公开(公告)号：US20170154875A1

公开(公告)日：2017-06-01

申请号：US15430943

申请日：2017-02-13

申请人： Invensas Corporation

发明人： Cyprian Emeka Uzoh ,  Rajesh Katkar

IPC分类号： H01L25/065 ,  H01L49/02 ,  B81B7/00 ,  H01L23/00

CPC分类号： H01L25/0657 ,  B81B7/0074 ,  H01L21/4853 ,  H01L23/3675 ,  H01L23/42 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/522 ,  H01L23/5383 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/24 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/16 ,  H01L25/50 ,  H01L28/10 ,  H01L28/20 ,  H01L28/40 ,  H01L2224/0239 ,  H01L2224/0332 ,  H01L2224/0333 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/03462 ,  H01L2224/03464 ,  H01L2224/0347 ,  H01L2224/03614 ,  H01L2224/0391 ,  H01L2224/03912 ,  H01L2224/03914 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05111 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05169 ,  H01L2224/05184 ,  H01L2224/05547 ,  H01L2224/05565 ,  H01L2224/05568 ,  H01L2224/05569 ,  H01L2224/05611 ,  H01L2224/05616 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05669 ,  H01L2224/05684 ,  H01L2224/1134 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/1147 ,  H01L2224/11903 ,  H01L2224/1191 ,  H01L2224/13022 ,  H01L2224/13023 ,  H01L2224/13025 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13169 ,  H01L2224/13184 ,  H01L2224/13565 ,  H01L2224/13616 ,  H01L2224/1403 ,  H01L2224/14131 ,  H01L2224/14132 ,  H01L2224/14134 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16148 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16265 ,  H01L2224/17181 ,  H01L2224/24147 ,  H01L2224/24227 ,  H01L2224/244 ,  H01L2224/32145 ,  H01L2224/3303 ,  H01L2224/33181 ,  H01L2224/45015 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48149 ,  H01L2224/4903 ,  H01L2224/73201 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81825 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H01L2924/1461 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/16251 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/3841 ,  H01L2924/00 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/01074 ,  H01L2924/01028 ,  H01L2924/01082 ,  H01L2224/05 ,  H01L2224/13 ,  H01L2224/81 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2224/45099

摘要： Apparatuses relating generally to a substrate are disclosed. In such an apparatus, first wire bond wires (“first wires”) extend from a surface of the substrate. Second wire bond wires (“second wires”) extend from the surface of the substrate. The first wires and the second wires are external to the substrate. The first wires are disposed at least partially within the second wires. The first wires are of a first height. The second wires are of a second height greater than the first height for coupling of at least one electronic component to the first wires at least partially disposed within the second wires.

公开(公告)号：US09666514B2

公开(公告)日：2017-05-30

申请号：US14686671

申请日：2015-04-14

申请人： Invensas Corporation

发明人： Cyprian Emeka Uzoh ,  Rajesh Katkar

IPC分类号： H05K1/00 ,  H01L23/498 ,  H01L21/48 ,  H01L23/538 ,  H01L23/15

CPC分类号： H01L23/562 ,  H01L21/4846 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/15 ,  H01L23/498 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/4985 ,  H01L23/49866 ,  H01L23/49894 ,  H01L23/5384 ,  H01L23/5387 ,  H05K1/0203 ,  H05K1/0326 ,  H05K2201/062 ,  H05K2201/10378

摘要： A substrate structure is presented that can include a porous polyimide material and electrodes formed in the porous polyimide material. In some examples, a method of forming a substrate can include depositing a barrier layer on a substrate; depositing a resist over the barrier layer; patterning and etching the resist; forming electrodes; removing the resist; depositing a porous polyimide aerogel; depositing a dielectric layer over the aerogel material; polishing a top side of the interposer to expose the electrodes; and removing the substrate from the bottom side of the interposer.

