公开(公告)号：US20190198376A1

公开(公告)日：2019-06-27

申请号：US16293201

申请日：2019-03-05

申请人： SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

发明人： Darrell D. TRUHITTE ,  James P. LETTERMAN, JR.

IPC分类号： H01L21/683 ,  H01L23/00 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

CPC分类号： H01L21/6835 ,  H01L21/4832 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/36 ,  H01L23/49537 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/48 ,  H01L24/49 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L24/94 ,  H01L24/95 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L2221/68304 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2224/04105 ,  H01L2224/11 ,  H01L2224/11003 ,  H01L2224/11312 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/11418 ,  H01L2224/1146 ,  H01L2224/11462 ,  H01L2224/116 ,  H01L2224/119 ,  H01L2224/1308 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/13166 ,  H01L2224/1319 ,  H01L2224/16245 ,  H01L2224/16258 ,  H01L2224/27003 ,  H01L2224/27312 ,  H01L2224/2732 ,  H01L2224/27334 ,  H01L2224/27418 ,  H01L2224/2746 ,  H01L2224/27462 ,  H01L2224/276 ,  H01L2224/279 ,  H01L2224/2908 ,  H01L2224/291 ,  H01L2224/29124 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/29164 ,  H01L2224/29166 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/32258 ,  H01L2224/33181 ,  H01L2224/45015 ,  H01L2224/48091 ,  H01L2224/4811 ,  H01L2224/48111 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/753 ,  H01L2224/75755 ,  H01L2224/75756 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81805 ,  H01L2224/81815 ,  H01L2224/81856 ,  H01L2224/83 ,  H01L2224/83005 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/8321 ,  H01L2224/83805 ,  H01L2224/83815 ,  H01L2224/83856 ,  H01L2224/85005 ,  H01L2224/92 ,  H01L2224/92125 ,  H01L2224/92147 ,  H01L2224/92227 ,  H01L2224/94 ,  H01L2224/95 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/0665 ,  H01L2924/014 ,  H01L2224/81 ,  H01L2224/27 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2924/207

摘要： Methods of manufacturing semiconductor packages. Implementations may include: providing a substrate with a first side, a second side, and a thickness; forming a plurality of pads on the first side of the substrate; and applying die attach material to the plurality of pads. The method may include bonding a wafer including a plurality of semiconductor die to the substrate at one or more die pads included in each die. The method may also include singulating the plurality of semiconductor die, overmolding the plurality of semiconductor die and the first side of the substrate with an overmold material, and removing the substrate to expose the plurality of pads and to form a plurality of semiconductor packages coupled together through the overmold material. The method also may include singulating the plurality of semiconductor packages to separate them.

公开(公告)号：US10002843B2

公开(公告)日：2018-06-19

申请号：US14667317

申请日：2015-03-24

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Tien-Szu Chen ,  Kuang-Hsiung Chen ,  Sheng-Ming Wang ,  Yu-Ying Lee

IPC分类号： H01L23/48 ,  H01L23/498 ,  H01L23/52 ,  H01L23/31 ,  H05K3/20 ,  H01L23/00 ,  H05K1/11 ,  H05K3/10

CPC分类号： H01L24/17 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/3157 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/48 ,  H01L24/49 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2224/16258 ,  H01L2224/17106 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48101 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48245 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/1511 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/1579 ,  H01L2924/181 ,  H05K1/111 ,  H05K3/10 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/85399

摘要： The present disclosure relates to a semiconductor substrate structure, semiconductor package and method of manufacturing the same. The semiconductor substrate structure includes a conductive structure and a dielectric structure. The conductive structure has a first conductive surface and a second conductive surface opposite to the first conductive surface. The dielectric structure covers at least a portion of the conductive structure, and has a first dielectric surface and a second dielectric surface opposite to the first dielectric surface. The first conductive surface does not protrude from the first dielectric surface, and the second conductive surface is recessed from the second dielectric surface. The dielectric structure includes, or is formed from, a photo-sensitive resin, and the dielectric structure defines a dielectric opening in the second dielectric surface to expose a portion of the second conductive surface.

