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公开(公告)号:CN107210240B
公开(公告)日:2019-07-19
申请号:CN201680007974.X
申请日:2016-02-01
申请人: 伊文萨思公司
IPC分类号: H01L21/60
CPC分类号: H01L24/81 , H01L21/768 , H01L23/49838 , H01L23/528 , H01L24/11 , H01L24/13 , H01L24/16 , H01L25/0657 , H01L25/50 , H01L2224/10126 , H01L2224/1182 , H01L2224/13023 , H01L2224/13105 , H01L2224/13109 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13184 , H01L2224/13562 , H01L2224/1357 , H01L2224/1379 , H01L2224/13809 , H01L2224/13811 , H01L2224/13847 , H01L2224/13855 , H01L2224/1601 , H01L2224/16014 , H01L2224/16058 , H01L2224/16145 , H01L2224/16227 , H01L2224/16238 , H01L2224/16503 , H01L2224/16505 , H01L2224/16507 , H01L2224/81007 , H01L2224/81048 , H01L2224/81143 , H01L2224/81193 , H01L2224/8181 , H01L2224/8182 , H01L2224/81862 , H01L2224/81895 , H01L2224/81903 , H01L2224/81905 , H01L2224/94 , H01L2924/01029 , H01L2924/01051 , H01L2924/01327 , H01L2924/364 , H01L2224/11 , H01L2224/81 , H01L2924/00014 , H01L2924/2064
摘要: 本发明提供了一种大体上涉及微电子器件的设备。在此类设备中,第一基板具有第一表面,其中第一互连件位于所述第一表面上,第二基板具有与所述第一表面间隔开的第二表面,所述第一表面与所述第二表面之间具有间隙。第二互连件位于所述第二表面上。所述第一互连件的下表面和所述第二互连件的上表面彼此耦接以用于所述第一基板和所述第二基板之间的导电性。导电衬圈围绕第一互连件和第二互连件的侧壁,并且介电层围绕所述导电衬圈。
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公开(公告)号:CN107546213A
公开(公告)日:2018-01-05
申请号:CN201710502805.X
申请日:2017-06-27
申请人: 瑞萨电子株式会社
IPC分类号: H01L23/535 , H01L23/538 , H01L21/60 , H01L23/31
CPC分类号: H01L24/13 , H01L21/311 , H01L21/321 , H01L21/56 , H01L23/293 , H01L23/3157 , H01L23/3192 , H01L23/525 , H01L23/53295 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/11 , H01L24/16 , H01L24/81 , H01L2224/02311 , H01L2224/02331 , H01L2224/02333 , H01L2224/02377 , H01L2224/0239 , H01L2224/03462 , H01L2224/0347 , H01L2224/03914 , H01L2224/0401 , H01L2224/05082 , H01L2224/05083 , H01L2224/05124 , H01L2224/05147 , H01L2224/05166 , H01L2224/05186 , H01L2224/05548 , H01L2224/05567 , H01L2224/061 , H01L2224/06135 , H01L2224/10145 , H01L2224/11334 , H01L2224/11462 , H01L2224/1147 , H01L2224/1182 , H01L2224/11849 , H01L2224/1191 , H01L2224/13021 , H01L2224/13024 , H01L2224/13083 , H01L2224/13111 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13163 , H01L2224/13164 , H01L2224/13565 , H01L2224/1357 , H01L2224/13686 , H01L2224/1369 , H01L2224/16112 , H01L2224/16237 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/81191 , H01L2224/81411 , H01L2224/81815 , H01L2924/3512 , H01L2924/01029 , H01L2924/013 , H01L2924/01014 , H01L2924/00014 , H01L2924/04941 , H01L2924/01047 , H01L2924/014 , H01L2924/053 , H01L2224/16225 , H01L2924/00012
摘要: 本发明涉及半导体器件及其制造方法,能够提高半导体器件的可靠性。半导体器件具有:半导体衬底(1);导体层(RM),形成在半导体衬底(1)上、且具有上表面及下表面;导体柱(CP),在导体层(RM)的上表面上形成,且具有上表面、下表面及侧壁;保护膜(16),覆盖导体层(RM)的上表面,且具有露出导体柱(CP)上表面及侧壁的开口(16a);及覆盖导体柱(CP)的侧壁的保护膜(SW)。而且,在俯视中,保护膜(16)的开口(16a)大于导体柱(CP)的上表面,并露出导体柱(CP)的上表面的整个区域。