公开(公告)号：US20170148764A1

公开(公告)日：2017-05-25

申请号：US14951892

申请日：2015-11-25

申请人： Invensas Corporation

发明人： Liang Wang ,  Guilian Gao ,  Hong Shen ,  Rajesh Katkar ,  Belgacem Haba

IPC分类号： H01L25/065 ,  H01L23/00 ,  H01L23/31 ,  H01L21/683 ,  H01L21/56 ,  H01L23/498 ,  H01L21/48 ,  H01L25/00 ,  H01L23/367

CPC分类号： H01L25/0655 ,  H01L21/4846 ,  H01L21/56 ,  H01L21/6835 ,  H01L23/3114 ,  H01L23/3675 ,  H01L23/49838 ,  H01L24/11 ,  H01L24/17 ,  H01L24/81 ,  H01L25/50 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/116 ,  H01L2224/16057 ,  H01L2224/16227 ,  H01L2224/1703 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/97 ,  H01L2924/15311 ,  H01L2924/16251 ,  H01L2224/81 ,  H01L2224/83

摘要： A microelectronic assembly includes a dielectric element having bumps projecting from a first surface thereof, the bumps having end surfaces flush with a planarized encapsulation. A circuit structure having a thickness less than or equal to 10 microns, formed by depositing two or more dielectric layers and conductive layers on the respective dielectric layers, has electrically conductive features thereon which electrically contact the bumps. The circuit structure can be formed separately on a carrier and then joined with the bumps on the dielectric element, or the circuit structure can be formed by a build up process on the planarized surface of the encapsulation and the planarized surfaces of the bumps.

公开(公告)号：US20170141042A1

公开(公告)日：2017-05-18

申请号：US15353552

申请日：2016-11-16

申请人： Invensas Corporation

发明人： Ashok S. Prabhu ,  Rajesh Katkar

IPC分类号： H01L23/538 ,  H01L25/10 ,  H01L21/54 ,  H01L21/48 ,  H01L21/56 ,  H01L25/00 ,  H01L23/31 ,  H01L23/18

CPC分类号： H01L25/0657 ,  H01L21/288 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/54 ,  H01L21/56 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/76885 ,  H01L21/76895 ,  H01L23/18 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/5389 ,  H01L24/19 ,  H01L25/105 ,  H01L25/50 ,  H01L2221/68331 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/16225 ,  H01L2224/81005 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06548 ,  H01L2225/06572 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/15311 ,  H01L2924/19107 ,  H01L2924/3511

摘要： Methods and apparatuses relate generally to a packaged microelectronic device for a package-on-package device (“PoP”) with enhanced tolerance for warping. In one such packaged microelectronic device, at least one redistribution layer includes first interconnect pads on a lower surface and second interconnect pads on an upper surface of the at least one redistribution layer. Interconnect structures are on and extend away from corresponding upper surfaces of the second interconnect pads. A microelectronic device is coupled to an upper surface of the at least one redistribution layer. A dielectric layer surrounds at least portions of shafts of the interconnect structures. The interconnect structures have upper ends thereof protruding above an upper surface of the dielectric layer a distance to increase a warpage limit for a combination of at least the packaged microelectronic device and one other packaged microelectronic device directly coupled to protrusions of the interconnect structures.

公开(公告)号：US09646917B2

公开(公告)日：2017-05-09

申请号：US14289860

申请日：2014-05-29

申请人： Invensas Corporation

发明人： Rajesh Katkar ,  Cyprian Emeka Uzoh

IPC分类号： H01L23/48 ,  H01L21/768 ,  H01L23/00 ,  H01L23/498 ,  H01L21/48

CPC分类号： H01L21/486 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/6835 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/49827 ,  H01L24/43 ,  H01L24/46 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/023 ,  H01L2224/4502 ,  H01L2924/00014 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A component such as an interposer or microelectronic element can be fabricated with a set of vertically extending interconnects of wire bond structure. Such method may include forming a structure having wire bonds extending in an axial direction within one of more openings in an element and each wire bond spaced at least partially apart from a wall of the opening within which it extends, the element consisting essentially of a material having a coefficient of thermal expansion (“CTE”) of less than 10 parts per million per degree Celsius (“ppm/° C.”). First contacts can then be provided at a first surface of the component and second contacts provided at a second surface of the component facing in a direction opposite from the first surface, the first contacts electrically coupled with the second contacts through the wire bonds.

