公开(公告)号：WO2015175554A2

公开(公告)日：2015-11-19

申请号：PCT/US2015/030410

申请日：2015-05-12

Applicant: INVENSAS CORPORATION

Inventor： KATKAR, Rajesh ,  UZOH, Cyprian, Emeka

IPC: H01L21/60

CPC classification number: H01L24/14 ,  B23K1/0016 ,  B23K3/0623 ,  B23K35/0244 ,  B23K35/0266 ,  B23K2201/40 ,  H01L21/02225 ,  H01L21/4853 ,  H01L21/56 ,  H01L21/563 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/3135 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/03 ,  H01L24/05 ,  H01L24/08 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/73 ,  H01L24/742 ,  H01L24/81 ,  H01L24/83 ,  H01L24/98 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/03318 ,  H01L2224/0332 ,  H01L2224/0333 ,  H01L2224/0391 ,  H01L2224/05022 ,  H01L2224/05073 ,  H01L2224/0508 ,  H01L2224/051 ,  H01L2224/05567 ,  H01L2224/056 ,  H01L2224/06102 ,  H01L2224/10145 ,  H01L2224/11001 ,  H01L2224/11005 ,  H01L2224/11009 ,  H01L2224/111 ,  H01L2224/11318 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/11849 ,  H01L2224/11901 ,  H01L2224/1191 ,  H01L2224/13005 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/13021 ,  H01L2224/13022 ,  H01L2224/13078 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13084 ,  H01L2224/131 ,  H01L2224/13116 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13169 ,  H01L2224/1319 ,  H01L2224/13561 ,  H01L2224/13562 ,  H01L2224/136 ,  H01L2224/13609 ,  H01L2224/13611 ,  H01L2224/1405 ,  H01L2224/16058 ,  H01L2224/16059 ,  H01L2224/16145 ,  H01L2224/16147 ,  H01L2224/16148 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/1701 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2224/17505 ,  H01L2224/2919 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/75253 ,  H01L2224/81138 ,  H01L2224/81141 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/8121 ,  H01L2224/8122 ,  H01L2224/81224 ,  H01L2224/81815 ,  H01L2224/81825 ,  H01L2224/8385 ,  H01L2224/9211 ,  H01L2225/06513 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/3512 ,  H01L2924/381 ,  H01L2924/3841 ,  H05K1/115 ,  H05K1/144 ,  H05K3/341 ,  H05K2201/09572 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/07025 ,  H01L2224/81 ,  H01L2224/83

Abstract: In some embodiments, to increase the height-to-pitch ratio of a solder connection that connects different structures with one or more solder balls, only a portion of a solder ball's surface is melted when the connection is formed on one structure and/or when the connection is being attached to another structure. In some embodiments, non-solder balls are joined by an intermediate solder ball (140i). A solder connection may be surrounded by a solder locking layer (1210) and may be recessed in a hole (1230) in that layer. Other features are also provided.

Abstract translation: 在一些实施例中，为了增加将不同结构与一个或多个焊球连接的焊料连接的高度与间距比，当在一个结构上形成连接时，和/或当 连接正在附加到另一个结构。 在一些实施例中，非焊球通过中间焊球（140i）连接。 焊料连接可以被焊料锁定层（1210）包围，并且可以凹入该层中的孔（1230）中。 还提供其他功能。

公开(公告)号：WO2011146579A2

公开(公告)日：2011-11-24

申请号：PCT/US2011/036941

申请日：2011-05-18

Applicant: VERTICAL CIRCUITS, INC. ,  CO, Reynaldo ,  LEAL, Jeffrey, S. ,  PANGRLE, Suzette, K. ,  MCGRATH, Scott ,  MELCHER, DeAnn, Eileen ,  BARRIE, Keith, L. ,  VILLLAVICENCIO, Grant ,  DEL ROSARIO, Elmer, M. ,  BRAY, John, R.

Inventor： CO, Reynaldo ,  LEAL, Jeffrey, S. ,  PANGRLE, Suzette, K. ,  MCGRATH, Scott ,  MELCHER, DeAnn, Eileen ,  BARRIE, Keith, L. ,  VILLLAVICENCIO, Grant ,  DEL ROSARIO, Elmer, M. ,  BRAY, John, R.

