公开(公告)号：US6044548A

公开(公告)日：2000-04-04

申请号：US038366

申请日：1998-03-10

申请人： Thomas H. Distefano ,  John W. Smith, Jr.

发明人： Thomas H. Distefano ,  John W. Smith, Jr.

IPC分类号： H01L21/48 ,  H01L21/60 ,  H01L23/49 ,  H01L23/498 ,  H05K3/34

CPC分类号： H01L24/10 ,  H01L21/486 ,  H01L21/4885 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/45144 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85205 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/19041 ,  H01L2924/19042 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49208

摘要： A method of making connections to a microelectronic unit includes the steps of providing a connection component having a flexible dielectric top sheet, a plurality of terminals on the top sheet and a plurality of electrically conductive, elongated flexible leads connected to the terminals and extending side-by-side downwardly from the terminals away from the top sheet to bottom ends remote from the top sheet. The connection component is then engaged with a front surface of a microelectronic unit having an array of contacts thereon while subjecting the connection component and the microelectronic unit to heat and pressure so that bottom ends of the leads remote from the top sheet bond with the contacts on the microelectronic unit to form electrical connections therewith.

摘要翻译： 制造与微电子单元的连接的方法包括以下步骤：提供具有柔性电介质顶片的连接部件，顶片上的多个端子和连接到端子的多个导电细长柔性引线， 从端子向上离开顶片到远离顶片的底端。 然后，连接部件与具有触点阵列的微电子单元的前表面接合，同时对连接部件和微电子单元进行加热和压力，使得远离顶片的引线的底端与触点接合在一起 微电子单元与其形成电连接。

公开(公告)号：US06255738B1

公开(公告)日：2001-07-03

申请号：US08940477

申请日：1997-09-30

申请人： Thomas H. Distefano ,  Craig Mitchell ,  Mark Thorson ,  Zlata Kovac

发明人： Thomas H. Distefano ,  Craig Mitchell ,  Mark Thorson ,  Zlata Kovac

IPC分类号： H01L2329

CPC分类号： H01L23/4985 ,  H01L23/24 ,  H01L23/293 ,  H01L2924/0002 ,  H01L2924/00

摘要： Filled, curable siloxane encapsulant compositions containing a curable siloxane base resin with functional groups reactive with functional groups of a hardener compound to form a polysiloxane, and filler particles with surface functional groups reactive with the hardener compound functional groups, wherein the filler particles have at least a bi-modal particle packing distribution of first filler particles having a first diameter and second filler particles having a second diameter smaller than the first diameter, and the first and second filler particles are present in amounts effective to provide a particle packing distribution with a relative bulk volume of at least about 90 percent. Tri-modal particle packing distributions of the first and second filler particles with third filler particles having a third diameter smaller than the second diameter are preferred, with the first, second and third filler particles being present in amounts effective to provide a tri-modal particle packing distribution with a relative bulk volume of at least about 95 percent. Encapsulant kits, cured encapsulant compositions in which filler particles are individually covalently bonded to one or more polysiloxane polymer chains, microelectronic assemblies incorporating the cured encapsulant compositions, and methods for preparing the curable encapsulant compositions are also disclosed.

摘要翻译： 含有具有与硬化剂化合物的官能团反应形成聚硅氧烷的官能团的可固化硅氧烷基础树脂的填充的可固化的硅氧烷密封剂组合物和具有与硬化剂化合物官能团反应的表面官能团的填料颗粒，其中填料颗粒至少具有 具有第一直径的第一填料颗粒和具有小于第一直径的第二直径的第二填料颗粒的双模式颗粒填充分布，并且第一和第二填料颗粒以有效提供颗粒填充分布的量存在于相对 体积至少约90％。 优选具有第三直径小于第二直径的第三填料颗粒的第一和第二填料颗粒的三模式颗粒填充分布，其中第一，第二和第三填料颗粒以有效提供三模式颗粒的量存在 填料分布的相对体积体积至少约95％。 还公开了封装剂试剂盒，固化的密封剂组合物，其中填料颗粒单独地共价键合到一个或多个聚硅氧烷聚合物链上，结合固化的密封剂组合物的微电子组件以及制备可固化的密封剂组合物的方法。

