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    Carrier unit for semiconductor device, and socket for semiconductor device equipped therewith
    13.
    发明专利
    Carrier unit for semiconductor device, and socket for semiconductor device equipped therewith 有权
    半导体器件载体单元及其半导体器件插座

    公开(公告)号：JP2006105692A

    公开(公告)日：2006-04-20

    申请号：JP2004290569

    申请日：2004-10-01

    Applicant: Yamaichi Electronics Co Ltd ,  山一電機株式会社

    Inventor： KURODA TOSHITAKA ,  HISAISHI MINORU

    IPC: G01R31/26

    CPC classification number: H01L23/32 ,  G01R1/0466 ,  G01R1/0483 ,  H01L24/72 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074

    Abstract: PROBLEM TO BE SOLVED: To preclude a bump of a connection substrate from being crushed, even when a pressing lid and a carrier housing are combined under the condition where no bare chip exists.
    SOLUTION: This carrier unit 40 includes the carrier housing 46, a contact sheet 44 provided with the bump 44B pressed onto an electrode group of the stored bare chips by a pressing body 56, the pressing lid 52, and a latch mechanism 50. The bump 44B is not crushed even under the condition where no bare chip exists, since pressing parts 56wa, 56wb of the pressing body 56 have respectively recesses 56A, 56B inserted with the bump 44B.
    COPYRIGHT: (C)2006,JPO&NCIPI

    Abstract translation: 要解决的问题：即使在不存在裸芯片的情况下组合按压盖和托架壳体时，为了防止连接基板的凸块被破碎。 解决方案：该载体单元40包括载体壳体46，设置有通过按压体56压入存储的裸芯片的电极组的凸块44B的接触片44，按压盖52和闩锁机构50 即使在不存在裸芯片的情况下，凸块44B也不会被挤压，因为按压体56的按压部分56wa，56wb分别具有插入凸块44B的凹部56A，56B。 版权所有（C）2006，JPO＆NCIPI

    Semiconductor device
    16.
    发明专利
    Semiconductor device 失效
    半导体器件

    公开(公告)号：JPS61125067A

    公开(公告)日：1986-06-12

    申请号：JP24593184

    申请日：1984-11-22

    Applicant: Hitachi Comput Eng Corp Ltd ,  Hitachi Ltd

    Inventor： MIZUMOTO HIROYUKI ,  FURUKAWA MICHIAKI

    IPC: H01L23/04 ,  H01L23/32 ,  H01L23/40 ,  H01L23/52

    CPC classification number: H01L23/32 ,  H01L23/4006 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: PURPOSE:To prevent the deformation and damage of a pellet and the like due to difference in thermal expansion coefficient of a wafer and a package substrate, by pushing the pellet to the package substrate by the elastic force of a fixing member, and holding the pellet. CONSTITUTION:A full wafer LSI5, which is attached to a wiring substrate 6, is held by an annular cap 11, which is attached to a package substrate 2 and its upper part. The cap 11 comprises a material having strong elastic force. The cap 11 fixed to the package substrate 2 by bolts 12 at a plurality of positions on the peripheral part. An edge part 13 is provided so as to face downward at the outermost edge of the cap. Meanwhile, a protruded part 14 is provided so as to face downward at the inner surface edge. Namely, the protruded part 14 elastically pushes the wiring substrate 6 and the full wafer LSI5 toward the bottom part of a cavity 3. Therefore, the wiring substrate 6 and the full wafer LSI5 are elastically held with respect to the package substrate 2 without using a bonding agent and the like.

    Abstract translation: 目的：为了防止由于晶片和封装基板的热膨胀系数的差异而引起的颗粒等的变形和损坏，通过固定构件的弹力将颗粒推压到封装基板上，并且保持颗粒 。 构成：附接到布线基板6的全晶片LSI5由附接到封装基板2及其上部的环形盖11保持。 帽11包括具有强弹性力的材料。 盖11通过螺栓12在周边部分的多个位置固定到封装基板2。 边缘部分13设置成在盖的最外边缘处朝下。 同时，突出部分14设置成在内表面边缘处向下。 也就是说，突出部分14弹性地将布线基板6和全晶片LSI5推向空腔3的底部。因此，布线基板6和全晶片LSI5相对于封装基板2弹性地保持，而不使用 粘合剂等。

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