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公开(公告)号：US20170162555A1
公开(公告)日：2017-06-08
申请号：US15346089
申请日：2016-11-08
申请人： Junglae Jo , Yeo-Hoon Yoon , Hojeong Moon , Taeeun Kim
发明人： Junglae Jo , Yeo-Hoon Yoon , Hojeong Moon , Taeeun Kim
IPC分类号： H01L25/18 , B23K35/26 , H01L25/065 , C22C13/00 , H01L23/498 , H01L23/00
CPC分类号： H01L25/18 , B23K35/262 , C22C13/00 , H01L21/4853 , H01L23/49811 , H01L23/49838 , H01L24/05 , H01L24/06 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/32 , H01L24/48 , H01L24/81 , H01L25/0657 , H01L25/105 , H01L2224/0401 , H01L2224/04042 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/131 , H01L2224/13111 , H01L2224/13113 , H01L2224/13139 , H01L2224/13147 , H01L2224/13155 , H01L2224/16227 , H01L2224/16503 , H01L2224/16507 , H01L2224/32225 , H01L2224/48091 , H01L2224/48106 , H01L2224/48227 , H01L2224/73265 , H01L2224/75283 , H01L2224/8121 , H01L2224/81444 , H01L2224/81447 , H01L2224/81455 , H01L2224/8149 , H01L2224/8181 , H01L2224/81815 , H01L2225/0651 , H01L2225/06517 , H01L2225/0652 , H01L2225/06572 , H01L2225/1023 , H01L2225/1058 , H01L2924/014 , H01L2924/1431 , H01L2924/1434 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/18161 , H01L2924/3512 , H01L2924/00014 , H01L2924/00012 , H01L2924/01047 , H01L2924/01029 , H01L2924/01028 , H01L2924/01083 , H01L2924/00
摘要： Solder compositions for semiconductor fabrication are provided that include silver (Ag) of 3.0 wt. % to 4.0 wt. %, copper (Cu) of 0.75 wt. % to 1.0 wt. %, nickel (Ni) of 0.08 wt. % to 1.0 wt. %, and tin (Sn) of 94 wt. % to 96.17 wt. %, or that include bismuth (Bi) of 0.3 wt. % to 2.0 wt. % in place of a portion of the tin (Sn) in the solder composition; and, semiconductor packages are also provided that use the solder compositions for bonding one or more components of the semiconductor packages to each other.
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22.发明申请SUBSTRATE STRUCTURE WITH SELECTIVE SURFACE FINISHES FOR FLIP CHIP ASSEMBLY 审中-公开具有选择性表面处理的基板结构用于片状芯片组件公开(公告)号：US20170040276A1
公开(公告)日：2017-02-09
申请号：US15225389
申请日：2016-08-01
申请人： Qorvo US, Inc.
IPC分类号： H01L23/00
CPC分类号： H01L24/81 , H01L23/3121 , H01L23/49811 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L2224/13082 , H01L2224/13101 , H01L2224/13147 , H01L2224/1403 , H01L2224/16225 , H01L2224/81143 , H01L2224/8121 , H01L2224/81444 , H01L2224/8149 , H01L2224/81815 , H01L2224/81911 , H01L2224/81913 , H01L2224/81914 , H01L2924/181 , H01L2924/00012 , H01L2924/00014 , H01L2924/014
摘要： The present disclosure relates to a substrate structure with selective surface finishes used in flip chip assembly, and a process for making the same. The disclosed substrate structure includes a substrate body, a metal structure with a first finish area and a second finish area, a first surface finish, and a second surface finish. The metal structure is formed on a top surface of the substrate body, the first surface finish is formed over the first finish area of the metal structure, and the second surface finish is formed over the second finish area of the metal structure. The first surface finish is different from the second surface finish.