CPC classification number: H01L25/0657 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3171 ,  H01L23/3185 ,  H01L23/3192 ,  H01L24/03 ,  H01L24/05 ,  H01L24/18 ,  H01L24/24 ,  H01L24/82 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2224/0235 ,  H01L2224/02371 ,  H01L2224/03002 ,  H01L2224/03318 ,  H01L2224/0332 ,  H01L2224/03632 ,  H01L2224/03848 ,  H01L2224/05016 ,  H01L2224/05017 ,  H01L2224/0529 ,  H01L2224/05553 ,  H01L2224/24051 ,  H01L2224/24145 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2224/94 ,  H01L2225/06551 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/03

Abstract: Methods for forming connectors on die pads at a wafer level of processing include forming spots of a curable electrically conductive material over die pads and extending to or over the interconnect die edge; curing the conductive material; and in a wafer cutting procedure thereafter severing the spots. Also, die pad to z-interconnect connectors formed by the methods, and shaped and dimensioned accordingly. Also, stacked die assemblies and stacked die packages containing die prepared according to the methods and having die pad to z-interconnect connectors formed by the methods and shaped and dimensioned accordingly.

Abstract translation: 在晶片级处理中在芯片焊盘上形成连接器的方法包括在芯片焊盘上形成可固化的导电材料的点并且延伸到互连芯片边缘上或之上; 固化导电材料; 并且在切割步骤之后切断斑点。 而且，通过这些方法形成的管芯焊盘到z-互连连接器，并相应地成形和尺寸。 而且，堆叠的模具组件和包含根据方法制备的模具的堆叠模具组件，并且具有通过所述方法形成并且形状和尺寸的模具垫到z互连连接器。

公开(公告)号：WO2015175554A3

公开(公告)日：2016-01-07

申请号：PCT/US2015030410

申请日：2015-05-12

Applicant: INVENSAS CORP

Inventor： KATKAR RAJESH ,  UZOH CYPRIAN EMEKA

IPC: H01L21/60 ,  H01L21/48 ,  H01L21/56 ,  H01L21/98 ,  H01L23/31 ,  H01L23/485 ,  H01L23/498 ,  H01L25/065 ,  H01L25/10

CPC classification number: H01L24/14 ,  B23K1/0016 ,  B23K3/0623 ,  B23K35/0244 ,  B23K35/0266 ,  B23K2201/40 ,  H01L21/02225 ,  H01L21/4853 ,  H01L21/56 ,  H01L21/563 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/3135 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/03 ,  H01L24/05 ,  H01L24/08 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/73 ,  H01L24/742 ,  H01L24/81 ,  H01L24/83 ,  H01L24/98 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/03318 ,  H01L2224/0332 ,  H01L2224/0333 ,  H01L2224/0391 ,  H01L2224/05022 ,  H01L2224/05073 ,  H01L2224/0508 ,  H01L2224/051 ,  H01L2224/05567 ,  H01L2224/056 ,  H01L2224/06102 ,  H01L2224/10145 ,  H01L2224/11001 ,  H01L2224/11005 ,  H01L2224/11009 ,  H01L2224/111 ,  H01L2224/11318 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/11849 ,  H01L2224/11901 ,  H01L2224/1191 ,  H01L2224/13005 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/13021 ,  H01L2224/13022 ,  H01L2224/13078 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13084 ,  H01L2224/131 ,  H01L2224/13116 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13169 ,  H01L2224/1319 ,  H01L2224/13561 ,  H01L2224/13562 ,  H01L2224/136 ,  H01L2224/13609 ,  H01L2224/13611 ,  H01L2224/1405 ,  H01L2224/16058 ,  H01L2224/16059 ,  H01L2224/16145 ,  H01L2224/16147 ,  H01L2224/16148 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/1701 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2224/17505 ,  H01L2224/2919 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/75253 ,  H01L2224/81138 ,  H01L2224/81141 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/8121 ,  H01L2224/8122 ,  H01L2224/81224 ,  H01L2224/81815 ,  H01L2224/81825 ,  H01L2224/8385 ,  H01L2224/9211 ,  H01L2225/06513 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/3512 ,  H01L2924/381 ,  H01L2924/3841 ,  H05K1/115 ,  H05K1/144 ,  H05K3/341 ,  H05K2201/09572 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/07025 ,  H01L2224/81 ,  H01L2224/83

