公开(公告)号：US20150241476A1

公开(公告)日：2015-08-27

申请号：US14708198

申请日：2015-05-09

申请人： International Business Machines Corporation

发明人： Bing Dang ,  John Knickerbocker ,  Yang Liu ,  Maurice Mason ,  Lubomyr T. Romankiw

IPC分类号： G01R1/073 ,  B81B3/00 ,  G01R31/26

CPC分类号： G01R1/0735 ,  B23K35/00 ,  B81B3/00 ,  B81B2201/02 ,  B81B2203/0118 ,  B81B2203/0127 ,  B81C1/00626 ,  G01R31/2607 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05082 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05644 ,  H01L2224/06131 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/11003 ,  H01L2224/111 ,  H01L2224/1112 ,  H01L2224/11334 ,  H01L2224/11849 ,  H01L2224/13017 ,  H01L2224/13019 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13564 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/1366 ,  H01L2224/13663 ,  H01L2224/73207 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/381 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/01104

摘要： A method of forming surface protrusions on an article, and the article with the protrusions attached. The article may be an Integrated Circuit (IC) chip, a test probe for the IC chip or any suitable substrate or nanostructure. The surface protrusions are electroplated to a template or mold wafer, transferred to the article and easily separated from the template wafer. Thus, the attached protrusions may be, e.g., micro-bumps or micro pillars on an IC chip or substrate, test probes on a probe head, or one or more cantilevered membranes in a micro-machine or micro-sensor or other micro-electro-mechanical systems (MEMS) formed without undercutting the MEMS structure.

摘要翻译： 在物品上形成表面突起的方法，以及附着有突起物的物品。 该物品可以是集成电路（IC）芯片，用于IC芯片的测试探针或任何合适的衬底或纳米结构。 表面突起电镀到模板或模具晶片上，转移到制品上，并容易地与模板晶片分离。 因此，附着的突起可以是例如IC芯片或衬底上的微凸起或微柱，探针头上的测试探针或微机或微传感器中的一个或多个悬臂膜或其它微电子 机械系统（MEMS）形成，而不会削弱MEMS结构。

公开(公告)号：US20150037936A1

公开(公告)日：2015-02-05

申请号：US14521233

申请日：2014-10-22

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Wen-Wei Shen ,  Chen-Shien Chen ,  Chen-Cheng Kuo ,  Ming-Fa Chen ,  Rung-De Wang

IPC分类号： H01L23/00

CPC分类号： H01L24/16 ,  H01L23/3157 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/03614 ,  H01L2224/0401 ,  H01L2224/05017 ,  H01L2224/05023 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05568 ,  H01L2224/05572 ,  H01L2224/05647 ,  H01L2224/05666 ,  H01L2224/1146 ,  H01L2224/11823 ,  H01L2224/11831 ,  H01L2224/1191 ,  H01L2224/13005 ,  H01L2224/13018 ,  H01L2224/13019 ,  H01L2224/13076 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/13111 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/13565 ,  H01L2224/1357 ,  H01L2224/1369 ,  H01L2224/16145 ,  H01L2224/16148 ,  H01L2224/16238 ,  H01L2224/81193 ,  H01L2224/81345 ,  H01L2224/81801 ,  H01L2224/81815 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/05042 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/35 ,  Y10T428/12361 ,  Y10T428/12396 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01047 ,  H01L2924/206 ,  H01L2224/05552

摘要： A device includes a work piece including a metal bump; and a dielectric layer having a portion directly over the metal bump. The metal bump and a surface of the portion of the dielectric layer form an interface. A metal finish is formed over and contacting the metal bump. The metal finish extends from over the dielectric layer to below the interface.

摘要翻译： 一种装置包括：包括金属凸块的工件; 以及具有直接在金属凸块上的部分的介电层。 金属凸块和电介质层部分的表面形成界面。 在金属凸块上方形成金属涂层并与金属凸块接触。 金属表面从介电层上延伸到界面的下方。

公开(公告)号：US20140361432A1

公开(公告)日：2014-12-11

申请号：US14466877

申请日：2014-08-22

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Cheng-Chieh Hsieh ,  Cheng-Lin Huang ,  Po-Hao Tsai ,  Shang-Yun Hou ,  Jing-Cheng Lin ,  Shin-Puu Jeng

