公开(公告)号：US20160225739A1

公开(公告)日：2016-08-04

申请号：US15096588

申请日：2016-04-12

Applicant: Invensas Corporation

Inventor： Belgacem Haba ,  Reynaldo Co ,  Rizza Lee Saga Cizek ,  Wael Zohni

IPC: H01L23/00 ,  B23K20/00 ,  H01L21/56

CPC classification number: H01L24/85 ,  B23K20/004 ,  B23K20/005 ,  B23K20/007 ,  H01L21/4853 ,  H01L21/56 ,  H01L23/49811 ,  H01L24/43 ,  H01L24/78 ,  H01L2224/04105 ,  H01L2224/056 ,  H01L2224/432 ,  H01L2224/4382 ,  H01L2224/43985 ,  H01L2224/783 ,  H01L2224/78301 ,  H01L2224/7855 ,  H01L2224/78621 ,  H01L2224/78822 ,  H01L2224/85 ,  H01L2224/85345 ,  H01L2224/85399 ,  H01L2224/96 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/2064 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: An electrically conductive lead is formed using a bonding tool. After bonding the wire to a metal surface and extending a length of the wire beyond the bonding tool, the wire is clamped. Movement of the bonding tool imparts a kink to the wire at a location where the wire is fully separated from any metal element other than the bonding tool. A forming element, e.g., an edge or a blade skirt provided at an exterior surface of the bonding tool can help kink the wire. Optionally, twisting the wire while tensioning the wire using the bonding tool can cause the wire to break and define an end. The lead then extends from the metal surface to the end, and may exhibit a sign of the torsional force applied thereto.

Abstract translation: 使用接合工具形成导电引线。 在将金属丝接合到金属表面上并将一段长度的金属丝延伸超过粘合工具之后，线被夹紧。 焊接工具的移动在电线与除了焊接工具之外的任何金属元件完全分离的位置处对电线施加扭结。 形成元件，例如设置在接合工具的外表面处的边缘或叶片裙部可以帮助扭结线。 可选地，在使用接合工具张紧线的同时扭转线可能导致线断裂并限定端部。 引线然后从金属表面延伸到末端，并且可能表现出施加到其上的扭转力的迹象。

公开(公告)号：US20160027761A1

公开(公告)日：2016-01-28

申请号：US14871185

申请日：2015-09-30

Applicant: Invensas Corporation

Inventor： Reynaldo Co ,  Jeffrey S. Leal ,  Suzette K. Pangrle ,  Scott McGrath ,  De Ann Eileen Melcher ,  Keith L. Barrie ,  Grant Villavicencio ,  Elmer M. Del Rosario ,  John R. Bray

IPC: H01L25/065 ,  H01L21/78

CPC classification number: H01L25/0657 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3171 ,  H01L23/3185 ,  H01L23/3192 ,  H01L24/03 ,  H01L24/05 ,  H01L24/18 ,  H01L24/24 ,  H01L24/82 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2224/0235 ,  H01L2224/02371 ,  H01L2224/03002 ,  H01L2224/03318 ,  H01L2224/0332 ,  H01L2224/03632 ,  H01L2224/03848 ,  H01L2224/05016 ,  H01L2224/05017 ,  H01L2224/0529 ,  H01L2224/05553 ,  H01L2224/24051 ,  H01L2224/24145 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2224/94 ,  H01L2225/06551 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/03

Abstract: Methods for forming connectors on die pads at a wafer level of processing include forming spots of a curable electrically conductive material over die pads and extending to or over the interconnect die edge; curing the conductive material; and in a wafer cutting procedure thereafter severing the spots. Also, die pad to z-interconnect connectors formed by the methods, and shaped and dimensioned accordingly. Also, stacked die assemblies and stacked die packages containing die prepared according to the methods and having die pad to z-interconnect connectors formed by the methods and shaped and dimensioned accordingly.

Abstract translation: 在晶片级处理中在芯片焊盘上形成连接器的方法包括在芯片焊盘上形成可固化的导电材料的点并且延伸到互连芯片边缘上或之上; 固化导电材料; 并且在切割步骤之后切断斑点。 而且，通过这些方法形成的管芯焊盘到z-互连连接器，并相应地成形和尺寸。 而且，堆叠的模具组件和包含根据方法制备的模具的堆叠模具组件，并且具有通过所述方法形成并且形状和尺寸的模具垫到z互连连接器。