Abstract: In some embodiments, to increase the height-to-pitch ratio of a solder connection that connects different structures with one or more solder balls, only a portion (510) of a solder ball's (140) surface is melted when the connection is formed on one structure (110) and/or when the connection is being attached to another structure (HOB). The structure (110) may be an integrated circuit, an interposer, a rigid or flexible wiring substrate, a printed circuit board, some other packaging substrate, or an integrated circuit package. In some embodiments, solder balls (140.1, 140.2) are joined by an intermediate solder ball (140i), upon melting of the latter only. Any of the solder balls (140, 140i) may have a non-solder central core (140C) coated by solder shell (140S). Some of the molten or softened solder may be squeezed out, to form a "squeeze-out" region (520, 520A, 520B, 520.1, 520.2). In some embodiments, a solder connection (210) such as discussed above, on a structure (110A), may be surrounded by a dielectric layer (1210), and may be recessed in a hole (1230) in that layer (1210), to help in aligning a post (1240) of a structure (HOB) with the connection (210) during attachment of the structures (110A, HOB). The dielectric layer (1210) may be formed by moulding. The dielectric layer may comprise a number of layers (1210.1, 1210.2), "shaved" (partially removed) to expose the solder connection (210). Alternatively, the recessed solder connections (210) may be formed using a sublimating or vapourisable material (1250), placed on top of the solder (210) before formation of the dielectric layer (1210) or coating solder balls (140); in the latter case, the solder (140C) sinks within the dielectric material (1210) upon removal of the material (1250) and subsequent reflow. The solder connections (210.1, 210.2) may be used for bonding one or more structures (HOB, HOC) (e.g. an integrated circuit die or wafer, a packaging substrate or a package) to a structure (110A) (a wiring substrate) on which a die (HOB) is flip-chip connected. The solder connections (210.1, 210.2) may differ from each other, in particular in height.

Abstract translation: 在一些实施例中，为了增加将不同结构与一个或多个焊球连接的焊料连接的高度与间距比，当焊接球（140）表面的一部分（510）形成在 一个结构（110）和/或当连接被附接到另一个结构（HOB）时。 结构（110）可以是集成电路，插入器，刚性或柔性布线基板，印刷电路板，一些其它封装基板或集成电路封装。 在一些实施例中，焊料球（140.1,140.2）仅在熔化时被中间焊球（140i）连接。 任何焊球（140,140i）可以具有由焊料壳（140S）涂覆的非焊料中心芯（140C）。 一些熔融或软化的焊料可能被挤出，以形成“挤出”区域（520,520A，520B，520.1,520.2）。 在一些实施例中，在结构（110A）上的如上所述的焊料连接（210）可被电介质层（1210）包围，并且可以凹入该层（1210）中的孔（1230）中， 以在结构（110A，110B）的附接期间帮助将结构的柱（1240）与连接件（210）对齐。 电介质层（1210）可以通过模塑形成。 介电层可以包括多个层（1210.1,1212.2），“剃光”（部分去除）以暴露焊料连接（210）。 或者，可以在形成电介质层（1210）或涂覆焊球（140）之前使用升华或蒸发的材料（1250）形成凹陷的焊料连接（210），放置在焊料（210）的顶部上。 在后一种情况下，当去除材料（1250）和随后的回流时，焊料（140C）在电介质材料（1210）内下沉。 焊接连接（210.1,210.2）可以用于将一个或多个结构（HOB，HOC）（例如集成电路管芯或晶片，封装衬底或封装）结合到结构（110A）（布线基板）上 一个芯片（HOB）是倒装芯片连接的。 焊接连接（210.1,210.2）可能彼此不同，特别是高度不同。

