公开(公告)号：US20050237077A1

公开(公告)日：2005-10-27

申请号：US11171153

申请日：2005-06-30

申请人： Alan Wood ,  Tim Corbett

发明人： Alan Wood ,  Tim Corbett

IPC分类号： G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/26 ,  G01R31/28 ,  H01L21/60 ,  H01L21/66 ,  H01L23/13 ,  H05K3/00 ,  H05K3/40 ,  H05K3/42

CPC分类号： H01L24/80 ,  G01R1/0466 ,  G01R1/0483 ,  G01R1/0491 ,  G01R1/0735 ,  G01R3/00 ,  G01R31/2831 ,  G01R31/2855 ,  G01R31/2863 ,  G01R31/2867 ,  G01R31/2886 ,  G01R31/2889 ,  G01R31/2893 ,  H01L22/20 ,  H01L22/22 ,  H01L23/13 ,  H01L2224/16145 ,  H01L2225/06562 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15151 ,  H05K3/0058 ,  H05K3/0067 ,  H05K3/4007 ,  H05K3/423 ,  H05K2201/0133 ,  H05K2201/0347 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2203/0307 ,  H05K2203/0723

摘要： A reusable burn-in/test fixture for testing unsingulated dice on a semiconductor wafer consisting of two halves. The first half of the test fixture is a wafer cavity plate for receiving the wafer, and the second half establishes electrical communication between the wafer and electrical testing equipment. A rigid substrate has conductors thereon which establish electrical contact with the wafer. The test fixture need not be opened until the burn-in and electrical testing are completed. After burn-in stress and electrical testing, it is possible to establish interconnection between the single die or separate and package dice into discrete parts, arrays or clusters, either as singulated parts or as arrays.

摘要翻译： 一个可重复使用的老化/测试夹具，用于测试由半个半部组成的半导体晶圆上的无引脚骰子。 测试夹具的前半部分是用于接收晶片的晶片腔板，第二半部分在晶片和电气测试设备之间建立电气连通。 刚性基板在其上具有与晶片电接触的导体。 在老化和电气测试完成之前，测试夹具不需要打开。 在老化应力和电气测试之后，可以将单个裸片或单独的封装裸片与封装裸片之间建立互为独立部件，阵列或簇的互连，或者作为单个部分或阵列。

公开(公告)号：US20050200028A1

公开(公告)日：2005-09-15

申请号：US11052279

申请日：2005-02-07

申请人： Warren Farnworth ,  Alan Wood ,  Trung Doan

发明人： Warren Farnworth ,  Alan Wood ,  Trung Doan

IPC分类号： H01L21/301 ,  H01L21/304 ,  H01L21/44 ,  H01L21/56 ,  H01L21/60 ,  H01L21/68 ,  H01L21/768 ,  H01L21/78 ,  H01L23/24 ,  H01L23/31 ,  H01L23/367 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/495 ,  H01L29/06

CPC分类号： H01L23/48 ,  B33Y70/00 ,  B33Y80/00 ,  H01L21/304 ,  H01L21/3043 ,  H01L21/56 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/76802 ,  H01L21/76898 ,  H01L21/78 ,  H01L23/24 ,  H01L23/3114 ,  H01L23/36 ,  H01L23/3672 ,  H01L23/481 ,  H01L23/49531 ,  H01L23/49575 ,  H01L24/05 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/27 ,  H01L24/94 ,  H01L24/96 ,  H01L25/105 ,  H01L25/50 ,  H01L29/0657 ,  H01L2221/68327 ,  H01L2221/68331 ,  H01L2221/68372 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/11849 ,  H01L2224/11901 ,  H01L2224/12105 ,  H01L2224/13009 ,  H01L2224/13022 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/274 ,  H01L2224/73104 ,  H01L2224/73253 ,  H01L2224/94 ,  H01L2225/06541 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/27

摘要： A semiconductor component includes a thinned semiconductor die having protective polymer layers on up to six surfaces. The component also includes contact bumps on the die embedded in a circuit side polymer layer, and terminal contacts on the contact bumps in a dense area array. A method for fabricating the component includes the steps of providing a substrate containing multiple dice, forming trenches on the substrate proximate to peripheral edges of the dice, and depositing a polymer material into the trenches. In addition, the method includes the steps of planarizing the back side of the substrate to contact the polymer filled trenches, and cutting through the polymer trenches to singulate the components from the substrate. Prior to the singulating step the components can be tested and burned-in while they remain on the substrate.

