公开(公告)号：US09515042B2

公开(公告)日：2016-12-06

申请号：US13512752

申请日：2011-07-19

申请人： Yasushi Akutsu ,  Kouichi Sato ,  Shigeyuki Yoshizawa

发明人： Yasushi Akutsu ,  Kouichi Sato ,  Shigeyuki Yoshizawa

IPC分类号： H01B1/04 ,  H01B1/22 ,  H01B13/00 ,  C09J7/00 ,  H01L23/00 ,  C09J9/02 ,  C08K3/08 ,  C08F220/28

CPC分类号： H01L24/29 ,  C08F2220/283 ,  C08K3/08 ,  C09J7/00 ,  C09J7/10 ,  C09J9/02 ,  C09J2201/602 ,  C09J2205/102 ,  C09J2433/00 ,  H01B1/22 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29198 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/29364 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/15788 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： An anisotropic conductive film is obtained by dispersing conductive particles in an insulating adhesive composition including a (meth)acrylate-based monomer composition, a radical polymerization initiator, and a film-forming resin. The (meth)acrylate-based monomer composition includes a (meth)acrylate-based monomer which has a cyclic ester residue or a cyclic amide residue represented by the formula (1): R1 is a hydrogen atom or a methyl group; R2 is an alkylene group or an alkyloxy group; R3 is an alkyl group, an alkylene group, an aryl group, or a halogen atom; n is an integer of 0 to 3; R4 is absent or an alkylene, dotted lines on both sides of R4 jointly represent a single bond; X1 is absent, or an oxygen atom or a carbon atom; and X2 is an oxygen atom, a nitrogen atom, or a sulfur atom.

公开(公告)号：US20160351532A1

公开(公告)日：2016-12-01

申请号：US15117326

申请日：2015-02-03

申请人： DEXERIALS CORPORATION

发明人： Yasushi AKUTSU

IPC分类号： H01L23/00 ,  C09J9/02 ,  C09J171/12

CPC分类号： H01L24/83 ,  C08K2201/001 ,  C09D163/00 ,  C09J7/00 ,  C09J7/10 ,  C09J9/02 ,  C09J171/12 ,  C09J2203/326 ,  C09J2205/102 ,  G02F1/13306 ,  G02F1/1339 ,  G02F1/134309 ,  G02F1/13439 ,  G02F1/1345 ,  G02F1/13452 ,  G02F2001/133302 ,  G02F2001/133354 ,  G02F2202/28 ,  H01L23/544 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/91 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2223/54486 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/29311 ,  H01L2224/29316 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/2936 ,  H01L2224/29371 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/8113 ,  H01L2224/81132 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/83101 ,  H01L2224/8313 ,  H01L2224/83132 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83851 ,  H05K1/0269 ,  H05K3/323 ,  H05K2203/166 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/0665

摘要： An alignment mark at a position that overlaps an area in which an anisotropic conductive film is pasted, and to accurately perform alignment using an image captured by a camera. An alignment method in which an electronic component is mounted on the obverse surface of a transparent substrate with a conductive adhesive agent interposed therebetween, a substrate-side alignment mark and a component-side alignment mark are adjusted from the captured image, and the position at which the electronic component is mounted on the transparent substrate is aligned, wherein in the conductive adhesive agent, conductive particles are in a regular arrangement as viewed from a planar perspective, and in the captured image, the outside edges of the alignment marks exposed between the conductive particles are intermittently visible as line segments (S) along the imaginary line segments of the outside edges of the alignment mark.

摘要翻译： 在与各向异性导电膜被粘贴的区域重叠的位置处的对准标记，并且使用由照相机拍摄的图像来精确地进行对准。 将电子部件安装在透明基板的具有导电性粘合剂的正面的基板侧对准标记和分量侧对准标记的对准方法中，从捕获图像和位置 对准电子部件安装在透明基板上，其中在导电粘合剂中，从平面的角度看，导电颗粒处于规则的布置，并且在捕获的图像中，对准标记的外边缘在 导电颗粒沿着对准标记的外边缘的假想线段间断地看作线段（S）。

公开(公告)号：US20160194531A1

公开(公告)日：2016-07-07

申请号：US14916490

申请日：2014-09-09

申请人： DEXERIALS CORPORATION

发明人： Masaharu AOKI ,  Shiyuki KANISAWA ,  Hidetsugu NAMIKI ,  Taichi KOYAMA ,  Akira ISHIGAMI

