公开(公告)号：US20090065920A1

公开(公告)日：2009-03-12

申请号：US12219263

申请日：2008-07-18

Applicant: Eun-Chul Ahn ,  Min-Ho O ,  Jong Ho Lee

Inventor： Eun-Chul Ahn ,  Min-Ho O ,  Jong Ho Lee

IPC: H01L23/488 ,  H01L21/58

CPC classification number: H01L23/13 ,  H01L23/5389 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L25/03 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/18 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2225/0651 ,  H01L2225/06524 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K1/185 ,  H05K2201/09509 ,  H05K2201/10515 ,  H05K2201/10719 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/01049

Abstract: A device includes a base substrate, a package including an encapsulated die, the package at least partially embedded in the base substrate, and a wiring portion on the package and extending across at least a portion of the base substrate adjacent to the package.

Abstract translation: 一种器件包括基底，包括封装的芯片的封装，至少部分地嵌入基底衬底中的封装以及封装上的布线部分，并延伸穿过与封装相邻的基底衬底的至少一部分。

公开(公告)号：US20090032915A1

公开(公告)日：2009-02-05

申请号：US12154753

申请日：2008-05-27

Applicant: Gabe Cherian ,  Don Saunders

Inventor： Gabe Cherian ,  Don Saunders

IPC: H01L21/60 ,  H01L23/495

CPC classification number: H05K3/3426 ,  H01L21/4853 ,  H01L21/6835 ,  H01L23/49555 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/73 ,  H01L24/742 ,  H01L24/85 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/1012 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/13124 ,  H01L2224/13147 ,  H01L2224/13184 ,  H01L2224/13582 ,  H01L2224/136 ,  H01L2224/13655 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/1601 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/4556 ,  H01L2224/45599 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73203 ,  H01L2224/73251 ,  H01L2224/73257 ,  H01L2224/81903 ,  H01L2224/85 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15331 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K3/308 ,  H05K2201/09418 ,  H05K2201/10318 ,  H05K2201/10424 ,  H05K2201/10689 ,  H05K2201/10704 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10825 ,  H05K2201/10871 ,  H05K2201/10946 ,  H05K2201/10977 ,  H05K2203/0769 ,  Y02P70/613 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/72

Abstract: Two groups of interconnection devices and methods are described. Both provide columns between electronic packages and boards or between chips and substrates or the like. In the first group, called Thermal Flex Contact Carrier (TFCC), the column elements are carved out of a flat laminated structure and then formed to suit. In the second group, the carrier, which carries the connecting elements, is made out of a soluble or removable material, which acts at the same time, as a solder mask, to prevent the solder from wicking along the stem of the elements.

Abstract translation: 描述了两组互连设备和方法。 两者都在电子封装和电路板之间或芯片和衬底之间提供列等。 在第一组中，称为热挠性接触载体（TFCC），将柱元素从平面层压结构中雕刻出来，然后形成。 在第二组中，承载连接元件的载体由可溶或可移除的材料制成，其作为焊接掩模同时作用，以防止焊料沿着元件的芯部芯吸。

公开(公告)号：US20090026634A1

公开(公告)日：2009-01-29

申请号：US12278481

申请日：2007-03-06

Applicant: Daisuke Sakurai ,  Yoshihiko Yagi

Inventor： Daisuke Sakurai ,  Yoshihiko Yagi

IPC: H01L23/52 ,  H01L21/00

CPC classification number: H01L21/00 ,  H01L24/06 ,  H01L24/10 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/06102 ,  H01L2224/11554 ,  H01L2224/13 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/13099 ,  H01L2224/1319 ,  H01L2224/1403 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/3511 ,  H05K1/095 ,  H05K3/321 ,  H05K2201/0108 ,  H05K2201/10674 ,  H05K2201/10719 ,  H05K2203/0514 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An electronic part mounting structure includes electronic part (2) having a plurality of electrode terminals (3), a substrate provided with connection terminals (6) in locations corresponding to these electrode terminals (3), and protruding electrode (7) for connecting one of electrode terminals (3) and one of connection terminals (6), where electrode terminal (3) of electronic part (2) and connection terminal (6) of substrate (5) are connected through protruding electrode (7), and protruding electrode (7) is formed of a conductive resin including a photosensitive resin and a conductive filler.