公开(公告)号：US06202297B1

公开(公告)日：2001-03-20

申请号：US09079336

申请日：1998-05-14

申请人： Anthony B. Faraci ,  James B. Zaccardi ,  Thomas H. Distefano ,  John W. Smith

发明人： Anthony B. Faraci ,  James B. Zaccardi ,  Thomas H. Distefano ,  John W. Smith

IPC分类号： H05K330

CPC分类号： H05K7/1084 ,  H01R12/714 ,  H01R13/24 ,  H05K3/326 ,  H05K3/4092 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49144

摘要： A connector for microelectronic devices having bump leads and methods for fabricating and using the connector. A dielectric substrate has a plurality of posts extending upwardly from a front surface. The posts may be arranged in an array of post groups each group defining a gap therebetween. A generally laminar contact extends from each post top. The bump leads are each inserted within a respective gap thereby engaging the contacts which wipe against the bump lead as it continues to be inserted. Typically, distal portions of the contacts deflect downwardly toward the substrate and outwardly away from the center of the gap as the bump lead is inserted into a gap.

摘要翻译： 具有凸起引线的微电子器件的连接器和用于制造和使用连接器的方法。 电介质基板具有从前表面向上延伸的多个柱。 柱可以以每组在其间限定间隙的柱组的排列布置。 大体层状接触从每个顶部延伸。 凸块引线各自插入在相应的间隙内，从而使其接触，当其继续插入时，触头抵靠凸起引线。 通常，当凸块引线插入到间隙中时，触头的远端部分向下偏转朝向基板并向外远离间隙的中心。

公开(公告)号：US5934914A

公开(公告)日：1999-08-10

申请号：US845016

申请日：1997-04-22

申请人： Joseph Fjelstad ,  John W. Smith ,  Thomas H. Distefano ,  James Zaccardi ,  A. Christian Walton

发明人： Joseph Fjelstad ,  John W. Smith ,  Thomas H. Distefano ,  James Zaccardi ,  A. Christian Walton

IPC分类号： B23K1/19 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/28 ,  H01L21/48 ,  H01L23/48 ,  H01L23/498 ,  H01R4/02 ,  H01R12/00 ,  H01R12/52 ,  H01R12/57 ,  H01R12/70 ,  H01R12/71 ,  H01R13/24 ,  H01R43/16 ,  H05K1/11 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K7/08 ,  H05K7/10 ,  H01R9/09

CPC分类号： H05K7/1084 ,  G01R1/0466 ,  G01R1/06744 ,  G01R1/07357 ,  H01L21/4853 ,  H01L23/49816 ,  H01L23/49827 ,  H01R13/2485 ,  H05K3/326 ,  H05K3/3436 ,  H05K7/1069 ,  G01R1/06711 ,  G01R1/06727 ,  G01R1/06733 ,  G01R3/00 ,  H01L2224/16237 ,  H01L2224/45144 ,  H01L2224/8114 ,  H01L2224/81385 ,  H01L2224/81899 ,  H01L24/81 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/30107 ,  H01R12/7076 ,  H05K1/118 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/1059 ,  H05K2201/10734 ,  H05K3/3431 ,  H05K3/4092 ,  Y02P70/613 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49204 ,  Y10T29/4921 ,  Y10T29/49222 ,  Y10T29/49224

摘要： Microelectronic contacts, such as flexible, tab-like, cantilever contacts, are provided with asperities disposed in a regular pattern. Each asperity has a sharp feature at its tip remote from the surface of the contact. As mating microelectronic elements are engaged with the contacts, a wiping action causes the sharp features of the asperities to scrape the mating element, so as to provide effective electrical interconnection and, optionally, effective metallurgical bonding between the contact and the mating element upon activation of a bonding material.

