公开(公告)号：US09647171B2

公开(公告)日：2017-05-09

申请号：US14479100

申请日：2014-09-05

申请人： The Board of Trustees of the University of Illinois

发明人： John A. Rogers ,  Ralph Nuzzo ,  Hoon-sik Kim ,  Eric Brueckner ,  Sang Il Park ,  Rak Hwan Kim

IPC分类号： H01L33/50 ,  H01L33/00 ,  H01L25/075 ,  H01L23/00 ,  H01L21/683 ,  H01L25/00 ,  H01L33/48 ,  H01L33/54 ,  H01L33/62

CPC分类号： H01L25/0753 ,  H01L21/6835 ,  H01L24/83 ,  H01L24/95 ,  H01L25/50 ,  H01L33/0079 ,  H01L33/32 ,  H01L33/486 ,  H01L33/507 ,  H01L33/54 ,  H01L33/62 ,  H01L2221/68322 ,  H01L2221/6835 ,  H01L2221/68354 ,  H01L2221/68363 ,  H01L2221/68368 ,  H01L2221/68386 ,  H01L2224/8312 ,  H01L2224/83868 ,  H01L2224/83871 ,  H01L2224/83874 ,  H01L2224/95085 ,  H01L2924/01322 ,  H01L2924/05432 ,  H01L2924/06 ,  H01L2924/12033 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/13063 ,  H01L2924/13064 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/2064 ,  H01L2924/20641 ,  H01L2933/0041 ,  H01L2933/005 ,  Y10S438/977 ,  H01L2924/00

摘要： Described herein are printable structures and methods for making, assembling and arranging electronic devices. A number of the methods described herein are useful for assembling electronic devices where one or more device components are embedded in a polymer which is patterned during the embedding process with trenches for electrical interconnects between device components. Some methods described herein are useful for assembling electronic devices by printing methods, such as by dry transfer contact printing methods. Also described herein are GaN light emitting diodes and methods for making and arranging GaN light emitting diodes, for example for display or lighting systems.

公开(公告)号：US09515025B2

公开(公告)日：2016-12-06

申请号：US14789645

申请日：2015-07-01

申请人： The Board of Trustees of the University of Illinois

发明人： John A. Rogers ,  Dahl-Young Khang ,  Yugang Sun ,  Etienne Menard

IPC分类号： H01L23/538 ,  H05K1/02 ,  H01L29/786

CPC分类号： H01L23/5387 ,  B81C2201/0185 ,  B82Y10/00 ,  H01L21/02422 ,  H01L21/02521 ,  H01L21/02532 ,  H01L21/02546 ,  H01L21/02628 ,  H01L21/6835 ,  H01L23/293 ,  H01L23/3157 ,  H01L23/564 ,  H01L24/29 ,  H01L24/32 ,  H01L24/80 ,  H01L27/1266 ,  H01L27/1285 ,  H01L27/1292 ,  H01L29/06 ,  H01L29/0665 ,  H01L29/0673 ,  H01L29/0676 ,  H01L29/068 ,  H01L29/151 ,  H01L29/158 ,  H01L29/16 ,  H01L29/1602 ,  H01L29/1606 ,  H01L29/7781 ,  H01L29/78603 ,  H01L29/78681 ,  H01L29/78696 ,  H01L31/0392 ,  H01L31/03925 ,  H01L31/03926 ,  H01L31/18 ,  H01L31/1804 ,  H01L2221/68368 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/80894 ,  H01L2224/8385 ,  H01L2924/0002 ,  H01L2924/01002 ,  H01L2924/01003 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01067 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/07802 ,  H01L2924/10329 ,  H01L2924/10336 ,  H01L2924/10349 ,  H01L2924/12032 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/13063 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/3025 ,  H05K1/0277 ,  H05K1/0283 ,  Y02E10/547 ,  Y02P70/521 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00014

摘要： The present invention provides stretchable, and optionally printable, semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed. Stretchable semiconductors and electronic circuits of the present invention preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention may be adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices.