公开(公告)号：WO2011146579A8

公开(公告)日：2012-12-20

申请号：PCT/US2011036941

申请日：2011-05-18

Applicant: INVENSAS CORP ,  CO REYNALDO ,  LEAL JEFFREY S ,  PANGRLE SUZETTE K ,  MCGRATH SCOTT ,  MELCHER DEANN EILEEN ,  BARRIE KEITH L ,  VILLAVICENCIO GRANT ,  DEL ROSARIO ELMER M ,  BRAY JOHN R

Inventor： CO REYNALDO ,  LEAL JEFFREY S ,  PANGRLE SUZETTE K ,  MCGRATH SCOTT ,  MELCHER DEANN EILEEN ,  BARRIE KEITH L ,  VILLAVICENCIO GRANT ,  DEL ROSARIO ELMER M ,  BRAY JOHN R

IPC: H01L23/12 ,  H01L23/48

CPC classification number: H01L25/0657 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3171 ,  H01L23/3185 ,  H01L23/3192 ,  H01L24/03 ,  H01L24/05 ,  H01L24/18 ,  H01L24/24 ,  H01L24/82 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2224/02371 ,  H01L2224/03002 ,  H01L2224/03318 ,  H01L2224/0332 ,  H01L2224/03632 ,  H01L2224/03848 ,  H01L2224/05016 ,  H01L2224/05017 ,  H01L2224/0529 ,  H01L2224/05553 ,  H01L2224/24051 ,  H01L2224/24145 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2224/94 ,  H01L2225/06551 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/03

Abstract: Methods for forming connectors on die pads at a wafer level of processing include forming spots of a curable electrically conductive material over die pads and extending to or over the interconnect die edge; curing the conductive material; and in a wafer cutting procedure thereafter severing the spots. Also, die pad to z-interconnect connectors formed by the methods, and shaped and dimensioned accordingly. Also, stacked die assemblies and stacked die packages containing die prepared according to the methods and having die pad to z-interconnect connectors formed by the methods and shaped and dimensioned accordingly.

Abstract translation: 用于在晶片级处理中在管芯焊盘上形成连接器的方法包括在管芯焊盘上方形成可固化导电材料的斑点并且延伸至互连芯片边缘或在互连芯片边缘之上延伸; 固化导电材料; 并在此后的晶圆切割过程中切断斑点。 而且，管芯焊盘用于z互连由这些方法形成的连接器，并且相应地被成形和确定尺寸。 而且，根据所述方法制备的堆叠的管芯组件和堆叠的管芯封装包含管芯，并且具有管芯焊盘以z互连由所述方法形成的连接器，并且相应地成形和确定尺寸。

公开(公告)号：WO2017055244A1

公开(公告)日：2017-04-06

申请号：PCT/EP2016/072912

申请日：2016-09-27

Applicant: SIEMENS AKTIENGESELLSCHAFT

Inventor： STEGMEIER, Stefan ,  ZAPF, Jörg

IPC: H01L23/485

CPC classification number: H01L24/05 ,  H01L24/03 ,  H01L24/24 ,  H01L24/29 ,  H01L24/32 ,  H01L24/82 ,  H01L2224/02166 ,  H01L2224/03318 ,  H01L2224/03334 ,  H01L2224/0346 ,  H01L2224/03505 ,  H01L2224/04026 ,  H01L2224/05556 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/29101 ,  H01L2224/73267 ,  H01L2224/82101 ,  H01L2224/83447 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2924/1203 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15786 ,  H01L2924/00014 ,  H01L2924/014

Abstract: Die Erfindung betrifft ein Verfahren zur Kontaktierung einer Kontaktfläche (90) eines Halbleiterbauteils (50) und ein Elektronikmodul. Bei dem Verfahren zur Kontaktierung einer Kontaktfläche (90) eines Halbleiterbauteils (50), wird zunächst an die Kontaktfläche (90) eine sich in Richtung von der Kontaktfläche (90) weg verjüngende elektrisch leitfähige Schicht (200) gebracht und nachfolgend wird an der Schicht in zumindest einer Erstreckungsrichtung der Kontaktfläche angrenzend Isolationsmaterial (230) gebracht. Das Elektronikmodul ist insbesondere ein Leistungsmodul und umfasst ein Halbleiterbauteil mit einer Kontaktfläche (90) und mit einer Leiterbahn (225), wobei die Kontaktfläche (90) mittels eines solchen Verfahrens kontaktiert ist.

