公开(公告)号：US09455237B2

公开(公告)日：2016-09-27

申请号：US14754293

申请日：2015-06-29

Applicant: Invensas Corporation

Inventor： Cyprian Emeka Uzoh ,  Rajesh Katkar

IPC: H01L21/44 ,  H01L23/00 ,  H01L23/498 ,  H01L21/768 ,  H01L21/48 ,  H01L21/3213

CPC classification number: H01L24/11 ,  H01L21/3213 ,  H01L21/32139 ,  H01L21/4853 ,  H01L21/76885 ,  H01L23/49811 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/02166 ,  H01L2224/03462 ,  H01L2224/0348 ,  H01L2224/0362 ,  H01L2224/03823 ,  H01L2224/0401 ,  H01L2224/05023 ,  H01L2224/05082 ,  H01L2224/05147 ,  H01L2224/05164 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/05558 ,  H01L2224/05564 ,  H01L2224/05565 ,  H01L2224/05568 ,  H01L2224/05578 ,  H01L2224/05582 ,  H01L2224/05611 ,  H01L2224/05664 ,  H01L2224/05686 ,  H01L2224/0569 ,  H01L2224/10126 ,  H01L2224/10145 ,  H01L2224/11013 ,  H01L2224/1111 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/1182 ,  H01L2224/11849 ,  H01L2224/131 ,  H01L2224/81815 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/00

Abstract: An apparatus relating generally to a substrate is disclosed. In this apparatus, a first metal layer is on the substrate. The first metal layer has an opening. The opening of the first metal layer has a bottom and one or more sides extending from the bottom. A second metal layer is on the first metal layer. The first metal layer and the second metal layer provide a bowl-shaped structure. An inner surface of the bowl-shaped structure is defined responsive to the opening of the first metal layer and the second metal layer thereon. The opening of the bowl-shaped structure is configured to receive and at least partially retain a bonding material during a reflow process.

公开(公告)号：US09412714B2

公开(公告)日：2016-08-09

申请号：US14291874

申请日：2014-05-30

Applicant: Invensas Corporation

Inventor： Reynaldo Co ,  Wael Zohni ,  Rizza Lee Saga Cizek ,  Rajesh Katkar

IPC: H01L23/02 ,  H01L23/00 ,  H01L23/34 ,  H01L23/31 ,  H01L21/56 ,  H01L23/522 ,  H01L23/498

CPC classification number: H01L25/0657 ,  H01L21/56 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/34 ,  H01L23/367 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/5226 ,  H01L24/17 ,  H01L24/81 ,  H01L25/50 ,  H01L2221/68318 ,  H01L2221/68359 ,  H01L2221/68381 ,  H01L2224/0401 ,  H01L2224/11318 ,  H01L2224/1132 ,  H01L2224/131 ,  H01L2224/1403 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06548 ,  H01L2225/06568 ,  H01L2225/06582 ,  H01L2225/06589 ,  H01L2924/014 ,  H01L2924/15151 ,  H01L2924/15312 ,  H01L2924/15321 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A microelectronic package may include a substrate having first and second regions, a first surface and a second surface remote from the first surface; at least one microelectronic element overlying the first surface within the first region; electrically conductive elements at the first surface within the second region; a support structure having a third surface and a fourth surface remote from the third surface and overlying the first surface within the second region in which the third surface faces the first surface, second and third electrically conductive elements exposed respectively at the third and fourth surfaces and electrically connected to the conductive elements at the first surface in the first region; and wire bonds defining edge surfaces and having bases electrically connected through ones of the third conductive elements to respective ones of the second conductive elements and ends remote from the support structure and the bases.

Abstract translation: 微电子封装可以包括具有第一和第二区域的基板，第一表面和远离第一表面的第二表面; 在所述第一区域内覆盖所述第一表面的至少一个微电子元件; 在第二区域内的第一表面处的导电元件; 支撑结构，其具有第三表面和第四表面，所述第三表面和第四表面远离所述第三表面并且在所述第三区域内的所述第一区域中覆盖所述第一表面，所述第三表面面向所述第一表面， 电连接到第一区域中的第一表面处的导电元件; 以及限定边缘表面并且具有通过第三导电元件中的一个电连接到相应的第二导电元件和远离支撑结构和基座的端部的接合线。