IPC分类号： C09J133/20 ,  C09J9/02 ,  H01L33/62

CPC分类号： C09J133/20 ,  C08F220/18 ,  C08L33/066 ,  C08L33/068 ,  C08L2205/22 ,  C09J9/02 ,  C09J133/066 ,  C09J163/00 ,  H01B1/22 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L33/62 ,  H01L2224/16227 ,  H01L2224/2929 ,  H01L2224/29311 ,  H01L2224/29316 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/2936 ,  H01L2224/29371 ,  H01L2224/29387 ,  H01L2224/29388 ,  H01L2224/2939 ,  H01L2224/29393 ,  H01L2224/294 ,  H01L2224/32225 ,  H01L2224/81424 ,  H01L2224/81487 ,  H01L2224/81903 ,  H01L2224/83424 ,  H01L2224/83487 ,  H01L2224/83851 ,  H01L2224/83862 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2933/0066 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/0635 ,  H01L2924/01006 ,  H01L2924/0543 ,  H01L2924/01049 ,  H01L2924/0544 ,  H01L2924/0105 ,  C08F2220/1825 ,  C08F2220/1808 ,  C08F220/44 ,  C08F220/06 ,  C08F220/20 ,  C08K5/151

摘要： This adhesive contains an epoxy compound, a cationic catalyst, and an acrylic resin that includes acrylic acid and an acrylic acid ester having a hydroxyl group. The acrylic acid in the acrylic resin reacts with the epoxy compound, creating a link between the acrylic resin island part and the epoxy compound sea part, and strengthening the anchoring effect with respect to the epoxy compound sea part by roughening the surface of an oxide film. Furthermore, the hydroxyl-group-containing acrylic acid ester in the acrylic resin becomes electrostatically adhesive to wiring due to the polarity of the hydroxyl group. Excellent adhesive strength can be obtained by adhering, in this way, the entire cured product composed of the acrylic resin island part and the epoxy compound sea part to the oxide film.

摘要翻译： 该粘合剂包含环氧化合物，阳离子催化剂和丙烯酸树脂，其包括丙烯酸和具有羟基的丙烯酸酯。 丙烯酸树脂中的丙烯酸与环氧化合物反应，产生丙烯酸树脂岛部分和环氧化合物海部之间的连接，并通过使氧化膜的表面粗糙化来增强相对于环氧化合物海部的锚固效果 。 此外，由于羟基的极性，丙烯酸树脂中的含羟基的丙烯酸酯与布线成为静电粘合剂。 通过将由丙烯酸树脂岛部和环氧化合物海部构成的整个固化物以这种方式粘附到氧化膜，可以获得良好的粘合强度。

公开(公告)号：US20150243626A1

公开(公告)日：2015-08-27

申请号：US14428582

申请日：2013-09-17

申请人： DEXERIALS CORPORATION

发明人： Kouichi Sato ,  Yasushi Akutsu

IPC分类号： H01L23/00 ,  B29C71/04 ,  G02F1/1345 ,  B32B33/00 ,  C09J9/02 ,  B29C59/02 ,  B32B3/30

CPC分类号： H01L24/28 ,  B29C59/02 ,  B29C71/04 ,  B29C2035/0827 ,  B29C2059/028 ,  B29K2063/00 ,  B29L2009/003 ,  B29L2031/34 ,  B32B3/08 ,  B32B3/30 ,  B32B7/12 ,  B32B27/08 ,  B32B27/20 ,  B32B27/308 ,  B32B27/36 ,  B32B27/38 ,  B32B33/00 ,  B32B2255/205 ,  B32B2264/102 ,  B32B2264/104 ,  B32B2270/00 ,  B32B2307/202 ,  B32B2307/412 ,  B32B2307/706 ,  B32B2457/00 ,  B32B2457/202 ,  C08K3/08 ,  C08K2201/001 ,  C09J7/00 ,  C09J7/10 ,  C09J9/02 ,  C09J2201/36 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2205/102 ,  G02F1/13452 ,  G02F1/13454 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/13144 ,  H01L2224/16227 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/2711 ,  H01L2224/2712 ,  H01L2224/27334 ,  H01L2224/29076 ,  H01L2224/2908 ,  H01L2224/29083 ,  H01L2224/2919 ,  H01L2224/29195 ,  H01L2224/2929 ,  H01L2224/29311 ,  H01L2224/29316 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/2936 ,  H01L2224/29371 ,  H01L2224/29387 ,  H01L2224/29388 ,  H01L2224/2939 ,  H01L2224/29391 ,  H01L2224/29393 ,  H01L2224/29394 ,  H01L2224/29395 ,  H01L2224/294 ,  H01L2224/29486 ,  H01L2224/29494 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75301 ,  H01L2224/81488 ,  H01L2224/81903 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83488 ,  H01L2224/83851 ,  H01L2224/83856 ,  H01L2224/83862 ,  H01L2224/83871 ,  H01L2224/83874 ,  H01L2224/83885 ,  H01L2224/83907 ,  H01L2924/01006 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/0543 ,  H01L2924/0544 ,  H01L2924/0549 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/351 ,  H01L2924/3511 ,  H01L2924/381 ,  Y10T156/1039 ,  Y10T428/24562 ,  H01L2924/00012 ,  H01L2924/0665 ,  H01L2924/0635 ,  H01L2924/069 ,  H01L2924/07025 ,  H01L2924/066 ,  H01L2924/06 ,  H01L2924/00014 ,  H01L2924/0615