摘要翻译： 本公开涉及一种用于倒装芯片组装的具有选择性表面光洁度的衬底结构及其制造方法。 所公开的基板结构包括基板主体，具有第一端面区域和第二端面区域的金属结构，第一表面光洁度和第二表面光洁度。 金属结构形成在基板主体的上表面上，第一表面光洁度形成在金属结构的第一精加工区域上，第二表面光洁度形成在金属结构的第二抛光区域上。 第一表面光洁度与第二表面光洁度不同。
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23.发明授权Integrated circuit packaging system with surface treatment and method of manufacture thereof 有权具有表面处理的集成电路封装系统及其制造方法公开(公告)号：US09385100B1
公开(公告)日：2016-07-05
申请号：US14659905
申请日：2015-03-17
申请人： Hun Teak Lee , YoungChul Kim , Hyunll Bae , HeeSoo Lee , HeeJo Chi
发明人： Hun Teak Lee , YoungChul Kim , Hyunll Bae , HeeSoo Lee , HeeJo Chi
CPC分类号： H01L24/81 , H01L21/4846 , H01L21/4857 , H01L23/49827 , H01L23/49838 , H01L23/49894 , H01L24/13 , H01L24/16 , H01L24/83 , H01L24/92 , H01L2224/10175 , H01L2224/131 , H01L2224/16113 , H01L2224/16227 , H01L2224/2919 , H01L2224/73204 , H01L2224/81385 , H01L2224/81395 , H01L2224/81411 , H01L2224/81439 , H01L2224/81444 , H01L2224/81455 , H01L2224/8149 , H01L2224/81801 , H01L2224/83104 , H01L2224/92125 , H01L2924/14 , H01L2924/381 , H01L2924/3841 , H01L2924/014 , H01L2924/00014
摘要： An integrated circuit packaging system, and a method of manufacture thereof, includes: an embedded trace substrate having bonding sites and traces embedded in a base material, an insulation layer on the traces, the insulation layer having a top surface coplanar with the top surface of the base material; and an integrated circuit die connected to the bonding sites.
摘要翻译： 一种集成电路封装系统及其制造方法，包括：嵌入迹线基板，其具有嵌入基材中的接合位置和迹线，迹线上的绝缘层，绝缘层具有与顶表面共面的顶表面 基材; 以及连接到接合位置的集成电路管芯。
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公开(公告)号：US20160104063A1
公开(公告)日：2016-04-14
申请号：US14975187
申请日：2015-12-18
IPC分类号： G06K19/077 , H01L23/00 , H01L23/498 , G06K19/02
CPC分类号： G06K19/07743 , G06K19/022 , G06K19/07722 , H01L23/49855 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/95 , H01L24/97 , H01L2224/0401 , H01L2224/1134 , H01L2224/1146 , H01L2224/13019 , H01L2224/16227 , H01L2224/2731 , H01L2224/2732 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2224/81191 , H01L2224/81395 , H01L2224/81455 , H01L2224/8149 , H01L2224/81903 , H01L2224/83101 , H01L2224/83192 , H01L2224/8385 , H01L2224/83851 , H01L2224/9211 , H01L2224/95115 , H01L2924/15313 , H05K3/244 , H01L2924/00014 , H01L2924/0781 , H01L2224/81 , H01L2224/83
摘要： A contact smart card has a smart card contact pad and an IC chip. The smart card contact pad includes a circuit substrate, a card-reader contact element on a first side of the circuit substrate, and a connection element on a second side of the circuit substrate. The card-reader contact element has a noble metal electrically conductive surface, and the connection element has a chip terminal connection surface which is not a noble metal. The IC chip is preferably flip-chip mounted at the second side of the circuit substrate and electrically connected to the chip terminal connection surface. Furthermore, the chip terminal connection surface is preferably an organometallic electrically conductive corrosion protection layer.
摘要翻译： 接触式智能卡具有智能卡接触垫和IC芯片。 智能卡接触焊盘包括电路基板，电路基板的第一侧上的读卡器接触元件和电路基板的第二侧上的连接元件。 读卡器接触元件具有贵金属导电表面，并且连接元件具有不是贵金属的芯片端子连接表面。 IC芯片优选地倒装芯片安装在电路基板的第二侧并电连接到芯片端子连接表面。 此外，芯片端子连接表面优选为有机金属导电腐蚀保护层。
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25.发明申请公开(公告)号：US20150333221A1
公开(公告)日：2015-11-19
申请号：US14278778
申请日：2014-05-15
发明人： Andreas Bibl , Dariusz Golda