公开(公告)号：US09368479B2

公开(公告)日：2016-06-14

申请号：US14201585

申请日：2014-03-07

Applicant: Invensas Corporation

Inventor： Rajesh Katkar ,  Arkalgud R. Sitaram ,  Cyprian Emeka Uzoh

IPC: H01L23/42 ,  H01L25/065 ,  H01L23/538 ,  H01L21/768 ,  H01L23/48 ,  H01L21/306 ,  H01L21/308 ,  H01L21/311 ,  H01L25/00 ,  H01L23/367

CPC classification number: H01L25/0657 ,  H01L21/30604 ,  H01L21/308 ,  H01L21/31105 ,  H01L21/76897 ,  H01L21/76898 ,  H01L23/3675 ,  H01L23/3677 ,  H01L23/42 ,  H01L23/481 ,  H01L23/5386 ,  H01L25/50 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/00

Abstract: An apparatus relates generally to a three-dimensional stacked integrated circuit. In such an apparatus, the three-dimensional stacked integrated circuit has at least a first die and a second die interconnected to one another using die-to-die interconnects. A substrate of the first die has at least one thermal via structure extending from a lower surface of the substrate toward a well of the substrate without extending to the well and without extending through the substrate. A first end of the at least one thermal via structure is at least sufficiently proximate to the well of the substrate for conduction of heat away therefrom. The substrate has at least one through substrate via structure extending from the lower surface of the substrate to an upper surface of the substrate. A second end of the at least one thermal via structure is coupled to at least one through die via structure of the second die for thermal conductivity.

Abstract translation: 装置一般涉及三维堆叠集成电路。 在这种装置中，三维堆叠集成电路具有至少第一管芯和第二管芯，使用管芯到管芯互连彼此互连。 第一管芯的衬底具有至少一个热通孔结构，其从衬底的下表面朝向衬底的阱延伸，而不延伸到阱并且不延伸通过衬底。 所述至少一个热通孔结构的第一端至少足够靠近所述衬底的阱，用于将热量传导出来。 衬底具有从衬底的下表面延伸到衬底的上表面的至少一个穿过衬底通孔结构。 所述至少一个热通孔结构的第二端与所述第二管芯的至少一个通孔通孔结构耦合以进行导热。

公开(公告)号：US09324626B2

公开(公告)日：2016-04-26

申请号：US14558462

申请日：2014-12-02

Applicant: Invensas Corporation

Inventor： Hong Shen ,  Liang Wang ,  Rajesh Katkar

IPC: H01L23/31 ,  H01L21/288 ,  H01L21/56 ,  H01L21/768 ,  H01L23/04 ,  H01L23/14 ,  H01L23/367 ,  H01L23/498 ,  H01L23/00 ,  H01L25/065 ,  H01L25/00 ,  H01L23/10

CPC classification number: H01L23/055 ,  H01L21/2885 ,  H01L21/4803 ,  H01L21/486 ,  H01L21/56 ,  H01L21/561 ,  H01L21/76879 ,  H01L21/76897 ,  H01L23/04 ,  H01L23/10 ,  H01L23/147 ,  H01L23/3107 ,  H01L23/315 ,  H01L23/3675 ,  H01L23/481 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5389 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2225/06548 ,  H01L2225/06555 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Stacked dies (110) are encapsulated in an interposer's cavity (304) by multiple encapsulant layers (524) formed of moldable material. Conductive paths (520, 623) connect the dies to the cavity's bottom all (304B) and, through TSVs passing through the bottom wall, to a conductor below the interposer. The conductive paths can be formed in segments each of which is formed in a through-hole (514) in a respective encapsulant layer. Each segment can be formed by electroplating onto a lower segment; the electroplating current can be provided from below the interposer through the TSVs and earlier formed segments. Other features are also provided.

Abstract translation: 堆叠的管芯（110）通过由可模制材料形成的多个密封层（524）封装在插入件的空腔（304）中。 导电路径（520,623）将模具连接到空腔的底部（304B），并且通过穿过底壁的TSV连接到插入件下方的导体。 导电路径可以形成为各自形成在各个密封层中的通孔（514）中的段。 每个段可以通过电镀形成在下段上; 电镀电流可以通过TSV和较早形成的片段从插入件的下方提供。 还提供其他功能。

公开(公告)号：US20160049383A1

公开(公告)日：2016-02-18

申请号：US14532806

申请日：2014-11-04

Applicant: Invensas Corporation

Inventor： Charles G. Woychik ,  Cyprian Emeka Uzoh ,  Hong Shen ,  Christopher W. Lattin ,  Guilian Gao ,  Rajesh Katkar

