RESIN COMPOSITION FOR WIRING BOARD, RESIN SHEET FOR WIRING BOARD, COMPOSITE BODY, METHOD FOR PRODUCING COMPOSITE BODY, AND SEMICONDUCTOR DEVICE
    392.
    发明申请
    RESIN COMPOSITION FOR WIRING BOARD, RESIN SHEET FOR WIRING BOARD, COMPOSITE BODY, METHOD FOR PRODUCING COMPOSITE BODY, AND SEMICONDUCTOR DEVICE 审中-公开
    接线板用树脂组合物,导线板用树脂片,复合体,生产复合体的方法及半导体器件

    公开(公告)号:US20110308848A1

    公开(公告)日:2011-12-22

    申请号:US13148774

    申请日:2010-02-08

    Abstract: Disclosed are a composite body, a method for producing the composite body and a semiconductor device, the composite body comprising a resin layer and a fine wiring and/or via hole being formed in the resin layer, having high adhesion and high reliability, and being capable of high frequencies. Also disclosed are a resin composition and a resin sheet, both of which can provide such a composite body.The composite body comprises a resin layer and an electroconductive layer, wherein a groove having a maximum width of 1 μm or more and 10 μm or less is on a surface of the resin layer; the electroconductive layer is inside the groove; and a surface of the resin layer being in contact with the electroconductive layer has an arithmetic average roughness (Ra) of 0.05 μm or more and 0.45 μm or less, and/or wherein the resin layer has a via hole having a diameter of 1 μm or more and 25 μm or less; the electroconductive layer is inside the via hole; and a surface of the resin layer of the inside of the via hole has an arithmetic average roughness (Ra) of 0.05 μm or more and 0.45 μm or less. The resin composition comprises an inorganic filler and a thermosetting resin, wherein the inorganic filler contains coarse particles having a diameter of more than 2 μm in an amount of 500 ppm or less. The resin sheet comprises a resin layer and a substrate, wherein the resin layer is on the substrate and comprises the resin composition.

    Abstract translation: 公开了一种复合体,该复合体的制造方法以及半导体装置,该复合体包括树脂层和在该树脂层中形成的精细布线和/或通孔,具有高粘合性和高可靠性,并且 能够高频率。 还公开了树脂组合物和树脂片,两者都可以提供这种复合体。 复合体包括树脂层和导电层,其中在树脂层的表面上具有最大宽度为1μm以上且10μm以下的槽; 导电层在槽内; 并且与导电层接触的树脂层的表面的算术平均粗糙度(Ra)为0.05μm以上且0.45μm以下,和/或其中树脂层具有直径为1μm的通孔 以上且25μm以下; 导电层在通孔内; 通孔内侧的树脂层的表面的算术平均粗糙度(Ra)为0.05μm以上且0.45μm以下。 树脂组合物包含无机填料和热固性树脂,其中无机填料含有直径大于2μm的粗颗粒的量在500ppm以下。 树脂片包括树脂层和基材,其中树脂层在基材上并包含树脂组合物。

    Electronic component, illuminating device, contact-type image sensor, and image reading device having no short circuit condition achieved by allowing only one electrode of an LED chip in direct contact with a metallic substrate
    395.
    发明授权
    Electronic component, illuminating device, contact-type image sensor, and image reading device having no short circuit condition achieved by allowing only one electrode of an LED chip in direct contact with a metallic substrate 失效
    电子元件,照明装置,接触式图像传感器和通过仅使一个LED芯片的一个电极与金属基板直接接触而实现的不具有短路状态的图像读取装置

    公开(公告)号:US08044341B2

    公开(公告)日:2011-10-25

    申请号:US12384833

    申请日:2009-04-09

    Applicant: Tomihisa Saito

    Inventor: Tomihisa Saito

    Abstract: An electronic component capable of effectively dissipating heat generated in an LED chip and other elements is provided. A light emitting unit 1 includes a substrate 2 made of copper or aluminum, an insulating layer 3 formed on the surface thereof, a circuit pattern 4 formed on the insulating layer 3, and a circuit pattern 5 formed on the substrate 2 through an opening 3a that has been formed in advance in the insulation layer 3. An LED chip 6 is mounted on the circuit patterns 4 and 5 by using solder 7. The LED chip 6 includes a ceramic substrate 9, electrodes 10 and 11 formed thereon, and an LED die 12 as a light emitting portion disposed on the electrode 11, which is one of the electrodes. Terminals 13 and 14 are provided on the upper surface of the LED die 12. The terminal 13, which is one of the terminals, is connected to the electrode 10 via a bonding wire 15, and the terminal 14, which is the other one of the terminals, is connected to the electrode 11 via a bonding wire 16.