公开(公告)号：US09899350B2

公开(公告)日：2018-02-20

申请号：US15229780

申请日：2016-08-05

申请人： Qorvo US, Inc.

发明人： Julio C. Costa ,  Thomas Scott Morris ,  Jonathan Hale Hammond ,  David Jandzinski ,  Stephen Parker ,  Jon Chadwick

IPC分类号： H01L23/29 ,  H01L23/00 ,  H01L23/31 ,  H01L23/373 ,  H01L23/433 ,  H01L25/065 ,  H01L25/00 ,  H01L21/56 ,  H01L25/16

CPC分类号： H01L24/97 ,  H01L21/561 ,  H01L23/3135 ,  H01L23/3737 ,  H01L23/4334 ,  H01L24/05 ,  H01L24/16 ,  H01L24/73 ,  H01L24/92 ,  H01L25/0655 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/16258 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2924/10271 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/18161 ,  H01L2924/19011 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2224/81 ,  H01L2224/83

摘要： A flip chip module having at least one flip chip die is disclosed. The flip chip module includes a carrier having a top surface with a first mold compound residing on the top surface. A first mold compound is disposed on the top surface of the carrier. A first thinned flip chip die resides over a first portion of the first mold compound with interconnects extending through the first portion to the top surface wherein the first portion of the mold compound fills a region between the first flip chip die and the top surface. A second mold compound resides over the substrate and provides a first recess over the first flip chip die wherein the first recess extends to a first die surface of the first flip chip die. A third mold compound resides in the first recess and covers an exposed surface of the flip chip die.

公开(公告)号：US09899300B2

公开(公告)日：2018-02-20

申请号：US15465427

申请日：2017-03-21

申请人： ROHM CO., LTD.

发明人： Kenji Fujii ,  Yasumasa Kasuya ,  Mamoru Yamagami ,  Naoki Kinoshita ,  Motoharu Haga

IPC分类号： H01L23/00 ,  H01L23/31 ,  H01L23/495

CPC分类号： H01L23/49527 ,  H01L23/291 ,  H01L23/293 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3142 ,  H01L23/3171 ,  H01L23/3675 ,  H01L23/4334 ,  H01L23/4822 ,  H01L23/49503 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49568 ,  H01L23/49572 ,  H01L23/525 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/33 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/02311 ,  H01L2224/02331 ,  H01L2224/0239 ,  H01L2224/024 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/0346 ,  H01L2224/03462 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05083 ,  H01L2224/05084 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05181 ,  H01L2224/05548 ,  H01L2224/05567 ,  H01L2224/05572 ,  H01L2224/05582 ,  H01L2224/05583 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05681 ,  H01L2224/05684 ,  H01L2224/1145 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/1161 ,  H01L2224/11825 ,  H01L2224/13008 ,  H01L2224/13011 ,  H01L2224/13016 ,  H01L2224/13017 ,  H01L2224/13019 ,  H01L2224/13024 ,  H01L2224/13147 ,  H01L2224/13561 ,  H01L2224/13582 ,  H01L2224/13624 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13664 ,  H01L2224/13666 ,  H01L2224/16014 ,  H01L2224/16245 ,  H01L2224/16258 ,  H01L2224/17107 ,  H01L2224/29008 ,  H01L2224/29082 ,  H01L2224/29124 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/29164 ,  H01L2224/29166 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/753 ,  H01L2224/75301 ,  H01L2224/75981 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81201 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/8146 ,  H01L2224/81464 ,  H01L2224/81466 ,  H01L2224/8183 ,  H01L2224/83191 ,  H01L2224/83201 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83455 ,  H01L2224/8346 ,  H01L2224/83464 ,  H01L2224/83466 ,  H01L2224/8383 ,  H01L2224/92225 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/05042 ,  H01L2924/07025 ,  H01L2924/17724 ,  H01L2924/17747 ,  H01L2924/181 ,  H01L2924/182 ,  H01L2924/186 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2224/05166 ,  H01L2924/01028 ,  H01L2924/0665

