-
公开(公告)号:CN102651357B
公开(公告)日:2016-09-28
申请号:CN201210034217.5
申请日:2012-02-15
申请人: 精工爱普生株式会社
发明人: 今井英生
IPC分类号: H01L23/48 , H01L25/065
CPC分类号: H01L23/481 , H01L21/76898 , H01L23/562 , H01L25/0657 , H01L25/074 , H01L2224/03462 , H01L2224/0401 , H01L2224/05009 , H01L2224/05553 , H01L2224/05567 , H01L2224/0557 , H01L2224/05571 , H01L2224/05609 , H01L2224/05611 , H01L2224/05613 , H01L2224/05616 , H01L2224/05618 , H01L2224/05624 , H01L2224/05639 , H01L2224/05647 , H01L2224/05655 , H01L2224/06181 , H01L2224/11462 , H01L2224/11464 , H01L2224/13007 , H01L2224/13017 , H01L2224/13022 , H01L2224/13144 , H01L2224/16146 , H01L2224/16147 , H01L2224/16237 , H01L2224/8114 , H01L2224/81191 , H01L2224/81895 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2924/01327 , H01L2924/00
摘要: 本发明提供半导体装置、传感器以及电子设备,该传感器具有该半导体装置。在形成有突起电极的第二基板上层叠形成有贯通电极的第一基板,在贯通电极中具有凹部,突起电极进入并层叠在凹部,突起电极的顶端宽度比凹部的开口宽度小。
-
公开(公告)号:CN103915396A
公开(公告)日:2014-07-09
申请号:CN201310384819.8
申请日:2013-08-29
申请人: 台湾积体电路制造股份有限公司
IPC分类号: H01L23/31 , H01L23/488 , H01L21/60 , H01L21/50
CPC分类号: H01L25/105 , H01L21/4853 , H01L21/561 , H01L21/563 , H01L23/3135 , H01L23/481 , H01L23/49816 , H01L23/49827 , H01L23/538 , H01L23/5389 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/73 , H01L24/81 , H01L24/94 , H01L24/97 , H01L25/03 , H01L25/0657 , H01L25/50 , H01L2224/0401 , H01L2224/05147 , H01L2224/05557 , H01L2224/056 , H01L2224/05611 , H01L2224/05613 , H01L2224/05616 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05684 , H01L2224/1132 , H01L2224/11334 , H01L2224/11849 , H01L2224/13082 , H01L2224/131 , H01L2224/13147 , H01L2224/13564 , H01L2224/136 , H01L2224/1403 , H01L2224/14181 , H01L2224/16058 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/1705 , H01L2224/32145 , H01L2224/32225 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/81007 , H01L2224/81193 , H01L2224/831 , H01L2224/94 , H01L2224/97 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06565 , H01L2225/06568 , H01L2225/1023 , H01L2225/1058 , H01L2225/1088 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/18161 , H01L2224/81 , H01L2924/00012 , H01L2224/83 , H01L2924/00 , H01L2224/03 , H01L2224/11 , H01L2924/014 , H01L2924/01047 , H01L2924/01029 , H01L2924/01083 , H01L2924/00014
摘要: 本发明公开的一种形成管芯封装件和层叠封装(PoP)结构的原理的描述性实施例包括:在管芯封装件的外部连接件的金属球上方形成焊膏层。焊膏层保护金属球不被氧化。此外,所述焊膏层能够与另一个管芯封装件进行焊料与焊料之间的接合。进一步地,焊膏层移动形成在焊膏层和金属球之间且位于管芯封装件的模塑料的表面下方的金属间化合物(IMC)层。具有位于表面下方的IMC层增强了两个管芯封装件之间的接合结构。本发明还公开了一种层叠封装接合结构及其形成方法。
-
公开(公告)号:CN102651357A
公开(公告)日:2012-08-29
申请号:CN201210034217.5
申请日:2012-02-15
申请人: 精工爱普生株式会社
发明人: 今井英生
IPC分类号: H01L23/48 , H01L25/065
