公开(公告)号：US08766438B2

公开(公告)日：2014-07-01

申请号：US13393459

申请日：2009-09-01

申请人： Hwee-Seng Jimmy Chew ,  Chee Kian Ong ,  Kee Kwang Lau

发明人： Hwee-Seng Jimmy Chew ,  Chee Kian Ong ,  Kee Kwang Lau

IPC分类号： H01L23/48

CPC分类号： H01L21/563 ,  H01L23/3171 ,  H01L23/3192 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/32 ,  H01L24/33 ,  H01L2224/02166 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05567 ,  H01L2224/05578 ,  H01L2224/056 ,  H01L2224/05687 ,  H01L2224/0569 ,  H01L2224/10125 ,  H01L2224/10126 ,  H01L2224/13008 ,  H01L2224/13012 ,  H01L2224/13016 ,  H01L2224/13027 ,  H01L2224/141 ,  H01L2224/14153 ,  H01L2224/16245 ,  H01L2224/26125 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/014 ,  H01L2924/15788 ,  H01L2924/05442 ,  H01L2924/05042 ,  H01L2224/13099 ,  H01L2224/05099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2924/00012

摘要： The invention discloses a package structure including a semiconductor device, a first protection layer, a second protection layer and at least one conductive connector. The semiconductor device has at least one pad. The first protection layer is disposed on the semiconductor device and exposes the pad. The second protection layer, disposed on the first protection layer, has at least one first opening and at least one second opening. The first opening exposes a partial surface of the pad. The second opening exposes a partial surface of the first protection layer. The conductive connector, opposite to the pad, is disposed on the second protection layer and coupled to the pad through the first openings.

摘要翻译： 本发明公开了一种包括半导体器件，第一保护层，第二保护层和至少一个导电连接器的封装结构。 半导体器件具有至少一个焊盘。 第一保护层设置在半导体器件上并使焊盘露出。 设置在第一保护层上的第二保护层具有至少一个第一开口和至少一个第二开口。 第一开口露出垫的部分表面。 第二开口露出第一保护层的部分表面。 与焊盘相对的导电连接器设置在第二保护层上，并通过第一开口与焊盘相连。

公开(公告)号：US08766422B2

公开(公告)日：2014-07-01

申请号：US13098083

申请日：2011-04-29

申请人： Kah Wee Gan ,  Yonggang Jin ,  Yun Liu ,  Yaohuang Huang

发明人： Kah Wee Gan ,  Yonggang Jin ,  Yun Liu ,  Yaohuang Huang

IPC分类号： H01L23/02 ,  H01L23/04

CPC分类号： H01L24/19 ,  H01L21/486 ,  H01L21/561 ,  H01L21/568 ,  H01L21/76868 ,  H01L21/76873 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/20 ,  H01L24/24 ,  H01L24/82 ,  H01L24/96 ,  H01L25/105 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2225/1035 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/00013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00

摘要： An embedded wafer level ball grid array (eWLB) is formed by embedding a semiconductor die in a molding compound. A trench is formed in the molding compound with a laser drill. A first layer of copper is deposited on the sidewall of the trench by physical vapor deposition. A second layer of copper is then formed on the first layer of copper by an electroless process. A third layer of copper is then formed on the second layer by electroplating.

摘要翻译： 嵌入式晶片级球栅阵列（eWLB）通过将半导体管芯嵌入到模塑料中而形成。 在激光钻头的模塑料中形成沟槽。 第一层铜通过物理气相沉积沉积在沟槽的侧壁上。 然后通过无电解方法在第一层铜上形成第二层铜层。 然后通过电镀在第二层上形成第三层铜层。

公开(公告)号：US08759989B2

公开(公告)日：2014-06-24

申请号：US13808782

申请日：2011-06-10

申请人： Kazuyuki Matsumura ,  Kanako Sugimoto ,  Hiroyuki Niwa ,  Chikara Inagaki

发明人： Kazuyuki Matsumura ,  Kanako Sugimoto ,  Hiroyuki Niwa ,  Chikara Inagaki

IPC分类号： H01L23/29 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： G03F7/031 ,  C08G59/68 ,  C08G73/1039 ,  C08G73/1042 ,  C08G73/1046 ,  C08G73/1053 ,  C08G73/106 ,  C08L79/08 ,  C08L2312/06 ,  C09J163/00 ,  H01L21/563 ,  H01L23/293 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2224/0401 ,  H01L2224/05644 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/274 ,  H01L2224/27436 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/29388 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/81204 ,  H01L2224/83204 ,  H01L2224/838 ,  H01L2225/06513 ,  H01L2225/06568 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/15788 ,  C08L63/00 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2924/05341 ,  H01L2924/05432 ,  H01L2924/05442 ,  H01L2924/05032 ,  H01L2924/0503 ,  H01L2924/05042 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： Provided is a photosensitive adhesive composition comprising (A) an alkali-soluble polyimide having particular structural unit(s) and having a particular structure at at least one end of the main chain, (B) a glycidylamine type epoxy compound of a particular structure, (C) a photopolymerizable compound, and (D) a photoinitiator, wherein (A) the alkali-soluble polyimide has a glass transition temperature of 160° C. or higher. The photosensitive adhesive composition has the ability to form patterns with an alkaline developer, excellent thermocompressibility at a low temperature to an irregular substrate after exposure, and a high adhesive strength even at a high temperature.

