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公开(公告)号：US09768086B2
公开(公告)日：2017-09-19
申请号：US15084211
申请日：2016-03-29
发明人： Ralph G. Nuzzo , John A. Rogers , Etienne Menard , Keon Jae Lee , Dahl-Young Khang , Yugang Sun , Matthew Meitl , Zhengtao Zhu
IPC分类号： H01L23/02 , H01L21/322 , B82Y10/00 , H01L29/06 , H01L29/786 , H01L31/0392 , H01L31/18 , H01L21/02 , H01L21/308 , H01L29/12 , H01L29/04 , H01L23/00 , H01L21/683 , H01L27/12 , H01L25/075 , H01L33/00 , H01L33/32
CPC分类号： H01L29/76 , B81C2201/0185 , B82Y10/00 , H01L21/02521 , H01L21/02603 , H01L21/02628 , H01L21/308 , H01L21/322 , H01L21/6835 , H01L23/02 , H01L24/03 , H01L24/05 , H01L24/08 , H01L24/29 , H01L24/32 , H01L24/80 , H01L24/83 , H01L24/94 , H01L24/97 , H01L25/0753 , H01L27/1285 , H01L27/1292 , H01L29/04 , H01L29/06 , H01L29/0665 , H01L29/0673 , H01L29/0676 , H01L29/068 , H01L29/12 , H01L29/78603 , H01L29/78681 , H01L29/78696 , H01L31/0392 , H01L31/03926 , H01L31/1804 , H01L31/1864 , H01L31/1896 , H01L33/007 , H01L33/0079 , H01L33/32 , H01L2221/68368 , H01L2221/68381 , H01L2224/03 , H01L2224/0332 , H01L2224/0345 , H01L2224/03614 , H01L2224/0362 , H01L2224/05073 , H01L2224/05082 , H01L2224/05124 , H01L2224/05144 , H01L2224/05155 , H01L2224/05166 , H01L2224/05552 , H01L2224/05553 , H01L2224/05554 , H01L2224/05555 , H01L2224/05644 , H01L2224/05666 , H01L2224/08225 , H01L2224/2919 , H01L2224/32225 , H01L2224/80 , H01L2224/80006 , H01L2224/80121 , H01L2224/80862 , H01L2224/80895 , H01L2224/83 , H01L2224/83005 , H01L2224/83121 , H01L2224/83192 , H01L2224/83193 , H01L2224/8385 , H01L2224/83862 , H01L2224/9202 , H01L2224/94 , H01L2224/95 , H01L2224/97 , H01L2924/00012 , H01L2924/01032 , H01L2924/0665 , H01L2924/10253 , H01L2924/10329 , H01L2924/12032 , H01L2924/12036 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/12044 , H01L2924/1305 , H01L2924/1306 , H01L2924/13063 , H01L2924/13091 , H01L2924/14 , H01L2924/1461 , H01L2924/15159 , H01L2924/15162 , H01L2924/15788 , H01L2924/1579 , Y02E10/547 , Y02P70/521 , Y10S977/707 , Y10S977/724 , H01L2924/00014 , H01L2924/00
摘要： The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.
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42.发明授权公开(公告)号：US11456258B2
公开(公告)日：2022-09-27
申请号：US16272488
申请日：2019-02-11
发明人： John A. Rogers , Dahl-Young Khang , Yugang Sun , Etienne Menard
IPC分类号： H01L23/538 , H01L29/72 , B82Y10/00 , H01L21/02 , H01L21/683 , H01L27/12 , H01L29/06 , H01L29/16 , H01L29/778 , H01L29/786 , H01L31/0392 , H01L31/18 , H05K1/02 , H01L23/29 , H01L29/15 , H01L23/31 , H01L23/00
摘要： The present invention provides stretchable, and optionally printable, semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed. Stretchable semiconductors and electronic circuits of the present invention preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention may be adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices.