CPC分类号: H01L23/481 , H01L21/76898 , H01L23/562 , H01L25/0657 , H01L25/074 , H01L2224/03462 , H01L2224/0401 , H01L2224/05009 , H01L2224/05553 , H01L2224/05567 , H01L2224/0557 , H01L2224/05571 , H01L2224/05609 , H01L2224/05611 , H01L2224/05613 , H01L2224/05616 , H01L2224/05618 , H01L2224/05624 , H01L2224/05639 , H01L2224/05647 , H01L2224/05655 , H01L2224/06181 , H01L2224/11462 , H01L2224/11464 , H01L2224/13007 , H01L2224/13017 , H01L2224/13022 , H01L2224/13144 , H01L2224/16146 , H01L2224/16147 , H01L2224/16237 , H01L2224/8114 , H01L2224/81191 , H01L2224/81895 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2924/01327 , H01L2924/00
摘要: 本发明提供半导体装置、传感器以及电子设备,该传感器具有该半导体装置。在形成有突起电极的第二基板上层叠形成有贯通电极的第一基板,在贯通电极中具有凹部,突起电极进入并层叠在凹部,突起电极的顶端宽度比凹部的开口宽度小。
-
公开(公告)号:CN101521170A
公开(公告)日:2009-09-02
申请号:CN200810187362.0
申请日:2008-12-29
申请人: 奇梦达股份公司
发明人: 艾尔弗雷德·马丁 , 芭芭拉·哈斯勒 , 马丁·弗拉诺施 , 克劳斯-京特·奥珀曼
IPC分类号: H01L21/60 , H01L23/482
CPC分类号: H05K3/3452 , H01L24/05 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/03828 , H01L2224/0401 , H01L2224/05569 , H01L2224/0557 , H01L2224/05611 , H01L2224/05613 , H01L2224/05616 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/06136 , H01L2224/10125 , H01L2224/10145 , H01L2224/11013 , H01L2224/11332 , H01L2224/11334 , H01L2224/11422 , H01L2224/11622 , H01L2224/1181 , H01L2224/11849 , H01L2224/13006 , H01L2224/13012 , H01L2224/13014 , H01L2224/131 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/8109 , H01L2224/81205 , H01L2224/8123 , H01L2224/81815 , H01L2924/0002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/01067 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/1432 , H01L2924/1434 , H01L2924/1436 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H05K3/3484 , H05K2201/0989 , H05K2201/2081 , H05K2203/043 , H01L2924/00014 , H01L2224/05552
摘要: 本发明涉及一种焊接触点及其形成方法。相应地还涉及一种集成电路,包括衬底和衬底上的结构层。结构层包括到衬底的开口,在衬底上具有第一范围和第二范围,其中,第一范围和第二范围至少部分地与开口重叠。集成电路还包括第一范围区域内的第一材料和第二范围区域内的第二材料。第一材料通过焊接材料阻止潮湿,以及第二材料通过焊接材料提供潮湿。
-
公开(公告)号:CN100463236C
公开(公告)日:2009-02-18
申请号:CN200410081933.4
申请日:2000-01-28
申请人: 丰田合成株式会社
IPC分类号: H01L33/00
CPC分类号: H01L33/385 , H01L23/62 , H01L25/167 , H01L33/48 , H01L2224/05001 , H01L2224/0558 , H01L2224/16145 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2924/10253 , H01L2924/00014 , H01L2924/00 , H01L2224/05639 , H01L2224/05644 , H01L2224/05673 , H01L2924/01079 , H01L2924/013 , H01L2224/05655 , H01L2924/01047 , H01L2224/05657 , H01L2224/05623 , H01L2224/05672 , H01L2224/05613 , H01L2224/05683 , H01L2224/05681 , H01L2224/05181 , H01L2224/05171 , H01L2224/05671 , H01L2224/05684 , H01L2224/05184 , H01L2224/05166 , H01L2224/05666 , H01L2224/05647 , H01L2224/05147 , H01L2224/05164 , H01L2224/05664 , H01L2224/05669 , H01L2224/05169 , H01L2224/05111 , H01L2224/05611 , H01L2224/05624 , H01L2224/05124 , H01L2224/05157 , H01L2224/05123 , H01L2224/05172 , H01L2224/05149 , H01L2224/05649 , H01L2224/05113 , H01L2224/05183 , H01L2224/05118 , H01L2224/05618 , H01L2224/0518 , H01L2224/0568 , H01L2224/05679 , H01L2224/05179 , H01L2224/05139 , H01L2224/05144 , H01L2224/05155