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公开(公告)号:CN104143538B
公开(公告)日:2018-01-02
申请号:CN201410181177.6
申请日:2014-04-30
申请人: 奇景光电股份有限公司
发明人: 林久顺
IPC分类号: H01L23/488 , H01L23/498
CPC分类号: H01L29/43 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L2224/0345 , H01L2224/0361 , H01L2224/03614 , H01L2224/03912 , H01L2224/0401 , H01L2224/05009 , H01L2224/05022 , H01L2224/05027 , H01L2224/05124 , H01L2224/05166 , H01L2224/05572 , H01L2224/05582 , H01L2224/05647 , H01L2224/1134 , H01L2224/1146 , H01L2224/1147 , H01L2224/1181 , H01L2224/1182 , H01L2224/11825 , H01L2224/11848 , H01L2224/13006 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13164 , H01L2224/13552 , H01L2224/13562 , H01L2224/1357 , H01L2224/13582 , H01L2224/13611 , H01L2224/13644 , H01L2224/13655 , H01L2224/13664 , H01L2924/01028 , H01L2924/0105 , H01L2924/15788 , H01L2924/00 , H01L2924/00014 , H01L2924/00012 , H01L2924/01074
摘要: 本发明公开一种玻璃倒装接合结构,其包含位于金属焊垫上的护层、位于金属焊垫上又部分位于护层上的黏着层、部分位于凹穴中并覆盖黏着层的金属凸块、完全覆盖金属凸块的帽盖层、引脚层与玻璃层直接相连、与电连接帽盖层和引脚层的导电粒子层。
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公开(公告)号:CN105984219A
公开(公告)日:2016-10-05
申请号:CN201610145036.8
申请日:2016-03-14
申请人: 精工爱普生株式会社
IPC分类号: B41J2/045
CPC分类号: H01L24/13 , B41J2/14233 , B41J2/161 , B41J2/1626 , B41J2/1631 , B41J2002/14241 , B41J2002/14491 , H01L24/02 , H01L24/05 , H01L24/11 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/30 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/02313 , H01L2224/0233 , H01L2224/02331 , H01L2224/0235 , H01L2224/02351 , H01L2224/0239 , H01L2224/0401 , H01L2224/04026 , H01L2224/05548 , H01L2224/05553 , H01L2224/05555 , H01L2224/05655 , H01L2224/1161 , H01L2224/11618 , H01L2224/11622 , H01L2224/13008 , H01L2224/1319 , H01L2224/13562 , H01L2224/1357 , H01L2224/13644 , H01L2224/16227 , H01L2224/27618 , H01L2224/27622 , H01L2224/27901 , H01L2224/29007 , H01L2224/29011 , H01L2224/29024 , H01L2224/2919 , H01L2224/29191 , H01L2224/301 , H01L2224/30145 , H01L2224/32237 , H01L2224/73103 , H01L2224/73203 , H01L2224/81139 , H01L2224/8114 , H01L2224/81191 , H01L2224/81201 , H01L2224/81444 , H01L2224/81903 , H01L2224/83191 , H01L2224/83192 , H01L2224/83201 , H01L2224/83455 , H01L2224/83466 , H01L2224/83471 , H01L2224/83856 , H01L2224/9211 , H01L2224/9212 , H01L2924/35121 , H01L2924/00014 , H01L2924/00012 , H01L2924/0665 , H01L2924/066 , H01L2924/0635 , H01L2924/07025 , H01L2924/0715 , H01L2924/0615 , H01L2924/01024 , H01L2924/01028 , H01L2924/01079 , H01L2224/27848 , H01L2224/11 , H01L2224/27 , H01L2224/81 , H01L2224/83 , B41J2/04541
摘要: 本发明提供一种能够在将金或其合金用作配线的结构中进一步提高粘合可靠性的电子装置以及电子装置的制造方法。电子装置(14)具备:驱动基板(压力室基板(29)以及振动板(31)),其形成有压电元件(32)以及该压电元件的驱动所涉及的电极配线(44、45);密封板(33),其被接合在该驱动基板上,电极配线以含有金(Au)的配线金属隔着作为基底层的紧贴层(50)而被形成在驱动基板上的方式被形成,并具有去除部(49),该去除部(49)将包括与接合树脂43接合的部分在内的区域中的配线金属的一部分去除而使紧贴层露出。