公开(公告)号：US09082753B2

公开(公告)日：2015-07-14

申请号：US14297701

申请日：2014-06-06

Applicant: Invensas Corporation

Inventor： Belgacem Haba ,  Reynaldo Co ,  Rizza Lee Saga Cizek ,  Wael Zohni

IPC: B23K31/02 ,  H01L21/44 ,  H01L23/00 ,  B23K20/00 ,  H01L23/498 ,  H01L21/48

CPC classification number: H01L24/85 ,  B23K20/004 ,  B23K20/005 ,  B23K20/007 ,  H01L21/4853 ,  H01L21/56 ,  H01L23/49811 ,  H01L24/43 ,  H01L24/78 ,  H01L2224/04105 ,  H01L2224/056 ,  H01L2224/432 ,  H01L2224/4382 ,  H01L2224/43985 ,  H01L2224/783 ,  H01L2224/78301 ,  H01L2224/7855 ,  H01L2224/78621 ,  H01L2224/78822 ,  H01L2224/85 ,  H01L2224/85345 ,  H01L2224/85399 ,  H01L2224/96 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/2064 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: An electrically conductive lead is formed using a bonding tool. After bonding the wire to a metal surface and extending a length of the wire beyond the bonding tool, the wire is clamped. Movement of the bonding tool imparts a kink to the wire at a location where the wire is fully separated from any metal element other than the bonding tool. A forming element, e.g., an edge or a blade skirt provided at an exterior surface of the bonding tool can help kink the wire. Twisting the wire while tensioning the wire using the bonding tool can cause the wire to break and define an end. The lead then extends from the metal surface to the end, and may exhibits a sign of the torsional force applied thereto.

Abstract translation: 使用接合工具形成导电引线。 在将金属丝接合到金属表面上并将一段长度的金属丝延伸超过粘合工具之后，线被夹紧。 焊接工具的移动在电线与除了焊接工具之外的任何金属元件完全分离的位置处对电线施加扭结。 形成元件，例如设置在接合工具的外表面处的边缘或叶片裙部可以帮助扭结线。 使用接合工具拉紧电线时扭绞线会导致电线断裂并限定端部。 引线然后从金属表面延伸到末端，并且可以表现出施加到其上的扭转力的标志。

公开(公告)号：US09041227B2

公开(公告)日：2015-05-26

申请号：US13795811

申请日：2013-03-12

Applicant: Invensas Corporation

Inventor： Ellis Chau ,  Reynaldo Co ,  Roseann Alatorre ,  Philip Damberg ,  Wei-Shun Wang ,  Se Young Yang

IPC: H01L23/48 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L25/10 ,  H01L25/00 ,  H01L23/495 ,  H01L21/48 ,  H01L23/367 ,  H01L23/433 ,  H01L21/56 ,  H01L25/065 ,  H05K3/34

CPC classification number: H01L24/85 ,  H01L21/4853 ,  H01L21/56 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/3677 ,  H01L23/4334 ,  H01L23/49517 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/06 ,  H01L24/16 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/78 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/45565 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/48997 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/851 ,  H01L2224/8518 ,  H01L2224/85399 ,  H01L2224/85951 ,  H01L2224/85986 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06558 ,  H01L2225/06562 ,  H01L2225/06565 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1029 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2225/1094 ,  H01L2924/00011 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/12042 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/1715 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/3511 ,  H05K3/3436 ,  H05K2201/10515 ,  H05K2201/1053 ,  Y10T29/49149 ,  Y10T29/49151 ,  H01L2224/45664 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076

Abstract: A microelectronic package includes a substrate having a first surface. A microelectronic element overlies the first surface. Electrically conductive elements are exposed at the first surface of the substrate, at least some of which are electrically connected to the microelectronic element. The package includes wire bonds having bases bonded to respective ones of the conductive elements and ends remote from the substrate and remote from the bases. The ends of the wire bonds are defined on tips of the wire bonds, and the wire bonds define respective first diameters between the bases and the tips thereof. The tips have at least one dimension that is smaller than the respective first diameters of the wire bonds. A dielectric encapsulation layer covers portions of the wire bonds, and unencapsulated portions of the wire bonds are defined by portions of the wire bonds, including the ends, are uncovered by the encapsulation layer.