公开(公告)号：US5776796A

公开(公告)日：1998-07-07

申请号：US726697

申请日：1996-10-07

申请人： Thomas H. Distefano ,  John W. Smith ,  Joseph Fjelstad ,  Craig S. Mitchell ,  Konstantine Karavakis

发明人： Thomas H. Distefano ,  John W. Smith ,  Joseph Fjelstad ,  Craig S. Mitchell ,  Konstantine Karavakis

IPC分类号： H01L21/56 ,  H01L21/68 ,  H01L23/24 ,  H01L23/31 ,  H01L23/495 ,  H01L21/44

CPC分类号： H01L21/568 ,  H01L21/56 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/24 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49572 ,  H01L24/32 ,  H01L24/50 ,  H01L24/97 ,  H01L2224/11003 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12042

摘要： A method of encapsulating a semiconductor device. The encapsulation method includes a semiconductor chip package assembly having a spacer layer between a top surface of a sheet-like substrate and a contact bearing surface of a semiconductor chip, wherein the substrate has conductive leads thereon, the leads being electrically connected to terminals on a first end and bonded to respective chip contacts on a second end. Typically, the spacer layer is comprised of a compliant or elastomeric material. A protective layer is attached on a bottom surface of the substrate so as to cover the terminals on the substrate. A flowable, curable encapsulant material is deposited around a periphery of the semiconductor chip after the attachment of the protective layer so as to encapsulate the leads. The encapsulant material is then cured. Typically, this encapsulation method is performed on a plurality of chip assemblies simultaneously.

摘要翻译： 一种封装半导体器件的方法。 封装方法包括：半导体芯片封装组件，其具有在片状基板的顶表面和半导体芯片的接触支承表面之间的间隔层，其中，所述基板在其上具有导电引线，所述引线电连接到 第一端并且在第二端上结合到各个芯片触点。 通常，间隔层由顺应性或弹性体材料构成。 保护层附着在基板的底面，以覆盖基板上的端子。 在安装保护层以便封装引线之后，可流动的可固化的密封剂材料围绕半导体芯片的周边沉积。 然后固化密封材料。 通常，这种封装方法同时在多个芯片组件上执行。

公开(公告)号：US5830782A

公开(公告)日：1998-11-03

申请号：US678808

申请日：1996-07-12

申请人： John W. Smith ,  Thomas H. Distefano

发明人： John W. Smith ,  Thomas H. Distefano

IPC分类号： H01L21/20 ,  H01L21/60 ,  H01L23/12 ,  H01L23/36 ,  H01L23/48

CPC分类号： H01L21/4839 ,  H01L21/561 ,  H01L21/6836 ,  H01L23/22 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L23/544 ,  H01L23/642 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/94 ,  H01L24/97 ,  H05K3/4084 ,  H01L2221/68327 ,  H01L2223/54426 ,  H01L2224/0401 ,  H01L2224/05644 ,  H01L2224/13016 ,  H01L2224/13018 ,  H01L2224/13026 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13582 ,  H01L2224/13611 ,  H01L2224/13617 ,  H01L2224/13638 ,  H01L2224/13644 ,  H01L2224/1412 ,  H01L2224/16057 ,  H01L2224/16225 ,  H01L2224/17104 ,  H01L2224/29191 ,  H01L2224/45124 ,  H01L2224/48744 ,  H01L2224/73204 ,  H01L2224/7525 ,  H01L2224/753 ,  H01L2224/75701 ,  H01L2224/75702 ,  H01L2224/75744 ,  H01L2224/75745 ,  H01L2224/75802 ,  H01L2224/75804 ,  H01L2224/75822 ,  H01L2224/75824 ,  H01L2224/81007 ,  H01L2224/81091 ,  H01L2224/8113 ,  H01L2224/81132 ,  H01L2224/81192 ,  H01L2224/81203 ,  H01L2224/81207 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/81457 ,  H01L2224/81464 ,  H01L2224/81469 ,  H01L2224/81825 ,  H01L2224/8183 ,  H01L2224/819 ,  H01L2224/83005 ,  H01L2224/83104 ,  H01L2224/8385 ,  H01L2224/83855 ,  H01L2224/83862 ,  H01L2224/95001 ,  H01L2224/97 ,  H01L24/05 ,  H01L24/29 ,  H01L24/75 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01066 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/19043 ,  H01L2924/351 ,  H05K1/118 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2203/063 ,  H05K3/361

