公开(公告)号：US09803111B2

公开(公告)日：2017-10-31

申请号：US14379961

申请日：2012-10-01

Applicant: HITACHI CHEMICAL COMPANY, LTD.

Inventor： Kazutaka Honda ,  Akira Nagai ,  Makoto Satou

IPC: H01L23/48 ,  H01L21/16 ,  C09J11/06 ,  B23K35/36 ,  B23K35/362 ,  H01L25/065 ,  H05K3/30 ,  H01L23/29 ,  H01L21/56 ,  C09J163/00 ,  C08K5/092 ,  H01L23/00 ,  H05K3/34

CPC classification number: C09J11/06 ,  B23K35/3613 ,  B23K35/3618 ,  B23K35/362 ,  C08K5/092 ,  C09J163/00 ,  H01L21/563 ,  H01L23/295 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L25/0657 ,  H01L2224/03825 ,  H01L2224/0401 ,  H01L2224/051 ,  H01L2224/05111 ,  H01L2224/05116 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05575 ,  H01L2224/0558 ,  H01L2224/056 ,  H01L2224/05611 ,  H01L2224/05616 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/11825 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13575 ,  H01L2224/1358 ,  H01L2224/136 ,  H01L2224/13611 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/16145 ,  H01L2224/16148 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/17181 ,  H01L2224/271 ,  H01L2224/27416 ,  H01L2224/27436 ,  H01L2224/27848 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/73104 ,  H01L2224/81011 ,  H01L2224/81121 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/81895 ,  H01L2224/81907 ,  H01L2224/831 ,  H01L2224/83191 ,  H01L2224/83203 ,  H01L2224/83855 ,  H01L2224/83862 ,  H01L2224/9205 ,  H01L2224/92122 ,  H01L2224/92125 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H05K3/305 ,  H05K3/3436 ,  H05K2201/0367 ,  H05K2201/10977 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/8385 ,  H01L2924/00 ,  C08L63/00 ,  H01L2224/27 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01029 ,  H01L2224/11 ,  H01L2924/0001

Abstract: An adhesive for a semiconductor, comprising an epoxy resin, a curing agent, and a compound having a group represented by the following formula (1): wherein R1 represents an electron-donating group.

公开(公告)号：US09795036B2

公开(公告)日：2017-10-17

申请号：US14396297

申请日：2013-04-05

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Arata Kishi ,  Hironori Munakata ,  Koji Motomura ,  Hiroki Maruo

IPC: H05K1/18 ,  H05K3/34 ,  H01L29/00 ,  H01L23/00

CPC classification number: H05K1/181 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/10156 ,  H01L2224/16238 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32052 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/81052 ,  H01L2224/81191 ,  H01L2224/8159 ,  H01L2224/81609 ,  H01L2224/81611 ,  H01L2224/81613 ,  H01L2224/81639 ,  H01L2224/81647 ,  H01L2224/81815 ,  H01L2224/81935 ,  H01L2224/81951 ,  H01L2224/81986 ,  H01L2224/83104 ,  H01L2224/83192 ,  H01L2224/9211 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/384 ,  H05K3/3436 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/10734 ,  H05K2201/10977 ,  H05K2201/10992 ,  H05K2201/2009 ,  H05K2201/2036 ,  H05K2201/2045 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A mounting structure includes a bonding material (106) that bonds second electrodes (104) of a circuit board (105) and bumps (103) of a semiconductor package (101), the bonding material (106) being surrounded by a first reinforcing resin (107). Moreover, a portion between the outer periphery of the semiconductor package (101) and the circuit board (105) is covered with a second reinforcing resin (108). Even if the bonding material (106) is a solder material having a lower melting point than a conventional bonding material, high drop resistance is obtained.

公开(公告)号：US09788424B2

公开(公告)日：2017-10-10

申请号：US14234903

申请日：2012-07-25

Applicant: Masatsugu Iiyama

Inventor： Masatsugu Iiyama

IPC: H05K1/11 ,  H05K3/34 ,  H01L23/13 ,  H01L23/498

CPC classification number: H05K1/111 ,  H01L23/13 ,  H01L23/49805 ,  H01L2224/48227 ,  H01L2224/49175 ,  H05K3/3442 ,  H05K2201/09181 ,  H05K2201/10727 ,  Y02P70/613 ,  H01L2924/00

Abstract: A wiring substrate comprises an insulating substrate and an external electrode on the insulating substrate. The insulating substrate comprises a lateral surface comprising a cutout. The cutout extends to a lower surface of the insulating substrate. The external electrode extends from an inner surface of the cutout to the lower surface of the insulating substrate. The insulating substrate comprises a protrusion at a lower end portion of the inner surface of the cutout. The protrusion protrudes from the inner surface of the cutout toward the lateral surface of the insulating substrate.

公开(公告)号：US09786590B2

公开(公告)日：2017-10-10

申请号：US15070184

申请日：2016-03-15

Applicant: SK Hynix Inc.