CPC分类号： H01L25/167 , G09F9/301 , H01L21/6835 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/24 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/82 , H01L24/83 , H01L24/92 , H01L24/97 , H01L25/0753 , H01L27/1266 , H01L27/15 , H01L27/153 , H01L27/156 , H01L2221/68318 , H01L2221/68359 , H01L2221/68381 , H01L2224/11462 , H01L2224/1147 , H01L2224/131 , H01L2224/13109 , H01L2224/13111 , H01L2224/16227 , H01L2224/24101 , H01L2224/24105 , H01L2224/24227 , H01L2224/245 , H01L2224/27462 , H01L2224/2747 , H01L2224/291 , H01L2224/29109 , H01L2224/29111 , H01L2224/32227 , H01L2224/73259 , H01L2224/73267 , H01L2224/81005 , H01L2224/81192 , H01L2224/81424 , H01L2224/81438 , H01L2224/81444 , H01L2224/81466 , H01L2224/81486 , H01L2224/8149 , H01L2224/81805 , H01L2224/81825 , H01L2224/8183 , H01L2224/82005 , H01L2224/82102 , H01L2224/82104 , H01L2224/82106 , H01L2224/83005 , H01L2224/83192 , H01L2224/83424 , H01L2224/83438 , H01L2224/83444 , H01L2224/83466 , H01L2224/83486 , H01L2224/8349 , H01L2224/83805 , H01L2224/83825 , H01L2224/8383 , H01L2224/92224 , H01L2224/92244 , H01L2224/97 , H01L2924/10161 , H01L2924/10162 , H01L2924/12041 , H01L2924/14 , H01L2924/15156 , H01L2924/18161 , H01L2924/18162 , H05K1/189 , H05K3/4682 , H05K2201/10106 , H01L2924/00014 , H01L2924/014 , H01L2924/01074 , H01L2924/01013 , H01L2924/01014 , H01L2924/0781 , H01L2924/01038 , H01L2924/053 , H01L2924/06 , H01L2924/01006 , H01L2924/01047 , H01L2924/01079 , H01L2924/01042 , H01L2924/01022 , H01L2924/01071 , H01L2224/81 , H01L2224/82 , H01L2224/83
摘要： A flexible display panel and method of formation with a sacrificial release layer are described. The method of manufacturing a flexible display system includes forming a sacrificial layer on a carrier substrate. A flexible display substrate is formed on the sacrificial layer, with a plurality of release openings that extend through the flexible display substrate to the sacrificial layer. An array of LEDs and a plurality of microchips are transferred onto the flexible display substrate to form a flexible display panel. The sacrificial layer is selectively removed such that the flexible display panel attaches to the carrier substrate by a plurality of support posts. The flexible display panel is removed from the carrier substrate and is electrically coupled with display components to form a flexible display system.
摘要翻译： 描述了柔性显示面板及其形成方法。 柔性显示系统的制造方法包括在载体基板上形成牺牲层。 在牺牲层上形成柔性显示基板，其中多个释放开口延伸穿过柔性显示基板至牺牲层。 将LED阵列和多个微芯片转移到柔性显示基板上以形成柔性显示面板。 选择性地去除牺牲层，使得柔性显示面板通过多个支撑柱附接到载体基板。 柔性显示面板从载体基板移除并与显示部件电耦合以形成柔性显示系统。
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公开(公告)号：US20140306016A1
公开(公告)日：2014-10-16
申请号：US14249722
申请日：2014-04-10
IPC分类号： G06K19/077 , H01L23/00
CPC分类号： G06K19/07743 , G06K19/022 , G06K19/07722 , H01L23/49855 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/95 , H01L24/97 , H01L2224/0401 , H01L2224/1134 , H01L2224/1146 , H01L2224/13019 , H01L2224/16227 , H01L2224/2731 , H01L2224/2732 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2224/81191 , H01L2224/81395 , H01L2224/81455 , H01L2224/8149 , H01L2224/81903 , H01L2224/83101 , H01L2224/83192 , H01L2224/8385 , H01L2224/83851 , H01L2224/9211 , H01L2224/95115 , H01L2924/15313 , H05K3/244 , H01L2924/00014 , H01L2924/0781 , H01L2224/81 , H01L2224/83
摘要： A contact smart card has a smart card contact pad and an IC chip. The smart card contact pad includes a circuit substrate, a card-reader contact element on a first side of the circuit substrate, and a connection element on a second side of the circuit substrate. The card-reader contact element has a noble metal electrically conductive surface, and the connection element has a chip terminal connection surface which is not a noble metal. The IC chip is preferably flip-chip mounted at the second side of the circuit substrate and electrically connected to the chip terminal connection surface. Furthermore, the chip terminal connection surface is preferably an organometallic electrically conductive corrosion protection layer.