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公开(公告)号:CN103681614B
公开(公告)日:2016-09-14
申请号:CN201310218344.5
申请日:2013-06-04
申请人: 台湾积体电路制造股份有限公司
IPC分类号: H01L23/538 , H01L21/60
CPC分类号: H01L24/02 , H01L21/4853 , H01L21/76885 , H01L23/49811 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L2224/02125 , H01L2224/02141 , H01L2224/02145 , H01L2224/0215 , H01L2224/0401 , H01L2224/05114 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05647 , H01L2224/10125 , H01L2224/11013 , H01L2224/11019 , H01L2224/1112 , H01L2224/11462 , H01L2224/11472 , H01L2224/13012 , H01L2224/13015 , H01L2224/13017 , H01L2224/13023 , H01L2224/13026 , H01L2224/1308 , H01L2224/13082 , H01L2224/13083 , H01L2224/13111 , H01L2224/13116 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/13166 , H01L2224/13551 , H01L2224/13564 , H01L2224/13565 , H01L2224/1357 , H01L2224/13582 , H01L2224/136 , H01L2224/13686 , H01L2224/1369 , H01L2224/14051 , H01L2224/16148 , H01L2224/16227 , H01L2224/16238 , H01L2224/16503 , H01L2224/81007 , H01L2224/81143 , H01L2224/81191 , H01L2224/81203 , H01L2224/81424 , H01L2224/81439 , H01L2224/81444 , H01L2224/81447 , H01L2224/8181 , H01L2224/81895 , H01L2224/8192 , H01L2224/81948 , H01L2225/06513 , H01L2924/04941 , H01L2924/07025 , H01L2924/181 , H01L2924/301 , H01L2924/35 , Y10T29/49144 , H01L2924/00014 , H01L2924/014 , H01L2924/05432 , H01L2924/053 , H01L2924/00 , H01L2924/00012
摘要: 一种迹线上凸块(BOT)结构包括由集成电路支撑的接触元件、电连接到接触元件的凸块下金属化(UBM)部件、位于凸块下金属化部件上的金属凸块以及位于基板上的基板迹线。基板迹线通过焊料接点和介面合金共化物连接到金属凸块;介面合金共化物的第一横截面积和焊料接点的第二横截面积的比率大于40%。
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公开(公告)号:CN102820276B
公开(公告)日:2016-05-11
申请号:CN201210186496.7
申请日:2012-06-07
申请人: 南茂科技股份有限公司
发明人: 沈更新
IPC分类号: H01L23/495 , H01L23/31 , H01L21/60
CPC分类号: H01L24/11 , H01L21/56 , H01L21/561 , H01L23/3107 , H01L23/4951 , H01L23/49551 , H01L23/49861 , H01L24/13 , H01L24/16 , H01L2224/0401 , H01L2224/05569 , H01L2224/05572 , H01L2224/05644 , H01L2224/05647 , H01L2224/05666 , H01L2224/05684 , H01L2224/13007 , H01L2224/13022 , H01L2224/13082 , H01L2224/13083 , H01L2224/13109 , H01L2224/13111 , H01L2224/13118 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13562 , H01L2224/1357 , H01L2224/13644 , H01L2224/16245 , H01L2224/8191 , H01L2224/94 , H01L2924/00014 , H01L2924/181 , H01L2924/351 , H01L2224/11 , H01L2224/05552 , H01L2924/00 , H01L2924/00012
摘要: 本发明提供一种四方扁平无接脚(Quad Flat Non-leaded;QFN)封装,其包含一芯片、一导线框架、多个复合凸块及一封装体。该芯片具有多个焊垫,且该导线框架具有多个接脚。每一所述多个复合凸块具有一第一导电层及一第二导电层。该第一导电层电性连接于所述多个焊垫其中之一与该第二导电层之间,且该第二导电层电性连接于该第一导电层与所述多个接脚其中之一之间。该封装体适可封装该芯片、所述多个接脚及所述多个复合凸块。藉此,提供一具有多个复合凸块及一半固化封装体的四方扁平无接脚封装,其中该半固化封装体在该芯片接合至该导线框架之前形成于该导线框架的所述多个接脚间的空间中。
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公开(公告)号:CN105144359A