Abstract translation: 微电子封装包括具有第一表面的衬底。 微电子元件覆盖在第一表面上。 导电元件在衬底的第一表面处露出，其中至少一些电连接到微电子元件。 封装包括引线键合，其具有接合到相应的导电元件的底部和远离基板的远离基座的端部。 线接合的端部限定在引线接合的尖端处，并且引线键合限定了基部和其尖端之间的相应的第一直径。 尖端具有至少一个尺寸小于引线接合的相应第一直径。 电介质封装层覆盖引线接合的部分，并且引线键合的未封装部分由引线键合的部分限定，包括末端，被封装层覆盖。

公开(公告)号：US20150129646A1

公开(公告)日：2015-05-14

申请号：US14077597

申请日：2013-11-12

Applicant: Invensas Corporation

Inventor： Belgacem Haba ,  Reynaldo Co ,  Rizza Lee Saga Cizek ,  Wael Zohni

IPC: H01L23/00

CPC classification number: H01L24/43 ,  B23K20/004 ,  B23K20/005 ,  B23K20/007 ,  B23K2101/42 ,  H01L21/4885 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/48 ,  H01L24/85 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/432 ,  H01L2224/4382 ,  H01L2224/43985 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2224/78301 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2224/45099 ,  H01L2924/00012

Abstract: An electrically conductive lead is formed using a bonding tool. After bonding the wire to a metal surface and extending a length of the wire beyond the bonding tool, the wire is clamped. Movement of the bonding tool imparts a kink to the wire at a location where the wire is fully separated from any metal element other than the bonding tool. A forming element, e.g., an edge or a blade skirt provided at an exterior surface of the bonding tool can help kink the wire. Tensioning the wire using the bonding tool causes the wire to break and define an end. The lead then extends from the metal surface to the end.

Abstract translation: 使用接合工具形成导电引线。 在将金属丝接合到金属表面上并将一段长度的金属丝延伸超过粘合工具之后，线被夹紧。 焊接工具的移动在线材与除了焊接工具之外的任何金属元件完全分离的位置处对线材施加扭结。 形成元件，例如设置在接合工具的外表面处的边缘或叶片裙部可以帮助扭结线。 使用接合工具拉紧电线会使电线断裂并确定端部。 然后，引线从金属表面延伸到末端。

公开(公告)号：US20210035948A1

公开(公告)日：2021-02-04

申请号：US16999601

申请日：2020-08-21

Applicant: Invensas Corporation

Inventor： Ellis Chau ,  Reynaldo Co ,  Roseann Alatorre ,  Philip Damberg ,  Wei-Shun Wang ,  Se Young Yang

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L21/56 ,  H01L25/10 ,  H01L25/00 ,  H01L23/495 ,  H01L21/48 ,  H01L23/367 ,  H01L23/433

Abstract: A microelectronic package includes a substrate having a first surface. A microelectronic element overlies the first surface. Electrically conductive elements are exposed at the first surface of the substrate, at least some of which are electrically connected to the microelectronic element. The package includes wire bonds having bases bonded to respective ones of the conductive elements and ends remote from the substrate and remote from the bases. The ends of the wire bonds are defined on tips of the wire bonds, and the wire bonds define respective first diameters between the bases and the tips thereof. The tips have at least one dimension that is smaller than the respective first diameters of the wire bonds. A dielectric encapsulation layer covers portions of the wire bonds, and unencapsulated portions of the wire bonds are defined by portions of the wire bonds, including the ends, are uncovered by the encapsulation layer.

公开(公告)号：US10806036B2

公开(公告)日：2020-10-13

申请号：US15875842

申请日：2018-01-19

Applicant: Invensas Corporation

Inventor： Reynaldo Co ,  Grant Villavicencio ,  Wael Zohni

IPC: H05K3/28 ,  H05K3/10 ,  H05K1/02 ,  H05K3/00 ,  B29C45/14 ,  H01L21/56 ,  B29L31/34

Abstract: In a method for forming a microelectronic device, a substrate is loaded into a mold press. The substrate has a first surface and a second surface. The second surface is placed on an interior lower surface of the mold press. The substrate has a plurality of wire bond wires extending from the first surface toward an interior upper surface of the mold press. An upper surface of a mold film is indexed to the interior upper surface of the mold press. A lower surface of the mold film is punctured with tips of the plurality of wire bond wires for having the tips of the plurality of wire bond wires extending above the lower surface of the mold film into the mold film. The tips of the plurality of wire bond wires are pressed down toward the lower surface of the mold film to bend the tips over.