摘要翻译： 接触式智能卡具有智能卡接触垫和IC芯片。 智能卡接触焊盘包括电路基板，电路基板的第一侧上的读卡器接触元件和电路基板的第二侧上的连接元件。 读卡器接触元件具有贵金属导电表面，并且连接元件具有不是贵金属的芯片端子连接表面。 IC芯片优选地倒装芯片安装在电路基板的第二侧并电连接到芯片端子连接表面。 此外，芯片端子连接表面优选为有机金属导电腐蚀保护层。
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公开(公告)号：US20140084460A1
公开(公告)日：2014-03-27
申请号：US14094714
申请日：2013-12-02
发明人： Carsten Nieland , Frank Kriebel
IPC分类号： H01L21/768 , H01L23/498
CPC分类号： H05K1/18 , G06K19/077 , H01L21/76885 , H01L23/49811 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L24/94 , H01L2224/0345 , H01L2224/03462 , H01L2224/03464 , H01L2224/0401 , H01L2224/05567 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/0566 , H01L2224/05664 , H01L2224/05666 , H01L2224/05669 , H01L2224/05671 , H01L2224/11462 , H01L2224/11464 , H01L2224/1161 , H01L2224/11622 , H01L2224/1182 , H01L2224/13006 , H01L2224/13011 , H01L2224/13012 , H01L2224/13014 , H01L2224/13017 , H01L2224/13019 , H01L2224/13022 , H01L2224/131 , H01L2224/13109 , H01L2224/13111 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/13599 , H01L2224/16113 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/73104 , H01L2224/73204 , H01L2224/81191 , H01L2224/81193 , H01L2224/81201 , H01L2224/81206 , H01L2224/81345 , H01L2224/81385 , H01L2224/814 , H01L2224/8149 , H01L2224/81898 , H01L2224/83862 , H01L2224/9211 , H01L2224/92125 , H01L2224/94 , H01L2924/00014 , H05K3/301 , H05K3/325 , H05K2201/1059 , H05K2201/10674 , H05K2201/10954 , H05K2203/0278 , H05K2203/041 , Y10T29/49018 , Y10T29/4913 , H01L2924/00012 , H01L2224/81 , H01L2224/83 , H01L2224/05552 , H01L2924/014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01074 , H01L2924/01082 , H01L2924/0105 , H01L2924/01047 , H01L2224/03
摘要： Contact bumps between a contact pad and a substrate can include recesses and protrusions that can mate with the material of the substrate. The irregular mating surfaces between the contact bumps and the contact pads can enhance the bonding strength of the contacts, for example, against shear and tension forces, especially for flexible systems such as smart cards.
摘要翻译： 接触焊盘和基板之间的接触凸块可以包括可与基板的材料配合的凹部和凸起。 接触凸块和接触垫之间的不规则配合表面可以增强接触件的接合强度，例如抗剪切力和张力，特别是对于柔性系统如智能卡。
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28.发明授权公开(公告)号：US06812549B2
公开(公告)日：2004-11-02
申请号：US10273885
申请日：2002-10-21
申请人： Kazushige Umetsu , Yohei Kurashima , Jun Amako
发明人： Kazushige Umetsu , Yohei Kurashima , Jun Amako
IPC分类号： H01L2940
CPC分类号： H01L21/486 , H01L21/76882 , H01L21/76898 , H01L23/481 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L2224/0345 , H01L2224/0401 , H01L2224/051 , H01L2224/05563 , H01L2224/05567 , H01L2224/0557 , H01L2224/05572 , H01L2224/056 , H01L2224/1132 , H01L2224/11334 , H01L2224/1134 , H01L2224/1181 , H01L2224/11849 , H01L2224/13009 , H01L2224/1319 , H01L2224/13411 , H01L2224/13444 , H01L2224/13483 , H01L2224/16146 , H01L2224/16225 , H01L2224/16227 , H01L2224/16237 , H01L2224/17181 , H01L2224/811 , H01L2224/81191 , H01L2224/81193 , H01L2224/814 , H01L2224/8149 , H01L2224/81815 , H01L2224/8185 , H01L2224/9202 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06565 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01079 , H01L2924/014 , H01L2924/09701 , H01L2924/1016 , H01L2924/1017 , H01L2924/12042 , H01L2924/14 , H05K3/3494 , H05K3/4038 , H05K2201/0305 , H05K2201/096 , H05K2203/041 , H05K2203/082 , H05K2203/107 , H01L2924/0105 , H01L2224/05552 , H01L2924/00
摘要： A conductive material is provided to an open end of a penetrating hole penetrating through at least a semiconductor element, on the side of a first surface of the semiconductor element. The conductive material is melted to flow into the penetrating hole. The conductive material is made to flow into the penetrating hole in a state that an atmospheric pressure on the side of a second surface of the semiconductor element opposite to the first surface is lower than an atmospheric pressure on the side of the first surface.