公开(公告)号：US20170069591A1

公开(公告)日：2017-03-09

申请号：US15357553

申请日：2016-11-21

申请人： Invensas Corporation

发明人： Rajesh Katkar ,  Tu Tam Vu ,  Bongsub Lee ,  Kyong-Mo Bang ,  Xuan Li ,  Long Huynh ,  Gabriel Z. Guevara ,  Akash Agrawal ,  Willmar Subido ,  Laura Wills Mirkarimi

IPC分类号： H01L23/00 ,  H01L25/065 ,  H01L21/78 ,  H01L25/10 ,  H01L23/31 ,  H01L21/56

CPC分类号： H01L24/49 ,  H01L21/486 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/48 ,  H01L24/85 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/4801 ,  H01L2224/48235 ,  H01L2224/484 ,  H01L2224/4845 ,  H01L2224/49171 ,  H01L2224/49173 ,  H01L2224/49177 ,  H01L2224/73217 ,  H01L2224/73267 ,  H01L2224/85005 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10272 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/2064 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/85399

摘要： An apparatus relates generally to a microelectronic package. In such an apparatus, a microelectronic die has a first surface, a second surface opposite the first surface, and a sidewall surface between the first and second surfaces. A plurality of wire bond wires with proximal ends thereof are coupled to either the first surface or the second surface of the microelectronic die with distal ends of the plurality of wire bond wires extending away from either the first surface or the second surface, respectively, of the microelectronic die. A portion of the plurality of wire bond wires extends outside a perimeter of the microelectronic die into a fan-out (“FO”) region. A molding material covers the first surface, the sidewall surface, and portions of the plurality of the wire bond wires from the first surface of the microelectronic die to an outer surface of the molding material.

摘要翻译： 一种装置一般涉及微电子封装。 在这种装置中，微电子管芯具有第一表面，与第一表面相对的第二表面和第一表面和第二表面之间的侧壁表面。 多个具有近端的引线接合线被耦合到微电子管芯的第一表面或第二表面，多个引线接合线的远端分别远离第一表面或第二表面 微电子模具。 多个引线接合线的一部分在微电子管芯的周边外延伸到扇出（“FO”）区域中。 成型材料覆盖第一表面，侧壁表面以及多个引线接合线从微电子管芯的第一表面到模制材料的外表面的部分。

公开(公告)号：US09548273B2

公开(公告)日：2017-01-17

申请号：US14704714

申请日：2015-05-05

申请人： Invensas Corporation

发明人： Guilian Gao ,  Cyprian Emeka Uzoh ,  Charles G. Woychik ,  Hong Shen ,  Arkalgud R. Sitaram ,  Liang Wang ,  Akash Agrawal ,  Rajesh Katkar

IPC分类号： H01L23/48 ,  H01L23/538 ,  H01L23/00 ,  H01L25/065 ,  H01L25/00 ,  H01L23/31 ,  H01L21/48

CPC分类号： H01L23/5385 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/147 ,  H01L23/15 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49827 ,  H01L24/05 ,  H01L24/08 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68331 ,  H01L2224/0401 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/08225 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32105 ,  H01L2224/32106 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48101 ,  H01L2224/48105 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/49097 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/15153 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/351 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： Die (110) and/or undiced wafers and/or multichip modules (MCMs) are attached on top of an interposer (120) or some other structure (e.g. another integrated circuit) and are covered by an encapsulant (160). Then the interposer is thinned from below. Before encapsulation, a layer (410) more rigid than the encapsulant is formed on the interposer around the die to reduce or eliminate interposer dishing between the die when the interposer is thinned by a mechanical process (e.g. CMP). Other features are also provided.

摘要翻译： 模具（110）和/或未开封的晶片和/或多芯片模块（MCM）被附接在插入器（120）或一些其它结构（例如另一集成电路）的顶部上并被密封剂（160）覆盖。 然后插入器从下面变薄。 在封装之前，在封装周围的插入件周围形成比密封剂更刚性的层（410），以通过机械工艺（例如CMP）来减小或消除插入件在裸片间的凹陷。 还提供其他功能。

公开(公告)号：US09543277B1

公开(公告)日：2017-01-10

申请号：US14830973

申请日：2015-08-20

申请人： Invensas Corporation

发明人： Bongsub Lee ,  Tu Tam Vu ,  Rajesh Katkar ,  Laura Wills Mirkarimi ,  Akash Agrawal ,  Kyong-Mo Bang ,  Gabriel Z. Guevara ,  Xuan Li ,  Long Huynh

IPC分类号： H01L25/065 ,  H01L23/00 ,  H01L25/00 ,  H01L23/31

CPC分类号： H01L25/0657 ,  H01L23/3128 ,  H01L24/03 ,  H01L24/06 ,  H01L24/43 ,  H01L24/46 ,  H01L25/50 ,  H01L2224/04042 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/49111 ,  H01L2224/49112 ,  H01L2224/49171 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/18165 ,  H01L2924/20751 ,  H01L2924/2075 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2224/05599