摘要翻译： 半导体部件包括在六个表面上具有保护性聚合物层的变薄的半导体管芯。 该组件还包括嵌入在电路侧聚合物层中的裸片上的接触凸块，并且密集区域阵列中接触凸块上的端子接触。 一种用于制造该部件的方法包括以下步骤：提供包含多个骰子的基底，在基底上邻近骰子的周边边缘形成沟槽，以及将聚合物材料沉积到沟槽中。 此外，该方法包括以下步骤：平坦化衬底的背面以接触聚合物填充的沟槽，并切割穿过聚合物沟槽以从衬底中分离组分。 在分离步骤之前，组分可以在它们保留在基材上时被测试和燃烧。

公开(公告)号：US20050181540A1

公开(公告)日：2005-08-18

申请号：US11052378

申请日：2005-02-07

申请人： Warren Farnworth ,  Alan Wood ,  Trung Doan

发明人： Warren Farnworth ,  Alan Wood ,  Trung Doan

IPC分类号： H01L21/301 ,  H01L21/304 ,  H01L21/44 ,  H01L21/56 ,  H01L21/60 ,  H01L21/68 ,  H01L21/768 ,  H01L21/78 ,  H01L23/24 ,  H01L23/31 ,  H01L23/367 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/495 ,  H01L29/06

CPC分类号： H01L23/48 ,  B33Y70/00 ,  B33Y80/00 ,  H01L21/304 ,  H01L21/3043 ,  H01L21/56 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/76802 ,  H01L21/76898 ,  H01L21/78 ,  H01L23/24 ,  H01L23/3114 ,  H01L23/36 ,  H01L23/3672 ,  H01L23/481 ,  H01L23/49531 ,  H01L23/49575 ,  H01L24/05 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/27 ,  H01L24/94 ,  H01L24/96 ,  H01L25/105 ,  H01L25/50 ,  H01L29/0657 ,  H01L2221/68327 ,  H01L2221/68331 ,  H01L2221/68372 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/11849 ,  H01L2224/11901 ,  H01L2224/12105 ,  H01L2224/13009 ,  H01L2224/13022 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/274 ,  H01L2224/73104 ,  H01L2224/73253 ,  H01L2224/94 ,  H01L2225/06541 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/27

摘要： A semiconductor component includes a thinned semiconductor die having protective polymer layers on up to six surfaces. The component also includes contact bumps on the die embedded in a circuit side polymer layer, and terminal contacts on the contact bumps in a dense area array. A method for fabricating the component includes the steps of providing a substrate containing multiple dice, forming trenches on the substrate proximate to peripheral edges of the dice, and depositing a polymer material into the trenches. In addition, the method includes the steps of planarizing the back side of the substrate to contact the polymer filled trenches, and cutting through the polymer trenches to singulate the components from the substrate. Prior to the singulating step the components can be tested and burned-in while they remain on the substrate.