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公开(公告)号：US11064946B2
公开(公告)日：2021-07-20
申请号：US15501373
申请日：2015-08-11
发明人： John A. Rogers , Ahyeon Koh , Daeshik Kang , YuHao Liu , Xian Huang
IPC分类号： A61B5/00 , A61B5/145 , A61B5/103 , A61B5/1455 , A61B5/01 , A61B5/053 , A61B5/1468 , B01L3/00 , A61B5/1477
摘要： Skin-mounted or epidermal devices and methods for monitoring biofluids are disclosed. The devices comprise a functional substrate that is mechanically and/or thermally matched to skin to provide durable adhesion for long-term wear. The functional substrates allow for the microfluidic transport of biofluids from the skin to one or more sensors that measure and/or detect biological parameters, such as rate of biofluid production, biofluid volume, and biomarker concentration. Sensors within the devices may be mechanical, electrical or chemical, with colorimetric indicators being observable by the naked eye or with a portable electronic device (e.g., a smartphone). By monitoring changes in an individual's health state over time, the disclosed devices may provide early indications of abnormal conditions.
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公开(公告)号：US10546841B2
公开(公告)日：2020-01-28
申请号：US15470780
申请日：2017-03-27
发明人： John A. Rogers , Ralph Nuzzo , Hoon-sik Kim , Eric Brueckner , Sang Il Park , Rak Hwan Kim
IPC分类号： H01L33/32 , H01L25/075 , H01L21/683 , H01L23/00 , H01L33/00 , H01L25/00 , H01L33/48 , H01L33/50 , H01L33/54 , H01L33/62
摘要： Described herein are printable structures and methods for making, assembling and arranging electronic devices. A number of the methods described herein are useful for assembling electronic devices where one or more device components are embedded in a polymer which is patterned during the embedding process with trenches for electrical interconnects between device components. Some methods described herein are useful for assembling electronic devices by printing methods, such as by dry transfer contact printing methods. Also described herein are GaN light emitting diodes and methods for making and arranging GaN light emitting diodes, for example for display or lighting systems.
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公开(公告)号：US10029451B2
公开(公告)日：2018-07-24
申请号：US15374926
申请日：2016-12-09
IPC分类号： B41F16/00
摘要： A transfer printing process that exploits the mismatch in mechanical or thermo-mechanical response at the interface of a printable micro- or nano-device and a transfer stamp to drive the release of the device from the stamp and its non-contact transfer to a receiving substrate are provided. The resulting facile, pick-and-place process is demonstrated with the assembling of 3-D microdevices and the printing of GAN light-emitting diodes onto silicon and glass substrates. High speed photography is used to provide experimental evidence of thermo-mechanically driven release.
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公开(公告)号：US09875974B2
公开(公告)日：2018-01-23
申请号：US14772354
申请日：2014-03-06
发明人： John A. Rogers , SukWon Hwang , Xian Huang
IPC分类号： H01L21/00 , H01L23/00 , H01L21/8238 , H01L21/28 , H01L21/306 , H01L21/56 , H01L21/683 , H01L21/768 , H01L21/78 , H01L21/84 , H01L23/532 , H01L25/065 , H01L25/16 , H01L25/00 , G01N27/22
CPC分类号： H01L23/564 , G01N27/22 , H01L21/28 , H01L21/30604 , H01L21/561 , H01L21/6835 , H01L21/768 , H01L21/78 , H01L21/8238 , H01L21/84 , H01L23/53257 , H01L24/96 , H01L25/0655 , H01L25/16 , H01L25/50 , H01L2221/68368 , H01L2221/68372 , H01L2221/68381 , H01L2924/01012 , H01L2924/01026 , H01L2924/0103 , H01L2924/01042 , H01L2924/01074 , H01L2924/1203 , H01L2924/12043 , H01L2924/1205 , H01L2924/13091
摘要： Provided are methods of making a transient electronic device by fabricating one or more inorganic semiconductor components, one or more metallic conductor components or one or more inorganic semiconductor components and one or more metallic conductor components supported by a mother substrate. The components may independently comprise a selectively transformable material and, optionally, further have a preselected transience profile. The components are transfer printed, thereby decoupling the component fabrication step from additional processing to provide desired device functionality and transient properties. A substrate layer is provided on top of the components and used to facilitate handling, processing, and/or device functionality.
