公开(公告)号：US06475822B2

公开(公告)日：2002-11-05

申请号：US09752853

申请日：2000-12-29

Applicant: Benjamin N. Eldridge ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan L. Mathieu

Inventor： Benjamin N. Eldridge ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan L. Mathieu

IPC: H01L2144

CPC classification number: G01R3/00 ,  B23K20/004 ,  B23K2101/38 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D7/123 ,  C25D21/02 ,  G01R1/06727 ,  G01R1/06744 ,  G01R31/2884 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/6835 ,  H01L22/20 ,  H01L23/4951 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/16 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05548 ,  H01L2224/1134 ,  H01L2224/16145 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/4554 ,  H01L2224/456 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85043 ,  H01L2224/851 ,  H01L2224/85201 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H01R12/57 ,  H05K1/141 ,  H05K3/24 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/4015 ,  H05K3/4092 ,  H05K7/1069 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/49204 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/05599 ,  H01L2224/05099

Abstract: Spring contact elements are fabricated by depositing at least one layer of metallic material into openings defined on a sacrificial substrate. The openings may be within the surface of the substrate, or in one or more layers deposited on the surface of the sacrificial substrate. Each spring contact element has a base end portion, a contact end portion, and a central body portion. The contact end portion is offset in the z-axis (at a different height) than the central body portion. The base end portion is preferably offset in an opposite direction along the z-axis from the central body portion. In this manner, a plurality of spring contact elements are fabricated in a prescribed spatial relationship with one another on the sacrificial substrate. The spring contact elements are suitably mounted by their base end portions to corresponding terminals on an electronic component, such as a space transformer or a semiconductor device, whereupon the sacrificial substrate is removed so that the contact ends of the spring contact elements extend above the surface of the electronic component. In an exemplary use, the spring contact elements are thereby disposed on a space transformer component of a probe card assembly so that their contact ends effect pressure connections to corresponding terminals on another electronic component, for the purpose of probing the electronic component.

Abstract translation: 通过将至少一层金属材料沉积到限定在牺牲衬底上的开口中来制造弹簧接触元件。 开口可以在衬底的表面内，或者在沉积在牺牲衬底的表面上的一个或多个层中。 每个弹簧接触元件具有基端部分，接触端部分和中心体部分。 接触端部在与中心体部分相同的z轴（不同高度）偏移。 基端部优选地沿着与中心主体部分的z轴相反的方向偏移。 以这种方式，在牺牲基板上以规定的空间关系制造多个弹簧接触元件。 弹簧接触元件通过它们的基端部适当地安装在诸如空间变压器或半导体器件的电子部件上的对应端子上，从而去除牺牲基板，使得弹簧接触元件的接触端部在表面上方延伸 的电子元件。 在示例性用途中，弹簧接触元件因此被布置在探针卡组件的空间变换器部件上，使得它们的接触端在另一电子部件上实现与相应端子的压力连接，以便探测电子部件。

公开(公告)号：US20020117330A1

公开(公告)日：2002-08-29

申请号：US10035633

申请日：2001-12-28

Applicant: FormFactor, Inc.

Inventor： Benjamin Niles Eldridge ,  Gary William Grube ,  Igor Yan Khandros ,  Gaetan L. Mathieu

IPC: H05K007/02 ,  H01L021/44

CPC classification number: H05K7/1069 ,  B23K20/004 ,  B23K2101/40 ,  C23C18/31 ,  C23C18/32 ,  C23C18/38 ,  C25D5/08 ,  C25D5/22 ,  C25D21/02 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07357 ,  G01R1/07378 ,  G01R31/2884 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/6715 ,  H01L21/67248 ,  H01L21/67253 ,  H01L21/67288 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/78 ,  H01L24/81 ,  H01L24/85 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/05568 ,  H01L2224/05571 ,  H01L2224/05572 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13082 ,  H01L2224/13099 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/16145 ,  H01L2224/45015 ,  H01L2224/45109 ,  H01L2224/45111 ,  H01L2224/45116 ,  H01L2224/4512 ,  H01L2224/45123 ,  H01L2224/45124 ,  H01L2224/45138 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45163 ,  H01L2224/45164 ,  H01L2224/45169 ,  H01L2224/45173 ,  H01L2224/45176 ,  H01L2224/45565 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48599 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85043 ,  H01L2224/85045 ,  H01L2224/851 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01031 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01083 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19107 ,  H01L2924/20751 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49174 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/49213 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/00012 ,  H01L2924/20752 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/00015 ,  H01L2924/2075 ,  H01L2924/01204 ,  H01L2924/013 ,  H01L2924/01004 ,  H01L2924/01048