摘要： To reduce substrate warp occurring after connection an anisotropic conductive film is used. An anisotropic conductive film has: a first insulating adhesive layer; a second insulating adhesive layer; and a conductive particle-containing layer sandwiched by the first insulating adhesive layer and the second insulating adhesive layer and having conductive particles contained in an insulating adhesive, wherein air bubbles are contained between the conductive particle-containing layer and the first insulating adhesive layer, and, the conductive particle-containing layer, a portion thereof below the conductive particles and in contact with the second insulating adhesive layer has a lower degree of cure than other portions thereof.

摘要翻译： 为了减少连接后发生的基板翘曲，使用各向异性导电膜。 各向异性导电膜具有：第一绝缘粘合剂层; 第二绝缘粘合剂层; 以及由所述第一绝缘粘合剂层和所述第二绝缘粘合剂层夹持的导电性粒子层，并且在所述导电性粒子含有层和所述第一绝缘性粘合剂层之间含有气泡， ，导电性粒子含有层的导电性粒子以下的部分与第二绝缘性粘合剂层的接触度比其它部分的固化度低。

公开(公告)号：US20150107765A1

公开(公告)日：2015-04-23

申请号：US14512535

申请日：2014-10-13

申请人： SunRay Scientific LLC

发明人： S. Kumar Khanna

IPC分类号： C09J9/02 ,  H05K3/30 ,  H05K13/04 ,  C09J9/00

CPC分类号： C09J9/02 ,  C08K9/02 ,  C08K2201/001 ,  C08K2201/01 ,  C09J9/00 ,  H01L24/29 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/16227 ,  H01L2224/2929 ,  H01L2224/29298 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/2936 ,  H01L2224/29388 ,  H01L2224/29393 ,  H01L2224/29499 ,  H01L2224/29562 ,  H01L2224/2957 ,  H01L2224/29639 ,  H01L2224/29644 ,  H01L2224/32013 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/75253 ,  H01L2224/75265 ,  H01L2224/75266 ,  H01L2224/75734 ,  H01L2224/75735 ,  H01L2224/81193 ,  H01L2224/83192 ,  H01L2224/83851 ,  H01L2224/83874 ,  H01L2224/8393 ,  H01L2924/00014 ,  H05K3/323 ,  H05K2201/0218 ,  H05K2201/0221 ,  H05K2201/0323 ,  H05K2201/083 ,  H05K2203/104 ,  H01L2924/2064 ,  H01L2924/0665 ,  H01L2224/0401

摘要： Illustrative embodiments of anisotropic conductive adhesive (ACA) and associated methods are disclosed. In one illustrative embodiment, the ACA may comprise a binder curable using UV light and a plurality of particles suspended in the binder. Each of the plurality of particles may comprise a ferromagnetic material coated with a layer of electrically conductive material. The electrically conducting material may form electrically conductive and isolated parallel paths when the ACA is cured using UV light after being subjected to a magnetic field.

摘要翻译： 公开了各向异性导电粘合剂（ACA）和相关方法的说明性实施方案。 在一个说明性实施方案中，ACA可以包括可使用UV光固化的粘合剂和悬浮在粘合剂中的多个颗粒。 多个颗粒中的每一个可以包括涂覆有导电材料层的铁磁材料。 当ACA在经受磁场后用UV光固化时，导电材料可以形成导电和隔离的平行路径。