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47.发明申请公开(公告)号：US20170133248A1
公开(公告)日：2017-05-11
申请号：US15195733
申请日：2016-06-28
发明人： Etienne Menard , John A. Rogers , Seok Kim , Andrew Carlson
CPC分类号： B41F16/006 , B32B9/005 , B32B37/025 , B32B37/16 , B32B41/00 , B32B2313/00 , B32B2457/14 , B41F16/00 , H01L21/67132 , H01L21/67144 , H01L21/6835 , H01L23/4821 , H01L25/50 , H01L2221/68363 , H01L2221/68368 , H01L2221/68381 , H01L2224/32145 , H01L2224/83192
摘要： In a method of printing a transferable component, a stamp including an elastomeric post having three-dimensional relief features protruding from a surface thereof is pressed against a component on a donor substrate with a first pressure that is sufficient to mechanically deform the relief features and a region of the post between the relief features to contact the component over a first contact area. The stamp is retracted from the donor substrate such that the component is adhered to the stamp. The stamp including the component adhered thereto is pressed against a receiving substrate with a second pressure that is less than the first pressure to contact the component over a second contact area that is smaller than the first contact area. The stamp is then retracted from the receiving substrate to delaminate the component from the stamp and print the component onto the receiving substrate. Related apparatus and stamps are also discussed.
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公开(公告)号：US09647171B2
公开(公告)日：2017-05-09
申请号：US14479100
申请日：2014-09-05
发明人： John A. Rogers , Ralph Nuzzo , Hoon-sik Kim , Eric Brueckner , Sang Il Park , Rak Hwan Kim
IPC分类号： H01L33/50 , H01L33/00 , H01L25/075 , H01L23/00 , H01L21/683 , H01L25/00 , H01L33/48 , H01L33/54 , H01L33/62
CPC分类号： H01L25/0753 , H01L21/6835 , H01L24/83 , H01L24/95 , H01L25/50 , H01L33/0079 , H01L33/32 , H01L33/486 , H01L33/507 , H01L33/54 , H01L33/62 , H01L2221/68322 , H01L2221/6835 , H01L2221/68354 , H01L2221/68363 , H01L2221/68368 , H01L2221/68386 , H01L2224/8312 , H01L2224/83868 , H01L2224/83871 , H01L2224/83874 , H01L2224/95085 , H01L2924/01322 , H01L2924/05432 , H01L2924/06 , H01L2924/12033 , H01L2924/12036 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/13063 , H01L2924/13064 , H01L2924/13091 , H01L2924/14 , H01L2924/1461 , H01L2924/15787 , H01L2924/15788 , H01L2924/181 , H01L2924/2064 , H01L2924/20641 , H01L2933/0041 , H01L2933/005 , Y10S438/977 , H01L2924/00
摘要： Described herein are printable structures and methods for making, assembling and arranging electronic devices. A number of the methods described herein are useful for assembling electronic devices where one or more device components are embedded in a polymer which is patterned during the embedding process with trenches for electrical interconnects between device components. Some methods described herein are useful for assembling electronic devices by printing methods, such as by dry transfer contact printing methods. Also described herein are GaN light emitting diodes and methods for making and arranging GaN light emitting diodes, for example for display or lighting systems.
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49.发明授权公开(公告)号：US09515025B2
公开(公告)日：2016-12-06
申请号：US14789645
申请日：2015-07-01
发明人： John A. Rogers , Dahl-Young Khang , Yugang Sun , Etienne Menard
IPC分类号： H01L23/538 , H05K1/02 , H01L29/786
CPC分类号： H01L23/5387 , B81C2201/0185 , B82Y10/00 , H01L21/02422 , H01L21/02521 , H01L21/02532 , H01L21/02546 , H01L21/02628 , H01L21/6835 , H01L23/293 , H01L23/3157 , H01L23/564 , H01L24/29 , H01L24/32 , H01L24/80 , H01L27/1266 , H01L27/1285 , H01L27/1292 , H01L29/06 , H01L29/0665 , H01L29/0673 , H01L29/0676 , H01L29/068 , H01L29/151 , H01L29/158 , H01L29/16 , H01L29/1602 , H01L29/1606 , H01L29/7781 , H01L29/78603 , H01L29/78681 , H01L29/78696 , H01L31/0392 , H01L31/03925 , H01L31/03926 , H01L31/18 , H01L31/1804 , H01L2221/68368 , H01L2224/291 , H01L2224/2919 , H01L2224/80894 , H01L2224/8385 , H01L2924/0002 , H01L2924/01002 , H01L2924/01003 , H01L2924/01005 , H01L2924/01006 , H01L2924/0101 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01049 , H01L2924/01051 , H01L2924/01067 , H01L2924/01072 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/07802 , H01L2924/10329 , H01L2924/10336 , H01L2924/10349 , H01L2924/12032 , H01L2924/12036 , H01L2924/12041 , H01L2924/12042 , H01L2924/13063 , H01L2924/13091 , H01L2924/1461 , H01L2924/3025 , H05K1/0277 , H05K1/0283 , Y02E10/547 , Y02P70/521 , H01L2924/3512 , H01L2924/00 , H01L2924/00014
摘要： The present invention provides stretchable, and optionally printable, semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed. Stretchable semiconductors and electronic circuits of the present invention preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention may be adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices.
