公开(公告)号：US5838161A

公开(公告)日：1998-11-17

申请号：US640472

申请日：1996-05-01

Applicant: Salman Akram ,  David R. Hembree

Inventor： Salman Akram ,  David R. Hembree

IPC: G01R1/04 ,  G01R31/28 ,  G01R35/00 ,  G01R31/02

CPC classification number: G01R31/2884 ,  G01R35/00 ,  G01R1/0408 ,  G01R31/2818

Abstract: An interconnect for a semiconductor die includes integrally formed test structures for evaluating various electrical characteristics of the interconnect. The test structures can include Kelvin structures, van der Pauw structures, resistors, capacitors, contact chains, via chains, serpentine test structures, and antenna test structures. Among the electrical characteristics that can be evaluated are the resistivity of contact member, conductor and substrate components of the interconnect, contact resistance between the contact members and conductors and capacitance of the contact members and conductors with respect to the substrate.

Abstract translation: 用于半导体管芯的互连件包括用于评估互连的各种电特性的整体形成的测试结构。 测试结构可以包括开尔文结构，范德堡结构，电阻，电容器，接触链，通孔链，蛇形测试结构和天线测试结构。 可以评估的电气特性是互连部件的接触部件，导体和基板部件的电阻率，接触部件和导体之间的接触电阻以及接触部件和导体相对于基板的电容。

公开(公告)号：US5578934A

公开(公告)日：1996-11-26

申请号：US432111

申请日：1995-05-01

Applicant: Alan G. Wood ,  Warren M. Farnworth ,  Salman Akram ,  David R. Hembree

Inventor： Alan G. Wood ,  Warren M. Farnworth ,  Salman Akram ,  David R. Hembree

IPC: G01R31/26 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/28 ,  H01L21/60 ,  H01L21/66 ,  H01L21/68 ,  H01L23/13 ,  H01L23/498 ,  H05K3/00 ,  H05K3/40 ,  H05K3/42 ,  G01R31/02

CPC classification number: G01R1/07314 ,  G01R1/0433 ,  G01R1/0483 ,  G01R31/2886 ,  G01R31/2893 ,  H01L21/6835 ,  H01L22/20 ,  H01L23/13 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/80 ,  H01L24/85 ,  H05K3/4007 ,  G01R1/0466 ,  G01R3/00 ,  G01R31/2863 ,  G01R31/2889 ,  H01L2224/16145 ,  H01L2224/48 ,  H01L2224/85001 ,  H01L2224/85205 ,  H01L2225/06562 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15174 ,  H01L2924/19041 ,  H01L2924/30105 ,  H05K2201/0133 ,  H05K2201/0347 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2203/0307 ,  H05K2203/0723 ,  H05K3/0058 ,  H05K3/0067 ,  H05K3/423

Abstract: A method and apparatus for testing unpackaged semiconductor dice includes a mother board and a plurality of interconnects mounted on the mother board and adapted to establish a temporary electrical connection with the dice. The interconnects can be formed with a silicon substrate and raised contact members for contacting the bond pads of a die. Alternately the interconnects can be formed with micro bump contact members mounted on an insulating film. The mother board allows each die to be tested separately for speed and functionality and to also be burn-in tested in parallel using standard burn-in ovens. In an alternate embodiment testing is performed using a mother board/daughter board arrangement. Each daughter board includes interconnects that allow the dice to be tested individually for speed and functionality. Multipule daughter boards can then be mounted to the mother board for burn-in testing using standard burn-in ovens.

Abstract translation: 用于测试未封装半导体晶片的方法和装置包括安装在母板上的母板和多个互连件，并且适于与裸片建立临时电连接。 互连可以形成有硅衬底和用于接触管芯的接合焊盘的凸起的接触构件。 或者，互连可以由安装在绝缘膜上的微凸块接触构件形成。 母板允许每个模具分别测试速度和功能，并且还可以使用标准烧录炉并行测试。 在替代实施例中，使用母板/子板布置进行测试。 每个子板包括互连，允许骰子单独测试速度和功能。 然后可以将多个子板安装到母板上，以使用标准老化炉进行老化测试。

公开(公告)号：US5483174A

公开(公告)日：1996-01-09

申请号：US192391

申请日：1994-02-03

Applicant: David R. Hembree ,  Warren M. Farnworth

Inventor： David R. Hembree ,  Warren M. Farnworth

IPC: G01R1/04 ,  G01R31/28

CPC classification number: G01R31/2886 ,  G01R1/0483 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079

Abstract: Optical alignment techniques, such as those used in "flip chip" bonding, are used to establish ohmic contact with the die by means of raised portions on contact members. This permits accurate alignment with a temporary die fixture in order to test the die. The tested die can then be qualified under a known good die program as having an acceptable degree of reliability. This permits the die to be characterized prior to assembly, so that the die may then be transferred in an unpackaged form. The ohmic contact is preferably established by applying a compression force applied to the die against the substrate results in a limited penetration of the contact member into the bondpads. The arrangement may be used for establishing electrical contact and with a burn-in oven and with a discrete die tester.