公开(公告)日:2015-12-09
申请号:CN201480014639.3
申请日:2014-02-20
申请人: 甲骨文国际公司
发明人: H·D·塞科 , A·V·克里什纳莫西 , J·E·坎宁安 , 张朝齐
IPC分类号: H01L21/60 , H01L23/485 , H01L23/29 , H01L23/31 , B23K3/06 , H01L21/02 , H01L25/065 , H01L21/56 , H01L21/683
CPC分类号: H01L24/14 , B23K3/0623 , H01L21/561 , H01L21/6836 , H01L23/296 , H01L23/3171 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/74 , H01L24/81 , H01L24/98 , H01L25/0657 , H01L2221/68327 , H01L2221/68381 , H01L2224/03452 , H01L2224/0361 , H01L2224/0362 , H01L2224/0401 , H01L2224/05557 , H01L2224/05558 , H01L2224/05571 , H01L2224/05573 , H01L2224/05686 , H01L2224/11005 , H01L2224/11013 , H01L2224/11015 , H01L2224/11334 , H01L2224/13099 , H01L2224/13561 , H01L2224/1357 , H01L2224/13644 , H01L2224/13686 , H01L2224/17517 , H01L2224/742 , H01L2224/81002 , H01L2224/81141 , H01L2224/81191 , H01L2224/81815 , H01L2224/94 , H01L2924/00014 , H01L2924/05432 , H01L2224/11 , H01L2224/03 , H01L2924/00012 , H01L2924/05442 , H01L2224/05552
摘要: 描述了多芯片模块(MCM)。这种MCM包括至少两个基板,其中基板通过基板的面对的表面上的阳性特征和阴性特征机械耦合并对准。这些阳性特征和阴性特征可以彼此配对并自锁定。阳性特征可以利用阴性特征中的亲水层自填充到至少一个基板上的阴性特征中。这种亲水层可以结合包围至少一个基板的顶表面上的阴性特征的疏水层来使用。
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公开(公告)号:CN105074893A
公开(公告)日:2015-11-18
申请号:CN201480008493.1
申请日:2014-01-16
申请人: 奥林巴斯株式会社
CPC分类号: H01L24/13 , H01L21/563 , H01L24/05 , H01L24/11 , H01L24/16 , H01L24/32 , H01L24/81 , H01L27/14636 , H01L2224/0346 , H01L2224/0401 , H01L2224/05096 , H01L2224/05098 , H01L2224/05124 , H01L2224/05166 , H01L2224/05568 , H01L2224/05571 , H01L2224/05576 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05666 , H01L2224/1145 , H01L2224/1146 , H01L2224/11622 , H01L2224/11826 , H01L2224/11849 , H01L2224/119 , H01L2224/13013 , H01L2224/13016 , H01L2224/13017 , H01L2224/13082 , H01L2224/131 , H01L2224/13109 , H01L2224/13111 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13551 , H01L2224/13552 , H01L2224/1356 , H01L2224/13562 , H01L2224/13565 , H01L2224/13566 , H01L2224/1357 , H01L2224/13582 , H01L2224/13624 , H01L2224/13639 , H01L2224/13644 , H01L2224/13647 , H01L2224/13655 , H01L2224/13666 , H01L2224/13669 , H01L2224/13684 , H01L2224/16058 , H01L2224/16059 , H01L2224/16238 , H01L2224/32225 , H01L2224/73204 , H01L2224/81009 , H01L2224/8109 , H01L2224/81092 , H01L2224/81191 , H01L2224/81203 , H01L2224/8138 , H01L2224/81424 , H01L2224/81439 , H01L2224/81444 , H01L2224/81447 , H01L2224/81455 , H01L2224/81466 , H01L2224/81469 , H01L2224/81484 , H01L2224/81903 , H01L2224/831 , H01L2224/92225 , H01L2924/01013 , H01L2924/01029 , H01L2924/01079 , H01L2924/381 , H01L2924/00014 , H01L2924/00012 , H01L2924/01074 , H01L2224/11825 , H01L2924/014
摘要: 该半导体基板具有:半导体基板主体(12d),其形成有布线(16);以及接合电极(12a),其被设置成在半导体基板主体(12d)的第一面(12c)突出。接合电极(12a)由复合体构成,所述复合体具有:第1金属部(14),其被设置成从半导体基板主体(12d)的第一面(12c)突出,突出方向的基端部与布线(16)电连接;以及第2金属部(15),其由比构成第1金属部(14)的第1金属硬的第2金属构成,被设置成在第1金属部(14)的突出高度以下的范围内与第1金属部(14)接合。