公开(公告)号：US20160190091A1

公开(公告)日：2016-06-30

申请号：US14879581

申请日：2015-10-09

申请人： Semprius, Inc. ,  The Board of Trustees of the University of Illinois

发明人： Etienne Menard ,  Matthew Meitl ,  John A. Rogers

IPC分类号： H01L23/00 ,  H01L21/78

CPC分类号： H01L27/1266 ,  H01L21/6835 ,  H01L21/76898 ,  H01L21/7806 ,  H01L23/481 ,  H01L23/544 ,  H01L24/02 ,  H01L24/05 ,  H01L24/08 ,  H01L24/24 ,  H01L24/27 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/73 ,  H01L24/75 ,  H01L24/799 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L24/97 ,  H01L24/98 ,  H01L27/1214 ,  H01L27/14618 ,  H01L31/0203 ,  H01L31/043 ,  H01L31/048 ,  H01L31/1892 ,  H01L2221/68318 ,  H01L2221/68322 ,  H01L2221/6835 ,  H01L2221/68368 ,  H01L2221/68372 ,  H01L2221/68381 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54486 ,  H01L2224/02371 ,  H01L2224/02372 ,  H01L2224/0239 ,  H01L2224/04026 ,  H01L2224/05548 ,  H01L2224/056 ,  H01L2224/08238 ,  H01L2224/24011 ,  H01L2224/24137 ,  H01L2224/24147 ,  H01L2224/24226 ,  H01L2224/245 ,  H01L2224/24998 ,  H01L2224/2731 ,  H01L2224/29078 ,  H01L2224/291 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29344 ,  H01L2224/3012 ,  H01L2224/32104 ,  H01L2224/32146 ,  H01L2224/32227 ,  H01L2224/73267 ,  H01L2224/75263 ,  H01L2224/75314 ,  H01L2224/7598 ,  H01L2224/76155 ,  H01L2224/80203 ,  H01L2224/80224 ,  H01L2224/82007 ,  H01L2224/821 ,  H01L2224/82102 ,  H01L2224/82106 ,  H01L2224/83093 ,  H01L2224/83121 ,  H01L2224/83132 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83224 ,  H01L2224/83805 ,  H01L2224/83815 ,  H01L2224/8384 ,  H01L2224/83851 ,  H01L2224/83855 ,  H01L2224/83859 ,  H01L2224/83862 ,  H01L2224/83868 ,  H01L2224/83871 ,  H01L2224/83874 ,  H01L2224/92244 ,  H01L2224/9512 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15787 ,  H01S5/02236 ,  H01S5/02276 ,  H05K1/18 ,  H05K13/04 ,  H05K13/046 ,  Y02E10/50 ,  Y10T29/49124 ,  Y10T29/51 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/13111

摘要： A method of printing transferable components includes pressing a stamp including at least one transferable semiconductor component thereon on a target substrate such that the at least one transferable component and a surface of the target substrate contact opposite surfaces of a conductive eutectic layer. During pressing of the stamp on the target substrate, the at least one transferable component is exposed to electromagnetic radiation that is directed through the transfer stamp to reflow the eutectic layer. The stamp is then separated from the target substrate to delaminate the at least one transferable component from the stamp and print the at least one transferable component onto the surface of the target substrate. Related systems and methods are also discussed.

摘要翻译： 打印可转移部件的方法包括在目标基板上按压包括至少一个可转移半导体部件的印模，使得至少一个可转印部件和目标基板的表面接触导电共晶层的相对表面。 在压印目标基板上的印模时，将至少一个可转印部件暴露于电磁辐射，该电磁辐射被引导通过传送印模以回流共晶层。 然后将印模与目标基材分离，以将印模中的至少一种可转移组分分层，并将该至少一种可转移组分印刷到目标基材的表面上。 还讨论了相关系统和方法。