公开(公告)号：US20050148160A1

公开(公告)日：2005-07-07

申请号：US10646897

申请日：2003-08-22

申请人： Warren Farnworth ,  Alan Wood ,  Trung Doan

发明人： Warren Farnworth ,  Alan Wood ,  Trung Doan

IPC分类号： H01L21/301 ,  H01L21/304 ,  H01L21/44 ,  H01L21/56 ,  H01L21/60 ,  H01L21/68 ,  H01L21/768 ,  H01L21/78 ,  H01L23/24 ,  H01L23/31 ,  H01L23/367 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/495 ,  H01L29/06

CPC分类号： H01L23/48 ,  B33Y70/00 ,  B33Y80/00 ,  H01L21/304 ,  H01L21/3043 ,  H01L21/56 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/76802 ,  H01L21/76898 ,  H01L21/78 ,  H01L23/24 ,  H01L23/3114 ,  H01L23/36 ,  H01L23/3672 ,  H01L23/481 ,  H01L23/49531 ,  H01L23/49575 ,  H01L24/05 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/27 ,  H01L24/94 ,  H01L24/96 ,  H01L25/105 ,  H01L25/50 ,  H01L29/0657 ,  H01L2221/68327 ,  H01L2221/68331 ,  H01L2221/68372 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05599 ,  H01L2224/11849 ,  H01L2224/11901 ,  H01L2224/12105 ,  H01L2224/13009 ,  H01L2224/13022 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/274 ,  H01L2224/73104 ,  H01L2224/73253 ,  H01L2224/94 ,  H01L2225/06541 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/27

摘要： A semiconductor component includes a thinned semiconductor die having protective polymer layers on up to six surfaces. The component also includes contact bumps on the die embedded in a circuit side polymer layer, and terminal contacts on the contact bumps in a dense area array. A method for fabricating the component includes the steps of providing a substrate containing multiple dice, forming trenches on the substrate proximate to peripheral edges of the dice, and depositing a polymer material into the trenches. In addition, the method includes the steps of planarizing the back side of the substrate to contact the polymer filled trenches, and cutting through the polymer trenches to singulate the components from the substrate. Prior to the singulating step the components can be tested and burned-in while they remain on the substrate.

摘要翻译： 半导体部件包括在六个表面上具有保护性聚合物层的变薄的半导体管芯。 该组件还包括嵌入在电路侧聚合物层中的裸片上的接触凸块，并且密集区域阵列中接触凸块上的端子接触。 一种用于制造该部件的方法包括以下步骤：提供包含多个骰子的基底，在基底上邻近骰子的周边边缘形成沟槽，以及将聚合物材料沉积到沟槽中。 此外，该方法包括以下步骤：平坦化衬底的背面以接触聚合物填充的沟槽，并切割穿过聚合物沟槽以从衬底中分离组分。 在分离步骤之前，组分可以在它们保留在基材上时被测试和燃烧。

公开(公告)号：US20050046038A1

公开(公告)日：2005-03-03

申请号：US10962931

申请日：2004-10-11

申请人： Warren Farnworth ,  Alan Wood ,  William Hiatt ,  James Wark ,  David Hembree ,  Kyle Kirby ,  Pete Benson

发明人： Warren Farnworth ,  Alan Wood ,  William Hiatt ,  James Wark ,  David Hembree ,  Kyle Kirby ,  Pete Benson

IPC分类号： H01L21/56 ,  H01L21/60 ,  H01L21/768 ,  H01L21/98 ,  H01L23/31 ,  H01L23/48 ,  H01L25/065 ,  G01R31/02

CPC分类号： H01L21/561 ,  B33Y70/00 ,  B33Y80/00 ,  H01L21/563 ,  H01L21/76898 ,  H01L23/3114 ,  H01L23/481 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68331 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05111 ,  H01L2224/05118 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05169 ,  H01L2224/05171 ,  H01L2224/05178 ,  H01L2224/0518 ,  H01L2224/05181 ,  H01L2224/05184 ,  H01L2224/05559 ,  H01L2224/05569 ,  H01L2224/05572 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/13005 ,  H01L2224/13006 ,  H01L2224/13009 ,  H01L2224/13024 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/73204 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/06582 ,  H01L2225/06596 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/18161 ,  H01L2924/19015 ,  H01L2924/19041 ,  H01L2924/351 ,  H01L2924/207 ,  H01L2224/05552 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/013