摘要: 一种具有倒装芯片式的半导体发光元件的发光二极管,包括:一倒装芯片;和一由半导体基片制成的子座,在所述半导体基片内形成一过电压保护的二极管,并且在所述半导体基片上放置所述倒装芯片,其中电接触所述倒装芯片的一正电极和一负电极形成于所述子座上,所述正电极和所述负电极的至少一个具有引线焊接的焊盘,并且所述过电压保护的二极管形成于既不被所述倒装芯片覆盖也不被所述焊盘的任何一个部分覆盖的区域。本发明可将倒装芯片放置在一个引线框架上,使倒装芯片的中心轴线,与引线框架的抛物面的中心轴线重合。
-
公开(公告)号:CN104347593A
公开(公告)日:2015-02-11
申请号:CN201410168415.X
申请日:2014-04-24
申请人: 爱思开海力士有限公司
IPC分类号: H01L23/538 , H01L21/768
CPC分类号: H01L25/0657 , H01L23/3128 , H01L23/3171 , H01L23/481 , H01L24/05 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L25/0652 , H01L25/18 , H01L25/50 , H01L2224/0401 , H01L2224/05009 , H01L2224/0557 , H01L2224/05605 , H01L2224/05609 , H01L2224/05611 , H01L2224/05613 , H01L2224/05616 , H01L2224/05618 , H01L2224/05623 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/06181 , H01L2224/11462 , H01L2224/13016 , H01L2224/13017 , H01L2224/13147 , H01L2224/16146 , H01L2224/16147 , H01L2224/16225 , H01L2224/16235 , H01L2224/16237 , H01L2224/81203 , H01L2224/81898 , H01L2224/94 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06565 , H01L2924/15311 , H01L2224/81
摘要: 提供了层叠封装体。所述层叠封装体包括第一芯片和第二芯片。第一芯片包括:第一芯片本体、穿过第一芯片本体的第一穿通电极、以及设置在第一芯片本体的底表面上的绝缘层。第二芯片包括:第二芯片本体和设置在第二芯片本体的顶表面上的凸块。第一芯片和第二芯片垂直地层叠,使得凸块穿过绝缘层以穿入第一穿通电极,并且第二芯片本体的顶表面直接接触绝缘层。还提供了相关的制造方法、电子系统和存储卡。
-
公开(公告)号:CN103187387A
公开(公告)日:2013-07-03
申请号:CN201210159760.8
申请日:2012-05-22
申请人: 财团法人工业技术研究院
IPC分类号: H01L23/498 , H01L21/48 , H01L21/60
CPC分类号: H01L24/13 , H01L23/49816 , H01L24/11 , H01L24/16 , H01L24/81 , H01L2224/0346 , H01L2224/0401 , H01L2224/05022 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05552 , H01L2224/05559 , H01L2224/05572 , H01L2224/05613 , H01L2224/05618 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05666 , H01L2224/05671 , H01L2224/05684 , H01L2224/11462 , H01L2224/1147 , H01L2224/115 , H01L2224/11502 , H01L2224/11848 , H01L2224/11849 , H01L2224/11901 , H01L2224/11906 , H01L2224/13076 , H01L2224/13111 , H01L2224/13113 , H01L2224/13118 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13166 , H01L2224/13171 , H01L2224/13184 , H01L2224/16145 , H01L2224/16238 , H01L2224/16503 , H01L2224/16507 , H01L2224/81097 , H01L2224/81193 , H01L2224/8181 , H01L2924/00 , H01L2924/00012 , H01L2924/00014 , H01L2924/01014 , H01L2924/01029 , H01L2924/01047 , H01L2924/0105 , H01L2924/01322 , H01L2924/10253 , H01L2224/1146
摘要: 本发明公开了一种凸块结构,包括基板、焊垫、电极及凸出电极。所述焊垫设置于所述基板上。所述电极由第一金属材料制成,且设置于焊垫上。所述凸出电极由第二金属材料制成,且设置于所述电极上,其中所述凸出电极的截面积小于电极的截面积。
-
公开(公告)号:CN1194423C
公开(公告)日:2005-03-23
申请号:CN00101674.1
申请日:2000-01-28
IPC分类号: H01L33/00
CPC分类号: H01L33/385 , H01L23/62 , H01L25/167 , H01L33/48 , H01L2224/05001 , H01L2224/0558 , H01L2224/16145 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2924/10253 , H01L2924/00014 , H01L2924/00 , H01L2224/05639 , H01L2224/05644 , H01L2224/05673 , H01L2924/01079 , H01L2924/013 , H01L2224/05655 , H01L2924/01047 , H01L2224/05657 , H01L2224/05623 , H01L2224/05672 , H01L2224/05613 , H01L2224/05683 , H01L2224/05681 , H01L2224/05181 , H01L2224/05171 , H01L2224/05671 , H01L2224/05684 , H01L2224/05184 , H01L2224/05166 , H01L2224/05666 , H01L2224/05647 , H01L2224/05147 , H01L2224/05164 , H01L2224/05664 , H01L2224/05669 , H01L2224/05169 , H01L2224/05111 , H01L2224/05611 , H01L2224/05624 , H01L2224/05124 , H01L2224/05157 , H01L2224/05123 , H01L2224/05172 , H01L2224/05149 , H01L2224/05649 , H01L2224/05113 , H01L2224/05183 , H01L2224/05118 , H01L2224/05618 , H01L2224/0518 , H01L2224/0568 , H01L2224/05679 , H01L2224/05179 , H01L2224/05139 , H01L2224/05144 , H01L2224/05155
摘要: 一种具有倒装芯片式半导体发光组件的发光二极管,包括:一倒装芯片;和由一半导体基片制成的一子座,其中形成有一过电压保护二极管,并且在其上放置所述倒装芯片,其中,与所述倒装芯片电连接的一正电极和一负电极形成于所述子座上,所述正、负电极中至少一个具有一用于引线焊接的焊接区,并且所述过电压保护的二极管形成于一既不被所述倒装芯片覆盖也不被所述焊接区的任何一个部分覆盖的区域。本发明可将倒装晶片放置在一个引线框架上,使倒装晶片的中心轴线,与引线框架的抛物面的中心轴线重合。
-
公开(公告)号:CN103367291B
公开(公告)日:2016-02-24
申请号:CN201210587511.9
申请日:2012-12-28
申请人: 台湾积体电路制造股份有限公司
IPC分类号: H01L23/488 , H01L21/60
CPC分类号: H01L24/81 , H01L21/56 , H01L23/3114 , H01L23/3121 , H01L23/49811 , H01L24/05 , H01L24/06 , H01L24/13 , H01L24/16 , H01L24/48 , H01L24/85 , H01L25/0657 , H01L25/105 , H01L2224/0401 , H01L2224/04042 , H01L2224/05557 , H01L2224/05571 , H01L2224/05611 , H01L2224/05613 , H01L2224/05616 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/06155 , H01L2224/131 , H01L2224/13147 , H01L2224/16145 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/81192 , H01L2224/85 , H01L2225/0651 , H01L2225/06513 , H01L2225/06541 , H01L2225/06568 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/15311 , H01L2924/15321 , H01L2924/181 , H01L2924/18161 , H01L2924/00 , H01L2224/45099 , H01L2924/014 , H01L2224/05552 , H01L2924/00012
摘要: 所描述的形成用于封装件层叠的接合结构的实施方式包括去除下封装件的部分连接件和的模塑料。所描述的接合结构能够使得上封装件的连接件与下封装件的连接件的置放和对准更容易。因此,接合工艺的工艺窗口更宽。另外,接合结构具有更光滑的连接轮廓和平坦的接合面。因此,接合结构不太可能断裂。改进了封装件层叠结构的产量和形状因数。本发明还公开了封装件层叠结构及其形成方法。
-
公开(公告)号:CN103367291A
公开(公告)日:2013-10-23
申请号:CN201210587511.9
申请日:2012-12-28
申请人: 台湾积体电路制造股份有限公司
IPC分类号: H01L23/488 , H01L21/60
CPC分类号: H01L24/81 , H01L21/56 , H01L23/3114 , H01L23/3121 , H01L23/49811 , H01L24/05 , H01L24/06 , H01L24/13 , H01L24/16 , H01L24/48 , H01L24/85 , H01L25/0657 , H01L25/105 , H01L2224/0401 , H01L2224/04042 , H01L2224/05557 , H01L2224/05571 , H01L2224/05611 , H01L2224/05613 , H01L2224/05616 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/06155 , H01L2224/131 , H01L2224/13147 , H01L2224/16145 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/81192 , H01L2224/85 , H01L2225/0651 , H01L2225/06513 , H01L2225/06541 , H01L2225/06568 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/15311 , H01L2924/15321 , H01L2924/181 , H01L2924/18161 , H01L2924/00 , H01L2224/45099 , H01L2924/014 , H01L2224/05552 , H01L2924/00012
摘要: 所描述的形成用于封装件层叠的接合结构的实施方式包括去除下封装件的部分连接件和的模塑料。所描述的接合结构能够使得上封装件的连接件与下封装件的连接件的置放和对准更容易。因此,接合工艺的工艺窗口更宽。另外,接合结构具有更光滑的连接轮廓和平坦的接合面。因此,接合结构不太可能断裂。改进了封装件层叠结构的产量和形状因数。本发明还公开了封装件层叠结构及其形成方法。
-
-
-
-
-
-
-
-
-