Abstract translation: 光学对准技术，例如在“倒装芯片”接合中使用的那些技术被用于通过接触构件上的凸起部分与模具建立欧姆接触。 这允许与临时模具夹具精确对准以便测试模具。 然后，所测试的模具可以在已知的良好的模具程序下被认证为具有可接受的可靠度。 这允许在组装之前对模具进行表征，从而可以以未包装的形式转移模具。 欧姆接触优选通过将施加到管芯的压缩力施加到衬底上而形成，从而导致接触构件有限地渗透到接合垫中。 该装置可以用于建立电接触以及使用老化炉和离散模具测试器。

公开(公告)号：US5424652A

公开(公告)日：1995-06-13

申请号：US896297

申请日：1992-06-10

Applicant: David R. Hembree ,  Warren M. Farnworth ,  Alan G. Wood

Inventor： David R. Hembree ,  Warren M. Farnworth ,  Alan G. Wood

IPC: G01R1/04 ,  G01R31/28

CPC classification number: G01R31/2886 ,  G01R1/0483 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079

Abstract: A method and apparatus for testing a singularized semiconductor die prior to packaging the die, thereby allowing for the packaging or other use of only known good die. The apparatus employs a housing of ceramic or other workable material. Contact pads on the interior of the package are coupled to exterior leads with conductive traces. The back side of a semiconductor die to be tested is removably mounted to a lid, and the bond pads on the die are aligned with the contact pads on the interior of the package. The lid is attached to the package thereby electrically coupling the contact pads with the bond pads on the die. Since the package has conventional exterior form and function the package is operational as a functioning device.

Abstract translation: 一种用于在封装模具之前测试单数化半导体管芯的方法和装置，从而允许包装或仅使用已知的良好管芯。 该装置采用陶瓷或其他可加工材料的壳体。 封装内部的接触焊盘通过导电迹线耦合到外部引线。 要测试的半导体管芯的背面可拆卸地安装到盖上，并且管芯上的接合焊盘与封装内部的接触焊盘对准。 盖子附接到封装，从而将接触垫与模具上的接合焊盘电耦合。 由于包装具有传统的外观形式和功能，因此包装可以作为一个功能性的设备运行。

公开(公告)号：US5046389A

公开(公告)日：1991-09-10

申请号：US446785

申请日：1989-12-06

Applicant: Ted L. Thompson ,  David R. Hembree

Inventor： Ted L. Thompson ,  David R. Hembree

IPC: B21D28/34 ,  H01L21/00

CPC classification number: H01L21/67271 ,  B21D28/34 ,  Y10S83/942 ,  Y10T83/0467 ,  Y10T83/2159 ,  Y10T83/2166 ,  Y10T83/2213 ,  Y10T83/6563 ,  Y10T83/8845 ,  Y10T83/8858

Abstract: An inspection station punch block apparatus for removing a portion of an integrated circuit die lead from a lead frame. The missing lead is used to mark a defective die and is lataer monitored by a scanning means which causes rejection of the die from the lead frame. A method of carrying out this operation is also disclosed.

Abstract translation: 一种用于从引线框架去除集成电路裸片引线的一部分的检查站冲压块装置。 缺失的引线用于标记有缺陷的裸片，并且由扫描装置监视，这导致了引线框架的裸片的排除。 还公开了一种执行该操作的方法。

公开(公告)号：US09960148B2

公开(公告)日：2018-05-01

申请号：US13367158

申请日：2012-02-06

Applicant: Salman Akram ,  David R. Hembree

Inventor： Salman Akram ,  David R. Hembree

IPC: H01L25/065

CPC classification number: H01L25/0657 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05568 ,  H01L2224/16 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2224/05599 ,  H01L2224/05099

Abstract: Methods and apparatuses for transferring heat from stacked microfeature devices are disclosed herein. In one embodiment, a microfeature device assembly comprises a support member having terminals and a first microelectronic die having first external contacts carried by the support member. The first external contacts are operatively coupled to the terminals on the support member. The assembly also includes a second microelectronic die having integrated circuitry and second external contacts electrically coupled to the first external contacts. The first die is between the support member and the second die. The assembly can further include a heat transfer unit between the first die and the second die. The heat transfer unit includes a first heat transfer portion, a second heat transfer portion, and a gap between the first and second heat transfer portions such that the first external contacts and the second external contacts are aligned with the gap.