Inventor： In Chul Hwang ,  Ki Young Kim ,  Myung Geun Park

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/498 ,  H01L23/00 ,  H05K1/11

CPC classification number: H01L23/4985 ,  H01L23/49838 ,  H01L23/49894 ,  H01L24/17 ,  H01L2224/17104 ,  H05K1/111 ,  H05K1/189 ,  H05K3/32 ,  H05K3/3436 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/10962 ,  Y02P70/613

Abstract: A semiconductor package may be provided. The semiconductor package may include a substrate formed with one or more connection pads. The semiconductor package may include a semiconductor device including at least one bump. The semiconductor package may include an anisotropic conductive fabric including conductive fibers and configured to electrically couple the at least one connection pad to the at least one bump.

公开(公告)号：US20170284630A1

公开(公告)日：2017-10-05

申请号：US15087941

申请日：2016-03-31

Applicant: SWS Warning Systems Inc.

Inventor： Steven A. Sergenese ,  Jerico Wong ,  Rainier Chua ,  Umer Anwer

IPC: F21V5/04 ,  F21V19/00 ,  H05K3/34 ,  F21V9/00

CPC classification number: F21V5/045 ,  F21V7/0058 ,  F21V9/00 ,  F21V19/0025 ,  F21V19/0055 ,  F21V23/004 ,  F21W2111/00 ,  F21Y2105/10 ,  F21Y2113/13 ,  F21Y2115/10 ,  H05K1/0209 ,  H05K3/341 ,  H05K3/3421 ,  H05K3/3452 ,  H05K3/3484 ,  H05K3/3494 ,  H05K2201/09781 ,  H05K2201/10106 ,  H05K2203/041 ,  H05K2203/043 ,  Y02P70/613

Abstract: The present disclosure describes light systems in which the intensity of base color LEDs configured to emit light within a target color region is increased using additional white LEDs and the emitted light is filtered so that a dominant portion of light passing through the filter at a particular viewing angle is within the target color region. The present disclosure also describes methods for forming a printed circuit board with an integral heat sink arrangement by depositing additional solder on solder pads that are not used to connect electronic components so that the additional solder acts as a heat sink.

公开(公告)号：US20170265303A1

公开(公告)日：2017-09-14

申请号：US15067439

申请日：2016-03-11

Applicant: Continental Automotive Systems, Inc.

Inventor： Donald J. Zito ,  David Wayne Currier ,  Keith A. Meny ,  Leobardo Martinez Hernandez ,  Russ Dalbke ,  Peter Lechowicz

IPC: H05K1/18 ,  H05K3/30 ,  H05K5/03 ,  H05K1/11 ,  H01G9/008

CPC classification number: H05K1/183 ,  H01G2/06 ,  H01G9/008 ,  H01G9/06 ,  H01G9/08 ,  H05K1/184 ,  H05K3/30 ,  H05K3/301 ,  H05K3/32 ,  H05K3/3421 ,  H05K5/0056 ,  H05K7/1432 ,  H05K2201/09072 ,  H05K2201/10015 ,  H05K2201/2018 ,  Y02P70/613

Abstract: A retention structure which provides both soldering and vibration stabilization of a capacitor as the capacitor is mounted to a printed circuit board (PCB) of an electronic module. An aperture is part of the PCB to stabilize and prevent the capacitor from rolling during manufacturing. Once secured to the PCB, Room Temperature Vulcanization (RTV), or similar adhesive bead, is placed onto a rigidizer or base plate (typically a casted or aluminum sheet plate). Once the capacitor is soldered in place and fixated on the PCB, the assembly is then placed onto the rigidizer such that the PCB is attached to the rigidizer using an adhesive, and the RTV bead contacts and is deformed by the capacitor, connecting the capacitor to the rigidizer to provide vibration stabilization support. The electronic module includes a cover, and optional dampening/constraint pads are attached to the cover of the electrolytic capacitor for additional vibration stabilization.

公开(公告)号：US20170263561A1

公开(公告)日：2017-09-14

申请号：US15246481

申请日：2016-08-24

Applicant: Apple Inc.

Inventor： Anne M. Mason ,  Peter J. Johnston ,  Christine A. Laliberte ,  Dominic P. McCarthy ,  Shawn X. Arnold ,  Souvik Mukherjee

IPC: H01L23/538 ,  H01L25/18 ,  H05K1/16 ,  H01L23/00 ,  H05K1/18 ,  H05K1/11

CPC classification number: H01L23/5386 ,  H01C7/00 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5385 ,  H01L24/17 ,  H01L25/18 ,  H01L2224/13147 ,  H01L2224/16227 ,  H01L2924/1434 ,  H01L2924/19043 ,  H05K1/113 ,  H05K1/167 ,  H05K1/181 ,  H05K3/3436 ,  H05K3/4076 ,  H05K2201/096 ,  H05K2201/10159 ,  H05K2201/10378 ,  H05K2201/10734 ,  Y02P70/613

