公开(公告)号：US20050148160A1

公开(公告)日：2005-07-07

申请号：US10646897

申请日：2003-08-22

申请人： Warren Farnworth ,  Alan Wood ,  Trung Doan

发明人： Warren Farnworth ,  Alan Wood ,  Trung Doan

IPC分类号： H01L21/301 ,  H01L21/304 ,  H01L21/44 ,  H01L21/56 ,  H01L21/60 ,  H01L21/68 ,  H01L21/768 ,  H01L21/78 ,  H01L23/24 ,  H01L23/31 ,  H01L23/367 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/495 ,  H01L29/06

CPC分类号： H01L23/48 ,  B33Y70/00 ,  B33Y80/00 ,  H01L21/304 ,  H01L21/3043 ,  H01L21/56 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/76802 ,  H01L21/76898 ,  H01L21/78 ,  H01L23/24 ,  H01L23/3114 ,  H01L23/36 ,  H01L23/3672 ,  H01L23/481 ,  H01L23/49531 ,  H01L23/49575 ,  H01L24/05 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/27 ,  H01L24/94 ,  H01L24/96 ,  H01L25/105 ,  H01L25/50 ,  H01L29/0657 ,  H01L2221/68327 ,  H01L2221/68331 ,  H01L2221/68372 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05599 ,  H01L2224/11849 ,  H01L2224/11901 ,  H01L2224/12105 ,  H01L2224/13009 ,  H01L2224/13022 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/274 ,  H01L2224/73104 ,  H01L2224/73253 ,  H01L2224/94 ,  H01L2225/06541 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/27

摘要： A semiconductor component includes a thinned semiconductor die having protective polymer layers on up to six surfaces. The component also includes contact bumps on the die embedded in a circuit side polymer layer, and terminal contacts on the contact bumps in a dense area array. A method for fabricating the component includes the steps of providing a substrate containing multiple dice, forming trenches on the substrate proximate to peripheral edges of the dice, and depositing a polymer material into the trenches. In addition, the method includes the steps of planarizing the back side of the substrate to contact the polymer filled trenches, and cutting through the polymer trenches to singulate the components from the substrate. Prior to the singulating step the components can be tested and burned-in while they remain on the substrate.

摘要翻译： 半导体部件包括在六个表面上具有保护性聚合物层的变薄的半导体管芯。 该组件还包括嵌入在电路侧聚合物层中的裸片上的接触凸块，并且密集区域阵列中接触凸块上的端子接触。 一种用于制造该部件的方法包括以下步骤：提供包含多个骰子的基底，在基底上邻近骰子的周边边缘形成沟槽，以及将聚合物材料沉积到沟槽中。 此外，该方法包括以下步骤：平坦化衬底的背面以接触聚合物填充的沟槽，并切割穿过聚合物沟槽以从衬底中分离组分。 在分离步骤之前，组分可以在它们保留在基材上时被测试和燃烧。

公开(公告)号：US20070045515A1

公开(公告)日：2007-03-01

申请号：US11218126

申请日：2005-09-01

申请人： Warren Farnworth ,  Alan Wood

发明人： Warren Farnworth ,  Alan Wood

IPC分类号： H01L27/00

CPC分类号： H01L27/14687 ,  H01L27/14618 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/14632 ,  H01L27/14636 ,  H01L27/14685 ,  H01L31/0232 ,  H01L2224/13

摘要： Microelectronic imaging devices and associated methods for attaching transmissive elements are disclosed. A manufacturing method in accordance with one embodiment of the invention includes providing an imager workpiece having multiple image sensor dies configured to detect energy over a target frequency. The image sensor dies can include an image sensor and a corresponding lens device positioned proximate to the image sensor. The method can further include positioning standoffs adjacent to the lens devices while the image sensor dies are connected to each other via the imager workpiece. At least one transmissive element can be attached to the workpiece at least proximate to the standoffs so the lens devices are positioned between the corresponding image sensors and the at least one transmissive element. Accordingly, the at least one transmissive element can protect the image sensors while the image sensor dies are still connected. In a subsequent process, the image sensor dies can be separated from each other.