公开(公告)号：US09548286B2

公开(公告)日：2017-01-17

申请号：US12853105

申请日：2010-08-09

Applicant: Scott E. Sills ,  David R. Jenkins ,  David R. Hembree

Inventor： Scott E. Sills ,  David R. Jenkins ,  David R. Hembree

IPC: H01L33/40 ,  H01L33/48 ,  H01L25/075 ,  H01L23/00 ,  H01L25/16 ,  H01L33/60 ,  H01L33/64

CPC classification number: H01L25/0753 ,  H01L24/32 ,  H01L24/73 ,  H01L25/167 ,  H01L33/60 ,  H01L33/64 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01322 ,  H01L2924/12043 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A solid state light (“SSL”), a solid state emitter (“SSE”), and methods of manufacturing SSLs and SSEs. In one embodiment, an SSL comprises a packaging substrate having an electrical contact and a light emitting structure having a front side and a back side. The back side of the light emitting structure is superimposed with the electrical contact of the packaging substrate. The SSL can further include a temperature control element aligned with the light emitting structure and the electrical contact of the packaging substrate.

Abstract translation: 固态光（“SSL”），固态发射器（“SSE”）以及制造SSL和SSEs的方法。 在一个实施例中，SSL包括具有电接触的封装衬底和具有前侧和后侧的发光结构。 发光结构的背面与封装基板的电接触重叠。 SSL还可以包括与发光结构对准的温度控制元件和封装衬底的电接触。

公开(公告)号：US20120043670A1

公开(公告)日：2012-02-23

申请号：US13285490

申请日：2011-10-31

Applicant: David R. Hembree ,  Alan G. Wood

Inventor： David R. Hembree ,  Alan G. Wood

IPC: H01L25/00 ,  H01L21/60 ,  H01L21/58

CPC classification number: H01L24/16 ,  G01R1/06716 ,  G01R1/07307 ,  H01L21/486 ,  H01L21/565 ,  H01L21/568 ,  H01L21/76877 ,  H01L21/76885 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/49827 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/81 ,  H01L24/85 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/02125 ,  H01L2224/0233 ,  H01L2224/02333 ,  H01L2224/02335 ,  H01L2224/02372 ,  H01L2224/02373 ,  H01L2224/02375 ,  H01L2224/0333 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05548 ,  H01L2224/05552 ,  H01L2224/05554 ,  H01L2224/05555 ,  H01L2224/05567 ,  H01L2224/05572 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/06181 ,  H01L2224/1134 ,  H01L2224/13009 ,  H01L2224/13024 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/16146 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/45116 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45655 ,  H01L2224/45684 ,  H01L2224/45698 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48145 ,  H01L2224/48455 ,  H01L2224/48463 ,  H01L2224/4847 ,  H01L2224/48471 ,  H01L2224/48475 ,  H01L2224/48624 ,  H01L2224/48647 ,  H01L2224/48724 ,  H01L2224/48747 ,  H01L2224/48824 ,  H01L2224/48847 ,  H01L2224/4899 ,  H01L2224/48992 ,  H01L2224/78301 ,  H01L2224/85051 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85951 ,  H01L2225/06506 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/10155 ,  H01L2924/10161 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45164 ,  H01L2924/013 ,  H01L2924/00013

Abstract: A semiconductor module system includes a module substrate and first and second semiconductor components stacked on the module substrate. The stacked semiconductor components include through wire interconnects that form an internal signal transmission system for the module system. Each through wire interconnect includes a via, a wire in the via and first and second contacts on the wire.

Abstract translation: 半导体模块系统包括模块基板和堆叠在模块基板上的第一和第二半导体部件。 层叠的半导体部件包括形成用于模块系统的内部信号传输系统的通线互连。 每个通线互连包括通孔，通孔中的导线以及导线上的第一和第二触点。