Abstract translation: 电子部件安装结构包括具有多个电极端子（3）的电子部件（2），与这些电极端子（3）相对应的位置设置有连接端子（6）的基板，以及用于连接一个 电极端子（3）和连接端子（6）中的一个，电子部件（2）的电极端子（3）和基板（5）的连接端子（6）通过突出电极（7）连接，并且突出电极 （7）由包含感光性树脂和导电性填料的导电性树脂形成。

公开(公告)号：US07422978B2

公开(公告)日：2008-09-09

申请号：US11301807

申请日：2005-12-13

Applicant: Teck Kheng Lee

Inventor： Teck Kheng Lee

IPC: H01L21/4763

CPC classification number: H01L23/13 ,  G06F1/18 ,  G06F1/183 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/4985 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L25/0655 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/2919 ,  H01L2224/32013 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83385 ,  H01L2224/8385 ,  H01L2924/00014 ,  H01L2924/01002 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/12041 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/351 ,  H05K1/0271 ,  H05K1/0284 ,  H05K3/3436 ,  H05K3/4007 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09481 ,  H05K2201/10719 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Various embodiments of an interposer for mounting a semiconductor die, as well as methods for forming the interposer, are disclosed. The interposer includes flexible solder pad elements that are formed from a core material of the interposer, such that the interposer may absorb thermally induced stresses and conform to warped or uneven surfaces. Embodiments of electronic device packages including a semiconductor die mounted to and electrically connected to the interposer, as well as methods for forming the electronic device packages, are also disclosed. In one electronic device package, the semiconductor die is electrically connected to the interposer with wire bonds attached to a routing layer of the interposer. In another electronic device package, the semiconductor die is electrically connected to the interposer by bonding the semiconductor die to the flexible solder pad elements of the interposer in a flip-chip configuration. A computer system incorporating an electronic device package with an interposer according to the present invention is also disclosed.

Abstract translation: 公开了用于安装半导体管芯的插入件的各种实施例以及用于形成插入件的方法。 插入器包括由插入器的芯材料形成的柔性焊盘元件，使得插入器可以吸收热诱导的应力并且符合​​翘曲或不平坦的表面。 还公开了包括安装到内插器并且电连接到插入器的半导体管芯的电子器件封装的实施例以及用于形成电子器件封装的方法。 在一个电子器件封装中，半导体管芯通过连接到插入器的布线层上的引线电连接到插入器。 在另一个电子器件封装中，半导体管芯通过以倒装芯片配置将半导体管芯与插入器的柔性焊盘元件接合而电连接到插入器。 还公开了一种结合根据本发明的具有插入器的电子器件封装的计算机系统。

公开(公告)号：US07387827B2

公开(公告)日：2008-06-17

申请号：US10427168

申请日：2003-04-30

Applicant: Terry Lee Sterrett ,  Richard J. Harries

Inventor： Terry Lee Sterrett ,  Richard J. Harries

IPC: B32B3/10 ,  H01L23/48

CPC classification number: H01L24/14 ,  B29C39/026 ,  B29C70/58 ,  B29C70/882 ,  B29L2031/3406 ,  C08J5/10 ,  C08L101/12 ,  H01L24/10 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/0508 ,  H01L2224/05568 ,  H01L2224/056 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/30107 ,  H05K3/321 ,  H05K2201/0367 ,  H05K2201/10674 ,  H05K2201/10719 ,  Y10T428/24273 ,  Y10T428/24322 ,  Y10T428/24331 ,  Y10T428/24917 ,  H01L2924/00 ,  H01L2224/05099

Abstract: Methods and designs for increasing interconnect areas for interconnect bumps are disclosed. An interconnect bump may be formed on a substrate such that the interconnect bump extends beyond a contact pad onto a substrate. An interconnect bump may be formed on a larger contact pad, the bump having a large diameter.