公开(公告)号：US20060275949A1

公开(公告)日：2006-12-07

申请号：US11496180

申请日：2006-07-31

申请人： Warren Farnworth ,  Alan Wood ,  Trung Tri Doan

发明人： Warren Farnworth ,  Alan Wood ,  Trung Tri Doan

IPC分类号： H01L21/00

CPC分类号： H01L23/48 ,  B33Y70/00 ,  B33Y80/00 ,  H01L21/304 ,  H01L21/3043 ,  H01L21/56 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/76802 ,  H01L21/76898 ,  H01L21/78 ,  H01L23/24 ,  H01L23/3114 ,  H01L23/36 ,  H01L23/3672 ,  H01L23/481 ,  H01L23/49531 ,  H01L23/49575 ,  H01L24/05 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/27 ,  H01L24/94 ,  H01L24/96 ,  H01L25/105 ,  H01L25/50 ,  H01L29/0657 ,  H01L2221/68327 ,  H01L2221/68331 ,  H01L2221/68372 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/11849 ,  H01L2224/11901 ,  H01L2224/12105 ,  H01L2224/13009 ,  H01L2224/13022 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/274 ,  H01L2224/73104 ,  H01L2224/73253 ,  H01L2224/94 ,  H01L2225/06541 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/27

摘要： A semiconductor component includes a thinned semiconductor substrate having protective polymer layers on up to six surfaces. The component also includes contacts on a circuit side of the substrate, conductive vias in electrical contact with the contacts, aNd conductors on a backside of the substrate. A method for fabricating the component includes the steps of providing the semiconductor substrate with the contacts on the circuit side, forming conductive vias from the back side in electrical contact with the contacts, and forming conductors on the backside.

摘要翻译： 半导体部件包括在多达六个表面上具有保护性聚合物层的变薄的半导体衬底。 该部件还包括在基板的电路侧的触点，与触点电接触的导电通孔，在基板的背面上的一个导体。 一种制造该部件的方法包括以下步骤：在电路侧提供半导体衬底上的触点，从背面形成与触点电接触的导电通孔，并在背面形成导体。

公开(公告)号：US06983536B2

公开(公告)日：2006-01-10

申请号：US10847969

申请日：2004-05-18

申请人： Warren Farnworth ,  Alan Wood

发明人： Warren Farnworth ,  Alan Wood

IPC分类号： H05K3/30

CPC分类号： H01L23/49838 ,  G01R1/0433 ,  G01R1/0466 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/0735 ,  G01R3/00 ,  G01R31/2863 ,  G01R31/287 ,  G01R31/2889 ,  G01R31/2893 ,  H01L21/6835 ,  H01L22/20 ,  H01L23/13 ,  H01L23/49816 ,  H01L24/80 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16145 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15174 ,  H05K3/0058 ,  H05K3/0067 ,  H05K3/4007 ,  H05K3/423 ,  H05K2201/0133 ,  H05K2201/0347 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2203/0307 ,  H05K2203/0723 ,  Y10T29/49117 ,  Y10T29/49121 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49131 ,  H01L2924/00 ,  H01L2224/05599

摘要： A method and apparatus for fabricating known good semiconductor dice are provided. The method includes the steps of: testing the gross functionality of dice contained on a semiconductor wafer; sawing the wafer to singulate a die; and then testing the die by assembly in a carrier having an interconnect adapted to establish electrical communication between the bond pads on the die and external test circuitry. The interconnect for the carrier can be formed using different contact technologies including: thick film contact members on a rigid substrate; self-limiting contact members on a silicon substrate; or microbump contact members with a textured surface. During assembly of the carrier, the die and interconnect are optically aligned and placed into contact with a predetermined contact force. This establishes an electrical connection between the contact members on the interconnect and the bond pads of the die. In the assembled carrier the die and interconnect are biased together by a force distribution mechanism that includes a bridge clamp, a pressure plate and a spring clip. Following testing of the die, the carrier is disassembled and the tested die is removed.