IPC分类号： H01L23/00

CPC分类号： H01L24/81 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/1132 ,  H01L2224/1145 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/11474 ,  H01L2224/1148 ,  H01L2224/11616 ,  H01L2224/11825 ,  H01L2224/11849 ,  H01L2224/1191 ,  H01L2224/13013 ,  H01L2224/13015 ,  H01L2224/13018 ,  H01L2224/13019 ,  H01L2224/13022 ,  H01L2224/13023 ,  H01L2224/13025 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1362 ,  H01L2224/13655 ,  H01L2224/13671 ,  H01L2224/13672 ,  H01L2224/16056 ,  H01L2224/16148 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81121 ,  H01L2224/81143 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2225/06513 ,  H01L2225/06555 ,  H01L2225/06565 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/12 ,  H01L2924/14 ,  H01L2924/3512 ,  H01L2924/35121 ,  H01L2924/384 ,  H01L2924/3841 ,  H01L2924/00014

摘要： A system and method for conductive pillars is provided. An embodiment comprises a conductive pillar having trenches located around its outer edge. The trenches are used to channel conductive material such as solder when a conductive bump is formed onto the conductive pillar. The conductive pillar may then be electrically connected to another contact through the conductive material.

摘要翻译： 提供了一种用于导电柱的系统和方法。 一个实施例包括具有位于其外边缘周围的沟槽的导电柱。 当在导电柱上形成导电凸块时，沟槽用于引导诸如焊料的导电材料。 导电柱然后可以通过导电材料电连接到另一接触件。

公开(公告)号：US20140159235A1

公开(公告)日：2014-06-12

申请号：US14073144

申请日：2013-11-06

申请人： FUJITSU LIMITED

发明人： Muneyuki Odaira

IPC分类号： H01L23/00

CPC分类号： H01L24/13 ,  H01L21/563 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/16 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0345 ,  H01L2224/039 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05166 ,  H01L2224/05647 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/11472 ,  H01L2224/11614 ,  H01L2224/11849 ,  H01L2224/11901 ,  H01L2224/11902 ,  H01L2224/11903 ,  H01L2224/13005 ,  H01L2224/13007 ,  H01L2224/13011 ,  H01L2224/13012 ,  H01L2224/13013 ,  H01L2224/13014 ,  H01L2224/13016 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/13019 ,  H01L2224/13076 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/13084 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13562 ,  H01L2224/13564 ,  H01L2224/1357 ,  H01L2224/13582 ,  H01L2224/136 ,  H01L2224/13611 ,  H01L2224/1601 ,  H01L2224/16058 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16503 ,  H01L2224/16507 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/8181 ,  H01L2224/81815 ,  H01L2224/831 ,  H01L2225/06513 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01327 ,  H01L2924/00

摘要： An electronic component includes an electrode portion and a solder portion formed on the electrode portion. In the electronic component, the electrode portion includes a first conductive portion and a second conductive portion each having different diffusion coefficient with respect to a component of the solder portion on a top surface of the electrode portion, and the solder portion is formed on the first conductive portion and the second conductive portion.

摘要翻译： 电子部件包括在电极部上形成的电极部和焊料部。 在电子部件中，电极部包括第一导电部和第二导电部，所述第一导电部和第二导电部相对于电极部的顶面上的焊料部的成分具有不同的扩散系数，焊料部形成在第一导电部 导电部分和第二导电部分。

公开(公告)号：US20140124927A1

公开(公告)日：2014-05-08

申请号：US14074598

申请日：2013-11-07

申请人： Nantong Fujitsu Microelectronics Co., Ltd.

发明人： CHANG-MING LIN ,  LEI SHI ,  XIAO-CHUN WU

IPC分类号： H01L21/48 ,  H01L23/498

CPC分类号： H01L21/4846 ,  H01L23/3192 ,  H01L23/525 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0346 ,  H01L2224/03464 ,  H01L2224/0401 ,  H01L2224/05017 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05558 ,  H01L2224/05582 ,  H01L2224/05611 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/1132 ,  H01L2224/1134 ,  H01L2224/11849 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/13019 ,  H01L2224/13024 ,  H01L2224/13076 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13562 ,  H01L2224/13582 ,  H01L2224/94 ,  H01L2224/11 ,  H01L2224/03 ,  H01L2924/014 ,  H01L2924/00012

摘要： An IC packaging method is provided. The method includes providing a semiconductor substrate. The semiconductor substrate has a metal pad and an insulating layer and the insulating layer has an opening to expose the meal pad. The method also includes forming an under-the-ball meal electrode on the exposed metal pad. The under-the-ball metal electrode has an electrode body and an electrode tail, the electrode body is located at a bottom portion of the under-the-ball metal electrode and is in contact with the metal pad, and the electrode tail is located at a top portion of the under-the-ball meal electrode. Further, the method includes forming a solder ball on the under-the-ball metal electrode.