摘要： A method of making a microelectronic assembly includes bonding a plurality of lead connection sections arranged in a row to contacts of a microelectronic element such as a semiconductor chip having contacts in rows at the periphery of the chip. The leads have terminal sections secured to a dielectric support structure, and horizontally curved sections between the terminal regions and bond regions. After bonding, the dielectric support structure is lifted upwardly relative to the chip, so as to bend the leads into a vertically-extensive orientation. Partial straightening of the original horizontal curvature allows each lead to stretch and accommodate the vertical movement.

摘要翻译： 制造微电子组件的方法包括将布置成行的多个引线连接部分接合到微电子元件的触点，例如在芯片周边具有行的触点的半导体芯片。 引线具有固定到电介质支撑结构的端子部分，以及端子区域和接合区域之间的水平弯曲部分。 在接合之后，电介质支撑结构相对于芯片向上提升，以便将引线弯曲成垂直方向。 原始水平曲率的部分矫直允许每个导线拉伸并适应垂直运动。

公开(公告)号：US06468836B1

公开(公告)日：2002-10-22

申请号：US09547200

申请日：2000-04-12

申请人： Thomas H. Distefano ,  Joseph Fjelstad ,  John W. Smith

发明人： Thomas H. Distefano ,  Joseph Fjelstad ,  John W. Smith

IPC分类号： H01L2182

CPC分类号： H01L24/48 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/85207 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00011 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399

摘要： A semiconductor chip package having an internal laterally curved lead in order to compensate for the CTE mismatch between a semiconductor chip and a supporting substrate, such as a PWB.

摘要翻译： 一种具有内部横向弯曲引线的半导体芯片封装，以补偿半导体芯片和诸如PWB的支撑基板之间的CTE失配。

公开(公告)号：US06365436B1

公开(公告)日：2002-04-02

申请号：US09712631

申请日：2000-11-14

申请人： Tony Faraci ,  Thomas H. Distefano ,  John W. Smith

发明人： Tony Faraci ,  Thomas H. Distefano ,  John W. Smith

IPC分类号： H01L2144

CPC分类号： H01L24/86 ,  H01L24/45 ,  H01L2224/16 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/7965 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/48

摘要： A plurality of separate semiconductor chips, each having a contact-bearing surface and contacts on such surface, are disposed in an array so that the contact-bearing surfaces face and define a first surface of the array. A flexible, dielectric sheet with terminals thereon overlies the first or contact bearing surface of the semiconductor chips. Elongated leads are disposed between the dielectric element and the semiconductor chips. Each lead has a first end connected to a terminal on the dielectric element, and a second end connected to a contact on a semiconductor chip in the array. All of the leads are formed simultaneously by moving the dielectric element and the array relative to one another to simultaneously displace all of the first ends of the leads relative to all of the second ends. The dielectric element is subdivided after the forming step so as to leave one region of the dielectric element connected to each chip and thereby form individual units each including one chip, or a small number of chips.