Abstract: A routing apparatus includes a PCB having first and second arrays of contact pads, an interposer having third, fourth and fifth arrays of contact pads, the third and fourth arrays of contact pads being disposed on opposing surfaces of the interposer, the third array of contact pads being electrically connected to the first array of contact pads. First and second integrated circuits are respectively mounted on the second and fourth arrays of contact pads. The interposer includes a first group of conductive traces insulated from one another, a first array of conductive vias extending perpendicularly to the first group of conductive traces, the first array of conductive vias including through-vias connecting the third array of contact pads to corresponding contact pads in the fourth array of contact pads. The interposer further including isolation resistors embedded within the first array of conductive vias, each isolation resistor being configured to produce a copy of a signal flowing through the conductive via that is coupled to one end of the isolation resistor on the conductive trace that is coupled to an opposite end of the isolation resistor.

公开(公告)号：US20170261708A1

公开(公告)日：2017-09-14

申请号：US15481994

申请日：2017-04-07

Applicant: INPHI CORPORATION

Inventor： Liang DING ,  Radhakrishnan L. NAGARAJAN ,  Roberto COCCIOLI

IPC: G02B6/42 ,  H04B10/40

CPC classification number: G02B6/4246 ,  G02B6/4214 ,  G02B6/4232 ,  G02B6/4245 ,  G02B6/4274 ,  G02B6/428 ,  G02B6/43 ,  G02B2006/12061 ,  G02B2006/12142 ,  H01L23/49827 ,  H01L24/17 ,  H01L24/81 ,  H01L25/167 ,  H01L2224/16057 ,  H01L2224/16225 ,  H01L2224/1712 ,  H01L2224/81191 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/1425 ,  H01L2924/1426 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/2064 ,  H01S5/02248 ,  H01S5/02276 ,  H01S5/02284 ,  H04B10/40 ,  H05K1/0274 ,  H05K1/181 ,  H05K3/3436 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2201/10378 ,  H05K2203/049 ,  Y02P70/611 ,  Y02P70/613

Abstract: A compact optical transceiver formed by hybrid multichip integration. The optical transceiver includes a Si-photonics chip attached on a PCB. Additionally, the optical transceiver includes a first TSV interposer and a second TSV interposer separately attached nearby the Si-photonics chip on the PCB. Furthermore, the optical transceiver includes a driver chip flip-bonded partially on the Si-photonics chip through a first sets of bumps and partially on the first TSV interposer through a second sets of bumps. Moreover, the optical transceiver includes a transimpedance amplifier module chip flip-bonded partially on the Si-photonics chip through a third sets of bumps and partially on the second TSV interposer through a fourth set of bumps.

公开(公告)号：US20170224722A1

公开(公告)日：2017-08-10

申请号：US15494624

申请日：2017-04-24

Applicant: GOJO INDUSTRIES, INC.

Inventor： DAVID R. MACINGA ,  MARCIA SNYDER ,  JAMES W. ARBOGAST

IPC: A61K31/785 ,  A61K31/194 ,  A61K9/00 ,  A61K31/045

CPC classification number: A61K31/785 ,  A61K9/0014 ,  A61K31/045 ,  A61K31/194 ,  H01L23/50 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K1/023 ,  H05K1/0231 ,  H05K1/0246 ,  H05K3/3436 ,  H05K3/3442 ,  H05K2201/10022 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10636 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2203/0415 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49174 ,  H01L2224/0401

Abstract: This invention provides a pre-surgical disinfecting composition that includes at least about 50 percent by weight of a C1-6 alcohol, based upon the total weight of the disinfecting composition, an acid, and a cationic oligomer or polymer. A method for pre-surgical skin disinfection with rapid antiseptic efficacy without the use of secondary antimicrobial compounds is also described.

公开(公告)号：US09721881B1

公开(公告)日：2017-08-01

申请号：US15142644

申请日：2016-04-29

Applicant: FREESCALE SEMICONDUCTOR, INC.

Inventor： Zhiwei Gong ,  Wei Gao

IPC: H01L23/495 ,  H01L23/498 ,  H01L21/48 ,  H01L23/00 ,  H01L25/16 ,  H05K1/11 ,  H05K1/18 ,  H05K3/34

CPC classification number: H01L23/49838 ,  H01L21/4853 ,  H01L21/486 ,  H01L23/13 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/09 ,  H01L25/162 ,  H01L2224/04042 ,  H01L2224/48091 ,  H05K1/115 ,  H05K1/141 ,  H05K1/181 ,  H05K3/34 ,  H05K3/3436 ,  H05K2201/09072 ,  H05K2201/10378 ,  H05K2201/10515 ,  H05K2201/10674 ,  H05K2201/10734 ,  Y02P70/611 ,  Y02P70/613

Abstract: A method of forming a semiconductor device assembly includes forming an interposer having an opening extending from a first major surface to a second major surface of the interposer and a plurality of external connectors on the second major surface. The method further includes attaching the first major surface of the interposer to a packaged semiconductor device, wherein the opening of the interposer exposes the packaged semiconductor device.