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31.发明授权Method of temporarily, then permanently, connecting to a semiconductor device 失效暂时，然后永久地连接到半导体器件的方法
公开(公告)号：US5983493A
公开(公告)日：1999-11-16
申请号：US839763
申请日：1997-04-15
IPC分类号： B23K20/00 , C23C18/16 , C25D5/08 , C25D5/22 , C25D7/12 , C25D21/02 , G01R1/067 , G01R1/073 , G01R31/28 , H01L21/00 , H01L21/48 , H01L21/56 , H01L21/60 , H01L21/603 , H01L21/66 , H01L23/48 , H01L23/485 , H01L23/49 , H01L23/498 , H01L25/065 , H01L25/16 , H05K1/14 , H05K3/20 , H05K3/32 , H05K3/40 , H01R43/00
CPC分类号： H05K3/4015 , B23K20/004 , C25D7/12 , G01R31/2884 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L22/20 , H01L23/49811 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , B23K2201/40 , C25D21/02 , C25D5/08 , C25D5/22 , G01R31/287 , H01L2224/1134 , H01L2224/13099 , H01L2224/13144 , H01L2224/13582 , H01L2224/13644 , H01L2224/13655 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/73203 , H01L2224/81801 , H01L2224/85201 , H01L2224/85205 , H01L24/45 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H05K1/141 , H05K3/20 , H05K3/326 , Y10T29/49144 , Y10T29/49149 , Y10T29/49171
摘要： Resilient contact structures are mounted directly to bond pads on semiconductor dies, prior to the dies being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies to be exercised (e.g., tested and/or burned-in) by connecting to the semiconductor dies with a circuit board or the like having a plurality of terminals disposed on a surface thereof. Subsequently, the semiconductor dies may be singulated from the semiconductor wafer, whereupon the same resilient contact structures can be used to effect interconnections between the semiconductor dies and other electronic components (such as wiring substrates, semiconductor packages, etc.). Using the all-metallic composite interconnection elements of the present invention as the resilient contact structures, burn-in can be performed at temperatures of at least 150.degree. C., and can be completed in less than 60 minutes.
摘要翻译： 弹性接触结构直接安装在半导体晶片上的接合焊盘上，在裸片与半导体晶片分离（分离）之前。 这使得半导体管芯能够通过具有设置在其表面上的多个端子的电路板等连接到半导体管芯来进行（例如，测试和/或烧入）。 接下来，半导体管芯可以从半导体晶片分离，因此可以使用相同的弹性接触结构来实现半导体管芯和其他电子部件（例如布线基板，半导体封装等）之间的互连。 使用本发明的全金属复合互连元件作为弹性接触结构，可以在至少150℃的温度下进行老化，并且可以在少于60分钟内完成。
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公开(公告)号：US5864946A
公开(公告)日：1999-02-02
申请号：US839758
申请日：1997-04-15
IPC分类号： B23K1/00 , B23K20/00 , C23C18/16 , C25D5/08 , C25D5/22 , C25D7/12 , C25D21/02 , G01R1/04 , G01R1/067 , G01R1/073 , G01R31/28 , H01L21/00 , H01L21/48 , H01L21/56 , H01L21/60 , H01L21/603 , H01L21/66 , H01L23/48 , H01L23/485 , H01L23/49 , H01L23/498 , H01L25/065 , H01L25/16 , H01R12/00 , H05K1/14 , H05K3/20 , H05K3/30 , H05K3/32 , H05K3/34 , H05K3/36 , H05K3/40 , H05K7/10 , H01R9/00
CPC分类号： H05K7/1069 , B23K1/0008 , B23K20/004 , C23C18/1605 , C23C18/165 , C25D7/12 , G01R1/07342 , G01R31/2884 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L21/6835 , H01L22/20 , H01L23/49811 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/27 , H01L24/72 , H01L24/81 , H01L24/94 , H01L25/0652 , H01L25/16 , H05K3/308 , H05K3/326 , H05K3/3426 , H05K3/4015 , B23K2201/40 , C25D21/02 , C25D5/08 , C25D5/22 , G01R31/2856 , G01R31/2863 , G01R31/2886 , H01L2223/54453 , H01L2224/02311 , H01L2224/03912 , H01L2224/0401 , H01L2224/04042 , H01L2224/0558 , H01L2224/05599 , H01L2224/05624 , H01L2224/05644 , H01L2224/11003 , H01L2224/1132 , H01L2224/11334 , H01L2224/1134 , H01L2224/1147 , H01L2224/1184 , H01L2224/13022 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/13582 , H01L2224/13639 , H01L2224/13644 , H01L2224/13647 , H01L2224/13655 , H01L2224/13657 , H01L2224/16145 , H01L2224/274 , H01L2224/2929 , H01L2224/293 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4556 , H01L2224/45572 , H01L2224/45599 , H01L2224/48624 , H01L2224/48644 , H01L2224/48724 , H01L2224/48844 , H01L2224/49109 , H01L2224/73203 , H01L2224/81801 , H01L2224/83851 , H01L2224/85201 , H01L2224/85205 , H01L2224/90 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06572 , H01L23/544 , H01L24/45 , H01L24/49 , H01L24/83 , H01L24/90 , H01L2924/00011 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/05042 , H01L2924/10253 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/1532 , H01L2924/181 , H01L2924/19041 , H01L2924/20104 , H01L2924/20105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01R12/52 , H05K1/141 , H05K2201/0397 , H05K2201/068 , H05K2201/1031 , H05K2201/10318 , H05K2201/10378 , H05K2201/10719 , H05K2201/10734 , H05K2201/10757 , H05K2201/10878 , H05K2201/10909 , H05K2201/10946 , H05K3/20 , H05K3/3421 , H05K3/368 , H05K3/4092 , Y02P70/611 , Y02P70/613 , Y10S977/712 , Y10S977/723 , Y10T29/49004 , Y10T29/49117 , Y10T29/4913 , Y10T29/49144 , Y10T29/49147 , Y10T29/49149 , Y10T29/49169 , Y10T29/49171 , Y10T29/49204 , Y10T29/49208 , Y10T29/4922 , Y10T29/49812 , Y10T428/12396 , Y10T428/12528
摘要： Resilient contact structures are mounted directly to bond pads on semiconductor dies, prior to the dies being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies to be exercised (e.g., tested and/or burned-in) by connecting to the semiconductor dies with a circuit board or the like having a plurality of terminals disposed on a surface thereof. Subsequently, the semiconductor dies may be singulated from the semiconductor wafer, whereupon the same resilient contact structures can be used to effect interconnections between the semiconductor dies and other electronic components (such as wiring substrates, semiconductor packages, etc.). Using the all-metallic composite interconnection elements of the present invention as the resilient contact structures, burn-in can be performed at temperatures of at least 150.degree. C., and can be completed in less than 60 minutes.
摘要翻译： 弹性接触结构直接安装在半导体晶片上的接合焊盘上，在裸片与半导体晶片分离（分离）之前。 这使得半导体管芯能够通过具有设置在其表面上的多个端子的电路板等连接到半导体管芯来进行（例如，测试和/或烧入）。 接下来，半导体管芯可以从半导体晶片分离，因此可以使用相同的弹性接触结构来实现半导体管芯和其他电子部件（例如布线基板，半导体封装等）之间的互连。 使用本发明的全金属复合互连元件作为弹性接触结构，可以在至少150℃的温度下进行老化，并且可以在少于60分钟内完成。
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公开(公告)号：US08373428B2
公开(公告)日：2013-02-12
申请号：US12535070
申请日：2009-08-04
IPC分类号： G01R31/00
CPC分类号： B23K20/004 , B23K2101/40 , C25D5/08 , C25D5/22 , C25D7/12 , C25D21/02 , G01R1/07342 , G01R1/07378 , G01R31/2884 , G01R31/2886 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L22/20 , H01L23/49811 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/1134 , H01L2224/13099 , H01L2224/16145 , H01L2224/45144 , H01L2224/73203 , H01L2224/81801 , H01L2224/85201 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06572 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/1532 , H01L2924/15787 , H01L2924/19041 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H05K1/141 , H05K3/20 , H05K3/308 , H05K3/326 , H05K3/3421 , H05K3/3426 , H05K3/368 , H05K3/4015 , H05K2201/068 , H05K2201/1031 , H05K2201/10318 , H05K2201/10757 , H05K2201/10878 , H05K2201/10909 , H05K2201/10946 , Y02P70/611 , Y02P70/613 , Y10T29/49155 , Y10T29/49222 , H01L2924/00
摘要： A probe card assembly includes a probe card, a space transformer having resilient contact structures (probe elements) mounted directly to (i.e., without the need for additional connecting wires or the like) and extending from terminals on a surface thereof, and an interposer disposed between the space transformer and the probe card. The space transformer and interposer are “stacked up” so that the orientation of the space transformer, hence the orientation of the tips of the probe elements, can be adjusted without changing the orientation of the probe card. Suitable mechanisms for adjusting the orientation of the space transformer, and for determining what adjustments to make, are disclosed. The interposer has resilient contact structures extending from both the top and bottom surfaces thereof, and ensures that electrical connections are maintained between the space transformer and the probe card throughout the space transformer's range of adjustment, by virtue of the interposer's inherent compliance. Multiple die sites on a semiconductor wafer are readily probed using the disclosed techniques, and the probe elements can be arranged to optimize probing of an entire wafer. Composite interconnection elements having a relatively soft core overcoated by a relatively hard shell, as the resilient contact structures are described.