公开(公告)号：US09105555B2

公开(公告)日：2015-08-11

申请号：US14220923

申请日：2014-03-20

申请人： The Board of Trustees of the University of Illinois

发明人： John A. Rogers ,  Dahl-Young Khang ,  Yugang Sun ,  Etienne Menard

IPC分类号： H01L29/72 ,  H01L29/15 ,  B82Y10/00 ,  H01L21/02 ,  H01L21/683 ,  H01L27/12 ,  H01L29/06 ,  H01L29/16 ,  H01L29/778 ,  H01L29/786 ,  H01L31/0392 ,  H01L31/18 ,  H05K1/02 ,  H01L23/29 ,  H01L23/00

CPC分类号： H01L23/5387 ,  B81C2201/0185 ,  B82Y10/00 ,  H01L21/02422 ,  H01L21/02521 ,  H01L21/02532 ,  H01L21/02546 ,  H01L21/02628 ,  H01L21/6835 ,  H01L23/293 ,  H01L23/3157 ,  H01L23/564 ,  H01L24/29 ,  H01L24/32 ,  H01L24/80 ,  H01L27/1266 ,  H01L27/1285 ,  H01L27/1292 ,  H01L29/06 ,  H01L29/0665 ,  H01L29/0673 ,  H01L29/0676 ,  H01L29/068 ,  H01L29/151 ,  H01L29/158 ,  H01L29/16 ,  H01L29/1602 ,  H01L29/1606 ,  H01L29/7781 ,  H01L29/78603 ,  H01L29/78681 ,  H01L29/78696 ,  H01L31/0392 ,  H01L31/03925 ,  H01L31/03926 ,  H01L31/18 ,  H01L31/1804 ,  H01L2221/68368 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/80894 ,  H01L2224/8385 ,  H01L2924/0002 ,  H01L2924/01002 ,  H01L2924/01003 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01067 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/07802 ,  H01L2924/10329 ,  H01L2924/10336 ,  H01L2924/10349 ,  H01L2924/12032 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/13063 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/3025 ,  H05K1/0277 ,  H05K1/0283 ,  Y02E10/547 ,  Y02P70/521 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00014

摘要： The present invention provides stretchable, and optionally printable, semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed. Stretchable semiconductors and electronic circuits of the present invention preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention may be adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices.

公开(公告)号：US12074213B2

公开(公告)日：2024-08-27

申请号：US17357697

申请日：2021-06-24

申请人： The Board of Trustees of the University of Illinois

发明人： Ralph G. Nuzzo ,  John A. Rogers ,  Etienne Menard ,  Keon Jae Lee ,  Dahl-Young Khang ,  Yugang Sun ,  Matthew Meitl ,  Zhengtao Zhu

IPC分类号： H01L29/76 ,  B82Y10/00 ,  H01L21/02 ,  H01L21/308 ,  H01L21/322 ,  H01L21/683 ,  H01L23/00 ,  H01L23/02 ,  H01L25/075 ,  H01L27/12 ,  H01L29/04 ,  H01L29/06 ,  H01L29/12 ,  H01L29/786 ,  H01L31/0392 ,  H01L31/18 ,  H01L33/00 ,  H01L33/32