Abstract: Contact structures exhibiting resilience or compliance for a variety of electronic components are formed by bonding a free end of a wire to a substrate, configuring the wire into a wire stem having a springable shape, severing the wire stem, and overcoating the wire stem with at least one layer of a material chosen primarily for its structural (resiliency, compliance) characteristics. A variety of techniques for configuring, severing, and overcoating the wire stem are disclosed. In an exemplary embodiment, a free end of a wire stem is bonded to a contact area on a substrate, the wire stem is configured to have a springable shape, the wire stem is severed to be free-standing by an electrical discharge, and the free-standing wire stem is overcoated by plating. A variety of materials for the wire stem (which serves as a falsework) and for the overcoat (which serves as a superstructure over the falsework) are disclosed. Various techniques are described for mounting the contact structures to a variety of electronic components (e.g., semiconductor wafers and dies, semiconductor packages, interposers, interconnect substrates, etc.), and various process sequences are described. The resilient contact structures described herein are ideal for making a nulltemporarynull (probe) connections to an electronic component such as a semiconductor die, for burn-in and functional testing. The self-same resilient contact structures can be used for subsequent permanent mounting of the electronic component, such as by soldering to a printed circuit board (PCB). An irregular topography can be created on or imparted to the tip of the contact structure to enhance its ability to interconnect resiliently with another electronic component. Among the numerous advantages of the present invention is the great facility with which the tips of a plurality of contact structures can be made to be coplanar with one another. Other techniques and embodiments, such as wherein the falsework wirestem protrudes beyond an end of the superstructure, or is melted down, and wherein multiple free-standing resilient contact structures can be fabricated from loops, are described.

公开(公告)号：US20020102763A1

公开(公告)日：2002-08-01

申请号：US10103775

申请日：2002-03-25

Inventor： Masachika Masuda ,  Tamaki Wada ,  Michiaki Sugiyama ,  Hirotaka Nishizawa ,  Toshio Sugano ,  Yasushi Takahashi ,  Masayasu Kawamura

IPC: H01L021/00

CPC classification number: H01L24/06 ,  H01L23/4951 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/4826 ,  H01L2224/48599 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01055 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/3011 ,  Y10T29/49121 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399

Abstract: A semiconductor device comprising a resin mold, two semiconductor chips positioned inside the resin mold and having front and back surfaces and external terminals formed on the front surfaces, and leads extending from the inside to the outside of the resin mold, wherein each of said leads is branched into two branch leads in at least the resin mold, the one branch lead is secured to the surface of the one semiconductor chip and is electrically connected to an external terminal on the surface thereof through a wire, the other branch lead is secured to the surface of the other semiconductor chip and is electrically connected to an external terminal on the surface thereof through a wire, and the two semiconductor chips are stacked one upon the other, with their back surfaces opposed to each other.

公开(公告)号：US06426563B1

公开(公告)日：2002-07-30

申请号：US09604802

申请日：2000-06-28

Applicant: Mitsuaki Fujihira

Inventor： Mitsuaki Fujihira

IPC: H01L2348

CPC classification number: H01L24/85 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48475 ,  H01L2224/4848 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48997 ,  H01L2224/4911 ,  H01L2224/49175 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85051 ,  H01L2224/851 ,  H01L2224/85148 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2224/859 ,  H01L2224/85951 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/20753 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/48455 ,  H01L2924/00015

Abstract: A semiconductor device includes a lower conductive member, an upper conductive member and a conductive wire. The one end of the conductive wire is electrically connected to a semiconductor chip. The lower conductive member is formed on a lead frame. The conductive wire is sandwiched between the lower conductive member and the upper conductive member located thereon and is electrically connected to the lead frame. A connecting portion of the conductive wire connected to the lead frame is sandwiched between the lower and upper conductive members so that the neck portion of the conductive wire can be protected from above.