摘要翻译： 探针卡组件包括探针卡，具有弹性接触结构（探针元件）的空间变换器，其直接安装到（即，不需要额外的连接线等）并且从其表面上的端子延伸，并且设置有插入器 空间变压器和探针卡之间。 空间变换器和插入器被堆叠，使得可以调节空间变换器的取向，从而可以调节探针元件的尖端的取向而不改变探针卡的取向。 公开了用于调整空间变换器的取向以及用于确定进行什么调整的适当机构。 插入器具有从其顶表面和底表面延伸的弹性接触结构，并且确保通过插入件的固有顺应性，在整个空间变压器的调节范围内在空间变压器和探针卡之间保持电连接。 使用所公开的技术容易地探测半导体晶片上的多个裸片位置，并且可以布置探针元件以优化整个晶片的探测。 作为弹性接触结构的描述，具有由相对硬的外壳覆盖的相对软的芯的复合互连元件。
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公开(公告)号：US08033838B2
公开(公告)日：2011-10-11
申请号：US12577444
申请日：2009-10-12
IPC分类号： H05K1/00
CPC分类号： G01R1/06727 , G01R1/06738 , H01L21/6835 , H01L2221/68359 , H01L2224/11003 , H01L2224/111 , H01L2224/11826 , H01L2224/13017 , H01L2224/13018 , H01L2224/13019 , H01L2224/13565 , H01L2224/13582 , H01L2224/819 , H01L2924/01019 , H01L2924/01074 , H01L2924/01078 , H01L2924/14 , H01L2924/1433 , H01L2924/3011 , H01L2924/3025
摘要： Spring contact elements are fabricated by depositing at least one layer of metallic material into openings defined on a sacrificial substrate. The openings may be within the surface of the substrate, or in one or more layers deposited on the surface of the sacrificial substrate. Each spring contact element has a base end portion, a contact end portion, and a central body portion. The contact end portion is offset in the z-axis (at a different height) than the central body portion. The base end portion is preferably offset in an opposite direction along the z-axis from the central body portion. In this manner, a plurality of spring contact elements are fabricated in a prescribed spatial relationship with one another on the sacrificial substrate. The spring contact elements are suitably mounted by their base end portions to corresponding terminals on an electronic component, such as a space transformer or a semiconductor device, whereupon the sacrificial substrate is removed so that the contact ends of the spring contact elements extend above the surface of the electronic component. In an exemplary use, the spring contact elements are thereby disposed on a space transformer component of a probe card assembly so that their contact ends effect pressure connections to corresponding terminals on another electronic component, for the purpose of probing the electronic component.
摘要翻译： 通过将至少一层金属材料沉积到限定在牺牲衬底上的开口中来制造弹簧接触元件。 开口可以在衬底的表面内，或者在沉积在牺牲衬底的表面上的一个或多个层中。 每个弹簧接触元件具有基端部分，接触端部分和中心体部分。 接触端部在与中心体部分相同的z轴（不同高度）偏移。 基端部优选地沿着与中心主体部分的z轴相反的方向偏移。 以这种方式，在牺牲基板上以规定的空间关系制造多个弹簧接触元件。 弹簧接触元件通过它们的基端部适当地安装在诸如空间变压器或半导体器件的电子部件上的对应端子上，从而去除牺牲基板，使得弹簧接触元件的接触端部在表面上方延伸 的电子元件。 在示例性用途中，弹簧接触元件因此被布置在探针卡组件的空间变换器部件上，使得它们的接触端在另一电子部件上实现与相应端子的压力连接，以便探测电子部件。
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公开(公告)号：US20100323551A1
公开(公告)日：2010-12-23
申请号：US12852337
申请日：2010-08-06
IPC分类号： H01R11/20
CPC分类号： H01R13/2407 , G01R1/06711 , G01R1/06727 , H01R4/26 , H01R9/091 , H01R12/57 , H01R13/2442 , H01R2201/20 , Y10T29/49004 , Y10T29/49128 , Y10T29/49165
摘要： An apparatus and method providing improved interconnection elements and tip structures for effecting pressure connections between terminals of electronic components is described. The tip structure of the present invention has a sharpened blade oriented on the upper surface of the tip structure such that the length of the blade is substantially parallel to the direction of horizontal movement of the tip structure as the tip structure deflects across the terminal of an electronic component. In this manner, the sharpened substantially parallel oriented blade slices cleanly through any non-conductive layer(s) on the surface of the terminal and provides a reliable electrical connection between the interconnection element and the terminal of the electrical component.