IPC: H01L25/065 ,  H01L23/367 ,  H01L21/56 ,  H01L23/31 ,  H01L25/00 ,  H01L23/00

CPC classification number: H01L25/0652 ,  H01L21/563 ,  H01L21/568 ,  H01L23/3107 ,  H01L23/36 ,  H01L23/3675 ,  H01L23/5384 ,  H01L23/5389 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L25/165 ,  H01L25/50 ,  H01L2224/0231 ,  H01L2224/11003 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/1403 ,  H01L2224/14051 ,  H01L2224/14181 ,  H01L2224/14517 ,  H01L2224/14519 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/17517 ,  H01L2224/17519 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73259 ,  H01L2224/81005 ,  H01L2224/83005 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06589 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/19107 ,  H05K1/185 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A device and method for an integrated device includes a first redistribution layer comprising one or more first conductors, one or more first dies mounted to a first surface of the first redistribution layer and electrically coupled to the first conductors, one or more first posts having first ends attached to the first dies and second ends opposite the first ends, one or more second posts having third ends attached to the first surface of the first redistribution layer and fourth ends opposite the third ends, and a second redistribution layer comprising one or more second conductors, the second redistribution layer being attached to the second ends of the first posts and to the fourth ends of the second posts. In some embodiments, the integrated device further includes a heat spreader mounted to a second surface of the first redistribution layer. The second surface is opposite the first surface.

Abstract translation: 一种用于集成器件的器件和方法包括：第一再分配层，其包括一个或多个第一导体，一个或多个第一裸片，其安装到第一再分布层的第一表面并电耦合到第一导体，一个或多个第一柱具有第一导体 末端附接到第一模具和与第一端相对的第二端，一个或多个第二柱，其具有附接到第一再分布层的第一表面的第三端和与第三端相对的第四端，以及包括一个或多个第二端的第二再分布层 导体，第二再分布层附接到第一柱的第二端和第二柱的第四端。 在一些实施例中，集成装置还包括安装到第一再分配层的第二表面的散热器。 第二表面与第一表面相对。

公开(公告)号：US20160044781A1

公开(公告)日：2016-02-11

申请号：US14887674

申请日：2015-10-20

Applicant: Invensas Corporation

Inventor： Rajesh Katkar ,  Cyprian Emeka Uzoh ,  Belgacem Haba ,  Ilyas Mohammed

IPC: H05K1/03 ,  H05K3/40 ,  H05K1/11 ,  H05K3/42 ,  H01L23/13 ,  H01L21/48

CPC classification number: H05K1/0306 ,  H01L21/481 ,  H01L21/4853 ,  H01L21/486 ,  H01L23/13 ,  H01L23/3731 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/49894 ,  H01L23/5381 ,  H01L23/5384 ,  H01L23/5385 ,  H01L23/5386 ,  H01L24/17 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2224/16113 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06548 ,  H01L2225/06572 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/107 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15331 ,  H05K1/09 ,  H05K1/112 ,  H05K1/115 ,  H05K3/4007 ,  H05K3/42 ,  H05K2201/09545 ,  H05K2201/10378 ,  H05K2203/0323

Abstract: Interposers and methods of making the same are disclosed herein. In one embodiment, an interposer includes a region having first and second oppositely facing surfaces and a plurality of pores, each pore extending in a first direction from the first surface towards the second surface, wherein alumina extends along a wall of each pore; a plurality of electrically conductive connection elements extending in the first direction, consisting essentially of aluminum and being electrically isolated from one another by at least the alumina; a first conductive path provided at the first surface for connection with a first component external to the interposer; and a second conductive path provided at the second surface for connection with a second component external to the interposer, wherein the first and second conductive paths are electrically connected through at least some of the connection elements.