摘要： A semiconductor component includes a base die and a secondary die stacked on and bonded to the base die. The base die includes conductive vias which form an internal signal transmission system for the component, and allow the circuit side of the secondary die to be bonded to the back side of the base die. The component also includes an array of terminal contacts on the circuit side of the base die in electrical communication with the conductive vias. The component can also include an encapsulant on the back side of the base die, which substantially encapsulates the secondary die, and a polymer layer on the circuit side of the base die which functions as a protective layer, a rigidifying member and a stencil for forming the terminal contacts. A method for fabricating the component includes the step of bonding singulated secondary dice to base dice on a base wafer, or bonding a secondary wafer to the base wafer, or bonding singulated secondary dice to singulated base dice.

摘要翻译： 半导体部件包括基模和层叠在基模上的二次模。 基模具包括形成用于部件的内部信号传输系统的导电通孔，并允许二次管芯的电路侧接合到基座的后侧。 该组件还包括与导电通孔电连通的基座芯片的电路侧上的端子触点阵列。 该组件还可以包括在基模的背侧上的密封剂，其基本上封装次模，以及在用作保护层的基模的电路侧上的聚合物层，用于形成的用于固化的模板 终端接触。 一种用于制造该部件的方法包括将单个二次骰子接合到基底晶片上的基底骰子上，或将次晶片接合到基底晶片，或将单个二次骰子接合到单个基体骰子的步骤。

公开(公告)号：US20050023259A1

公开(公告)日：2005-02-03

申请号：US10930236

申请日：2004-08-30

申请人： Warren Farnworh ,  Alan Wood

发明人： Warren Farnworh ,  Alan Wood

IPC分类号： B23K1/005 ,  H01L21/00 ,  H01L21/48 ,  H05K3/34 ,  B23K26/00 ,  B23K31/02

CPC分类号： H01L21/67138 ,  B23K1/0056 ,  B23K2101/42 ,  H01L21/4853 ,  H01L2224/11334 ,  H05K3/3478 ,  H05K3/3494 ,  H05K2203/041 ,  H05K2203/043 ,  H05K2203/0557 ,  H05K2203/107 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49179

摘要： Methods and apparatuses for bonding solder balls to bond pads are described. In one embodiment, portions of a plurality of solder balls are placed within a frame and in registered alignment with individual bond pads over a substrate. While the ball portions are within the frame, the balls are exposed to bonding conditions effective to bond the balls with their associated bond pads. In another embodiment, a frame is provided having a plurality of holes sized to receive individual solder balls. Individual balls are delivered into the holes from over the frame. The balls are placed into registered alignment with a plurality of individual bond pads over a substrate while the balls are in the holes. The balls are bonded with the individual associated bond pads.

公开(公告)号：US06351034B1

公开(公告)日：2002-02-26

申请号：US09088605

申请日：1998-06-01

申请人： Warren M. Farnworth ,  Derek Gochnour ,  Alan Wood

发明人： Warren M. Farnworth ,  Derek Gochnour ,  Alan Wood

IPC分类号： H01L2334

CPC分类号： H01L24/75 ,  H01L23/32 ,  H01L24/72 ,  H01L2224/16225 ,  H01L2224/73251 ,  H01L2224/75315 ,  H01L2224/81901 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2224/16 ,  H01L2224/72 ,  H01L2224/0401

摘要： A chip carrier for temporarily connecting a semiconductor chip to a testing device. The chip carrier includes a substrate having a first set of contact points for electrically engaging the testing device and a second set of contact points to be connected with the contact elements of the semiconductor chip. The semiconductor chip is disposed on the substrate and is substantially covered by a cover member. One or more clips are in contact with the cover member and are used to secure the semiconductor chip in position. The clips have a first member removably attached to the substrate and a second member separated from the first member and in contact with the cover member. As the second member is displaced from an unstressed position, a force is generated by the clip and transferred to the cover member and the semiconductor chip. The chip carrier reliably secures the semiconductor chip while occupying a relatively small space over the semiconductor chip.