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公开(公告)号：US20160190091A1
公开(公告)日：2016-06-30
申请号：US14879581
申请日：2015-10-09
发明人： Etienne Menard , Matthew Meitl , John A. Rogers
CPC分类号： H01L27/1266 , H01L21/6835 , H01L21/76898 , H01L21/7806 , H01L23/481 , H01L23/544 , H01L24/02 , H01L24/05 , H01L24/08 , H01L24/24 , H01L24/27 , H01L24/29 , H01L24/30 , H01L24/32 , H01L24/73 , H01L24/75 , H01L24/799 , H01L24/82 , H01L24/83 , H01L24/92 , H01L24/94 , H01L24/97 , H01L24/98 , H01L27/1214 , H01L27/14618 , H01L31/0203 , H01L31/043 , H01L31/048 , H01L31/1892 , H01L2221/68318 , H01L2221/68322 , H01L2221/6835 , H01L2221/68368 , H01L2221/68372 , H01L2221/68381 , H01L2223/5442 , H01L2223/54426 , H01L2223/54486 , H01L2224/02371 , H01L2224/02372 , H01L2224/0239 , H01L2224/04026 , H01L2224/05548 , H01L2224/056 , H01L2224/08238 , H01L2224/24011 , H01L2224/24137 , H01L2224/24147 , H01L2224/24226 , H01L2224/245 , H01L2224/24998 , H01L2224/2731 , H01L2224/29078 , H01L2224/291 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29344 , H01L2224/3012 , H01L2224/32104 , H01L2224/32146 , H01L2224/32227 , H01L2224/73267 , H01L2224/75263 , H01L2224/75314 , H01L2224/7598 , H01L2224/76155 , H01L2224/80203 , H01L2224/80224 , H01L2224/82007 , H01L2224/821 , H01L2224/82102 , H01L2224/82106 , H01L2224/83093 , H01L2224/83121 , H01L2224/83132 , H01L2224/83191 , H01L2224/83192 , H01L2224/83224 , H01L2224/83805 , H01L2224/83815 , H01L2224/8384 , H01L2224/83851 , H01L2224/83855 , H01L2224/83859 , H01L2224/83862 , H01L2224/83868 , H01L2224/83871 , H01L2224/83874 , H01L2224/92244 , H01L2224/9512 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01057 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/10329 , H01L2924/12041 , H01L2924/12044 , H01L2924/14 , H01L2924/15787 , H01S5/02236 , H01S5/02276 , H05K1/18 , H05K13/04 , H05K13/046 , Y02E10/50 , Y10T29/49124 , Y10T29/51 , H01L2924/00014 , H01L2924/00 , H01L2224/13111
摘要： A method of printing transferable components includes pressing a stamp including at least one transferable semiconductor component thereon on a target substrate such that the at least one transferable component and a surface of the target substrate contact opposite surfaces of a conductive eutectic layer. During pressing of the stamp on the target substrate, the at least one transferable component is exposed to electromagnetic radiation that is directed through the transfer stamp to reflow the eutectic layer. The stamp is then separated from the target substrate to delaminate the at least one transferable component from the stamp and print the at least one transferable component onto the surface of the target substrate. Related systems and methods are also discussed.
摘要翻译： 打印可转移部件的方法包括在目标基板上按压包括至少一个可转移半导体部件的印模，使得至少一个可转印部件和目标基板的表面接触导电共晶层的相对表面。 在压印目标基板上的印模时，将至少一个可转印部件暴露于电磁辐射，该电磁辐射被引导通过传送印模以回流共晶层。 然后将印模与目标基材分离，以将印模中的至少一种可转移组分分层，并将该至少一种可转移组分印刷到目标基材的表面上。 还讨论了相关系统和方法。
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