公开(公告)号：US09004667B2

公开(公告)日：2015-04-14

申请号：US13811632

申请日：2011-07-22

Applicant: Akira Taguchi

Inventor： Akira Taguchi

IPC: B41J11/00 ,  F21V29/00 ,  B41J2/45 ,  H01L25/075 ,  H01L33/64

CPC classification number: H01L33/64 ,  B41J2/45 ,  B41J11/002 ,  H01L24/73 ,  H01L25/0753 ,  H01L33/642 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/09701 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A light irradiation device according to an embodiment includes a light emitting element, and a substrate on which the light emitting element is mounted. The substrate includes a laminated body constituted so that a plurality of insulating layers are laminated, a first heat transfer member disposed in the laminated body so that a part thereof is located directly below the light emitting element, and a second heat transfer member disposed between the insulating layers so as to surround the first heat transfer member when seen in a plan view. Thermal conductivities of the first heat transfer member and second heat transfer member are higher than a thermal conductivity of the laminated body.

Abstract translation: 根据实施例的光照射装置包括发光元件和安装有发光元件的基板。 基板包括层压体，其被层叠成多个绝缘层，第一传热部件设置在层叠体中，使得其一部分位于发光元件的正下方，第二传热部件设置在第二传热部件之间， 绝缘层，以便在平面图中观察时围绕第一传热构件。 第一传热构件和第二传热构件的热导率高于层压体的热导率。

公开(公告)号：US20150091145A1

公开(公告)日：2015-04-02

申请号：US14566870

申请日：2014-12-11

Applicant: STATS ChipPAC, Ltd.

Inventor： Yaojian Lin ,  Pandi C. Marimuthu

IPC: H01L21/768 ,  H01L23/498

CPC classification number: H01L21/76829 ,  H01L21/4832 ,  H01L21/486 ,  H01L21/568 ,  H01L21/76879 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49861 ,  H01L23/5389 ,  H01L24/11 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/06182 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/11849 ,  H01L2224/11901 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/20 ,  H01L2224/2101 ,  H01L2224/211 ,  H01L2224/215 ,  H01L2224/221 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H05K1/185 ,  H05K2201/10674 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00

Abstract: A semiconductor device has a semiconductor die mounted over the carrier. An encapsulant is deposited over the carrier and semiconductor die. The carrier is removed. A first interconnect structure is formed over the encapsulant and a first surface of the die. A second interconnect structure is formed over the encapsulant and a second surface of the die. A first protective layer is formed over the first interconnect structure and second protective layer is formed over the second interconnect structure prior to forming the vias. A plurality of vias is formed through the second interconnect structure, encapsulant, and first interconnect structure. A first conductive layer is formed in the vias to electrically connect the first interconnect structure and second interconnect structure. An insulating layer is formed over the first interconnect structure and second interconnect structure and into the vias. A discrete semiconductor component can be mounted to the first interconnect structure.

Abstract translation: 半导体器件具有安装在载体上的半导体管芯。 封装剂沉积在载体和半导体管芯上。 载体被移除。 在密封剂和模具的第一表面上形成第一互连结构。 在密封剂和模具的第二表面上形成第二互连结构。 在第一互连结构之上形成第一保护层，并且在形成通孔之前在第二互连结构上形成第二保护层。 通过第二互连结构，密封剂和第一互连结构形成多个通孔。 在通孔中形成第一导电层以电连接第一互连结构和第二互连结构。 绝缘层形成在第一互连结构和第二互连结构之上，并且形成在通孔中。 分立半导体部件可以安装到第一互连结构。