摘要翻译： 用于将半导体芯片临时连接到测试装置的芯片载体。 芯片载体包括具有用于电耦合测试装置的第一组接触点和要与半导体芯片的接触元件连接的第二组接触点的基板。 半导体芯片设置在基板上并且基本上被盖构件覆盖。 一个或多个夹子与盖构件接触并用于将半导体芯片固定就位。 夹子具有可移除地附接到基底的第一构件和与第一构件分离并与盖构件接触的第二构件。 当第二构件从非受压位置移位时，夹子产生力并将其传递到盖构件和半导体芯片。 芯片载体在半导体芯片占据相对较小的空间的同时可靠地固定半导体芯片。

公开(公告)号：US5392870A

公开(公告)日：1995-02-28

申请号：US156887

申请日：1993-11-23

申请人： William S. Clapham ,  Alan Wood

发明人： William S. Clapham ,  Alan Wood

IPC分类号： E21C25/10 ,  E21C25/08 ,  E21C35/187 ,  E21C35/197 ,  F16B19/00 ,  E21B10/00 ,  F16B7/10 ,  F16L39/00

CPC分类号： E21C35/197 ,  E21C35/187 ,  F16B19/004 ,  Y10T403/32991

摘要： The invention provides a liner sleeve (8) adapted, in use, to be interposed between the external periphery of a round shank (3) of a point attack, mineral cutter pick (1), and the internal periphery of a circular, shank-receiving bore (5) of a pick box (6), the sleeve (8) being constituted by a plurality of individual rings (14A, 14B, 14C) stacked end-to-end in abutting relationship about a common longitudinal axis (15), the rings (14A, 14B, 14C) together having an axial length (17) approximating to the axial length (12) of the bore (5). The invention also includes a pick box (6) provided with such a sleeve (8), and also a combination of pick (1) and pick box (6)

摘要翻译： 本发明提供了一种衬套（8），其在使用中适于插入点攻击的圆形柄（3）的外围之间，矿物切割器（1）和圆形柄柄 接收孔（6）的接收孔（5），套筒（8）由围绕公共纵向轴线（15）的邻接关系端对端堆叠的多个单独的环（14A，14B，14C）构成， ，所述环（14A，14B，14C）一起具有近似于所述孔（5）的轴向长度（12）的轴向长度（17）。 本发明还包括设置有这种套筒（8）的拾取箱（6），以及拾取（1）和拾取箱（6）的组合，

公开(公告)号：USD694291S1

公开(公告)日：2013-11-26

申请号：US29425624

申请日：2012-06-25

申请人： Philip F. Hottmann ,  Alan Wood

设计人： Philip F. Hottmann ,  Alan Wood

公开(公告)号：US08420001B2

公开(公告)日：2013-04-16

申请号：US12454473

申请日：2009-05-18

申请人： Martin Leuterer ,  Andreas Pfister ,  Frank Mueller ,  Alan Wood ,  Brian Wilson ,  Horst Sandner

发明人： Martin Leuterer ,  Andreas Pfister ,  Frank Mueller ,  Alan Wood ,  Brian Wilson ,  Horst Sandner

IPC分类号： B29C35/08 ,  C08F2/42 ,  C08J3/28

CPC分类号： B29C35/16 ,  B29C64/153 ,  B29C2035/0838 ,  B29K2995/004 ,  B33Y10/00 ,  B33Y70/00

摘要： A three-dimensional object is manufactured from a powder of polymer material by selective sintering process by means of electromagnetic radiation of the powder, wherein the powder comprises a preselected polymer or copolymer and is subjected to selective sintering such that the manufactured three-dimensional object has a final crystallinity which is in such a range that the balance of properties, in particular mechanical properties including Young's modulus, tensile strength and elongation at break, is improved.