摘要翻译： 提供IC封装方法。 该方法包括提供半导体衬底。 半导体衬底具有金属焊盘和绝缘层，并且绝缘层具有露出餐垫的开口。 该方法还包括在暴露的金属垫上形成球下餐具电极。 球下金属电极具有电极体和电极尾部，电极体位于球下金属电极的底部并与金属焊盘接触，电极尾部位于 在球粉末电极的顶部。 此外，该方法包括在球下金属电极上形成焊球。

公开(公告)号：US20140008792A1

公开(公告)日：2014-01-09

申请号：US14021914

申请日：2013-09-09

申请人： STATS ChipPAC, Ltd.

发明人： Rajendra D. Pendse

IPC分类号： H01L23/498 ,  H01L23/00

CPC分类号： H01L24/17 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/3157 ,  H01L23/49811 ,  H01L23/49838 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L33/62 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/13016 ,  H01L2224/13018 ,  H01L2224/13019 ,  H01L2224/13023 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1411 ,  H01L2224/16 ,  H01L2224/1601 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/16238 ,  H01L2224/17107 ,  H01L2224/27013 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/75 ,  H01L2224/75301 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81194 ,  H01L2224/81203 ,  H01L2224/81208 ,  H01L2224/81345 ,  H01L2224/81385 ,  H01L2224/81801 ,  H01L2224/83051 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2224/83856 ,  H01L2224/93 ,  H01L2224/94 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15174 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/13109 ,  H01L2924/3512 ,  H01L2924/0665 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/81805

摘要： A semiconductor device has a semiconductor die with a plurality of composite bumps formed over a surface of the semiconductor die. The composite bumps have a fusible portion and non-fusible portion, such as a conductive pillar and bump formed over the conductive pillar. The composite bumps can also be tapered. Conductive traces are formed over a substrate with interconnect sites having edges parallel to the conductive trace from a plan view for increasing escape routing density. The interconnect site can have a width less than 1.2 times a width of the conductive trace. The composite bumps are wider than the interconnect sites. The fusible portion of the composite bumps is bonded to the interconnect sites so that the fusible portion covers a top surface and side surface of the interconnect sites. An encapsulant is deposited around the composite bumps between the semiconductor die and substrate.

摘要翻译： 半导体器件具有形成在半导体管芯的表面上的多个复合凸块的半导体管芯。 复合凸块具有可熔部分和不可熔部分，例如形成在导电柱上的导电柱和凸块。 复合凸块也可以是锥形的。 导电迹线形成在具有从平面图平行于导电迹线的边缘的互连位置的衬底上，以增加逃逸路由密度。 互连部位可以具有小于导电迹线宽度的1.2倍的宽度。 复合凸块比互连部位宽。 复合凸块的可熔部分结合到互连部位，使得可熔部分覆盖互连部位的顶表面和侧表面。 围绕半导体管芯和衬底之间的复合凸块沉积密封剂。

公开(公告)号：US20130277826A9

公开(公告)日：2013-10-24

申请号：US12960178

申请日：2010-12-03

申请人： Rajendra D. Pendse

发明人： Rajendra D. Pendse

IPC分类号： H01L23/485 ,  H01L21/3205

CPC分类号： H01L24/17 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/3157 ,  H01L23/49811 ,  H01L23/49838 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L33/62 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/13016 ,  H01L2224/13018 ,  H01L2224/13019 ,  H01L2224/13023 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1411 ,  H01L2224/16 ,  H01L2224/1601 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/16238 ,  H01L2224/17107 ,  H01L2224/27013 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/75 ,  H01L2224/75301 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81194 ,  H01L2224/81203 ,  H01L2224/81208 ,  H01L2224/81345 ,  H01L2224/81385 ,  H01L2224/81801 ,  H01L2224/83051 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2224/83856 ,  H01L2224/93 ,  H01L2224/94 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15174 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/13109 ,  H01L2924/3512 ,  H01L2924/0665 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/81805

摘要： A semiconductor device has a semiconductor die with a plurality of composite bumps formed over a surface of the semiconductor die. The composite bumps have a fusible portion and non-fusible portion, such as a conductive pillar and bump formed over the conductive pillar. The composite bumps can also be tapered. Conductive traces are formed over a substrate with interconnect sites having edges parallel to the conductive trace from a plan view for increasing escape routing density. The interconnect site can have a width less than 1.2 times a width of the conductive trace. The composite bumps are wider than the interconnect sites. The fusible portion of the composite bumps is bonded to the interconnect sites so that the fusible portion covers a top surface and side surface of the interconnect sites. An encapsulant is deposited around the composite bumps between the semiconductor die and substrate.