公开(公告)号：US07935991B2

公开(公告)日：2011-05-03

申请号：US12114757

申请日：2008-05-03

Applicant: Alan G. Wood ,  William M. Hiatt ,  David R. Hembree

Inventor： Alan G. Wood ,  William M. Hiatt ,  David R. Hembree

IPC: H01L23/48 ,  H01L21/70 ,  H01L29/40

CPC classification number: H01L21/76898 ,  H01L21/4885 ,  H01L21/6835 ,  H01L21/6836 ,  H01L23/3114 ,  H01L23/481 ,  H01L23/4951 ,  H01L23/4985 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/50 ,  H01L24/78 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L24/86 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/05571 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/06102 ,  H01L2224/06136 ,  H01L2224/11003 ,  H01L2224/1131 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/114 ,  H01L2224/1147 ,  H01L2224/116 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/1319 ,  H01L2224/2518 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/4824 ,  H01L2224/4845 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/78301 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/85001 ,  H01L2224/851 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/19042 ,  Y10T29/53187 ,  Y10T29/53209 ,  H01L2924/00 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2224/83851 ,  H01L2224/05552

Abstract: A semiconductor component includes a semiconductor substrate having at least one conductive interconnect on the backside thereof bonded to an inner surface of a substrate contact. A stacked semiconductor component includes multiple semiconductor components in a stacked array having bonded connections between conductive interconnects on adjacent components. An image sensor semiconductor component includes a semiconductor substrate having light detecting elements on the circuit side, and conductive interconnects on the backside.

Abstract translation: 半导体部件包括在其背面具有至少一个导电互连的半导体衬底，其结合到衬底接触的内表面。 层叠的半导体部件包括堆叠阵列中的多个半导体部件，其具有在相邻部件上的导电互连之间的接合连接。 图像传感器半导体部件包括在电路侧具有光检测元件的半导体基板和背面的导电互连。

公开(公告)号：US07883908B2

公开(公告)日：2011-02-08

申请号：US12581255

申请日：2009-10-19

Applicant: David R. Hembree ,  Alan G. Wood

Inventor： David R. Hembree ,  Alan G. Wood

IPC: H01L21/60

CPC classification number: H01L24/16 ,  G01R1/06716 ,  G01R1/07307 ,  H01L21/486 ,  H01L21/565 ,  H01L21/568 ,  H01L21/76877 ,  H01L21/76885 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/49827 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/81 ,  H01L24/85 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/02125 ,  H01L2224/0233 ,  H01L2224/02333 ,  H01L2224/02335 ,  H01L2224/02372 ,  H01L2224/02373 ,  H01L2224/02375 ,  H01L2224/0333 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05548 ,  H01L2224/05552 ,  H01L2224/05554 ,  H01L2224/05555 ,  H01L2224/05567 ,  H01L2224/05572 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/06181 ,  H01L2224/1134 ,  H01L2224/13009 ,  H01L2224/13024 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/16146 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/45116 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45655 ,  H01L2224/45684 ,  H01L2224/45698 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48145 ,  H01L2224/48455 ,  H01L2224/48463 ,  H01L2224/4847 ,  H01L2224/48471 ,  H01L2224/48475 ,  H01L2224/48624 ,  H01L2224/48647 ,  H01L2224/48724 ,  H01L2224/48747 ,  H01L2224/48824 ,  H01L2224/48847 ,  H01L2224/4899 ,  H01L2224/48992 ,  H01L2224/78301 ,  H01L2224/85051 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85951 ,  H01L2225/06506 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/10155 ,  H01L2924/10161 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45164 ,  H01L2924/013 ,  H01L2924/00013

Abstract: A method for fabricating a semiconductor component with an encapsulated through wire interconnect includes the steps of providing a substrate having a first side, a second side and a substrate contact; forming a via in the substrate contact and the substrate to the second side; placing a wire in the via; forming a first contact on the wire proximate to the first side and a second contact on the wire proximate to the second side; and forming a polymer layer on the first side leaving the first contact exposed. The polymer layer can be formed using a film assisted molding process including the steps of: forming a mold film on tip portions of the bonding members, molding the polymer layer, and then removing the mold film to expose the tip portions of the bonding members. The through wire interconnect provides a multi level interconnect having contacts on opposing sides of the semiconductor substrate.

Abstract translation: 一种用封装的直通线互连制造半导体部件的方法包括以下步骤：提供具有第一面，第二面和基板接触的基板; 在基板接触中形成通孔，将基板形成到第二面; 将电线放在通孔中; 在靠近第一侧的导线上形成第一触点，并且在靠近第二侧的导线上形成第二触点; 并在第一侧上形成聚合物层，留下暴露的第一接触。 聚合物层可以使用薄膜辅助成型方法形成，包括以下步骤：在粘合部件的顶端部分上形成模具膜，模制聚合物层，然后移除模具膜以暴露粘合部件的末端部分。 通线互连提供了在半导体衬底的相对侧上具有触点的多电平互连。