Abstract translation: 公开了用于增加互连凸块的互连区域的方法和设计。 互连凸块可以形成在衬底上，使得互连凸块延伸超过接触焊盘到衬底上。 可以在更大的接触焊盘上形成互连凸块，凸块具有大的直径。

公开(公告)号：US20080136010A1

公开(公告)日：2008-06-12

申请号：US12022254

申请日：2008-01-30

Applicant: Dustin P. Wood ,  Kaladhar Radhakrishnan

Inventor： Dustin P. Wood ,  Kaladhar Radhakrishnan

IPC: H01L23/495

CPC classification number: H01L23/50 ,  H01L2224/16 ,  H01L2924/01019 ,  H01L2924/15311 ,  H01L2924/19106 ,  H01L2924/3011 ,  H05K1/0262 ,  H05K2201/10325 ,  H05K2201/10719

Abstract: An integrated circuit (IC) package includes a substrate and an IC die mounted on a first side of the substrate. The IC package also includes a plurality of capacitors mounted on a second side of the substrate. The second side is opposite to the first side. The IC package further includes a plurality of conductive contact pads formed on the second side of the substrate and interspersed among the capacitors. Other embodiments are described and claimed.

Abstract translation: 集成电路（IC）封装包括安装在基板的第一侧上的基板和IC芯片。 IC封装还包括安装在基板的第二侧上的多个电容器。 第二面与第一面相反。 该IC封装还包括多个导电接触焊盘，其形成在该衬底的第二侧上并散布在该电容器之间。 描述和要求保护其他实施例。

公开(公告)号：US20080123311A1

公开(公告)日：2008-05-29

申请号：US11470434

申请日：2006-09-06

Applicant: Lewis S. Goldmann ,  Jeffrey A. Zitz

Inventor： Lewis S. Goldmann ,  Jeffrey A. Zitz

IPC: H05K7/00 ,  H05K3/00

CPC classification number: H05K3/325 ,  H05K1/0271 ,  H05K3/0061 ,  H05K2201/10409 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/2009 ,  Y10T29/49124

Abstract: An IC chip package and related method are disclosed. The IC chip package may include a printed circuit board (PCB) coupled to a chip carrier by a land grid array (LGA) connector; a metal stiffener including at least one force-adjustable member contacting an underside of the PCB; and at least two couplers for coupling the metal stiffener to a lid or a heat sink, with the PCB, the chip carrier and the LGA connector therebetween. The force-adjustable member reduces the required assembly forces and accommodates natural and non-systematic out-of flatness tolerances of the PCB and the chip carrier.

Abstract translation: 公开了一种IC芯片封装及相关方法。 IC芯片封装可以包括通过平面栅格阵列（LGA）连接器耦合到芯片载体的印刷电路板（PCB）; 金属加强件，其包括接触PCB底面的至少一个力可调节构件; 以及用于将金属加强件耦合到盖或散热器的至少两个耦合器，其中PCB，芯片载体和LGA连接器在其间。 力可调节构件减小了所需的组装力并且适应PCB和芯片载体的自然和非系统的平坦度公差。

公开(公告)号：US20080122108A1

公开(公告)日：2008-05-29

申请号：US11942483

申请日：2007-11-19

Applicant: Se-Young YANG ,  Wang-Ju LEE

Inventor： Se-Young YANG ,  Wang-Ju LEE

IPC: H01L23/48

CPC classification number: H05K3/325 ,  H01L23/49811 ,  H01L24/10 ,  H01L24/13 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/13 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13147 ,  H01L2224/13624 ,  H01L2224/13647 ,  H01L2224/16225 ,  H01L2224/17 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/3511 ,  H05K1/0271 ,  H05K3/3436 ,  H05K2201/10242 ,  H05K2201/10719 ,  H05K2203/127 ,  Y02P70/613 ,  H01L2924/0105 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Provided are a rotation joint capable of compensating for a mismatch due to thermal expansion and a semiconductor device having the same. The rotation joint can include a support member and a first contact member coupled to a first portion of the support member such that a surface of the first contact member is moveable relative to a surface of the support member adjacent to the first contact member. The first contact member can include solder material.