    Abstract translation: 提供能够有效地散发在LED芯片和其他元件中产生的热的电子部件。 发光单元1包括由铜或铝制成的基板2,形成在其表面上的绝缘层3,形成在绝缘层3上的电路图案4和通过开口3a形成在基板2上的电路图案5 预先形成在绝缘层3中。通过使用焊料7将LED芯片6安装在电路图案4,5上.LED芯片6包括陶瓷基板9,形成在其上的电极10和11以及LED 管芯12作为发光部分,设置在作为电极之一的电极11上。 端子13和14设置在LED管芯12的上表面上。作为端子之一的端子13通过接合线15连接到电极10,端子14是另一个 端子经由接合线16连接到电极11。

    Circuit board including hybrid via structures
    396.
    发明授权
    Circuit board including hybrid via structures 有权
    电路板包括混合通孔结构

    公开(公告)号:US08044305B2

    公开(公告)日:2011-10-25

    申请号:US11443763

    申请日:2006-05-31

    Abstract: A circuit board may include hybrid via structures configured to connect to components, such as connectors and electronic components, mounted on the circuit board. A hybrid via structure may include one or more micro-vias configured to provide an electrical connection to a signal trace in the circuit board and one or more through-vias configured to provide a ground connection to at least one reference plane in the circuit board. In one embodiment, a plurality of circuit boards including the hybrid via structures and signal traces may be connected to establish a channel supporting differential signaling and data transfer rates of at least about 5 Gb/s. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.

    Abstract translation: 电路板可以包括被配置为连接到安装在电路板上的诸如连接器和电子部件的组件的混合通孔结构。 混合通孔结构可以包括一个或多个微通孔,其被配置为提供与电路板中的信号迹线的电连接以及被配置为提供到电路板中的至少一个参考平面的接地连接的一个或多个通孔。 在一个实施例中,可以连接包括混合通路结构和信号迹线的多个电路板,以建立支持至少约5Gb / s的差分信令和数据传输速率的信道。 当然,在不偏离本实施例的情况下,可以进行许多替代,变化和修改。

    Multilayer printed wiring board
    400.
    发明授权
    Multilayer printed wiring board 有权
    多层印刷线路板

    公开(公告)号:US07982139B2

    公开(公告)日:2011-07-19

    申请号:US11356350

    申请日:2006-02-17

    Abstract: A multilayer printed wiring board 10 includes: a mounting portion 60 on the top surface of which is mounted a semiconductor element that is electrically connected to a wiring pattern 32, etc.; and a capacitor portion 40 having a high dielectric constant layer 43, formed of ceramic and first and second layer electrodes 41 and 42 that sandwich the high dielectric constant layer 43. One of either of the first and second layer electrodes 41 and 42 is connected to a power supply line of the semiconductor element and the other of either of the first and second layer electrodes 41 and 42 is connected to a ground line. In this multilayer printed wiring board 10, high dielectric constant layer 43 included in the layered capacitor portion 40, which is connected between the power supply line and the ground line, is formed of ceramic. With this structure, the static capacitance of the layered capacitor portion 40 can be high, and an adequate decoupling effect is exhibited even under circumstances in which instantaneous potential drops occur readily.

    Abstract translation: 多层印刷电路板10包括:安装部分60,其顶表面上安装有电连接到布线图案32的半导体元件; 以及具有由陶瓷形成的高介电常数层43的电容器部分40和夹在高介电常数层43上的第一和第二层电极41和42。第一和第二层电极41和42中的一个连接到 半导体元件的电源线和第一和第二层电极41和42中的另一个连接到接地线。 在这种多层印刷电路板10中,连接在电源线和接地线之间的层状电容器部分40中包括的高介电常数层43由陶瓷形成。 利用这种结构,层状电容器部分40的静态电容可以很高,并且即使在容易发生瞬时电位下降的情况下也可以发挥足够的去耦效应。

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