Abstract translation: 半导体器件包括下导电构件，上导电构件和导线。 导线的一端电连接到半导体芯片。 下导电构件形成在引线框架上。 导线被夹在下导电构件和位于其上的上导电构件之间，并且与导线架电连接。 连接到引线框架的导线的连接部分夹在下导电部件和上导电部件之间，从而能够防止导线的颈部上方的保护。

公开(公告)号：US20020056901A1

公开(公告)日：2002-05-16

申请号：US09449864

申请日：1999-11-29

Inventor： ATSUSHI ONO ,  YASUNORI CHIKAWA

IPC: H01L023/48 ,  H01L023/52

CPC classification number: H01L24/48 ,  H01L24/05 ,  H01L24/10 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04073 ,  H01L2224/05556 ,  H01L2224/05644 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/48463 ,  H01L2224/4847 ,  H01L2224/85201 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/15787 ,  H01L2224/45099 ,  H01L2924/00

Abstract: An interconnection or active element is formed on a substrate, and an electrode pad is formed on the interconnection or active element with an interlayer insulating film therebetween. A projected electrode is formed on the surface of the electrode pad for protecting the interconnection or active element during bonding to an external terminal.

Abstract translation: 在衬底上形成互连或有源元件，并且在互连或有源元件上形成电极焊盘，其间具有层间绝缘膜。 在电极焊盘的表面上形成突出电极，用于在与外部端子接合期间保护互连或有源元件。

公开(公告)号：US20020048846A1

公开(公告)日：2002-04-25

申请号：US09943763

申请日：2001-08-30

Inventor： David J. Corisis

IPC: H01L021/44 ,  H01L021/48 ,  H01L021/50

CPC classification number: H01L24/85 ,  H01L23/49503 ,  H01L23/49541 ,  H01L24/29 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/78703 ,  H01L2224/83805 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/83205

Abstract: A leadframe configuration for a semiconductor device has a die attach paddle with paddle support bars. In addition, clamp tabs extend outwardly from lesser supported locations of the paddle to underlie a conventional lead clamp. The clamp tabs are formed as an integral part of the paddle. Normal clamping during die attach and wire bonding operations prevents paddle movement and enhances integrity of the die bond and wire bonds.

Abstract translation: 用于半导体器件的引线框架配置具有带叶片支撑杆的管芯附接叶片。 另外，夹紧片从桨的较小的支撑位置向外延伸到常规引线夹的下面。 夹紧片形成为桨叶的组成部分。 管芯附着和引线接合操作期间的正常夹紧可防止桨移动并增强芯片接合和引线键合的完整性。

公开(公告)号：US20020027289A1

公开(公告)日：2002-03-07

申请号：US09941622

申请日：2001-08-30

Inventor： Toshimichi Kurihara ,  Tetsu Toda ,  Shigeki Tsubaki

IPC: H01L023/48

CPC classification number: H01L24/85 ,  H01L24/03 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05083 ,  H01L2224/05124 ,  H01L2224/05166 ,  H01L2224/05169 ,  H01L2224/05181 ,  H01L2224/05184 ,  H01L2224/05556 ,  H01L2224/05624 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48453 ,  H01L2224/48465 ,  H01L2224/48507 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/78301 ,  H01L2224/85181 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/04941 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/13063 ,  H01L2924/13091 ,  H01L2924/20106 ,  H01L2924/20752 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/013 ,  H01L2924/00013

Abstract: The present invention provides a bonding structure between a bonding pad and a bonding portion of a bonding wire made of an Au-base material, wherein said bonding pad further comprises: a base layer; at least a barrier layer overlying said base layer; and a bonding layer overlying said at least barrier layer, said bonding layer including an Al-base material, and wherein said bonding portion of said bonding wire is buried in said bonding layer, and an AunullAl alloy layer extends on an interface between said bonding portion and said bonding layer, and a bottom of said AunullAl alloy layer is in contact with or adjacent to an upper surface of said barrier layer.