公开(公告)号：US08987886B2

公开(公告)日：2015-03-24

申请号：US13413724

申请日：2012-03-07

Applicant: James Rathburn

Inventor： James Rathburn

IPC: H01L23/52 ,  H01L23/498 ,  H01L21/48 ,  H01L21/768

CPC classification number: H01L23/49827 ,  G02B6/3608 ,  G02B6/4281 ,  H01L21/486 ,  H01L21/76831 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/60 ,  H01L24/13 ,  H01L24/48 ,  H01L25/16 ,  H01L2223/6627 ,  H01L2224/0401 ,  H01L2224/08235 ,  H01L2224/1132 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/81192 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An electrical interconnect including a first circuitry layer with a first surface and a second surface. At least a first dielectric layer is printed on the first surface of the first circuitry layer to include a plurality of first recesses. A conductive material is deposited in a plurality of the first recesses to form a plurality of first conductive pillars electrically coupled to, and extending generally perpendicular to, the first circuitry layer. At least a second dielectric layer is printed on the first dielectric layer to include a plurality of second recesses generally aligned with a plurality of the first conductive pillars. A conductive material is deposited in a plurality of the second recesses to form a plurality of second conductive pillars electrically coupled to, and extending parallel the first conductive pillars.

Abstract translation: 一种电互连，包括具有第一表面和第二表面的第一电路层。 至少第一电介质层印刷在第一电路层的第一表面上以包括多个第一凹槽。 导电材料沉积在多个第一凹槽中以形成电耦合到第一电路层并且大致垂直于第一电路层延伸的多个第一导电柱。 至少第二电介质层印刷在第一电介质层上以包括与多个第一导电柱大致对准的多个第二凹部。 导电材料沉积在多个第二凹槽中以形成电耦合到第一导电柱并平行延伸的多个第二导电柱。

公开(公告)号：US08955216B2

公开(公告)日：2015-02-17

申请号：US13318181

申请日：2010-05-25

Applicant: James Rathburn

Inventor： James Rathburn

IPC: H05K3/30 ,  H01L21/683 ,  H01L21/48 ,  H01L23/498 ,  H01L23/00 ,  H01L25/065 ,  H05K3/46

CPC classification number: H01L21/6835 ,  H01L21/4867 ,  H01L23/49822 ,  H01L23/4985 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0655 ,  H01L2221/68345 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K3/4664 ,  H05K3/4682 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A compliant printed circuit semiconductor package including a compliant printed circuit with at least a first dielectric layer selectively printed on a substrate with first recesses. A conductive material is printed in the first recesses to form contact members accessible along a first surface of the compliant printed circuit. At least one semiconductor device is located proximate the first surface of the compliant printed circuit. Wirebonds electrically couple terminals on the semiconductor device to the contact members. Overmolding material seals the semiconductor device and the wirebonds to the first surface of the compliant printed circuit. Contact pads on a second surface of the compliant printed circuit are electrically coupled to the contact members.

Abstract translation: 一种兼容的印刷电路半导体封装，包括具有至少第一介电层的柔性印刷电路，所述第一介电层选择性地印刷在具有第一凹槽的 在第一凹部中印刷导电材料以形成可沿顺应性印刷电路的第一表面接触的接触部件。 至少一个半导体器件位于顺应印刷电路的第一表面附近。 接线将半导体器件上的端子电耦合到接触构件。 包覆成型材料将半导体器件和引线密封到兼容印刷电路的第一表面。 柔性印刷电路的第二表面上的接触焊盘电耦合到接触构件。

公开(公告)号：US08944786B1

公开(公告)日：2015-02-03

申请号：US12838664

申请日：2010-07-19

Applicant: Eugene McDougall

Inventor： Eugene McDougall

IPC: F04D13/02 ,  A61H33/00

CPC classification number: A61H33/0091 ,  F04D13/024 ,  H01L23/043 ,  H01L23/49537 ,  H01L23/49833 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/3011 ,  H01L2924/00

Abstract: A pedicure spa or hydrotherapy system for circulating fluid which includes a motor coupled magnetically with an impeller assembly on the wall of the pedicure spa or hydrotherapy system is disclosed. The system is designed to have low energy consumption and an ultra low profile while at the same time providing a pipeless water circulation that is easy to operate and clean. In addition, the invention minimizes the growth of bacteria within the pumping system as the impeller assembly is easily removed from the wall for cleaning without any mechanical aids. In certain embodiments, the magnetic propulsion and coupling device includes a multi-directional combination of strategically placed and alternating-pole magnets on magnet plates and additional magnets in the housing.