Abstract translation: 提供能够补偿由于热膨胀引起的失配的旋转接头和具有该失配的半导体器件。 旋转接头可以包括支撑构件和联接到支撑构件的第一部分的第一接触构件，使得第一接触构件的表面相对于邻近第一接触构件的支撑构件的表面可移动。 第一接触构件可以包括焊料材料。

公开(公告)号：US07348214B2

公开(公告)日：2008-03-25

申请号：US11652425

申请日：2007-01-11

Applicant: Dustin P. Wood ,  Kaladhar Radhakrishnan

Inventor： Dustin P. Wood ,  Kaladhar Radhakrishnan

IPC: H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC classification number: H01L23/50 ,  H01L2224/16 ,  H01L2924/01019 ,  H01L2924/15311 ,  H01L2924/19106 ,  H01L2924/3011 ,  H05K1/0262 ,  H05K2201/10325 ,  H05K2201/10719

Abstract: An integrated circuit (IC) package includes a substrate and an IC die mounted on a first side of the substrate. The IC package also includes a plurality of capacitors mounted on a second side of the substrate. The second side is opposite to the first side. The IC package further includes a plurality of conductive contact pads formed on the second side of the substrate and interspersed among the capacitors. Other embodiments are described and claimed.

Abstract translation: 集成电路（IC）封装包括安装在基板的第一面上的基板和IC芯片。 IC封装还包括安装在基板的第二侧上的多个电容器。 第二面与第一面相反。 该IC封装还包括多个导电接触焊盘，其形成在该衬底的第二侧上并散布在该电容器之间。 描述和要求保护其他实施例。

公开(公告)号：US20080068817A1

公开(公告)日：2008-03-20

申请号：US11882581

申请日：2007-08-02

Applicant: Yoshihiro Morita

Inventor： Yoshihiro Morita

IPC: H05K7/12 ,  H01L23/32 ,  H01R4/48 ,  H05K1/14

CPC classification number: H05K1/0231 ,  H01L23/433 ,  H01L23/4338 ,  H01L2924/0002 ,  H01R13/2414 ,  H05K3/0058 ,  H05K3/325 ,  H05K2201/0314 ,  H05K2201/10515 ,  H05K2201/10719 ,  H05K2201/2009 ,  H01L2924/00

Abstract: A printed circuit board unit includes a first board and a second board. First electrically-conductive terminals are fixed and exposed on the front surface of the first board within a specific area of the first board in a matrix. Second electrically-conductive terminals are arranged in a matrix and supported on the front surface of the second board. The second electrically-conductive terminals have flexibility. Each of the second electrically-conductive terminals is disengageably brought in contact with the corresponding first electrically-conductive terminal. A static pressure member is received on the back surface of the first board within an area corresponding to the specific area to generate a static pressure. An urging plate is overlaid on the static pressure member so that the static pressure member is interposed between the urging plate and the first board. The urging plate exhibits an urging force applied to the first board toward the second board.

Abstract translation: 印刷电路板单元包括第一板和第二板。 第一导电端子固定并暴露在基板的第一板的特定区域内的第一板的前表面上。 第二导电端子布置成矩阵并且支撑在第二板的前表面上。 第二导电端子具有灵活性。 每个第二导电端子可分离地与相应的第一导电端子接触。 在与特定区域相对应的区域内，在第一板的后表面上容纳有静压部件，以产生静压。 推压板重叠在静压部件上，使得静压部件插入在推压板和第一板之间。 推压板向第二板呈现施加到第一板的施力。