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公开(公告)号:CN104143539A
公开(公告)日:2014-11-12
申请号:CN201410189747.6
申请日:2014-05-06
申请人: 奇景光电股份有限公司
发明人: 林久顺
IPC分类号: H01L23/488 , H01L21/60
CPC分类号: H01L29/43 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L2224/0345 , H01L2224/0361 , H01L2224/03614 , H01L2224/03912 , H01L2224/0401 , H01L2224/05009 , H01L2224/05022 , H01L2224/05027 , H01L2224/05124 , H01L2224/05166 , H01L2224/05572 , H01L2224/05582 , H01L2224/05647 , H01L2224/1134 , H01L2224/1146 , H01L2224/1147 , H01L2224/1181 , H01L2224/1182 , H01L2224/11825 , H01L2224/11848 , H01L2224/13006 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13164 , H01L2224/13552 , H01L2224/13562 , H01L2224/1357 , H01L2224/13582 , H01L2224/13611 , H01L2224/13644 , H01L2224/13655 , H01L2224/13664 , H01L2924/01028 , H01L2924/0105 , H01L2924/15788 , H01L2924/00 , H01L2924/00014 , H01L2924/00012 , H01L2924/01074
摘要: 本发明公开一种用于驱动集成电路的金属凸块结构及其制造方法。该金属凸块结构包含位于金属焊垫上的护层、位于金属焊垫上又部分位于护层上的黏着层、部分位于凹穴中并覆盖黏着层的金属凸块、以及完全覆盖金属凸块的覆层。覆层具有横向延伸的侧翼,且侧翼位于护层上。
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公开(公告)号:CN104051406A
公开(公告)日:2014-09-17
申请号:CN201310680445.4
申请日:2013-12-11
申请人: 南茂科技股份有限公司
IPC分类号: H01L23/498
CPC分类号: H01L21/4825 , H01L23/15 , H01L23/49816 , H01L23/4985 , H01L23/49866 , H01L23/49894 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L2224/0345 , H01L2224/03452 , H01L2224/03462 , H01L2224/03464 , H01L2224/0361 , H01L2224/03912 , H01L2224/0401 , H01L2224/05005 , H01L2224/05027 , H01L2224/05139 , H01L2224/05144 , H01L2224/05155 , H01L2224/05164 , H01L2224/05166 , H01L2224/05541 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/11462 , H01L2224/11464 , H01L2224/1147 , H01L2224/11825 , H01L2224/11848 , H01L2224/11901 , H01L2224/13005 , H01L2224/13082 , H01L2224/13111 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13562 , H01L2224/13564 , H01L2224/1357 , H01L2224/13644 , H01L2224/13647 , H01L2224/16225 , H01L2224/16227 , H01L2224/16238 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2224/81191 , H01L2224/814 , H01L2224/8159 , H01L2224/8169 , H01L2224/81744 , H01L2224/81815 , H01L2224/8185 , H01L2224/81862 , H01L2224/83104 , H01L2924/01322 , H01L2924/15788 , H01L2924/351 , H01L2924/01079 , H01L2924/01046 , H01L2924/00014 , H01L2924/01074 , H01L2924/01082 , H01L2924/00012 , H01L2924/0665 , H01L2924/0655 , H01L2924/206 , H01L2924/014 , H01L2924/00 , H01L2224/1146
摘要: 一半导体结构包括:一装置;在所述装置上的一导电衬垫;及在所述导电衬垫上方的一Ag1-xYx合金凸块。所述Ag1-xYx凸块的Y包含以任意权重百分比与Ag形成完全固溶体的金属,且所述Ag1-xYx合金凸块之的X在0.005至0.25的一范围内。一个标准差与所述Ag1-xYx合金凸块的一粒径分布的一均值之间的一差异在0.2μm至0.4μm的一范围内。所述Ag1-xYx合金凸块在一纵向横截面平面上的一平均粒径在0.5μm至1.5μm的一范围内。
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