摘要： A semiconductor device has a semiconductor element provided with a functional surface on which a functional circuit is formed and with a back surface facing in the opposite direction to the functional surface, while also having a lead supporting the semiconductor element and electrically connected to the semiconductor element, and a resin package covering at least a portion of the semiconductor element and the lead. The semiconductor element has a functional surface side electrode formed on the functional surface and equipped with a functional surface side raised part that projects in the direction in which the functional surface faces. The functional surface side raised part of the functional surface side electrode is joined to the lead by solid state bonding.

公开(公告)号：US20170194234A1

公开(公告)日：2017-07-06

申请号：US15465427

申请日：2017-03-21

申请人： ROHM CO., LTD.

发明人： Kenji FUJII ,  Yasumasa KASUYA ,  Mamoru YAMAGAMI ,  Naoki KINOSHITA ,  Motoharu HAGA

IPC分类号： H01L23/495 ,  H01L23/00 ,  H01L23/31

CPC分类号： H01L23/49527 ,  H01L23/291 ,  H01L23/293 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3142 ,  H01L23/3171 ,  H01L23/3675 ,  H01L23/4334 ,  H01L23/4822 ,  H01L23/49503 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49568 ,  H01L23/49572 ,  H01L23/525 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/33 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/02311 ,  H01L2224/02331 ,  H01L2224/0239 ,  H01L2224/024 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/0346 ,  H01L2224/03462 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05083 ,  H01L2224/05084 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05181 ,  H01L2224/05548 ,  H01L2224/05567 ,  H01L2224/05572 ,  H01L2224/05582 ,  H01L2224/05583 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05681 ,  H01L2224/05684 ,  H01L2224/1145 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/1161 ,  H01L2224/11825 ,  H01L2224/13008 ,  H01L2224/13011 ,  H01L2224/13016 ,  H01L2224/13017 ,  H01L2224/13019 ,  H01L2224/13024 ,  H01L2224/13147 ,  H01L2224/13561 ,  H01L2224/13582 ,  H01L2224/13624 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13664 ,  H01L2224/13666 ,  H01L2224/16014 ,  H01L2224/16245 ,  H01L2224/16258 ,  H01L2224/17107 ,  H01L2224/29008 ,  H01L2224/29082 ,  H01L2224/29124 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/29164 ,  H01L2224/29166 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/753 ,  H01L2224/75301 ,  H01L2224/75981 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81201 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/8146 ,  H01L2224/81464 ,  H01L2224/81466 ,  H01L2224/8183 ,  H01L2224/83191 ,  H01L2224/83201 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83455 ,  H01L2224/8346 ,  H01L2224/83464 ,  H01L2224/83466 ,  H01L2224/8383 ,  H01L2224/92225 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/05042 ,  H01L2924/07025 ,  H01L2924/17724 ,  H01L2924/17747 ,  H01L2924/181 ,  H01L2924/182 ,  H01L2924/186 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2224/05166 ,  H01L2924/01028 ,  H01L2924/0665

摘要： A semiconductor device has a semiconductor element provided with a functional surface on which a functional circuit is formed and with a back surface facing in the opposite direction to the functional surface, while also having a lead supporting the semiconductor element and electrically connected to the semiconductor element, and a resin package covering at least a portion of the semiconductor element and the lead. The semiconductor element has a functional surface side electrode formed on the functional surface and equipped with a functional surface side raised part that projects in the direction in which the functional surface faces. The functional surface side raised part of the functional surface side electrode is joined to the lead by solid state bonding.

公开(公告)号：US09543235B2

公开(公告)日：2017-01-10

申请号：US14875672

申请日：2015-10-05

申请人： Amkor Technology, Inc.