CPC分类号： H01L29/76 ,  B82Y10/00 ,  H01L21/02521 ,  H01L21/02603 ,  H01L21/02628 ,  H01L21/308 ,  H01L21/322 ,  H01L21/6835 ,  H01L23/02 ,  H01L24/03 ,  H01L24/80 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0753 ,  H01L27/1285 ,  H01L27/1292 ,  H01L29/04 ,  H01L29/06 ,  H01L29/0665 ,  H01L29/0673 ,  H01L29/0676 ,  H01L29/068 ,  H01L29/12 ,  H01L29/78603 ,  H01L29/78681 ,  H01L29/78696 ,  H01L31/0392 ,  H01L31/03926 ,  H01L31/1804 ,  H01L31/1864 ,  H01L31/1896 ,  H01L33/007 ,  H01L33/0093 ,  H01L33/32 ,  B81C2201/0185 ,  H01L24/05 ,  H01L24/08 ,  H01L24/29 ,  H01L24/32 ,  H01L24/94 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/03 ,  H01L2224/0332 ,  H01L2224/0345 ,  H01L2224/03614 ,  H01L2224/0362 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05555 ,  H01L2224/05644 ,  H01L2224/05666 ,  H01L2224/08225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/80 ,  H01L2224/80006 ,  H01L2224/80121 ,  H01L2224/80862 ,  H01L2224/80895 ,  H01L2224/83 ,  H01L2224/83005 ,  H01L2224/83121 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2224/95 ,  H01L2224/97 ,  H01L2924/00012 ,  H01L2924/01032 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12032 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13063 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15159 ,  H01L2924/15162 ,  H01L2924/15788 ,  H01L2924/1579 ,  Y02E10/547 ,  Y02P70/50 ,  Y10S977/707 ,  Y10S977/724 ,  H01L2224/05644 ,  H01L2924/00014 ,  H01L2224/05124 ,  H01L2924/00014 ,  H01L2224/0332 ,  H01L2924/00014 ,  H01L2224/97 ,  H01L2224/80 ,  H01L2224/97 ,  H01L2224/83 ,  H01L2224/80121 ,  H01L2924/00012 ,  H01L2224/83121 ,  H01L2924/00012 ,  H01L2224/9202 ,  H01L2224/03 ,  H01L2224/05666 ,  H01L2924/00014 ,  H01L2224/2919 ,  H01L2924/0665 ,  H01L2224/94 ,  H01L2224/03 ,  H01L2224/05155 ,  H01L2924/00014 ,  H01L2224/05144 ,  H01L2924/01032 ,  H01L2224/05082 ,  H01L2224/05644 ,  H01L2224/05155 ,  H01L2224/05144 ,  H01L2924/01032 ,  H01L2224/05073 ,  H01L2224/05644 ,  H01L2224/05166 ,  H01L2224/05166 ,  H01L2924/00014 ,  H01L2224/05555 ,  H01L2924/00014 ,  H01L2224/05554 ,  H01L2924/00014 ,  H01L2224/05553 ,  H01L2924/00014 ,  H01L2224/05552 ,  H01L2924/00012 ,  H01L2224/83192 ,  H01L2224/32225 ,  H01L2924/00 ,  H01L2924/13091 ,  H01L2924/00 ,  H01L2924/1306 ,  H01L2924/00 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2924/1305 ,  H01L2924/00 ,  H01L2924/12032 ,  H01L2924/00 ,  H01L2924/15788 ,  H01L2924/00 ,  H01L2924/12036 ,  H01L2924/00 ,  H01L2924/12042 ,  H01L2924/00 ,  H01L2924/12043 ,  H01L2924/00 ,  H01L2924/12044 ,  H01L2924/00 ,  H01L2924/13063 ,  H01L2924/00 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/13055 ,  H01L2924/00

摘要： The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.

公开(公告)号：US11154201B2

公开(公告)日：2021-10-26

申请号：US16086377

申请日：2017-03-31

申请人： The Board of Trustees of the University of Illinois ,  Washington University in St. Louis

发明人： John A. Rogers ,  Gunchul Shin ,  Anthony R. Banks ,  Michael Bruchas ,  Robert Gereau

IPC分类号： A61B5/00 ,  A61B5/07 ,  A61B17/04 ,  A61N5/06

摘要： Provided are implantable biomedical devices and related methods for interfacing with a target tissue. The devices comprise a substrate, an electronic device supported by the substrate and a freely positionable injectable needle electronically connected to the electronic device by a deformable interconnect, where the injectable needle has one or more optical sources provided on a distal tip end. The injectable needle may further comprise a photodetector.