Abstract translation: 本发明提供一种接合焊盘和由Au基材料形成的接合线的接合部分之间的接合结构，其中所述接合焊盘还包括：基层; 至少覆盖所述基底层的阻挡层; 以及覆盖所述至少阻挡层的接合层，所述接合层包括Al基材料，并且其中所述接合线的所述接合部分被埋在所述接合层中，并且Au-Al合金层在所述接合层之间的界面上延伸 接合部分和所述接合层，并且所述Au-Al合金层的底部与所述阻挡层的上表面接触或邻近所述阻挡层。

公开(公告)号：US20020023943A1

公开(公告)日：2002-02-28

申请号：US09940203

申请日：2001-08-27

Inventor： Gregory M. Chapman ,  Michael J. Bettinger ,  Jennifer A. Due

IPC: B23K031/02 ,  B23K037/00

CPC classification number: H01L24/85 ,  B23K20/005 ,  B23K2101/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/05624 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/48824 ,  H01L2224/7825 ,  H01L2224/78301 ,  H01L2224/78302 ,  H01L2224/78306 ,  H01L2224/78307 ,  H01L2224/85043 ,  H01L2224/85045 ,  H01L2224/85181 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  Y10S228/904 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015

Abstract: An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame, the wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding the wire feed aperture in the capillary and a concave surface extending therefrom to the intersection with the radius extending from the external tip diameter of the working tip.

公开(公告)号：US20020020918A1

公开(公告)日：2002-02-21

申请号：US09974045

申请日：2001-10-11

Applicant: Kabushiki Kaisha Toshiba

Inventor： Minakshisundaran Balasubramanian Anand

IPC: H01L023/48 ,  H01L023/52 ,  H01L029/40

CPC classification number: H01L24/05 ,  H01L24/03 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/04042 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05166 ,  H01L2224/05187 ,  H01L2224/05546 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/05666 ,  H01L2224/45124 ,  H01L2224/4807 ,  H01L2224/48091 ,  H01L2224/48453 ,  H01L2224/48463 ,  H01L2224/48724 ,  H01L2224/48747 ,  H01L2224/48766 ,  H01L2224/85201 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/05042 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/04953 ,  H01L2224/05556 ,  H01L2924/00

Abstract: In the present invention, the bonding pad is formed in a lattice-like shape. Directly underneath the passivation layer, the etching stopper layer is provided. An opening is made through the passivation layer and the etching stopper layer so as to expose the bonding pad. The cavity sections of the lattice-like shape of the bonding pad are filled with the insulating layer. The bonding wire is connected to the lattice-shaped bonding pad. With this structure, the bonding error of the device manufactured by the damascening process can be avoided.

Abstract translation: 在本发明中，焊盘形成格子状。 在钝化层的正下方，设置有蚀刻停止层。 通过钝化层和蚀刻停止层形成开口以露出接合焊盘。 接合焊盘的格子状的空腔部分被绝缘层填充。 接合线连接到格子状的接合焊盘。 通过这种结构，可以避免通过分解过程制造的装置的接合误差。

公开(公告)号：US20020017722A1

公开(公告)日：2002-02-14

申请号：US09977229

申请日：2001-10-16

Applicant: Hitachi, Ltd.

Inventor： Masachika Masuda

IPC: H01L023/34

CPC classification number: H01L24/85 ,  H01L23/4951 ,  H01L23/49575 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/06136 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/4826 ,  H01L2224/48471 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85181 ,  H01L2224/85186 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01055 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/48227 ,  H01L2924/00012

Abstract: Two semiconductor chips sealed with a mold resin are stacked on each other so that their backs are opposite to each other. The two semiconductor chips are supported by suspension leads fixedly secured to a circuit forming surface (lower surface) of the lower chip. A pair of bus bar leads is placed in the vicinity of the sides of these chips, and a plurality of leads are placed there outside. Wires are bonded between one surfaces of both the bus bar leads and the leads and one of the two semiconductor chips. Further, wires are bonded between the other surfaces of both the bus bar leads and the leads and the other of the semiconductor chips. Thus, a semiconductor device wherein the two semiconductor chips are laminated and sealed with a resin, is reduced in manufacturing cost, and the thinning of the present semiconductor device is pushed forward.

Abstract translation: 用模具树脂密封的两个半导体芯片彼此堆叠，使得它们的背部彼此相对。 两个半导体芯片由固定地固定到下芯片的电路形成表面（下表面）的悬挂引线支撑。 一对母线引线被放置在这些芯片的侧面附近，并且多个引线被放置在外部。 导线连接在汇流条引线和导线的两个表面之间，两个半导体芯片之一。 此外，导线被接合在汇流条引线和引线的另一个表面以及另一个半导体芯片之间。 因此，其中两个半导体芯片被树脂层压和密封的半导体器件的制造成本降低，并且使本半导体器件的薄化被向前推。