Abstract translation: 公开了一种用于循环流体的修脚水疗或水疗系统，其包括与修脚温泉或水疗系统的壁上的叶轮组件磁耦合的马达。 该系统设计具有低能耗和超低特性，同时提供易于操作和清洁的无管式水循环。 此外，本发明使泵送系统内的细菌的生长最小化，因为叶轮组件容易地从墙壁上移除用于清洁而没有任何机械辅助器具。 在某些实施例中，磁推进和耦合装置包括在磁体板上的策略放置的和交替磁极的多方向组合以及壳体中的附加磁体。

公开(公告)号：US20150028480A1

公开(公告)日：2015-01-29

申请号：US14513563

申请日：2014-10-14

Applicant: Tessera, Inc.

Inventor： Kazuo Sakuma ,  Philip Damberg ,  Belgacem Haba

IPC: H01L23/00 ,  H05K1/03 ,  H05K1/02 ,  H05K1/09

CPC classification number: H01L21/4853 ,  H01L23/3142 ,  H01L23/498 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/01 ,  H01L24/15 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/2064 ,  H01L2924/20641 ,  H05K1/0284 ,  H05K1/0306 ,  H05K1/09 ,  H05K3/002 ,  H05K2201/0166 ,  H01L2924/00

Abstract: An interconnection substrate includes a plurality of electrically conductive elements of at least one wiring layer defining first and second lateral directions. Electrically conductive projections for bonding to electrically conductive contacts of at least one component external to the substrate, extend from the conductive elements above the at least one wiring layer. The conductive projections have end portions remote from the conductive elements and neck portions between the conductive elements and the end portions. The end portions have lower surfaces extending outwardly from the neck portions in at least one of the lateral directions. The substrate further includes a dielectric layer overlying the conductive elements and extending upwardly along the neck portions at least to the lower surfaces. At least portions of the dielectric layer between the conductive projections are recessed below a height of the lower surfaces.

Abstract translation: 互连衬底包括限定第一和第二横向方向的至少一个布线层的多个导电元件。 导电突起，用于粘合到基板外部的至少一个部件的导电触点，从导电元件延伸到至少一个布线层之上。 导电突起具有远离导电元件的端部和导电元件与端部之间的颈部。 端部具有在至少一个横向方向上从颈部部分向外延伸的下表面。 衬底还包括覆盖导电元件并且沿着颈部部分至少向下表面向上延伸的电介质层。 导电突起之间的电介质层的至少部分凹陷在下表面的高度之下。

公开(公告)号：US08940636B2

公开(公告)日：2015-01-27

申请号：US13273537

申请日：2011-10-14

Applicant: Reza A. Pagaila ,  Zigmund R. Camacho ,  Lionel Chien Hui Tay ,  Byung Tai Do

Inventor： Reza A. Pagaila ,  Zigmund R. Camacho ,  Lionel Chien Hui Tay ,  Byung Tai Do

IPC: H01L21/44 ,  H01L21/683 ,  H01L21/56 ,  H01L23/31 ,  H01L23/538 ,  H01L23/00 ,  H01L25/065 ,  H01L25/10 ,  H01L25/00

CPC classification number: H01L21/6835 ,  H01L21/568 ,  H01L23/3114 ,  H01L23/5389 ,  H01L24/12 ,  H01L24/13 ,  H01L24/19 ,  H01L24/25 ,  H01L24/28 ,  H01L24/81 ,  H01L24/94 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2221/68372 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05009 ,  H01L2224/0557 ,  H01L2224/12105 ,  H01L2224/13009 ,  H01L2224/13099 ,  H01L2224/16147 ,  H01L2224/16237 ,  H01L2224/19 ,  H01L2224/24011 ,  H01L2224/32145 ,  H01L2224/73267 ,  H01L2224/81141 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/81894 ,  H01L2224/82039 ,  H01L2224/9202 ,  H01L2224/92244 ,  H01L2225/06551 ,  H01L2225/06558 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2224/05552 ,  H01L2924/00 ,  H01L2224/83005

