US06655023B1

公开(公告)日：2003-12-02

申请号：US09468620

申请日：1999-12-21

Applicant: Benjamin N. Eldridge ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan L. Mathieu

Inventor： Benjamin N. Eldridge ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan L. Mathieu

IPC: H01R900

CPC classification number: H05K7/1069 ,  B23K1/0008 ,  B23K20/004 ,  B23K2101/40 ,  C23C18/1605 ,  C23C18/165 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/07342 ,  G01R31/2856 ,  G01R31/2863 ,  G01R31/2884 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/6835 ,  H01L22/20 ,  H01L23/49811 ,  H01L23/544 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/27 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L24/83 ,  H01L24/90 ,  H01L24/94 ,  H01L25/0652 ,  H01L25/16 ,  H01L2223/54453 ,  H01L2224/02311 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/0558 ,  H01L2224/05599 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/11003 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/1147 ,  H01L2224/1184 ,  H01L2224/13022 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13582 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/16145 ,  H01L2224/274 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4556 ,  H01L2224/45572 ,  H01L2224/45599 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48724 ,  H01L2224/48844 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/83851 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2224/90 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  Y10S977/712 ,  Y10S977/723 ,  Y10T29/49004 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49169 ,  Y10T29/49171 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/4922 ,  Y10T29/49812 ,  Y10T428/12396 ,  Y10T428/12528 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/48824 ,  H01L2224/48744 ,  H01L2224/29099 ,  H01L2224/29075 ,  H01L2224/85399

Abstract: Resilient contact structures are mounted directly to bond pads on semiconductor dies, prior to the dies being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies to be exercised (e.g., tested and/or burned-in) by connecting to the semiconductor dies with a circuit board or the like having a plurality of terminals disposed on a surface thereof. Subsequently, the semiconductor dies may be singulated from the semiconductor wafer, whereupon the same resilient contact structures can be used to effect interconnections between the semiconductor dies and other electronic components (such as wiring substrates, semiconductor packages, etc.). Using the all-metallic composite interconnection elements of the present invention as the resilient contact structures, burn-in can be performed at temperatures of at least 150° C., and can be comprised in less than 60 minutes.

Abstract translation: 弹性接触结构直接安装在半导体晶片上的接合焊盘上，在裸片与半导体晶片分离（分离）之前。 这使得半导体管芯能够通过具有设置在其表面上的多个端子的电路板等连接到半导体管芯来进行（例如，测试和/或烧入）。 接下来，半导体管芯可以从半导体晶片分离，因此可以使用相同的弹性接触结构来实现半导体管芯和其他电子部件（例如布线基板，半导体封装等）之间的互连。 使用本发明的全金属复合互连元件作为弹性接触结构，可以在至少150℃的温度下进行老化，并且可以在少于60分钟内包含。

公开(公告)号：US06642625B2

公开(公告)日：2003-11-04

申请号：US10299131

申请日：2002-11-19

Applicant: Thomas H. Dozier, II ,  Benjamin N. Eldridge ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan L. Mathieu ,  David V. Pederson ,  Michael A. Stadt

Inventor： Thomas H. Dozier, II ,  Benjamin N. Eldridge ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan L. Mathieu ,  David V. Pederson ,  Michael A. Stadt

IPC: H01L2304

CPC classification number: G01R1/0408 ,  B23K3/087 ,  G01R1/0416 ,  G01R1/0466 ,  G01R31/2886 ,  H01L23/04 ,  H01L23/13 ,  H01L23/32 ,  H01L23/5385 ,  H01L24/72 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16237 ,  H01L2224/73251 ,  H01L2224/8114 ,  H01L2224/81901 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K1/119 ,  H05K3/308 ,  H05K3/325 ,  H05K2201/0311 ,  H05K2201/09472 ,  H05K2201/09827 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/4914 ,  Y10T29/49147 ,  Y10T29/49153 ,  Y10T29/49208 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  H01L2924/00014 ,  H01L2224/72

Abstract: Temporary connections to spring contact elements extending from an electronic component such as a semiconductor device are made by urging the electronic component, consequently the ends of the spring contact elements, vertically against terminals of an interconnection substrate, or by horizontally urging terminals of an interconnection substrate against end portions of the spring contact elements. A variety of terminal configurations are disclosed.

Abstract translation: 从诸如半导体器件的电子部件延伸的弹簧接触元件的临时连接是通过推动电子部件，因此弹簧接触元件的端部垂直地抵靠互连基板的端子，或者通过水平推动互连基板的端子 抵抗弹簧接触元件的端部。 公开了各种终端配置。