摘要翻译： 多个单独的半导体芯片（每个具有接触表面和在该表面上的接触）被布置成阵列，使得接触表面面对并限定阵列的第一表面。 具有端子的柔性介电片覆盖在半导体芯片的第一或接触支承表面上。 细长引线设置在电介质元件和半导体芯片之间。 每个引线具有连接到电介质元件上的端子的第一端，以及连接到阵列中的半导体芯片上的触点的第二端。 所有的引线通过相对于彼此移动介质元件和阵列而同时形成，以同时相对于所有第二端移位引线的所有第一端。 介电元件在形成步骤之后被细分，以便将电介质元件的一个区域连接到每个芯片，从而形成各自包括一个芯片或少量芯片的单元。

公开(公告)号：US06286205B1

公开(公告)日：2001-09-11

申请号：US09209226

申请日：1998-12-10

申请人： Anthony B. Faraci ,  James B. Zaccardi ,  Thomas H. Distefano ,  John W. Smith

发明人： Anthony B. Faraci ,  James B. Zaccardi ,  Thomas H. Distefano ,  John W. Smith

IPC分类号： H05K330

CPC分类号： H05K7/1084 ,  H01R12/714 ,  H01R13/24 ,  H05K3/326 ,  H05K3/4092 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49144

摘要： A method for making connections to a microelectronic device having bump leads thereon. A substrate is provided having a front surface and a plurality of electrically conductive posts extending upwardly from the front surface. The posts are disposed in groups, wherein the posts of each group define a gap therebetween. Contacts are provided extending generally horizontally outwardly from each post remote from the front surface of the substrate. The microelectronic device is assembled to the substrate and posts so that the bump leads penetrate into the gaps and engage the contacts which wipe against the bump leads as they are inserted.

摘要翻译： 一种用于连接到其上具有凸块引线的微电子器件的方法。 提供了具有前表面和从前表面向上延伸的多个导电柱的衬底。 柱被分组地布置，其中每组的柱在它们之间限定了间隙。 提供从远离基板的前表面的每个支柱大致水平向外延伸的触点。 微电子器件被组装到衬底上并且固定，使得凸起引线插入到间隙中并且接合触头，这些接触件在它们被插入时擦拭凸起引线。

公开(公告)号：US06208025B1

公开(公告)日：2001-03-27

申请号：US09413410

申请日：1999-10-06

申请人： Pieter H. Bellaar ,  Thomas H. Distefano ,  Joseph Fjelstad ,  Christopher M. Pickett ,  John W. Smith

发明人： Pieter H. Bellaar ,  Thomas H. Distefano ,  Joseph Fjelstad ,  Christopher M. Pickett ,  John W. Smith

IPC分类号： H01L2348

CPC分类号： H01L23/49816 ,  H01L23/4985 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K3/284 ,  H05K3/3436 ,  H05K3/4084 ,  H05K2201/049 ,  H05K2201/10234 ,  H05K2201/10378 ,  H05K2201/10977 ,  H05K2203/041 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

摘要： A microelectronic component for mounting a rigid substrate, such as a hybrid circuit to a rigid support substrate, such as a printed circuit board. The microelectronic component includes a rigid interposer which may have a chip mounted on its first surface; a pattern of contacts on the rigid interposer; a flexible interposer overlying the second surface of the rigid interposer; a pattern of terminals on the flexible interposer; flexible leads; and solder coated copper balls mounted on the flexible interposer. The microelectronic component may have a socket assembly mounted on the first surface of the rigid interposer. The microelectronic component may be mounted on a rigid support substrate.

摘要翻译： 一种微电子部件，用于将诸如混合电路的刚性基板安装到刚性支撑基板，例如印刷电路板。 微电子部件包括可以在其第一表面上安装芯片的刚性插入器; 刚性插入件上的接触图案; 位于刚性插入件的第二表面上的柔性插入件; 柔性插入器上的端子图案; 柔性线 以及焊接涂覆的铜球安装在柔性插入件上。 微电子部件可以具有安装在刚性插入件的第一表面上的插座组件。 微电子部件可以安装在刚性支撑基板上。