Abstract translation: 本发明涉及一种用于接触半导体器件（50）和电子模块的接触表面（90）。 在用于接触半导体器件（50）的接触表面（90）的方法中，在所述接触表面（90）远离锥形导电层（200）的方向配置第一在接触表面（90），并随后在层 带来了相邻的绝缘材料（230）的接触面中的至少一个延伸的方向。 电子模块是特别的功率模块，并包括具有接触表面（90）的半导体器件，并与导体路径（225），其中，所述接触表面（90）是由这样的方法的装置接触。

公开(公告)号：WO2015175557A1

公开(公告)日：2015-11-19

申请号：PCT/US2015/030413

申请日：2015-05-12

Applicant: INVENSAS CORPORATION

Inventor： UZOH, Cyprian, Emeka ,  KATKAR, Rajesh

IPC: H01L21/60 ,  H01L23/485 ,  H01L21/48 ,  H01L23/498 ,  H01L23/31 ,  H01L21/56 ,  H01L21/98 ,  H01L25/10 ,  H01L25/065

CPC classification number: H01L23/49811 ,  B23K1/0016 ,  B23K35/0244 ,  B23K35/0266 ,  B23K35/22 ,  B23K2201/40 ,  B32B15/01 ,  H01L21/4853 ,  H01L21/56 ,  H01L21/563 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/3135 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/73 ,  H01L24/742 ,  H01L24/81 ,  H01L24/82 ,  H01L24/83 ,  H01L24/98 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/03 ,  H01L2224/03001 ,  H01L2224/03009 ,  H01L2224/03318 ,  H01L2224/0332 ,  H01L2224/0333 ,  H01L2224/03334 ,  H01L2224/0348 ,  H01L2224/03848 ,  H01L2224/03849 ,  H01L2224/039 ,  H01L2224/03901 ,  H01L2224/0391 ,  H01L2224/04105 ,  H01L2224/05022 ,  H01L2224/051 ,  H01L2224/05294 ,  H01L2224/05547 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/05582 ,  H01L2224/056 ,  H01L2224/05794 ,  H01L2224/05839 ,  H01L2224/05844 ,  H01L2224/05847 ,  H01L2224/05855 ,  H01L2224/0603 ,  H01L2224/06102 ,  H01L2224/10145 ,  H01L2224/11001 ,  H01L2224/11005 ,  H01L2224/11009 ,  H01L2224/111 ,  H01L2224/11318 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/11848 ,  H01L2224/11849 ,  H01L2224/119 ,  H01L2224/11901 ,  H01L2224/1191 ,  H01L2224/13005 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/13021 ,  H01L2224/13022 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13116 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13169 ,  H01L2224/1319 ,  H01L2224/13294 ,  H01L2224/133 ,  H01L2224/13339 ,  H01L2224/13344 ,  H01L2224/13347 ,  H01L2224/13355 ,  H01L2224/13561 ,  H01L2224/13562 ,  H01L2224/13565 ,  H01L2224/136 ,  H01L2224/13609 ,  H01L2224/13611 ,  H01L2224/1403 ,  H01L2224/16058 ,  H01L2224/16059 ,  H01L2224/16145 ,  H01L2224/16147 ,  H01L2224/16148 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/1701 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2224/17505 ,  H01L2224/2101 ,  H01L2224/211 ,  H01L2224/2401 ,  H01L2224/2402 ,  H01L2224/24137 ,  H01L2224/24146 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/73267 ,  H01L2224/75253 ,  H01L2224/81 ,  H01L2224/81138 ,  H01L2224/81141 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/8121 ,  H01L2224/8122 ,  H01L2224/81224 ,  H01L2224/81815 ,  H01L2224/82005 ,  H01L2224/82101 ,  H01L2224/82102 ,  H01L2224/82105 ,  H01L2224/83 ,  H01L2224/8385 ,  H01L2224/9211 ,  H01L2225/06513 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/07025 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/3512 ,  H01L2924/381 ,  H01L2924/3841