Abstract: A semiconductor package includes a semiconductor wafer having a plurality of semiconductor die. A contact pad is formed over and electrically connected to an active surface of the semiconductor die. A gap is formed between the semiconductor die. An insulating material is deposited in the gap between the semiconductor die. An adhesive layer is formed over a surface of the semiconductor die and the insulating material. A via is formed in the insulating material and the adhesive layer. A conductive material is deposited in the via to form a through hole via (THV). A conductive layer is formed over the contact pad and the THV to electrically connect the contact pad and the THV. The plurality of semiconductor die is singulated. The insulating material can include an organic material. The active surface of the semiconductor die can include an optical device.

Abstract translation: 半导体封装包括具有多个半导体管芯的半导体晶片。 接触垫形成在半导体管芯的有源表面上并电连接到半导体管芯的有源表面。 在半导体管芯之间形成间隙。 绝缘材料沉积在半导体管芯之间的间隙中。 在半导体管芯和绝缘材料的表面上形成粘合剂层。 在绝缘材料和粘合剂层中形成通孔。 导电材料沉积在通孔中以形成通孔（THV）。 在接触焊盘和THV上形成导电层，以电连接接触焊盘和THV。 多个半导体管芯被切割。 绝缘材料可以包括有机材料。 半导体管芯的有源表面可以包括光学器件。

公开(公告)号：US20150021754A1

公开(公告)日：2015-01-22

申请号：US14509785

申请日：2014-10-08

Applicant: STATS CHIPPAC, LTD.

Inventor： Yaojian Lin ,  Pandi C. Marimuthu ,  Il Kwon Shim

IPC: H01L23/367 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/367 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/16 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/42 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/5389 ,  H01L23/552 ,  H01L23/562 ,  H01L24/19 ,  H01L24/20 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/20 ,  H01L2224/24195 ,  H01L2224/73267 ,  H01L2224/9222 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/03 ,  H01L2224/19 ,  H01L2924/00012

Abstract: A semiconductor device has a first semiconductor die and an encapsulant deposited over the first semiconductor die. An interconnect structure is formed over the first semiconductor die and encapsulant. A thermal interface material is formed over the first semiconductor die and encapsulant. A stiffening layer is formed over the first semiconductor die and an edge portion of the encapsulant. Alternatively, an insulating layer is formed adjacent to the first semiconductor die and a stiffening layer is formed over the insulating layer. The stiffening layer includes metal, ferrite, ceramic, or semiconductor material. A heat spreader is disposed over the first semiconductor die and a central portion of the encapsulant. Openings are formed in the heat spreader. A recess is formed in the heat spreader along an edge of the heat spreader. A coefficient of thermal expansion (CTE) of the stiffening layer is less than a CTE of the heat spreader.

Abstract translation: 半导体器件具有沉积在第一半导体管芯上的第一半导体管芯和密封剂。 在第一半导体管芯和密封剂上形成互连结构。 在第一半导体管芯和密封剂上形成热界面材料。 在第一半导体管芯上形成加强层和密封剂的边缘部分。 或者，与第一半导体管芯相邻地形成绝缘层，并且在绝缘层上形成加强层。 加强层包括金属，铁氧体，陶瓷或半导体材料。 散热器设置在第一半导体管芯上方和密封剂的中心部分。 开口形成在散热器中。 散热器沿着散热器的边缘形成凹部。 加强层的热膨胀系数（CTE）小于散热器的CTE。