发明人： Hyung Il Jeon ,  Ji Young Chung ,  Byong Jin Kim ,  In Bae Park ,  Jae Min Bae ,  No Sun Park

IPC分类号： H01L23/48 ,  H01L23/495 ,  H01L23/00 ,  H01L23/31

CPC分类号： H01L23/49503 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49572 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/1134 ,  H01L2224/13014 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13138 ,  H01L2224/13147 ,  H01L2224/16013 ,  H01L2224/16245 ,  H01L2224/16258 ,  H01L2224/81191 ,  H01L2224/81385 ,  H01L2224/81815 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/0105 ,  H01L2924/014 ,  H01L2924/00014

摘要： In one embodiment, an electronic package structure includes a lead having a first width. An electronic chip having a conductive bump on a major surface, the conductive bump has a second width greater than the first width. The conductive bump is attached to the lead such that a portion of the conductive bump extends to at least partially surround a side surface of the lead. A molding compound resin encapsulates the electronic chip, the conductive bump, and at least a portion of the lead. The lead is configured so strengthen the joining force between the lead and conductive bump.

摘要翻译： 在一个实施例中，电子封装结构包括具有第一宽度的引线。 一种在主表面上具有导电凸块的电子芯片，所述导电凸块具有大于所述第一宽度的第二宽度。 导电凸块附接到引线，使得导电凸块的一部分延伸到至少部分地围绕引线的侧表面。 模塑复合树脂封装电子芯片，导电凸块和引线的至少一部分。 引线被配置为加强引线和导电凸块之间的接合力。

公开(公告)号：US20160343592A1

公开(公告)日：2016-11-24

申请号：US15229780

申请日：2016-08-05

申请人： Qorvo US, Inc.

发明人： Julio C. Costa ,  Thomas Scott Morris ,  Jonathan Hale Hammond ,  David Jandzinski ,  Stephen Parker ,  Jon Chadwick

IPC分类号： H01L21/56 ,  H01L25/00 ,  H01L25/065 ,  H01L23/31 ,  H01L23/29

CPC分类号： H01L24/97 ,  H01L21/561 ,  H01L23/3135 ,  H01L23/3737 ,  H01L23/4334 ,  H01L24/05 ,  H01L24/16 ,  H01L24/73 ,  H01L24/92 ,  H01L25/0655 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/16258 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2924/10271 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/18161 ,  H01L2924/19011 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2224/81 ,  H01L2224/83

摘要： A flip chip module having at least one flip chip die is disclosed. The flip chip module includes a carrier having a top surface with a first mold compound residing on the top surface. A first mold compound is disposed on the top surface of the carrier. A first thinned flip chip die resides over a first portion of the first mold compound with interconnects extending through the first portion to the top surface wherein the first portion of the mold compound fills a region between the first flip chip die and the top surface. A second mold compound resides over the substrate and provides a first recess over the first flip chip die wherein the first recess extends to a first die surface of the first flip chip die. A third mold compound resides in the first recess and covers an exposed surface of the flip chip die.

摘要翻译： 公开了一种具有至少一个倒装芯片的倒装芯片模块。 倒装芯片模块包括具有顶表面的载体，第一模具化合物位于顶表面上。 第一模具化合物设置在载体的顶表面上。 第一变薄的倒装芯片模具位于第一模具化合物的第一部分之上，其中互连件延伸穿过第一部分到顶部表面，其中模具化合物的第一部分填充第一倒装芯片模具和顶部表面之间的区域。 第二模具化合物位于衬底上并且在第一倒装芯片模具上方提供第一凹部，其中第一凹部延伸到第一倒装芯片模具的第一模具表面。 第三模具化合物位于第一凹部中并且覆盖倒装芯片裸片的暴露表面。

公开(公告)号：US20160240450A1

公开(公告)日：2016-08-18

申请号：US15096792

申请日：2016-04-12

申请人： ROHM CO., LTD.