摘要翻译： 描述了提供改进的互连元件和尖端结构以实现电子部件的端子之间的压力连接的装置和方法。 本发明的尖端结构具有尖端结构的上表面上定向的锋利的叶片，使得叶片的长度基本上平行于尖端结构的水平移动方向，因为尖端结构偏转穿过端部 电子元件 以这种方式，锋利的基本上平行的定向叶片切片通过终端表面上的任何非导电层清洁，并且在互连元件和电气部件的端子之间提供可靠的电连接。
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公开(公告)号：US07798822B2
公开(公告)日：2010-09-21
申请号：US12511057
申请日：2009-07-28
IPC分类号： H01R12/00
CPC分类号： G01R1/07314 , H01H1/0036 , H01L2224/02335 , H01L2924/00013 , Y10T29/49147 , Y10T29/49204 , Y10T29/49218 , Y10T29/49316 , H01L2224/13099
摘要： Microelectronic contact structures are fabricated by separately forming, then joining together, various components thereof. Each contact structure has three components: a “post” component, a “beam” component, and a “tip” component. The resulting contact structure, mounted to an electronic component, is useful for making an electrical connection with another electronic component. The post component can be fabricated on a sacrificial substrate, joined to the electronic component and its sacrificial substrate removed. Alternatively, the post component can be formed on the electronic component. The beam and tip components can each be fabricated on a sacrificial substrate. The beam component is joined to the post component and its sacrificial substrate is removed, and the tip component is joined to the beam component and its sacrificial substrate is removed.
摘要翻译： 微电子接触结构通过分别形成，然后连接在一起而制成其各种部件。 每个接触结构具有三个部件：“后”部件，“梁”部件和“尖端”部件。 安装到电子部件上的所得接触结构对于与另一个电子部件进行电连接是有用的。 后部组件可以制造在牺牲基板上，连接到电子部件并且去除其牺牲基板。 或者，可以在电子部件上形成柱部件。 梁和尖端部件可以分别制造在牺牲衬底上。 梁组件连接到柱部件，并且其牺牲基板被移除，并且尖端部件接合到梁部件并且其牺牲基板被移除。
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公开(公告)号：US07601039B2
公开(公告)日：2009-10-13
申请号：US11456568
申请日：2006-07-11
IPC分类号： H05K3/00
CPC分类号： G01R3/00 , B23K2101/38 , G01R1/06727 , G01R1/06744 , H01L21/6835 , H01L23/4951 , H01L24/72 , H01L2924/01005 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/3011 , H01L2924/3025 , H01R12/57 , H05K3/4092 , Y10T29/49147 , Y10T29/49149 , Y10T29/49155 , Y10T29/49204 , H01L2924/00
摘要： An electronic interconnection apparatus can include a sacrificial substrate, which can include first trenches and second trenches formed in the sacrificial substrate. The first trenches can be disposed below a surface of the sacrificial substrate, and the second trenches can be disposed below the first trenches. First sidewalls can connect the surface and the first trenches, and the first sidewalls can be angled with respect to the surface and the first trenches. Second sidewalls can connect the first trenches and the second trenches, and the second sidewalls can be angled with respect to the first trenches and the second trenches. Spring contact elements can reside upon the sacrificial substrate. Each of the spring contact elements can have a first portion disposed on the surface, a second portion disposed on one of the first trenches, and a third portion disposed on one of the second trenches.
