Method for manufacturing IC substrate
    351.
    发明授权
    Method for manufacturing IC substrate 有权
    IC基板制造方法

    公开(公告)号:US09015936B2

    公开(公告)日:2015-04-28

    申请号:US13891204

    申请日:2013-05-10

    Abstract: A method for manufacturing an IC substrate includes following steps: providing a roll of double-sided flexible copper clad laminate; converting the roll of double sided flexible copper clad laminate into a roll of double sided flexible wiring board in a roll to roll manner; cutting the roll of double-sided flexible wiring board into a plurality of separate sheets of double sided flexible wiring board; forming first and second rigid insulating layers on the first and second wiring layers of each sheet of double sided flexible wiring board; forming third and fourth wiring layers on the first and second rigid insulating layers, and electrically connecting the first and third wiring layers, and electrically connecting the fourth and second wiring layers, thereby obtaining a sheet of substrate having a plurality of IC substrate units; and cutting the sheet of substrate into separate IC substrate units.

    Abstract translation: 制造IC基板的方法包括以下步骤:提供一卷双面柔性覆铜层压板; 将双面柔性覆铜层压板卷以卷对卷方式转换成双面柔性布线板卷; 将双面柔性布线板的卷筒切割成多个单独的双面柔性布线板; 在每张双面柔性布线板的第一和第二布线层上形成第一和第二刚性绝缘层; 在第一和第二刚性绝缘层上形成第三和第四布线层,并且电连接第一和第三布线层,并电连接第四和第二布线层,从而获得具有多个IC基板单元的基片; 并将基片切割成单独的IC基片单元。

    Flex-rigid wiring board and method of manufacturing the same
    355.
    发明授权
    Flex-rigid wiring board and method of manufacturing the same 有权
    挠性刚性接线板及其制造方法

    公开(公告)号:US08925194B2

    公开(公告)日:2015-01-06

    申请号:US13219169

    申请日:2011-08-26

    Abstract: A method of manufacturing a flex-rigid wiring board includes disposing a non-flexible substrate and a flexible board side by side in the horizontal direction of the substrate and board such that an end of the substrate is positioned adjacent to an end of the board and forms boundary between the board and the substrate with respect to the end of the board, covering the boundary between the board and the substrate with an insulating layer such that the insulating layer is positioned on the board and the substrate across the boundary, forming a second conductor pattern on the insulating layer, forming a via hole which passes through the insulating layer and reaches a first conductor pattern of the board, and plating the via hole such that a via conductor connecting the first and second patterns. The flexible board includes a flexible substrate and the first pattern formed over the substrate.

    Abstract translation: 制造柔性刚性布线板的方法包括在基板和板的水平方向上并排设置非柔性基板和柔性基板,使得基板的端部邻近板的端部定位, 在板和基板之间形成相对于板的端部的边界,用绝缘层覆盖板和基板之间的边界,使得绝缘层位于板上并且基板跨越边界,形成第二个 形成绝缘层上的导体图案,形成穿过绝缘层并到达板的第一导体图形的通孔,并且对通孔进行电镀,使得连接第一和第二图案的通孔导体。 柔性板包括柔性基板和形成在基板上的第一图案。

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