Abstract: In some embodiments, to increase the height-to-pitch ratio of a solder connection that connects different structures with one or more solder balls, only a portion (510) of a solder ball's (140) surface is melted when the connection is formed on one structure (110) and/or when the connection is being attached to another structure (HOB). The structure (110) may be an integrated circuit, an interposer, a rigid or flexible wiring substrate, a printed circuit board, some other packaging substrate, or an integrated circuit package. In some embodiments, solder balls (140.1, 140.2) are joined by an intermediate solder ball (140i), upon melting of the latter only. Any of the solder balls (140, 140i) may have a non-solder central core (140C) coated by solder shell (140S). Some of the molten or softened solder may be squeezed out, to form a "squeeze-out" region (520, 520A, 520B, 520.1, 520.2). In some embodiments, a solder connection (210) such as discussed above, on a structure (110A), may be surrounded by a dielectric layer (1210), and may be recessed in a hole (1230) in that layer (1210), to help in aligning a post (1240) of a structure (HOB) with the connection (210) during attachment of the structures (110A, HOB). The dielectric layer (1210) may be formed by moulding. The dielectric layer may comprise a number of layers (1210.1, 1210.2), "shaved" (partially removed) to expose the solder connection (210). Alternatively, the recessed solder connections (210) may be formed using a sublimating or vapourisable material (1250), placed on top of the solder (210) before formation of the dielectric layer (1210) or coating solder balls (140); in the latter case, the solder (140C) sinks within the dielectric material (1210) upon removal of the material (1250) and subsequent reflow. In some embodiments, the solder connections (210) may also be formed in openings (2220) in a dielectric layer (2210) (photoimageable polymer or inorganic) by solder paste printing and/or solder ball jet placement followed by reflow to let the solder sink to the bottom of the openings (2220), with possible repetition of the process and possible use of different solders in the different steps. The solder connections (210, 210.1, 210.2) may be used for bonding one or more structures (HOB, HOC) (e.g. an integrated circuit die or wafer, a packaging substrate or a package) to a structure (110A) (a wiring substrate) on which a die (HOB) is flip-chip connected. The solder connections (210, 210.1, 210.2) may differ from each other, in particular in height, which can be used for attaching a structure (HOB) with posts (1240) of different heights or for attaching two structures (HOB, HOC) in the case of a stepped form of the dielectric layer, one of the structures (HOC) being possibly placed higher than the other structure (HOB). In some embodiments, the structure (HOA) may be removed after bonding to the structures (HOB, HOC) and a redistribution layer (3210) may be formed to provide connecting lines (3220) connecting the solder connections (210) to contact pads (120R) and possibly interconnecting between the solder connections (210) and/or between the contact pads (120R).