公开(公告)号：US20180026007A1

公开(公告)日：2018-01-25

申请号：US15699288

申请日：2017-09-08

Applicant: Invensas Corporation

Inventor： Ellis Chau ,  Reynaldo Co ,  Roseann Alatorre ,  Philip Damberg ,  Wei-Shun Wang ,  Se Young Yang

IPC: H01L23/00 ,  H01L25/10 ,  H01L23/498 ,  H01L21/48 ,  H01L23/433 ,  H01L23/367 ,  H01L23/31 ,  H01L21/56 ,  H01L25/00 ,  H01L23/495 ,  H01L25/065 ,  H05K3/34

Abstract: A microelectronic package includes a substrate having a first surface. A microelectronic element overlies the first surface. Electrically conductive elements are exposed at the first surface of the substrate, at least some of which are electrically connected to the microelectronic element. The package includes wire bonds having bases bonded to respective ones of the conductive elements and ends remote from the substrate and remote from the bases. The ends of the wire bonds are defined on tips of the wire bonds, and the wire bonds define respective first diameters between the bases and the tips thereof. The tips have at least one dimension that is smaller than the respective first diameters of the wire bonds. A dielectric encapsulation layer covers portions of the wire bonds, and unencapsulated portions of the wire bonds are defined by portions of the wire bonds, including the ends, are uncovered by the encapsulation layer.

公开(公告)号：US20160260647A1

公开(公告)日：2016-09-08

申请号：US15159287

申请日：2016-05-19

Applicant: Invensas Corporation

Inventor： Reynaldo Co ,  Laura Mirkarimi

IPC: H01L23/31 ,  H01L25/065 ,  H01L25/10 ,  H01L23/00

CPC classification number: H01L23/3128 ,  H01L21/4853 ,  H01L23/3121 ,  H01L23/49517 ,  H01L23/49811 ,  H01L24/03 ,  H01L24/06 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/78 ,  H01L24/81 ,  H01L24/85 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06562 ,  H01L2225/06565 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2224/32145 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2224/05599

Abstract: A microelectronic assembly (10) includes a substrate (12) having a first and second opposed surfaces. A microelectronic element (22) overlies the first surface and first electrically conductive elements (28) can be exposed at at least one of the first surface or second surfaces. Some of the first conductive elements (28) are electrically connected to the microelectronic element (22). Wire bonds (32) have bases (34) joined to the conductive elements (28) and end surfaces (38) remote from the substrate and the bases, each wire bond defining an edge surface (37) extending between the base and the end surface. An encapsulation layer (42) can extend from the first surface and fill spaces between the wire bonds, such that the wire bonds can be separated by the encapsulation layer. Unencapsulated portions of the wire bonds (32) are defined by at least portions of the end surfaces (38) of the wire bonds that are uncovered by the encapsulation layer (42).

公开(公告)号：US09412714B2

公开(公告)日：2016-08-09

申请号：US14291874

申请日：2014-05-30

Applicant: Invensas Corporation

Inventor： Reynaldo Co ,  Wael Zohni ,  Rizza Lee Saga Cizek ,  Rajesh Katkar

IPC: H01L23/02 ,  H01L23/00 ,  H01L23/34 ,  H01L23/31 ,  H01L21/56 ,  H01L23/522 ,  H01L23/498

CPC classification number: H01L25/0657 ,  H01L21/56 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/34 ,  H01L23/367 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/5226 ,  H01L24/17 ,  H01L24/81 ,  H01L25/50 ,  H01L2221/68318 ,  H01L2221/68359 ,  H01L2221/68381 ,  H01L2224/0401 ,  H01L2224/11318 ,  H01L2224/1132 ,  H01L2224/131 ,  H01L2224/1403 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06548 ,  H01L2225/06568 ,  H01L2225/06582 ,  H01L2225/06589 ,  H01L2924/014 ,  H01L2924/15151 ,  H01L2924/15312 ,  H01L2924/15321 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A microelectronic package may include a substrate having first and second regions, a first surface and a second surface remote from the first surface; at least one microelectronic element overlying the first surface within the first region; electrically conductive elements at the first surface within the second region; a support structure having a third surface and a fourth surface remote from the third surface and overlying the first surface within the second region in which the third surface faces the first surface, second and third electrically conductive elements exposed respectively at the third and fourth surfaces and electrically connected to the conductive elements at the first surface in the first region; and wire bonds defining edge surfaces and having bases electrically connected through ones of the third conductive elements to respective ones of the second conductive elements and ends remote from the support structure and the bases.

Abstract translation: 微电子封装可以包括具有第一和第二区域的基板，第一表面和远离第一表面的第二表面; 在所述第一区域内覆盖所述第一表面的至少一个微电子元件; 在第二区域内的第一表面处的导电元件; 支撑结构，其具有第三表面和第四表面，所述第三表面和第四表面远离所述第三表面并且在所述第三区域内的所述第一区域中覆盖所述第一表面，所述第三表面面向所述第一表面， 电连接到第一区域中的第一表面处的导电元件; 以及限定边缘表面并且具有通过第三导电元件中的一个电连接到相应的第二导电元件和远离支撑结构和基座的端部的接合线。