公开(公告)号：US11058300B2

公开(公告)日：2021-07-13

申请号：US16481147

申请日：2018-01-26

申请人： NORTHWESTERN UNIVERSITY ,  THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS

发明人： John A. Rogers ,  Seungyong Han ,  Sang Min Won ,  Jeonghyun Kim

IPC分类号： A61B5/00 ,  A61B5/0205 ,  A61B5/026 ,  A61B5/01 ,  A61B5/0533 ,  A61B5/145 ,  A61B5/08

摘要： Provided herein are medical devices comprising a plurality of biologically interactive devices configured for interacting with a large area biological surface. The biologically interactive devices each may comprise a sensor for measuring a physiological parameter. A wireless controller is configured to wirelessly operate the plurality of biologically interactive devices. A wireless transmitter is configured for wirelessly communicating an output from said plurality of biologically interactive devices to a remote receiver. The medical devices are particularly suited for measuring one or both of pressure and temperature, with compatibility for incorporating additional sensors of interest.

公开(公告)号：US10736551B2

公开(公告)日：2020-08-11

申请号：US15501364

申请日：2015-08-11

申请人： The Board of Trustees of the University of Illinois

发明人： John A. Rogers

IPC分类号： A61B5/00 ,  A61B5/1455 ,  A61B5/145 ,  A61B10/00 ,  A61B5/1468 ,  A61B5/053 ,  A61B5/01 ,  A61B5/026

摘要： The invention provides systems and methods for tissue-mounted photonics. Devices of some embodiments implement photonic sensing and actuation in flexible and/stretchable device architectures compatible with achieving long term, mechanically robust conformal integration with a range of tissue classes, including in vivo biometric sensing for internal and external tissues. Tissue-mounted photonic systems of some embodiments include colorimetric, fluorometric and/or spectroscopic photonics sensors provided in pixelated array formats on soft, elastomeric substrates to achieve spatially and/or or temporally resolved sensing of tissue and/or environmental properties, while minimize adverse physical effects to the tissue. Tissue-mounted photonic systems of some embodiments enable flexible passive or active optical sensing modalities, including sensing compatible with optical readout using a mobile electronic devices such as a mobile phone or tablet computer.

公开(公告)号：US10357201B2

公开(公告)日：2019-07-23

申请号：US15861257

申请日：2018-01-03

申请人： The Board of Trustees of the University of Illinois

发明人： John A. Rogers ,  Ming Ying ,  Andrew Bonifas ,  Nanshu Lu

IPC分类号： A61B5/00 ,  A61B5/01 ,  A41D19/015 ,  H05K3/00 ,  H05K7/02 ,  A61B5/11 ,  H01L23/538 ,  A61B34/35 ,  A61B34/00 ,  H05K1/02 ,  A61B42/10 ,  A61N1/04 ,  H05K1/11 ,  H05K1/16 ,  H05K1/18 ,  H05K3/30

摘要： Disclosed are appendage mountable electronic systems and related methods for covering and conforming to an appendage surface. A flexible or stretchable substrate has an inner surface for receiving an appendage, including an appendage having a curved surface, and an opposed outer surface that is accessible to external surfaces. A stretchable or flexible electronic device is supported by the substrate inner and/or outer surface, depending on the application of interest. The electronic device in combination with the substrate provides a net bending stiffness to facilitate conformal contact between the inner surface and a surface of the appendage provided within the enclosure. In an aspect, the system is capable of surface flipping without adversely impacting electronic device functionality, such as electronic devices comprising arrays of sensors, actuators, or both sensors and actuators.

公开(公告)号：US10204864B2

公开(公告)日：2019-02-12

申请号：US15339338

申请日：2016-10-31

申请人： The Board of Trustees of the University of Illinois

发明人： John A. Rogers ,  Dahl-Young Khang ,  Yugang Sun ,  Etienne Menard

IPC分类号： H01L23/538 ,  H01L23/00 ,  H01L29/786 ,  H01L23/31 ,  H05K1/02

摘要： The present invention provides stretchable, and optionally printable, semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed. Stretchable semiconductors and electronic circuits of the present invention preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention may be adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices.