公开(公告)号：US20140084438A1

公开(公告)日：2014-03-27

申请号：US14118112

申请日：2012-06-14

申请人： Shin Soyano

发明人： Shin Soyano

IPC分类号： H01L23/495 ,  H01L23/00

CPC分类号： H01L23/49575 ,  H01L23/24 ,  H01L23/3107 ,  H01L23/3735 ,  H01L23/49524 ,  H01L23/49844 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/84 ,  H01L24/85 ,  H01L24/92 ,  H01L25/072 ,  H01L25/18 ,  H01L2224/04026 ,  H01L2224/04034 ,  H01L2224/04042 ,  H01L2224/0603 ,  H01L2224/06181 ,  H01L2224/291 ,  H01L2224/32225 ,  H01L2224/37011 ,  H01L2224/37147 ,  H01L2224/4007 ,  H01L2224/40091 ,  H01L2224/40095 ,  H01L2224/40137 ,  H01L2224/40139 ,  H01L2224/40225 ,  H01L2224/40227 ,  H01L2224/40993 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/73221 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/77272 ,  H01L2224/83815 ,  H01L2224/84138 ,  H01L2224/84801 ,  H01L2224/85001 ,  H01L2224/85205 ,  H01L2224/92166 ,  H01L2224/92247 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/1203 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15787 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/01042 ,  H01L2924/014 ,  H01L2924/2076 ,  H01L2924/00015 ,  H01L2224/83205 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A semiconductor device has a plurality of electronic components mounted on an insulating substrate formed with a metal layer, and electrically connected to each other or to the metal layer; a positioning wire member having a predetermined diameter and a predetermined length, and bonded to each of the plurality of electronic components or to the metal layer; a lead frame disposed to bridge and electrically connect the plurality of electronic components to each other or between the metal layer and the electronic components; and an opening having a size capable of inserting the wire member therethrough formed to penetrate through the lead frame, to join the lead frame to each of the electronic components or the metal layer at a predetermined position therein. The lead frame is positioned on the insulating substrate by inserting the wire member into the opening.

摘要翻译： 半导体器件具有安装在形成有金属层的绝缘基板上并且彼此电连接或与金属层电连接的多个电子部件; 定位线构件，其具有预定直径和预定长度，并且结合到所述多个电子部件中的每一个或所述金属层; 引线框架，其设置成将所述多个电子部件彼此之间或所述金属层与所述电子部件电连接; 以及具有能够插入穿过引线框架的线材的尺寸的开口，以将引线框架连接到每个电子部件或金属层上的预定位置。 引线框架通过将线材插入开口而位于绝缘基板上。

公开(公告)号：US20140070387A1

公开(公告)日：2014-03-13

申请号：US14018932

申请日：2013-09-05

申请人： LSIS CO., LTD.

发明人： Bohyun YOUN ,  Min HEO

IPC分类号： H01L23/40 ,  H01L23/00

CPC分类号： H01L23/40 ,  H01L24/37 ,  H01L24/40 ,  H01L24/72 ,  H01L24/73 ,  H01L24/91 ,  H01L2023/4062 ,  H01L2023/4087 ,  H01L2224/371 ,  H01L2224/40106 ,  H01L2224/40227 ,  H01L2224/732 ,  H01L2224/83801 ,  H01L2924/00014 ,  H01L2924/014 ,  H05K1/0203 ,  H05K1/0215 ,  H05K3/301 ,  H05K3/3421 ,  H05K7/2049 ,  H05K2201/10409 ,  H05K2201/10689 ,  H01L2924/00 ,  H01L2224/84

摘要： Provided is a coupling assembly of a power semiconductor device and a printed circuit board (PCB). The coupling assembly of the power semiconductor device and the printed circuit board (PCB) includes a PCB, a power semiconductor device comprising a plurality of legs electrically connected to a circuit pattern disposed on the PCB, a connection member disposed above the power semiconductor device, the connection member being formed of an electrically conductive material, a main fixing unit fixing the power semiconductor device to the PCB, and a housing disposed outside the PCB. Thus, a coupling force between the power semiconductor device and the PCB and electric efficiency may be improved to a heat generation amount. In addition, heat may be more quickly dissipated through the connection member to improve a cooling effect.

摘要翻译： 提供了功率半导体器件和印刷电路板（PCB）的耦合组件。 功率半导体器件和印刷电路板（PCB）的耦合组件包括PCB，功率半导体器件，包括电连接到布置在PCB上的电路图案的多个支脚，设置在功率半导体器件上方的连接元件， 所述连接构件由导电材料形成，主固定单元将所述功率半导体器件固定到所述PCB，以及壳体，设置在所述PCB外部。 因此，功率半导体器件与PCB之间的耦合力和电效率可以提高到发热量。 此外，可以通过连接构件更快地散发热量以改善冷却效果。

公开(公告)号：US08575747B2

公开(公告)日：2013-11-05

申请号：US13189074

申请日：2011-07-22

申请人： Randolph Cruz

发明人： Randolph Cruz

IPC分类号： H01L23/12

CPC分类号： H01L23/49524 ,  H01L23/3142 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/35 ,  H01L24/37 ,  H01L24/40 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/37011 ,  H01L2224/37013 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/3754 ,  H01L2224/40095 ,  H01L2224/40227 ,  H01L2224/40247 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73221 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A clip interconnect comprises a columnar part, a bridge part, and a locking feature. The bridge part has a plurality of sides. The columnar part and the bridge part are configured to form an angle at an interface between the columnar part and the bridge part. The locking feature is located in at least one of the plurality of sides of the bridge part. The locking feature comprises an alternating pattern of teeth and valleys.

摘要翻译： 夹子互连件包括柱形部件，桥接部件和锁定部件。 桥部分具有多个侧面。 柱状部分和桥接部分构造成在柱状部分和桥接部分之间的界面处形成一个角度。 锁定特征位于桥接部分的多个侧面中的至少一个中。 锁定特征包括齿和谷的交替图案。

公开(公告)号：US08558367B2

公开(公告)日：2013-10-15

申请号：US13365409

申请日：2012-02-03

申请人： Tatsuo Ota ,  Toshiaki Shinohara

发明人： Tatsuo Ota ,  Toshiaki Shinohara

IPC分类号： H01L23/24

CPC分类号： H01L23/4952 ,  H01L23/24 ,  H01L23/3135 ,  H01L23/3735 ,  H01L23/4334 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/072 ,  H01L2224/291 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40137 ,  H01L2224/40139 ,  H01L2224/40225 ,  H01L2224/40227 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73215 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2224/84801 ,  H01L2924/01029 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/351 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2924/00014

摘要： A semiconductor module includes: an insulating plate; a plurality of metal patterns formed on the insulating plate and spaced apart from each other; a power device chip solder-joined on one the metal pattern; a lead frame solder-joined on the metal pattern to which the power device chip is not solder-joined, and on the power device chip; an external main electrode provided to an outer casing, and joined by wire bonding to the lead frame above the metal pattern to which the power device chip is not joined; and a sealing resin formed by potting to seal the power device chip, the lead frame, and the metal patterns.

摘要翻译： 半导体模块包括：绝缘板; 形成在所述绝缘板上并彼此间隔开的多个金属图案; 在一个金属图案上焊接接合的功率器件芯片; 在功率器件芯片未焊接到的金属图案上焊接的引线框架和功率器件芯片; 外部主电极，设置在外壳上，通过引线接合连接到功率器件芯片未连接的金属图案上方的引线框架; 以及通过灌封形成的密封树脂，以密封功率器件芯片，引线框架和金属图案。

公开(公告)号：US20130146991A1

公开(公告)日：2013-06-13

申请号：US13314438

申请日：2011-12-08

申请人： Ralf Otremba ,  Josef Hoeglauer ,  Joachim Mahler ,  Johannes Lodermeyer

发明人： Ralf Otremba ,  Josef Hoeglauer ,  Joachim Mahler ,  Johannes Lodermeyer

IPC分类号： H01L25/07 ,  H01L21/60 ,  H01L23/538

CPC分类号： H01L25/50 ,  H01L21/4857 ,  H01L21/568 ,  H01L21/76897 ,  H01L23/3107 ,  H01L23/492 ,  H01L23/5389 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/14 ,  H01L24/24 ,  H01L24/73 ,  H01L24/82 ,  H01L24/96 ,  H01L25/071 ,  H01L25/072 ,  H01L2224/02379 ,  H01L2224/02381 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05548 ,  H01L2224/05567 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/1132 ,  H01L2224/11849 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/1411 ,  H01L2224/14181 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/24011 ,  H01L2224/2402 ,  H01L2224/24105 ,  H01L2224/24135 ,  H01L2224/245 ,  H01L2224/40105 ,  H01L2224/40227 ,  H01L2224/73209 ,  H01L2224/73267 ,  H01L2224/82106 ,  H01L2224/96 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2224/03 ,  H01L2224/11 ,  H01L2224/81 ,  H01L2224/84 ,  H01L2924/00012 ,  H01L2924/01029 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2224/05552