Abstract translation: 在一些实施例中，为了增加将不同结构与一个或多个焊球连接的焊料连接的高度与间距比，当焊接球（140）表面的一部分（510）形成在 一个结构（110）和/或当连接被附接到另一个结构（HOB）时。 结构（110）可以是集成电路，插入器，刚性或柔性布线基板，印刷电路板，一些其它封装基板或集成电路封装。 在一些实施例中，焊料球（140.1,140.2）仅在熔化时被中间焊球（140i）连接。 任何焊球（140,140i）可以具有由焊料壳（140S）涂覆的非焊料中心芯（140C）。 一些熔融或软化的焊料可能被挤出，以形成“挤出”区域（520,520A，520B，520.1,520.2）。 在一些实施例中，在结构（110A）上的如上所述的焊料连接（210）可被电介质层（1210）包围，并且可以凹入该层（1210）中的孔（1230）中， 以在结构（110A，110B）的附接期间帮助将结构的柱（1240）与连接件（210）对齐。 电介质层（1210）可以通过模制形成。 介电层可以包括多个层（1210.1,1212.2），“剃光”（部分去除）以暴露焊料连接（210）。 或者，可以在形成电介质层（1210）或涂覆焊球（140）之前使用升华或蒸发的材料（1250）形成凹陷的焊料连接（210），放置在焊料（210）的顶部上。 在后一种情况下，当去除材料（1250）和随后的回流时，焊料（140C）在电介质材料（1210）内下沉。 在一些实施例中，焊料连接（210）还可以通过焊膏印刷和/或焊球喷射放置形成在电介质层（2210）（可光成像的聚合物或无机）中的开口（2220）中，然后回流以使焊料 沉入开口（2220）的底部，可能重复该过程并可能在不同步骤中使用不同的焊料。 焊接连接（210,210.1,210.2）可以用于将一个或多个结构（HOB，HOC）（例如，集成电路管芯或晶片，封装衬底或封装）结合到结构（110A）（布线基板 ），其上晶片（HOB）被倒装连接。 焊接连接（210,210.1,210.2）可以彼此不同，特别是在高度上可以不同，其可用于将结构（HOB）与不同高度的柱（1240）连接或用于附接两个结构（HOB，HOC） 在阶梯形状的电介质层的情况下，结构（HOC）中的一个可能被放置得高于其他结构（HOB）。 在一些实施例中，可以在结合到结构（HOB，HOC）之后去除结构（HOA），并且可以形成再分布层（3210），以提供将焊接连接（210）连接到接触焊盘的连接线（3220） 120R），并且可能在焊料连接（210）和/或接触焊盘（120R）之间互连。

公开(公告)号：WO2011146579A3

公开(公告)日：2012-02-23

申请号：PCT/US2011036941

申请日：2011-05-18

Applicant: VERTICAL CIRCUITS INC ,  CO REYNALDO ,  LEAL JEFFREY S ,  PANGRLE SUZETTE K ,  MCGRATH SCOTT ,  MELCHER DEANN EILEEN ,  BARRIE KEITH L ,  VILLLAVICENCIO GRANT ,  DEL ROSARIO ELMER M ,  BRAY JOHN R

Inventor： CO REYNALDO ,  LEAL JEFFREY S ,  PANGRLE SUZETTE K ,  MCGRATH SCOTT ,  MELCHER DEANN EILEEN ,  BARRIE KEITH L ,  VILLLAVICENCIO GRANT ,  DEL ROSARIO ELMER M ,  BRAY JOHN R

IPC: H01L23/12 ,  H01L23/48

CPC classification number: H01L25/0657 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3171 ,  H01L23/3185 ,  H01L23/3192 ,  H01L24/03 ,  H01L24/05 ,  H01L24/18 ,  H01L24/24 ,  H01L24/82 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2224/02371 ,  H01L2224/03002 ,  H01L2224/03318 ,  H01L2224/0332 ,  H01L2224/03632 ,  H01L2224/03848 ,  H01L2224/05016 ,  H01L2224/05017 ,  H01L2224/0529 ,  H01L2224/05553 ,  H01L2224/24051 ,  H01L2224/24145 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2224/94 ,  H01L2225/06551 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/03

Abstract: Methods for forming connectors on die pads at a wafer level of processing include forming spots of a curable electrically conductive material over die pads and extending to or over the interconnect die edge; curing the conductive material; and in a wafer cutting procedure thereafter severing the spots. Also, die pad to z-interconnect connectors formed by the methods, and shaped and dimensioned accordingly. Also, stacked die assemblies and stacked die packages containing die prepared according to the methods and having die pad to z-interconnect connectors formed by the methods and shaped and dimensioned accordingly.

Abstract translation: 在晶片级处理中在芯片焊盘上形成连接器的方法包括在芯片焊盘上形成可固化的导电材料的点并且延伸到互连芯片边缘上或之上; 固化导电材料; 并且在切割步骤之后切断斑点。 而且，通过这些方法形成的管芯焊盘到z-互连连接器，并相应地成形和尺寸。 而且，堆叠的模具组件和包含根据方法制备的模具的堆叠模具组件，并且具有通过所述方法形成并且形状和尺寸的模具垫到z互连连接器。