发明人： Kenji FUJII ,  Yasumasa KASUYA ,  Mamoru YAMAGAMI ,  Naoki KINOSHITA ,  Motoharu HAGA

IPC分类号： H01L23/29 ,  H01L23/31 ,  H01L23/00 ,  H01L23/367

CPC分类号： H01L23/49527 ,  H01L23/291 ,  H01L23/293 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3142 ,  H01L23/3171 ,  H01L23/3675 ,  H01L23/4334 ,  H01L23/4822 ,  H01L23/49503 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49568 ,  H01L23/49572 ,  H01L23/525 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/33 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/02311 ,  H01L2224/02331 ,  H01L2224/0239 ,  H01L2224/024 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/0346 ,  H01L2224/03462 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05083 ,  H01L2224/05084 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05181 ,  H01L2224/05548 ,  H01L2224/05567 ,  H01L2224/05572 ,  H01L2224/05582 ,  H01L2224/05583 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05681 ,  H01L2224/05684 ,  H01L2224/1145 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/1161 ,  H01L2224/11825 ,  H01L2224/13008 ,  H01L2224/13011 ,  H01L2224/13016 ,  H01L2224/13017 ,  H01L2224/13019 ,  H01L2224/13024 ,  H01L2224/13147 ,  H01L2224/13561 ,  H01L2224/13582 ,  H01L2224/13624 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13664 ,  H01L2224/13666 ,  H01L2224/16014 ,  H01L2224/16245 ,  H01L2224/16258 ,  H01L2224/17107 ,  H01L2224/29008 ,  H01L2224/29082 ,  H01L2224/29124 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/29164 ,  H01L2224/29166 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/753 ,  H01L2224/75301 ,  H01L2224/75981 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81201 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/8146 ,  H01L2224/81464 ,  H01L2224/81466 ,  H01L2224/8183 ,  H01L2224/83191 ,  H01L2224/83201 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83455 ,  H01L2224/8346 ,  H01L2224/83464 ,  H01L2224/83466 ,  H01L2224/8383 ,  H01L2224/92225 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/05042 ,  H01L2924/07025 ,  H01L2924/17724 ,  H01L2924/17747 ,  H01L2924/181 ,  H01L2924/182 ,  H01L2924/186 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2224/05166 ,  H01L2924/01028 ,  H01L2924/0665

摘要： A semiconductor device has a semiconductor element provided with a functional surface on which a functional circuit is formed and with a back surface facing in the opposite direction to the functional surface, while also having a lead supporting the semiconductor element and electrically connected to the semiconductor element, and a resin package covering at least a portion of the semiconductor element and the lead. The semiconductor element has a functional surface side electrode formed on the functional surface and equipped with a functional surface side raised part that projects in the direction in which the functional surface faces. The functional surface side raised part of the functional surface side electrode is joined to the lead by solid state bonding.

公开(公告)号：US20160027694A1

公开(公告)日：2016-01-28

申请号：US14341454

申请日：2014-07-25

申请人： Semiconductor Components Industries, LLC

发明人： Darrel Truhitte ,  James P. Letterman, JR.