公开(公告)号：US20150014419A1

公开(公告)日：2015-01-15

申请号：US14500343

申请日：2014-09-29

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Shunpei YAMAZAKI ,  Jun KOYAMA ,  Kiyoshi KATO ,  Takaaki KOEN ,  Yuto YAKUBO ,  Makoto YANAGISAWA ,  Hisashi OHTANI ,  Eiji SUGIYAMA ,  Nozomi HORIKOSHI

IPC: G06K19/077

CPC classification number: G06K19/07735 ,  G06K19/07722 ,  G06K19/07794 ,  H01L23/295 ,  H01L23/3157 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00

Abstract: A semiconductor device capable of wireless communication, which has high reliability in terms of resistance to external force, in particular, pressing force and can prevent electrostatic discharge in an integrated circuit without preventing reception of an electric wave. The semiconductor device includes an on-chip antenna connected to the integrated circuit and a booster antenna which transmits a signal or power included in a received electric wave to the on-chip antenna without contact. In the semiconductor device, the integrated circuit and the on-chip antenna are interposed between a pair of structure bodies formed by impregnating a fiber body with a resin. One of the structure bodies is provided between the on-chip antenna and the booster antenna. A conductive film having a surface resistance value of approximately 106 to 1014 Ω/cm2 is formed on at least one surface of each structure body.

Abstract translation: 一种能够进行无线通信的半导体装置，其在外力方面具有高的可靠性，特别是按压力，并且能够防止集成电路中的静电放电，而不会妨碍电波的接收。 半导体器件包括连接到集成电路的片上天线和将接收到的电波中包含的信号或功率发送到片上天线而不接触的增强天线。 在半导体器件中，集成电路和片上天线插入通过用树脂浸渍纤维体而形成的一对结构体之间。 其中一个结构体设置在片上天线和增强天线之间。 在每个结构体的至少一个表面上形成表面电阻值为大约106至1014Ω·cm 2 / cm 2的导电膜。

公开(公告)号：US08927341B2

公开(公告)日：2015-01-06

申请号：US14166540

申请日：2014-01-28

Applicant: Nichia Corporation

Inventor： Masafumi Kuramoto ,  Satoru Ogawa ,  Miki Niwa

IPC: H01L21/60 ,  H01L23/00 ,  H01L21/18 ,  H01L33/64 ,  H01L33/62

CPC classification number: H01L33/641 ,  H01L21/187 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L33/62 ,  H01L2224/0345 ,  H01L2224/0401 ,  H01L2224/06102 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29 ,  H01L2224/2908 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/29386 ,  H01L2224/32225 ,  H01L2224/812 ,  H01L2224/81801 ,  H01L2224/81894 ,  H01L2224/81907 ,  H01L2224/83801 ,  H01L2224/8383 ,  H01L2224/8384 ,  H01L2224/83907 ,  H01L2224/85205 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01063 ,  H01L2924/01064 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01105 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/12035 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/19041 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/3512 ,  H01L2924/0541 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

Abstract: An object of the invention is to provide a method for producing a conductive member having low electrical resistance, and the conductive member is obtained using a low-cost stable conductive material composition that does not contain an adhesive. A method for producing a semiconductor device in which silver or silver oxide provided on a surface of a base and silver or silver oxide provided on a surface of a semiconductor element are bonded, includes the steps of arranging a semiconductor element on a base such that silver or silver oxide provided on a surface of the semiconductor element is in contact with silver or silver oxide provided on a surface of the base, and bonding the semiconductor element and the base by applying heat having a temperature of 200 to 900° C. to the semiconductor device and the base.

Abstract translation: 本发明的目的是提供一种用于制造具有低电阻的导电构件的方法，并且使用不含粘合剂的低成本稳定的导电材料组合物获得导电构件。 一种制造半导体器件的方法，其中设置在基底表面上的银或氧化银和设置在半导体元件的表面上的银或银氧化物结合，包括以下步骤：将半导体元件布置在基底上，使得银 或设置在半导体元件的表面上的氧化银与设置在基板的表面上的银或氧化银接触，并且通过对温度为200〜900℃的热进行加热而将半导体元件和基板接合到 半导体器件和基极。