摘要翻译： 提供了一种用于制造已知的良好半导体晶片的方法和装置。 该方法包括以下步骤：测试包含在半导体晶片上的骰子的总功能; 锯切晶片以切割模具; 然后通过组装在具有适于建立管芯上的接合焊盘与外部测试电路之间的电连通的互连的载体中来测试管芯。 用于载体的互连可以使用不同的接触技术形成，包括：刚性基板上的厚膜接触构件; 硅衬底上的自限制接触构件; 或具有纹理表面的微型块接触构件。 在载体的组装期间，芯片和互连件被光学对准并且被放置成与预定的接触力接触。 这就建立了互连上的接触构件和管芯的接合垫之间的电连接。 在组装的载体中，管芯和互连件通过包括桥夹，压板和弹簧夹的力分配机构偏压在一起。 在对模具进行测试之后，拆下载体并且移除被测试的模具。

公开(公告)号：US20050101037A1

公开(公告)日：2005-05-12

申请号：US10998269

申请日：2004-11-26

申请人： Warren Farnworth ,  Alan Wood ,  David Hembree

发明人： Warren Farnworth ,  Alan Wood ,  David Hembree

IPC分类号： H01L21/48 ,  H01L21/60 ,  H01L21/768 ,  H01L23/13 ,  H01L23/498 ,  H01L23/538 ,  H01L25/10 ,  H05K1/03 ,  H05K1/11 ,  H05K3/00 ,  H01L21/66 ,  G01R31/26

CPC分类号： H01L21/486 ,  H01L21/6835 ,  H01L21/76898 ,  H01L23/13 ,  H01L23/481 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/75 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05568 ,  H01L2224/05569 ,  H01L2224/0557 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/81801 ,  H01L2224/82039 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/1005 ,  H01L2225/1058 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H05K1/0306 ,  H05K1/112 ,  H05K3/0029 ,  H05K3/0032 ,  H05K2201/09472 ,  H05K2201/0959 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2201/10674 ,  H05K2201/10734 ,  H01L2924/00

摘要： A method for fabricating semiconductor components and interconnects includes the steps of providing a substrate, such as a semiconductor die, forming external contacts on opposing sides of the substrate by laser drilling vias through the substrate, and forming conductive members in the vias. The conductive members include enlarged terminal portions that are covered with a non-oxidizing metal. The method can be used to fabricate stackable semiconductor packages having integrated circuits in electrical communication with the external contacts. The method can also be used to fabricate interconnects for electrically engaging packages, dice and wafers for testing or for constructing electronic assemblies.

摘要翻译： 一种用于制造半导体部件和互连的方法包括以下步骤：提供诸如半导体管芯的衬底，通过穿过衬底的激光钻孔通孔在衬底的相对侧上形成外部触点，以及在通孔中形成导电构件。 导电构件包括被非氧化金属覆盖的扩大端子部分。 该方法可用于制造具有与外部触点电连通的集成电路的可堆叠半导体封装。 该方法还可用于制造用于电接合封装，裸片和晶片用于测试或构建电子组件的互连。

公开(公告)号：US20050064679A1

公开(公告)日：2005-03-24

申请号：US10928381

申请日：2004-08-27

申请人： Warren Farnworth ,  Alan Wood

发明人： Warren Farnworth ,  Alan Wood

IPC分类号： E21B43/02 ,  G03F7/00 ,  G03F7/004 ,  H01L21/30 ,  H01L21/46

CPC分类号： G03F7/0037 ,  G03F7/0047

摘要： A composite material includes an unconsolidated, consolidatable component and a physical modifier component. The consolidatable component is configured to be selectively consolidated to form an article, while the physical modifier component provides desired physical properties. The physical modifier component may be an unconsolidated material dispersed throughout the consolidatable component or a preformed matrix including interstices within which the consolidatable component may be introduced. The consolidatable component of the composite material may be selectively consolidated to fix the at least one physical component therein. Alternatively, the consolidatable component may be nonselectively consolidated, then regions thereof selectively removed. Methods for fabricating articles from such composite materials are also disclosed, as are systems that are configured for use in fabricating articles from such composite materials.