摘要翻译： 电子互连设备可以包括牺牲衬底，其可以包括形成在牺牲衬底中的第一沟槽和第二沟槽。 第一沟槽可以设置在牺牲衬底的表面下方，并且第二沟槽可以设置在第一沟槽下方。 第一侧壁可以连接表面和第一沟槽，并且第一侧壁可以相对于表面和第一沟槽成角度。 第二侧壁可以连接第一沟槽和第二沟槽，并且第二侧壁可以相对于第一沟槽和第二沟槽成角度。 弹性接触元件可以驻留在牺牲衬底上。 每个弹簧接触元件可以具有设置在表面上的第一部分，设置在第一沟槽中的一个上的第二部分和设置在第二沟槽之一上的第三部分。
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公开(公告)号：US07196531B2
公开(公告)日：2007-03-27
申请号：US11073187
申请日：2005-03-04
申请人： Gary W. Grube , Igor Y. Khandros , Benjamin N. Eldridge , Gaetan L. Mathieu , Poya Lotfizadeh , Jim Chih-Chiang Tseng
发明人： Gary W. Grube , Igor Y. Khandros , Benjamin N. Eldridge , Gaetan L. Mathieu , Poya Lotfizadeh , Jim Chih-Chiang Tseng
CPC分类号： G01R31/2886 , G01R1/07314 , G01R1/07342 , G01R1/07357 , G01R1/07378 , G01R3/00 , Y10T29/49126
摘要： A method of designing and manufacturing a probe card assembly includes prefabricating one or more elements of the probe card assembly to one or more predefined designs. Thereafter, design data regarding a newly designed semiconductor device is received along with data describing the tester and testing algorithms to be used to test the semiconductor device. Using the received data, one or more of the prefabricated elements is selected. Again using the received data, one or more of the selected prefabricated elements is customized. The probe card assembly is then built using the selected and customized elements.
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公开(公告)号：US07059047B2
公开(公告)日：2006-06-13
申请号：US10673691
申请日：2003-09-29
申请人： Thomas H. Dozier, II , Benjamin N. Eldridge , Gary W. Grube , Igor Y. Khandros , Gaetan L. Mathieu , David V. Pedersen , Michael A. Stadt
发明人： Thomas H. Dozier, II , Benjamin N. Eldridge , Gary W. Grube , Igor Y. Khandros , Gaetan L. Mathieu , David V. Pedersen , Michael A. Stadt
IPC分类号： H01R9/00
CPC分类号： G01R1/0408 , B23K3/087 , G01R1/0416 , G01R1/0466 , G01R31/2886 , H01L23/04 , H01L23/13 , H01L23/32 , H01L23/5385 , H01L24/72 , H01L2224/1134 , H01L2224/13099 , H01L2224/16 , H01L2224/16237 , H01L2224/73251 , H01L2224/8114 , H01L2224/81901 , H01L2924/00013 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01078 , H01L2924/01079 , H05K1/119 , H05K3/308 , H05K3/325 , H05K2201/0311 , H05K2201/09472 , H05K2201/09827 , Y10T29/49128 , Y10T29/4913 , Y10T29/49139 , Y10T29/4914 , Y10T29/49147 , Y10T29/49153 , Y10T29/49208 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , H01L2924/00014 , H01L2224/72
摘要： Temporary connections to spring contact elements extending from an electronic component such as a semiconductor device are made by urging the electronic component, consequently the ends of the spring contact elements, vertically against terminals of an interconnection substrate, or by horizontally urging terminals of an interconnection substrate against end portions of the spring contact elements. A variety of terminal configurations are disclosed.
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公开(公告)号：US06825422B2
公开(公告)日：2004-11-30
申请号：US10174455
申请日：2002-06-17
IPC分类号： H05K116
CPC分类号： H01R13/2407 , G01R1/06711 , G01R1/06727 , H01R4/26 , H01R9/091 , H01R12/57 , H01R13/2442 , H01R2201/20 , Y10T29/49004 , Y10T29/49128 , Y10T29/49165
摘要： An apparatus and method providing improved interconnection elements and tip structures for effecting pressure connections between terminals of electronic components is described. The tip structure of the present invention has a sharpened blade oriented on the upper surface of the tip structure such that the length of the blade is substantially parallel to the direction of horizontal movement of the tip structure as the tip structure deflects across the terminal of an electronic component. In this manner, the sharpened substantially parallel oriented blade slices cleanly through any non-conductive layer(s) on the surface of the terminal and provides a reliable electrical connection between the interconnection element and the terminal of the electrical component.
摘要翻译： 描述了提供改进的互连元件和尖端结构以实现电子部件的端子之间的压力连接的装置和方法。 本发明的尖端结构具有尖端结构的上表面上定向的锋利的叶片，使得叶片的长度基本上平行于尖端结构的水平移动方向，因为尖端结构偏转穿过端部 电子元件 以这种方式，锋利的基本上平行的定向叶片切片通过终端表面上的任何非导电层清洁，并且在互连元件和电气部件的端子之间提供可靠的电连接。
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