Abstract translation: 中间体及其制备方法在本文中公开。 在一个实施例中，插入件包括具有第一和第二相对面的表面和多个孔的区域，每个孔从第一表面朝向第二表面沿第一方向延伸，其中氧化铝沿每个孔的壁延伸; 多个导电连接元件，其沿第一方向延伸，主要由铝构成，并通过至少氧化铝彼此电隔离; 第一导电路径，设置在第一表面处，用于与插入件外部的第一部件连接; 以及设置在所述第二表面处用于与所述插入件外部的第二部件连接的第二导电路径，其中所述第一和第二导电路径通过至少一些所述连接元件电连接。

公开(公告)号：US20150380377A1

公开(公告)日：2015-12-31

申请号：US14841381

申请日：2015-08-31

Applicant: Invensas Corporation

Inventor： CYPRIAN EMEKA UZOH ,  Rajesh Katkar

IPC: H01L23/00 ,  H01L25/16

CPC classification number: H01L25/0657 ,  B81B7/0074 ,  H01L21/4853 ,  H01L23/3675 ,  H01L23/42 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/522 ,  H01L23/5383 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/24 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/16 ,  H01L25/50 ,  H01L28/10 ,  H01L28/20 ,  H01L28/40 ,  H01L2224/0239 ,  H01L2224/0332 ,  H01L2224/0333 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/03462 ,  H01L2224/03464 ,  H01L2224/0347 ,  H01L2224/03614 ,  H01L2224/0391 ,  H01L2224/03912 ,  H01L2224/03914 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05111 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05169 ,  H01L2224/05184 ,  H01L2224/05547 ,  H01L2224/05565 ,  H01L2224/05568 ,  H01L2224/05569 ,  H01L2224/05611 ,  H01L2224/05616 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05669 ,  H01L2224/05684 ,  H01L2224/1134 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/1147 ,  H01L2224/11903 ,  H01L2224/1191 ,  H01L2224/13022 ,  H01L2224/13023 ,  H01L2224/13025 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13169 ,  H01L2224/13184 ,  H01L2224/13565 ,  H01L2224/13616 ,  H01L2224/1403 ,  H01L2224/14131 ,  H01L2224/14132 ,  H01L2224/14134 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16148 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16265 ,  H01L2224/17181 ,  H01L2224/24147 ,  H01L2224/24227 ,  H01L2224/244 ,  H01L2224/32145 ,  H01L2224/3303 ,  H01L2224/33181 ,  H01L2224/45015 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48149 ,  H01L2224/4903 ,  H01L2224/73201 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81825 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H01L2924/1461 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/16251 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/3841 ,  H01L2924/00 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/01074 ,  H01L2924/01028 ,  H01L2924/01082 ,  H01L2224/05 ,  H01L2224/13 ,  H01L2224/81 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2224/45099

Abstract: Apparatuses relating generally to a substrate are disclosed. In such an apparatus, first wire bond wires (“first wires”) extend from a surface of the substrate. Second wire bond wires (“second wires”) extend from the surface of the substrate. The first wires and the second wires are external to the substrate. The first wires are disposed at least partially within the second wires. The first wires are of a first height. The second wires are of a second height greater than the first height for coupling of at least one electronic component to the first wires at least partially disposed within the second wires.

Abstract translation: 公开了一般涉及衬底的装置。 在这种装置中，第一线接合线（“第一线”）从衬底的表面延伸。 第二线接合线（“第二线”）从衬底的表面延伸。 第一线和第二线在衬底外部。 第一导线至少部分地设置在第二导线内。 第一根导线是第一个高度。 第二导线的第二高度大于第一高度，用于将至少一个电子部件耦合到至少部分地设置在第二导线内的第一导线。

公开(公告)号：US09165793B1

公开(公告)日：2015-10-20

申请号：US14268899

申请日：2014-05-02

Applicant: Invensas Corporation

Inventor： Liang Wang ,  Hong Shen ,  Rajesh Katkar

IPC: H01L21/00 ,  H01L21/56

CPC classification number: H01L28/60 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/56 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/5223 ,  H01L24/05 ,  H01L24/32 ,  H01L24/83 ,  H01L25/105 ,  H01L25/11 ,  H01L25/115 ,  H01L25/165 ,  H01L25/50 ,  H01L28/40 ,  H01L28/65 ,  H01L2224/05009 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/1205 ,  H01L2924/15311 ,  H01L2924/16153 ,  H01L2924/00

Abstract: A method for making an integrated circuit package includes providing a handle wafer having a first region defining a cavity. A capacitor is formed in the first region. The capacitor has a pair of electrodes, each coupled to one of a pair of conductive pads, at least one of which is disposed on a lower surface of the handle wafer. An interposer having an upper surface with a conductive pad and at least one semiconductor die disposed thereon is also provided. The die has an integrated circuit that is electroconductively coupled to a redistribution layer (RDL) of the interposer. The lower surface of the handle wafer is bonded to the upper surface of the interposer such that the die is disposed below or within the cavity and the electroconductive pad of the handle wafer is bonded to the electroconductive pad of the interposer in a metal-to-metal bond.

Abstract translation: 制造集成电路封装的方法包括提供具有限定空腔的第一区域的处理晶片。 在第一区域形成电容器。 电容器具有一对电极，每对电极耦合到一对导电焊盘中的一个，其至少一个设置在处理晶片的下表面上。 还提供了具有上表面的插入件，其具有导电焊盘和设置在其上的至少一个半导体管芯。 芯片具有与内插器的再分配层（RDL）电导耦合的集成电路。 把手晶片的下表面被结合到插入件的上表面，使得模具设置在空腔的下方或内部，并且处理晶片的导电焊盘以金属间隔结合到插入件的导电焊盘上， 金属键。

公开(公告)号：US20150262928A1

公开(公告)日：2015-09-17

申请号：US14558462

申请日：2014-12-02

Applicant: Invensas Corporation

Inventor： Hong Shen ,  Liang Wang ,  Rajesh Katkar

IPC: H01L23/498 ,  H01L25/065 ,  H01L21/288 ,  H01L23/31 ,  H01L21/56 ,  H01L21/768 ,  H01L25/00

CPC classification number: H01L23/055 ,  H01L21/2885 ,  H01L21/4803 ,  H01L21/486 ,  H01L21/56 ,  H01L21/561 ,  H01L21/76879 ,  H01L21/76897 ,  H01L23/04 ,  H01L23/10 ,  H01L23/147 ,  H01L23/3107 ,  H01L23/315 ,  H01L23/3675 ,  H01L23/481 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5389 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2225/06548 ,  H01L2225/06555 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Stacked dies (110) are encapsulated in an interposer's cavity (304) by multiple encapsulant layers (524) formed of moldable material. Conductive paths (520, 623) connect the dies to the cavity's bottom all (304B) and, through TSVs passing through the bottom wall, to a conductor below the interposer. The conductive paths can be formed in segments each of which is formed in a through-hole (514) in a respective encapsulant layer. Each segment can be formed by electroplating onto a lower segment; the electroplating current can be provided from below the interposer through the TSVs and earlier formed segments. Other features are also provided.

Abstract translation: 堆叠的管芯（110）通过由可模制材料形成的多个密封层（524）封装在插入件的空腔（304）中。 导电路径（520,623）将模具连接到空腔的底部（304B），并且通过穿过底壁的TSV连接到插入件下方的导体。 导电路径可以形成为各自形成在各个密封层中的通孔（514）中的段。 每个段可以通过电镀形成在下段上; 电镀电流可以通过TSV和较早形成的片段从插入件的下方提供。 还提供其他功能。

公开(公告)号：US20150097284A1

公开(公告)日：2015-04-09

申请号：US14050193

申请日：2013-10-09

Applicant: Invensas Corporation

Inventor： Cyprian Emeka Uzoh ,  Rajesh Katkar

IPC: H01L23/498 ,  H01L21/768

CPC classification number: H01L24/11 ,  H01L21/3213 ,  H01L21/32139 ,  H01L21/4853 ,  H01L21/76885 ,  H01L23/49811 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/02166 ,  H01L2224/03462 ,  H01L2224/0348 ,  H01L2224/0362 ,  H01L2224/03823 ,  H01L2224/0401 ,  H01L2224/05023 ,  H01L2224/05082 ,  H01L2224/05147 ,  H01L2224/05164 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/05558 ,  H01L2224/05564 ,  H01L2224/05565 ,  H01L2224/05568 ,  H01L2224/05578 ,  H01L2224/05582 ,  H01L2224/05611 ,  H01L2224/05664 ,  H01L2224/05686 ,  H01L2224/0569 ,  H01L2224/10126 ,  H01L2224/10145 ,  H01L2224/11013 ,  H01L2224/1111 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/1182 ,  H01L2224/11849 ,  H01L2224/131 ,  H01L2224/81815 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/00

Abstract: An apparatus relating generally to a substrate is disclosed. In this apparatus, a first metal layer is on the substrate. The first metal layer has an opening. The opening of the first metal layer has a bottom and one or more sides extending from the bottom. A second metal layer is on the first metal layer. The first metal layer and the second metal layer provide a bowl-shaped structure. An inner surface of the bowl-shaped structure is defined responsive to the opening of the first metal layer and the second metal layer thereon. The opening of the bowl-shaped structure is configured to receive and at least partially retain a bonding material during a reflow process.