摘要： A fan-out microelectronic package is provided in which bond wires electrically couple bond pads on a microelectronic element, e.g., a semiconductor chip which may have additional traces thereon, with contacts at a fan-out area of a dielectric element adjacent an edge surface of the chip. The bond wires mechanically decouple the microelectronic element from the fan-out area, which can make the electrical interconnections less prone to reliability issues due to effects of differential thermal expansion, such as caused by temperature excursions during initial package fabrication, bonding operations or thermal cycling. In addition, mechanical decoupling provided by the bond wires may also remedy other mechanical issues such as shock and possible delamination of package elements.

摘要翻译： 提供了一种扇出式微电子封装，其中，接合线将微电子元件（例如，可能在其上具有附加迹线的半导体芯片）上的接合焊盘电耦合，并且电介质元件的邻近边缘表面的电介质元件的扇出区域处的触点 芯片。 接合线将微电子元件与扇出区域机械地分离，这可以使得由于差分热膨胀的影响而导致电互连不容易产生可靠性问题，例如由初始封装制造，接合操作或热循环期间的温度漂移引起的 。 此外，由接合线提供的机械解耦也可以补救其他机械问题，例如冲击和包装元件的可能的分层。

公开(公告)号：US09490195B1

公开(公告)日：2016-11-08

申请号：US14883864

申请日：2015-10-15

申请人： Invensas Corporation

发明人： Ashok S. Prabhu ,  Rajesh Katkar ,  Sean Moran

IPC分类号： H01L23/552 ,  H01L23/495 ,  H01L23/31

CPC分类号： H01L23/49575 ,  H01L21/56 ,  H01L21/561 ,  H01L21/568 ,  H01L23/295 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/49568 ,  H01L23/552 ,  H01L24/24 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/82 ,  H01L24/85 ,  H01L24/96 ,  H01L24/97 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24175 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/85005 ,  H01L2224/97 ,  H01L2225/1029 ,  H01L2225/1035 ,  H01L2225/1064 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/18165 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/85399

摘要： An assembly includes a plurality of stacked encapsulated microelectronic packages, each package including a microelectronic element having a front surface with a plurality of chip contacts at the front surface and edge surfaces extending away from the front surface. An encapsulation region of each package contacts at least one edge surface and extends away therefrom to a remote surface of the package. The package contacts of each package are disposed at a single one of the remote surfaces, the package contacts facing and coupled with corresponding contacts at a surface of a substrate nonparallel with the front surfaces of the microelectronic elements therein.

摘要翻译： 组件包括多个堆叠的封装的微电子封装，每个封装包括微电子元件，该微电子元件具有在前表面处具有多个芯片触点的前表面和远离前表面延伸的边缘表面。 每个包装的封装区域接触至少一个边缘表面，并从其延伸到包装的远端表面。 每个封装的封装触点设置在远程表面中的单个一个处，封装触点面对并与衬底的与其中的微电子元件的前表面不平行的表面处的相应触点耦合。

公开(公告)号：US20160268205A1

公开(公告)日：2016-09-15

申请号：US15158963

申请日：2016-05-19

申请人： Invensas Corporation

发明人： Cyprian Emeka Uzoh ,  Rajesh Katkar ,  Charles G. Woychik ,  Guilian Gao ,  Arkalgud R. Sitaram

IPC分类号： H01L23/532 ,  H01L23/498 ,  H01L25/065 ,  H01L21/768

CPC分类号： H01L23/5328 ,  H01L21/76838 ,  H01L21/7684 ,  H01L21/76898 ,  H01L23/49811 ,  H01L23/5226 ,  H01L24/83 ,  H01L25/0652 ,  H01L2224/0401 ,  H01L2224/131 ,  H01L2224/16148 ,  H01L2224/16227 ,  H01L2224/4823 ,  H01L2224/73203 ,  H01L2224/73257 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2924/014

摘要： An interconnect (124) suitable for attachment of integrated circuit assemblies to each other comprises a polymer member (130) which is conductive and/or is coated with a conductive material (144). Such interconnects replace metal bond wires in some embodiments. Other features are also provided.