公开(公告)号：US20120107552A1

公开(公告)日：2012-05-03

申请号：US12938511

申请日：2010-11-03

申请人： John P. TELLKAMP

发明人： John P. TELLKAMP

IPC分类号： B32B5/16 ,  B32B38/00 ,  B32B7/00

CPC分类号： H01L24/29 ,  C09J9/02 ,  C09J2203/326 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/04026 ,  H01L2224/05655 ,  H01L2224/26175 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/2936 ,  H01L2224/29393 ,  H01L2224/29439 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/325 ,  H01L2224/83009 ,  H01L2224/83192 ,  H01L2224/83851 ,  H01L2924/14 ,  Y10T428/24174 ,  H01L2924/0665 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A method for conductively attaching a workpiece (110) onto a substrate (101). Spreading a layer of an adhesive polymeric compound (130) over the first surface (101a) of the substrate, the compound including a suspension of electrically and thermally conductive first particles (140) intermixed with a suspension of ferromagnetic surfactant-coated second particles (141). Applying an external magnetic field (401) to the layer, the field oriented normal to the first surface and capable of arraying the ferromagnetic particles in lines, and, by causality, aligning the conductive particles in chains normal to the first surface. Orienting the second surface (110a) of the workpiece parallel to the first substrate surface (101a) and bringing the aligned conductive particle chains (140) in contact with the first and second surfaces by pressing the workpiece onto the layer and piercing the chain ends to touch the first and second surfaces.

摘要翻译： 一种用于将工件（110）导电地附接到基板（101）上的方法。 在衬底的第一表面（101a）上铺展一层粘合的聚合化合物（130），该化合物包括导电和导热的第一颗粒（140）与铁磁表面活性剂涂覆的第二颗粒（141）的悬浮液混合的悬浮液 ）。 将外部磁场（401）施加到该层，该场与第一表面垂直并且能够排列铁磁颗粒，并且通过因果关系将导电颗粒与第一表面垂直的链对准。 使工件的第二表面（110a）平行于第一基板表面（101a）定向，并且使对准的导电粒子链（140）通过将工件压入该层并将链端刺穿到第二表面 触摸第一和第二表面。

公开(公告)号：US20120106111A1

公开(公告)日：2012-05-03

申请号：US12916569

申请日：2010-10-31

申请人： JOSEPH MAZZOCHETTE ,  Sarwan Kumar Khanna

发明人： JOSEPH MAZZOCHETTE ,  Sarwan Kumar Khanna

IPC分类号： H05K7/00 ,  H01F1/00 ,  H01F1/26 ,  C09K5/00 ,  H01F1/04 ,  B82Y99/00 ,  B82Y30/00

CPC分类号： H05K3/323 ,  B82Y30/00 ,  H01F1/26 ,  H01F1/37 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/2929 ,  H01L2224/29324 ,  H01L2224/29349 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/2936 ,  H01L2224/29369 ,  H01L2224/29371 ,  H01L2224/29388 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29447 ,  H01L2224/29455 ,  H01L2224/32105 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2224/83887 ,  H01L2225/06558 ,  H01L2924/00013 ,  H01L2924/01029 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15787 ,  H01L2924/3011 ,  H05K2201/0218 ,  H05K2201/0266 ,  H05K2201/083 ,  H05K2203/104 ,  H01L2924/0665 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00 ,  H01L2924/3512

摘要： A composition of matter comprising a plurality of nanoparticles in a non-conductive binder, wherein, the type of nanoparticles form isolated parallel electrically and thermally conductive columns when cured in the presence of the magnetic field. Also wherein the plurality of nanoparticles are Paramagnetic or Ferromagnetic magnetic. Wherein the nano particles are coated, and of a particular shape. Wherein the particles are selected from the group consisting of; Al, Pt, Cr, Mn, crown glass, Fe, Ni, and Co, Ni—Fe/SiO2, Co/SiO2, Fe—Co/SiO2, Fe/nickel-ferrite, Ni—Zn-ferrite/SiO2, Fe—Ni/polymer, Co/polymer, ferrites, iron oxide and any combination and alloy thereof, and the Binder selected from the group consisting of; epoxies, polyurethanes, polyimides, polymeric materials, silicones, adhesives, acrylates, the UV curable modifier and any combination thereof.

摘要翻译： 一种在非导电粘合剂中包含多个纳米颗粒的物质组合物，其中当在磁场存在下固化时，纳米颗粒的类型形成隔离的平行的导电和导热柱。 而且其中多个纳米颗粒是顺磁性或铁磁性的。 其中纳米颗粒被涂覆并且具有特定形状。 其中颗粒选自： Al，Pt，Cr，Mn，冠状玻璃，Fe，Ni和Co，Ni-Fe / SiO2，Co / SiO2，Fe-Co / SiO2，Fe /镍铁氧体，Ni-Zn-铁素体/ Ni /聚合物，Co /聚合物，铁氧体，氧化铁及其任何组合和合金，以及选自以下的粘合剂： 环氧树脂，聚氨酯，聚酰亚胺，聚合物材料，硅酮，粘合剂，丙烯酸酯，UV可固化改性剂及其任何组合。

公开(公告)号：US07176044B2

公开(公告)日：2007-02-13

申请号：US10459601

申请日：2003-06-12

申请人： Deborah Derfelt Forray ,  Puwei Liu ,  Benedicto delos Santos

发明人： Deborah Derfelt Forray ,  Puwei Liu ,  Benedicto delos Santos

IPC分类号： G01R31/26

CPC分类号： H01L24/83 ,  C09J5/06 ,  H01L24/29 ,  H01L24/73 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/29386 ,  H01L2224/29393 ,  H01L2224/29439 ,  H01L2224/29455 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2224/83856 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/15787 ,  Y10T156/10 ,  Y10T428/31504 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/05032 ,  H01L2924/0503 ,  H01L2924/04642 ,  H01L2924/0532 ,  H01L2924/05442 ,  H01L2924/05432 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2924/01049 ,  H01L2924/01048

摘要： The present invention relates to b-stageable die attach adhesives, methods of preparing such adhesives, methods of applying such adhesives to the die and other substrate surfaces, and assemblies prepared therewith for connecting microelectronic circuitry.

摘要翻译： 本发明涉及b级可用的芯片附着粘合剂，制备这种粘合剂的方法，将这种粘合剂施加到模具和其它基材表面的方法，以及用于连接微电子电路制备的组件。

公开(公告)号：US20060284141A1

公开(公告)日：2006-12-21

申请号：US11157611

申请日：2005-06-21

申请人： Osama Musa

发明人： Osama Musa

IPC分类号： H01B1/12

CPC分类号： C08K5/0091 ,  C08K5/3415 ,  H01L23/36 ,  H01L23/552 ,  H01L24/83 ,  H01L2224/2929 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/29439 ,  H01L2224/83851 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01079 ,  H01L2924/0781 ,  H01L2924/14 ,  H05K1/095 ,  H05K2203/121 ,  H01L2924/00014 ,  H01L2924/00

摘要： A conductive resin composition comprises a resin, a conductive filler, and the metal salt of a compound containing maleimide functionality.

摘要翻译： 导电树脂组合物包含树脂，导电填料和含有马来酰亚胺官能团的化合物的金属盐。

公开(公告)号：US20050163982A1

公开(公告)日：2005-07-28

申请号：US11039778

申请日：2005-01-24

申请人： Masahiro Ono ,  Tsukasa Shiraishi

发明人： Masahiro Ono ,  Tsukasa Shiraishi

IPC分类号： H01L21/56 ,  H01L21/60 ,  H01L23/498 ,  H05K3/32 ,  B32B3/00

CPC分类号： H01L24/83 ,  H01L21/563 ,  H01L23/49811 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/31 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/1329 ,  H01L2224/13318 ,  H01L2224/13339 ,  H01L2224/13344 ,  H01L2224/13347 ,  H01L2224/13355 ,  H01L2224/13357 ,  H01L2224/1336 ,  H01L2224/13364 ,  H01L2224/13369 ,  H01L2224/13386 ,  H01L2224/1339 ,  H01L2224/13444 ,  H01L2224/16225 ,  H01L2224/29082 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81101 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K3/321 ,  Y10T156/1056 ,  Y10T428/24917 ,  Y10T428/24983 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/29347 ,  H01L2224/29344 ,  H01L2224/29339 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/2936 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/29318 ,  H01L2224/29444 ,  H01L2224/05599

摘要： The invention is intended for providing a semiconductor package structure which prevents degradation in characteristics of a semiconductor device, and breakage of interconnections, when the semiconductor device is packaged on a circuit substrate. In the package structure having the semiconductor device mounted on the circuit substrate, bump electrodes of the semiconductor device are placed on input/output terminal electrodes of the circuit substrate and are electrically and mechanically connected thereto by bonding with a conductive adhesive, and the semiconductor device is bonded and fixed to the circuit substrate by a resin film formed previously on a surface of a main body of the circuit substrate. The structure does no damage to a semiconductor functional part and to interconnections, and allows mounting with a lower load as compared to structures using conventional anisotropic conductive films and the like.

摘要翻译： 本发明旨在提供一种当将半导体器件封装在电路基板上时，防止半导体器件的特性劣化以及互连断裂的半导体封装结构。 在具有安装在电路基板上的半导体器件的封装结构中，半导体器件的突起电极被放置在电路基板的输入/输出端子电极上，并通过与导电粘合剂结合而电连接和机械连接，半导体器件 通过预先形成在电路基板的主体的表面上的树脂膜粘结固定在电路基板上。 与使用常规的各向异性导电膜等的结构相比，该结构不会损坏半导体功能部件和互连，并且允许以较低的负载进行安装。