IPC分类号： H01L21/78 ,  H01L23/00 ,  H01L21/683 ,  H01L21/56

CPC分类号： H01L21/6835 ,  H01L21/4832 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/36 ,  H01L23/49537 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/48 ,  H01L24/49 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L24/94 ,  H01L24/95 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L2221/68304 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2224/04105 ,  H01L2224/11 ,  H01L2224/11003 ,  H01L2224/11312 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/11418 ,  H01L2224/1146 ,  H01L2224/11462 ,  H01L2224/116 ,  H01L2224/119 ,  H01L2224/1308 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/13166 ,  H01L2224/1319 ,  H01L2224/16245 ,  H01L2224/16258 ,  H01L2224/27003 ,  H01L2224/27312 ,  H01L2224/2732 ,  H01L2224/27334 ,  H01L2224/27418 ,  H01L2224/2746 ,  H01L2224/27462 ,  H01L2224/276 ,  H01L2224/279 ,  H01L2224/2908 ,  H01L2224/291 ,  H01L2224/29124 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/29164 ,  H01L2224/29166 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/32258 ,  H01L2224/33181 ,  H01L2224/45015 ,  H01L2224/48091 ,  H01L2224/4811 ,  H01L2224/48111 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/753 ,  H01L2224/75755 ,  H01L2224/75756 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81805 ,  H01L2224/81815 ,  H01L2224/81856 ,  H01L2224/83 ,  H01L2224/83005 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/8321 ,  H01L2224/83805 ,  H01L2224/83815 ,  H01L2224/83856 ,  H01L2224/85005 ,  H01L2224/92 ,  H01L2224/92125 ,  H01L2224/92147 ,  H01L2224/92227 ,  H01L2224/94 ,  H01L2224/95 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/0665 ,  H01L2924/014 ,  H01L2224/81 ,  H01L2224/27 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2924/207

摘要： Methods of manufacturing semiconductor packages. Implementations may include: providing a substrate with a first side, a second side, and a thickness; forming a plurality of pads on the first side of the substrate; and applying die attach material to the plurality of pads. The method may include bonding a wafer including a plurality of semiconductor die to the substrate at one or more die pads included in each die. The method may also include singulating the plurality of semiconductor die, overmolding the plurality of semiconductor die and the first side of the substrate with an overmold material, and removing the substrate to expose the plurality of pads and to form a plurality of semiconductor packages coupled together through the overmold material. The method also may include singulating the plurality of semiconductor packages to separate them.

摘要翻译： 制造半导体封装的方法。 实施方案可以包括：提供具有第一侧面，第二侧面和厚度的基底; 在所述基板的第一侧上形成多个焊盘; 以及将所述芯片附接材料施加到所述多个焊盘。 该方法可以包括在包括在每个管芯中的一个或多个管芯焊盘处将包括多个半导体管芯的晶片接合到衬底。 该方法还可以包括用多重半导体芯片分离多个半导体芯片，用包覆模塑材料包覆模制多个半导体芯片和基板的第一侧，以及移除基板以暴露多个焊盘并形成耦合在一起的多个半导体封装 通过包覆成型材料。 该方法还可以包括分离多个半导体封装以分离它们。

公开(公告)号：US20160013161A1

公开(公告)日：2016-01-14

申请号：US14859465

申请日：2015-09-21

申请人： SK hynix Inc.

发明人： Ki Il MOON ,  Jong Hyun KIM

IPC分类号： H01L25/065 ,  H01L23/00 ,  H01L23/498

CPC分类号： H01L25/0657 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/49861 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L25/04 ,  H01L25/043 ,  H01L2224/04042 ,  H01L2224/16245 ,  H01L2224/16258 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48105 ,  H01L2224/48145 ,  H01L2224/48175 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06555 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/85399 ,  H01L2224/05599 ,  H01L2924/00

摘要： A semiconductor package includes: a plurality of lead members disposed with a space therebetween over a surface of a substrate, a first semiconductor chip disposed in a face-up manner over the first surface of the substrate between at least two of the plurality of lead members; a second semiconductor chip disposed in a face-up manner over the first semiconductor chip and the at least two lead members, and a connection member for connecting the substrate, the at least two lead members, the first semiconductor chip and the second semiconductor chip with one another.

摘要翻译： 半导体封装包括：多个引线构件，其在基板表面之间设置有空间，第一半导体芯片以面向上的方式设置在多个引线构件中的至少两个引线构件之间的基板的第一表面上 ; 在第一半导体芯片和所述至少两个引线构件上以面朝上的方式设置的第二半导体芯片，以及用于将所述基板，所述至少两个引线构件，所述第一半导体芯片和所述第二半导体芯片连接到所述第二半导体芯片的连接构件， 另一个。