摘要翻译： 在半导体元件的第一表面侧的贯通至少半导体元件的穿透孔的开口端设有导电材料。 导电材料熔化以流入穿透孔。 使导电材料以与第一表面相反的半导体元件的第二表面侧的大气压低于第一表面侧的大气压的状态流入贯通孔。
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公开(公告)号：US09997441B2
公开(公告)日：2018-06-12
申请号：US14810594
申请日：2015-07-28
发明人： Tomohiro Suzuki
IPC分类号： H01L23/498 , H01L21/48 , H01L23/538 , H01L23/00 , H01L21/683 , H05K3/46 , H01L21/56 , H01L23/31
CPC分类号： H01L23/49822 , H01L21/4857 , H01L21/486 , H01L21/561 , H01L21/568 , H01L21/6835 , H01L23/3128 , H01L23/49811 , H01L23/49827 , H01L23/49833 , H01L23/49838 , H01L23/49894 , H01L23/5389 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/81 , H01L24/83 , H01L24/85 , H01L24/92 , H01L24/97 , H01L2221/68318 , H01L2221/68345 , H01L2221/68359 , H01L2221/68381 , H01L2224/131 , H01L2224/13111 , H01L2224/13116 , H01L2224/16227 , H01L2224/16235 , H01L2224/16237 , H01L2224/32225 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/81005 , H01L2224/81444 , H01L2224/81447 , H01L2224/8149 , H01L2224/81815 , H01L2224/83005 , H01L2224/83101 , H01L2224/83104 , H01L2224/8385 , H01L2224/85005 , H01L2224/92125 , H01L2224/92147 , H01L2224/97 , H01L2924/15311 , H01L2924/1533 , H01L2924/181 , H01L2924/3511 , H05K3/4682 , H01L2224/81 , H01L2924/00012 , H01L2224/83 , H01L2224/85 , H01L2924/00 , H01L2924/00014 , H01L2924/014 , H01L2924/01029 , H01L2924/01051 , H01L2924/01047
摘要： A wiring substrate includes a support member, and a wiring member formed on one side of the support member. The support member includes metal foils and at least one resin layer alternately layered, so that one of the metal foils is provided as a first outermost layer on the one side of the support member and another one of the metal foils is provided as a second outermost layer on another side of the support member. The first outermost layer includes thick and thin foils that are peelably adhered. The thick foil contacts the at least one resin layer. One surface of the thin foil faces an outer side of the support member. The wiring member includes wiring layers and an insulating layer alternately layered on the thin foil. The number of the metal foils and the number of the wiring layers are the same.
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公开(公告)号：US09875957B2
公开(公告)日：2018-01-23
申请号：US14791670
申请日：2015-07-06
发明人： Noriyoshi Shimizu , Yusuke Gozu , Jun Furuichi , Akio Rokugawa , Takashi Ito
IPC分类号： H05K1/11 , H01L23/498 , H05K3/46 , H05K1/09 , H01L23/538 , H01L25/065 , H01L25/10 , H01L23/00 , H05K3/00 , H05K3/38
CPC分类号： H01L23/49822 , H01L23/49811 , H01L23/49816 , H01L23/49827 , H01L23/49833 , H01L23/49894 , H01L23/5389 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L24/92 , H01L25/0655 , H01L25/105 , H01L2224/131 , H01L2224/13111 , H01L2224/13116 , H01L2224/13144 , H01L2224/16227 , H01L2224/16237 , H01L2224/16238 , H01L2224/26175 , H01L2224/2919 , H01L2224/32225 , H01L2224/32237 , H01L2224/73204 , H01L2224/81191 , H01L2224/81444 , H01L2224/81447 , H01L2224/8149 , H01L2224/81801 , H01L2224/83104 , H01L2224/83855 , H01L2224/92125 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2924/15311 , H01L2924/3511 , H05K1/095 , H05K1/111 , H05K1/112 , H05K1/114 , H05K1/115 , H05K3/0073 , H05K3/383 , H05K3/4644 , H05K2201/0195 , H05K2201/09845 , H05K2203/0392 , H01L2924/00014 , H01L2924/014 , H01L2924/01079 , H01L2924/01029 , H01L2924/01047 , H01L2924/0665
摘要： A wiring substrate includes a first wiring structure and a second wiring structure. The first wiring structure includes a first insulating layer, which covers a first wiring layer, and a via wiring. A first through hole of the first insulating layer is filled with the via wiring. The second wiring structure includes a second wiring layer and a second insulating layer. The second wiring layer is formed on an upper surface of the first insulating layer and an upper end surface of the via wiring. The second wiring layer partially includes a roughened surface. The second insulating layer is stacked on the upper surface of the first insulating layer and covers the second wiring layer. The second wiring structure has a higher wiring density than the first wiring structure. The roughened surface of the second wiring layer has a smaller surface roughness than the first wiring layer.
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