摘要翻译： 复合材料包括未固结的，可固结的组分和物理改性剂组分。 可整合组件被配置为选择性地合并以形成物品，而物理修饰剂组分提供期望的物理性质。 物理改性剂组分可以是分散在整个可整合组分中的未固结的材料或预先形成的基质，其中可以引入可固结组分的间隙。 可以选择性地将复合材料的可固结部件固结以固定其中的至少一种物理组分。 或者，可固化组分可以非选择性地固结，然后其区域被选择性地去除。 还公开了从这种复合材料制造制品的方法，以及被配置用于从这种复合材料制造制品的系统。

公开(公告)号：US20080001068A1

公开(公告)日：2008-01-03

申请号：US11898291

申请日：2007-09-11

申请人： Warren Farnworth ,  Alan Wood

发明人： Warren Farnworth ,  Alan Wood

IPC分类号： H01L27/14

CPC分类号： H01L27/14687 ,  H01L27/14618 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/14632 ,  H01L27/14636 ,  H01L27/14685 ,  H01L31/0232 ,  H01L2224/13

摘要： Microelectronic imaging devices and associated methods for attaching transmissive elements are disclosed. A manufacturing method in accordance with one embodiment of the invention includes providing an imager workpiece having multiple image sensor dies configured to detect energy over a target frequency. The image sensor dies can include an image sensor and a corresponding lens device positioned proximate to the image sensor. The method can further include positioning standoffs adjacent to the lens devices while the image sensor dies are connected to each other via the imager workpiece. At least one transmissive element can be attached to the workpiece at least proximate to the standoffs so the lens devices are positioned between the corresponding image sensors and the at least one transmissive element. Accordingly, the at least one transmissive element can protect the image sensors while the image sensor dies are still connected. In a subsequent process, the image sensor dies can be separated from each other.

摘要翻译： 公开了用于附接透射元件的微电子成像装置和相关方法。 根据本发明的一个实施例的制造方法包括提供具有多个图像传感器管芯的成像器工件，所述图像传感器管被配置为检测目标频率上的能量。 图像传感器管芯可以包括图像传感器和位于图像传感器附近的对应的透镜装置。 该方法还可以包括在图像传感器管芯经由成像器工件相互连接的同时定位与透镜设备相邻的间隔。 至少一个透射元件可以至少靠近支座附接到工件，使得透镜装置位于相应的图像传感器和至少一个透射元件之间。 因此，至少一个透射元件可以在图像传感器管芯仍然连接的同时保护图像传感器。 在随后的过程中，图像传感器管芯可以彼此分离。

公开(公告)号：US20070123058A1

公开(公告)日：2007-05-31

申请号：US11699085

申请日：2007-01-29

申请人： Warren Farnworth ,  Alan Wood

发明人： Warren Farnworth ,  Alan Wood

IPC分类号： G06F19/00 ,  H01L21/31

CPC分类号： H01L24/76 ,  B29C64/112 ,  B29C64/129 ,  B33Y40/00 ,  G03F7/70416 ,  H01L24/82 ,  H01L51/0005 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0106 ,  H01L2924/01077 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00

摘要： A semiconductor device structure includes a sacrificial element and at least one feature adjacent to and at least partially formed by the sacrificial element. The sacrificial element may include a plurality of adjacent, mutually adhered regions. A substrate, such as a semiconductor device or other semiconductor device component, may carry the sacrificial element and the at least one feature. Another feature of the semiconductor device structure (e.g., a conductive trace) may be located adjacent to and at least partially formed by the at least one feature (e.g., a trench for the conductive trace). Semiconductor packages with optical elements and support structures that are formed from photopolymer are also disclosed.