摘要： A device includes a first power semiconductor chip with a first contact pad and a second contact pad on a first face and a third contact pad on the second face. The device further includes a second power semiconductor chip with a first contact pad and a second contact pad on a first face and a third contact pad on the second face. The first and second power semiconductor chips are arranged one above another, and the first face of the first power semiconductor chip faces in the direction of the first face of the second power semiconductor chip. In addition, the first power semiconductor chip is located laterally at least partially outside of the outline of the second power semiconductor chip.

公开(公告)号：US20130134572A1

公开(公告)日：2013-05-30

申请号：US13749006

申请日：2013-01-24

申请人： INFINEON TECHNOLOGIES AG

发明人： Andreas Lenniger ,  Andre Uhlemann ,  Olaf Hohlfeld

IPC分类号： H01L23/367 ,  H01L21/50

CPC分类号： H01L23/367 ,  H01L21/50 ,  H01L23/24 ,  H01L23/3135 ,  H01L23/3677 ,  H01L23/3735 ,  H01L23/3736 ,  H01L23/4006 ,  H01L23/473 ,  H01L24/29 ,  H01L24/32 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L25/072 ,  H01L2224/291 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/32227 ,  H01L2224/32245 ,  H01L2224/37147 ,  H01L2224/40227 ,  H01L2224/40247 ,  H01L2224/45014 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48132 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2224/4846 ,  H01L2224/48472 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83455 ,  H01L2224/83464 ,  H01L2224/83801 ,  H01L2224/8382 ,  H01L2224/8384 ,  H01L2224/84801 ,  H01L2224/8484 ,  H01L2224/85205 ,  H01L2224/8584 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/1203 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/013 ,  H01L2924/00013 ,  H01L2224/83205 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A semiconductor device includes a semiconductor chip joined with a substrate and a base plate joined with the substrate. The base plate includes a first metal layer clad to a second metal layer. The second metal layer is deformed to provide a pin-fin or fin cooling structure. The second metal layer has a sub-layer that has no pins and no pin-fins. The first metal layer has a first thickness and the sub-layer has a second thickness. The ratio between the first thickness and the second thickness is at least 4:1.

摘要翻译： 半导体器件包括与衬底连接的半导体芯片和与衬底接合的基板。 基板包括包覆到第二金属层的第一金属层。 第二金属层变形以提供销鳍或翅片冷却结构。 第二金属层具有没有引脚而没有引脚鳍的子层。 第一金属层具有第一厚度，并且子层具有第二厚度。 第一厚度与第二厚度之比至少为4:1。

公开(公告)号：US20120306105A1

公开(公告)日：2012-12-06

申请号：US13150645

申请日：2011-06-01

申请人： Brian Joseph Robert

发明人： Brian Joseph Robert

IPC分类号： H01L23/488 ,  H01L21/58

CPC分类号： H01L23/3735 ,  H01L23/36 ,  H01L23/473 ,  H01L24/29 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/29083 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/32225 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/40091 ,  H01L2224/40225 ,  H01L2224/40227 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/83424 ,  H01L2224/83447 ,  H01L2224/83801 ,  H01L2224/83825 ,  H01L2924/00011 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45147 ,  H01L2924/01004 ,  H01L2924/00014

摘要： In one embodiment, a method for forming a multi-component power structure for use in electrically propelled vehicles may include constraining a parent material system between a power component and a thermal device. The parent material system may include a low temperature material having a relatively low melting point and a high temperature material having a relatively high melting point. The relatively low melting point may be less than the relatively high melting point. The parent material system can be heated to a melting temperature greater than the relatively low melting point and lower than the relatively high melting point to diffuse the low temperature material into the high temperature material. The parent material system can be solidified to form a transient liquid phase bond that is electrically and thermally conductive.

摘要翻译： 在一个实施例中，用于形成用于电动推进车辆的多部件动力结构的方法可以包括限制功率部件和热装置之间的母材系统。 母材体系可以包括具有较低熔点的低温材料和具有较高熔点的高温材料。 相对低的熔点可能低于较高的熔点。 母材系统可以被加热到大于相对低熔点的熔点并且低于相对高的熔点，以将低温材料扩散到高温材料中。 母体系统可以固化以形成导电和导热的瞬时液相。

公开(公告)号：US20120133037A1

公开(公告)日：2012-05-31

申请号：US13189074

申请日：2011-07-22

申请人： Randolph Cruz

发明人： Randolph Cruz

IPC分类号： H01L23/495 ,  H05K7/00 ,  H01R4/68 ,  H01L23/48 ,  H01L21/50

CPC分类号： H01L23/49524 ,  H01L23/3142 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/35 ,  H01L24/37 ,  H01L24/40 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/37011 ,  H01L2224/37013 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/3754 ,  H01L2224/40095 ,  H01L2224/40227 ,  H01L2224/40247 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73221 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A clip interconnect comprises a columnar part, a bridge part, and a locking feature. The bridge part has a plurality of sides. The columnar part and the bridge part are configured to form an angle at an interface between the columnar part and the bridge part. The locking feature is located in at least one of the plurality of sides of the bridge part. The locking feature comprises an alternating pattern of teeth and valleys.

摘要翻译： 夹子互连件包括柱形部件，桥接部件和锁定部件。 桥部分具有多个侧面。 柱状部分和桥接部分构造成在柱状部分和桥接部分之间的界面处形成一个角度。 锁定特征位于桥接部分的多个侧面中的至少一个中。 锁定特征包括齿和谷的交替图案。

公开(公告)号：US20240363595A1

公开(公告)日：2024-10-31

申请号：US18770232

申请日：2024-07-11

申请人： ROHM CO., LTD.

发明人： Kenichi ONODERA ,  Soichiro TAKAHASHI

IPC分类号： H01L25/07 ,  H01L23/00 ,  H01L23/053 ,  H01L23/14 ,  H01L23/15 ,  H01L23/31 ,  H01L23/367 ,  H01L23/49

CPC分类号： H01L25/072 ,  H01L23/053 ,  H01L23/142 ,  H01L23/15 ,  H01L23/3121 ,  H01L23/367 ,  H01L23/49 ,  H01L24/40 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/40227 ,  H01L2224/48227 ,  H01L2224/73221

摘要： A power module includes a first end power semiconductor element and a second end power semiconductor element. A first sum is a sum of a path length between the gate electrode of the first end power semiconductor element and a first control terminal and a path length between the source electrode of the first end power semiconductor element and a first detection terminal. A second sum is a sum of a path length between the gate electrode of the second end power semiconductor element and the first control terminal and a path length between the source electrode of the second end power semiconductor element and the first detection terminal. The power module includes a first control layer connected to the gate electrode. The first control layer includes a first detour portion that detours the path to reduce a difference between the first sum and the second sum.

公开(公告)号：US20240274563A1

公开(公告)日：2024-08-15

申请号：US18415880

申请日：2024-01-18

申请人： Infineon Technologies AG

发明人： Hock Heng CHONG ,  Hui Khin TAN ,  Chee Yang NG ,  Swee Kah LEE

IPC分类号： H01L23/00

CPC分类号： H01L24/13 ,  H01L24/16 ,  H01L24/40 ,  H01L24/81 ,  H01L24/84 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1357 ,  H01L2224/13686 ,  H01L2224/16227 ,  H01L2224/40227 ,  H01L2224/40245 ,  H01L2224/40499 ,  H01L2224/81815 ,  H01L2224/84815 ,  H01L2924/014 ,  H01L2924/0536 ,  H01L2924/0541 ,  H01L2924/0543 ,  H01L2924/0544 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108

摘要： A solder structure and method is disclosed. In one example, the solder structure includes a solder material, and a coating which at least partially coats the solder material and is configured for protecting the solder material against solder spreading. The coating is at least partially disrupted when establishing a solder connection between the solder material and a solderable structure.