摘要翻译： 半导体器件具有形成在半导体管芯的表面上的多个复合凸块的半导体管芯。 复合凸块具有可熔部分和不可熔部分，例如形成在导电柱上的导电柱和凸块。 复合凸块也可以是锥形的。 导电迹线形成在具有从平面图平行于导电迹线的边缘的互连位置的衬底上，以增加逃逸路由密度。 互连部位可以具有小于导电迹线宽度的1.2倍的宽度。 复合凸块比互连部位宽。 复合凸块的可熔部分结合到互连部位，使得可熔部分覆盖互连部位的顶表面和侧表面。 围绕半导体管芯和衬底之间的复合凸块沉积密封剂。

公开(公告)号：US20130234328A1

公开(公告)日：2013-09-12

申请号：US13873509

申请日：2013-04-30

申请人： MICRON TECHNOLOGY, INC.

发明人： Teck Kheng Lee

IPC分类号： H01L23/00

CPC分类号： H01L24/14 ,  H01L21/4846 ,  H01L23/481 ,  H01L23/49811 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/1012 ,  H01L2224/13012 ,  H01L2224/13016 ,  H01L2224/13019 ,  H01L2224/13023 ,  H01L2224/1403 ,  H01L2224/16145 ,  H01L2224/73103 ,  H01L2224/73204 ,  H01L2224/81136 ,  H01L2224/81138 ,  H01L2224/8114 ,  H01L2224/81193 ,  H01L2224/812 ,  H01L2224/81208 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/20105 ,  H01L2924/20106 ,  H05K3/06 ,  H05K3/325 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2201/10977 ,  H05K2203/0315 ,  H05K2203/0369 ,  H05K2203/1476 ,  H01L2924/00012

摘要： A method of establishing conductive connections is disclosed. The method includes providing an integrated circuit die having a plurality of solder balls each of which has an oxide layer on an outer surface of the solder ball. The method also includes performing a heating process to heat at least the solder balls and applying a force causing each of a plurality of piercing bond structures on a substrate to pierce one of the solder balls and its associated oxide layer to thereby establish a conductive connection between the solder ball and the piercing bond structure.

公开(公告)号：US20130175516A1

公开(公告)日：2013-07-11

申请号：US13781790

申请日：2013-03-01

申请人： THE PROCTER & GAMBLE COMPANY

发明人： William Johnstone Ray ,  Mark D. Lowenthal ,  Neil O. Shotton ,  Richard A. Blanchard ,  Mark Allan Lewandowski ,  Brad Oraw ,  Mark John Steinhardt ,  Corey Michael Bischoff ,  Edward Mack Sawicki ,  Kenneth Stephen McGuire

IPC分类号： H01L51/00 ,  H01L33/56 ,  C08K5/05 ,  C08L1/08 ,  C08K5/21

CPC分类号： H01L33/56 ,  F21K9/232 ,  F21V14/02 ,  F21W2121/00 ,  F21Y2107/00 ,  F21Y2115/10 ,  H01L24/05 ,  H01L24/13 ,  H01L33/20 ,  H01L33/38 ,  H01L33/382 ,  H01L2224/0401 ,  H01L2224/05552 ,  H01L2224/056 ,  H01L2224/13014 ,  H01L2224/13019 ,  H01L2224/13022 ,  H01L2224/13025 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/13033 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

摘要： A lighting apparatus comprising a plurality of diodes and an electrical interface configured to receive an electrical signal and transmit the electrical signal to the plurality of diodes is provided.

公开(公告)号：US20130175515A1

公开(公告)日：2013-07-11

申请号：US13781789

申请日：2013-03-01

申请人： The Procter & Gamble Company

发明人： William Johnstone Ray ,  Mark D. Lowenthal ,  Neil O. Shotton ,  Richard A. Blanchard ,  Mark Allan Lewandowski ,  Brad Oraw ,  Mark John Steinhardt ,  Corey Michael Bischoff ,  Edward Mack Sawicki ,  Kenneth Stephen McGuire

IPC分类号： H01L33/56 ,  H01L51/00

CPC分类号： H01L33/56 ,  F21K9/23 ,  F21V14/02 ,  F21W2121/00 ,  F21Y2107/00 ,  F21Y2115/10 ,  H01L24/05 ,  H01L24/13 ,  H01L33/20 ,  H01L33/38 ,  H01L33/382 ,  H01L2224/0401 ,  H01L2224/05552 ,  H01L2224/056 ,  H01L2224/13014 ,  H01L2224/13019 ,  H01L2224/13022 ,  H01L2224/13025 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/13033 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

摘要： A lighting apparatus comprising a plurality of diodes and an electrical interface configured to receive an electrical signal and transmit the electrical signal to the plurality of diodes is provided.