摘要翻译： 半导体器件结构包括牺牲元件和与牺牲元件相邻且至少部分地由牺牲元件形成的至少一个特征。 牺牲元件可以包括多个相邻的相互粘合的区域。 诸如半导体器件或其他半导体器件部件的衬底可以承载牺牲元件和至少一个特征。 半导体器件结构（例如导电迹线）的另一个特征可以位于与至少一个特征（例如导电迹线的沟槽）相邻并至少部分地形成。 还公开了由光聚合物形成的具有光学元件和支撑结构的半导体封装。

公开(公告)号：US20070045875A1

公开(公告)日：2007-03-01

申请号：US11215780

申请日：2005-08-30

申请人： Warren Farnworth ,  Alan Wood

发明人： Warren Farnworth ,  Alan Wood

IPC分类号： H01L23/28

CPC分类号： H01L21/6835 ,  H01L21/568 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16145 ,  H01L2224/73259 ,  H01L2224/81005 ,  H01L2225/06513 ,  H01L2225/06586 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/18161

摘要： Methods for wafer-level packaging of microfeature devices and microfeature devices formed using such methods are disclosed herein. A method for packaging microfeature devices in accordance with an embodiment of the invention can include releasably attaching a plurality of first known good microelectronic dies to a carrier substrate in a desired arrangement. In several embodiments, for example, the first dies can be releasably attached to an attachment feature on the carrier substrate. The method can also include attaching one or more second known good microelectronic dies to the individual first dies in a stacked configuration to form a plurality of stacked devices. The method further includes at least partially encapsulating the stacked devices and separating the stacked devices from each other.

摘要翻译： 本文公开了使用这种方法形成的微特征装置和微特征装置的晶片级封装的方法。 根据本发明的实施例的用于封装微特征器件的方法可以包括以期望的布置将多个第一已知的良好微电子管芯可释放地附接到载体衬底。 在几个实施例中，例如，第一模具可以可释放地附接到载体基底上的附着特征。 该方法还可以包括将一个或多个第二已知的良好的微电子管芯以堆叠的结构附接到各个第一管芯以形成多个堆叠的器件。 该方法还包括至少部分地封装堆叠的装置并将堆叠的装置彼此分离。

公开(公告)号：US20060201705A1

公开(公告)日：2006-09-14

申请号：US11433721

申请日：2006-05-12

申请人： Akram Salman ,  Warren Farnworth ,  Alan Wood ,  J. Brooks ,  Eugene Cloud

发明人： Akram Salman ,  Warren Farnworth ,  Alan Wood ,  J. Brooks ,  Eugene Cloud

IPC分类号： H05K1/18

CPC分类号： H05K3/4007 ,  H01L23/4951 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H05K1/0271 ,  H05K1/095 ,  H05K3/321 ,  H05K3/325 ,  H05K3/326 ,  H05K2201/0133 ,  H05K2201/0314 ,  H05K2201/0367 ,  H05K2201/09909 ,  H05K2201/10454 ,  H05K2201/10696 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00 ,  H01L2924/00012

摘要： A device comprising a circuit, a lead having a first end connected to the circuit and having a second end, and a deformable structure connected to the second end of the lead. The invention may be embodied on a circuit board, so that the circuit board includes a substrate and a deformable structure connected to said substrate. Also disclosed is a device comprising a circuit having an active side and a non-active side, a package enclosing the active side of the circuit and not enclosing a portion of the non-active side of the circuit, and a lead having a first end connected to the active side of the circuit via a lead-over-chip connection, and having a second end extending from the package. Also disclosed is a device comprising a circuit and a lead formed from a flexible conductor, with the lead having a first end connected to the circuit.