摘要翻译： 提供一种感光性粘合剂组合物，其包含（A）具有特定结构单元的碱溶性聚酰亚胺，并且在主链的至少一端具有特定结构，（B）具体结构的缩水甘油胺型环氧化合物， （C）光聚合性化合物，（D）光引发剂，（A）碱溶性聚酰亚胺的玻璃化转变温度为160℃以上。 感光性粘合剂组合物具有与碱性显影剂形成图案的能力，在曝光后在低温下对于不规则基材的优异的热压性，以及即使在高温下也具有高的粘合强度。

公开(公告)号：US08759970B2

公开(公告)日：2014-06-24

申请号：US12546463

申请日：2009-08-24

申请人： Salman Akram

发明人： Salman Akram

IPC分类号： H01L23/48

CPC分类号： H01L24/85 ,  H01L23/53238 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/45 ,  H01L24/48 ,  H01L24/50 ,  H01L24/86 ,  H01L2224/02166 ,  H01L2224/03 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05082 ,  H01L2224/05083 ,  H01L2224/05166 ,  H01L2224/05181 ,  H01L2224/05184 ,  H01L2224/05556 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05681 ,  H01L2224/13099 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/45669 ,  H01L2224/48091 ,  H01L2224/48453 ,  H01L2224/48463 ,  H01L2224/48507 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48655 ,  H01L2224/48664 ,  H01L2224/48666 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48747 ,  H01L2224/48755 ,  H01L2224/48764 ,  H01L2224/48766 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/48855 ,  H01L2224/48864 ,  H01L2224/48866 ,  H01L2224/48881 ,  H01L2224/85375 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2224/78 ,  H01L2224/48824 ,  H01L2924/00 ,  H01L2224/48744 ,  H01L2224/48781 ,  H01L2224/48681 ,  H01L2224/29099

摘要： An improved wire bond is provided with the bond pads of semiconductor devices and the lead fingers of lead frames or an improved conductive lead of a TAB tape bond with the bond pad of a semiconductor device. More specifically, an improved wire bond is described wherein the bond pad on a surface of the semiconductor device comprises a layer of copper and at least one layer of metal and/or at least a barrier layer of material between the copper layer and one layer of metal on the copper layer to form a bond pad.

摘要翻译： 改进的引线键合设置有半导体器件的接合焊盘和引线框架的引线指，或者TAB带的改进的导电引线与半导体器件的焊盘焊接。 更具体地，描述了改进的引线键合，其中半导体器件的表面上的接合焊盘包括铜层和至少一层金属和/或至少在铜层和一层之间的材料阻挡层 铜层上的金属形成接合垫。

公开(公告)号：US20140170812A1

公开(公告)日：2014-06-19

申请号：US13846640

申请日：2013-03-18

申请人： SK HYNIX INC.

发明人： Cheol Ho JOH

IPC分类号： H01L21/50

CPC分类号： H01L24/85 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/78 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05553 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/787 ,  H01L2224/78745 ,  H01L2224/789 ,  H01L2224/83191 ,  H01L2224/85181 ,  H01L2224/85186 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/10161 ,  Y10T29/53178 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2924/00 ,  H01L2224/4554

摘要： There are proposed a method and apparatus for manufacturing a chip package in which bonding wires are coupled with contact pads in which an overhang holder holds and fixes portions of a surface adjacent to portions where the contact pads are located.

摘要翻译： 提出了一种用于制造芯片封装的方法和装置，其中，接合线与接触焊盘耦合，其中突出支架保持并固定与接触垫所在部分相邻的表面的部分。

公开(公告)号：US08753922B2

公开(公告)日：2014-06-17

申请号：US13741910

申请日：2013-01-15

申请人： Renesas Electronics Corporation

发明人： Yasutaka Nakashiba ,  Kenta Ogawa

IPC分类号： H01L21/00 ,  H01L23/495 ,  H01L23/48 ,  H01L23/522 ,  H01L23/64 ,  H01L23/544

CPC分类号： H01L23/5227 ,  H01L21/56 ,  H01L23/48 ,  H01L23/49534 ,  H01L23/49537 ,  H01L23/49575 ,  H01L23/544 ,  H01L23/645 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/85 ,  H01L25/0657 ,  H01L2223/6655 ,  H01L2224/04042 ,  H01L2224/29 ,  H01L2224/29139 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83855 ,  H01L2224/85 ,  H01L2224/92147 ,  H01L2224/92247 ,  H01L2225/06562 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01021 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/0635 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A first semiconductor chip and a second semiconductor chip are overlapped with each other in a direction in which a first multilayer interconnect layer and a second multilayer interconnect layer are opposed to each other. When seen in a plan view, a first inductor and a second inductor are overlapped. The first semiconductor chip and the second semiconductor chip have non-opposed areas which are not opposed to each other. The first multilayer interconnect layer has a first external connection terminal in the non-opposed area, and the second multilayer interconnect layer has a second external connection terminal in the non-opposed area.

摘要翻译： 第一半导体芯片和第二半导体芯片在第一多层互连层和第二多层互连层彼此相对的方向上彼此重叠。 当在平面图中看到时，第一电感器和第二电感器重叠。 第一半导体芯片和第二半导体芯片具有不相对的非对置区域。 第一多层互连层在非对置区域中具有第一外部连接端子，并且第二多层互连层在非对置区域中具有第二外部连接端子。

公开(公告)号：US08749065B2

公开(公告)日：2014-06-10

申请号：US12009719

申请日：2008-01-22

申请人： Ichiro Kouno ,  Takeshi Wakabayashi ,  Ichiro Mihara

发明人： Ichiro Kouno ,  Takeshi Wakabayashi ,  Ichiro Mihara

IPC分类号： H01L23/48

CPC分类号： H01L24/11 ,  H01L24/03 ,  H01L24/05 ,  H01L24/12 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05024 ,  H01L2224/05083 ,  H01L2224/05111 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05572 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/1147 ,  H01L2224/1148 ,  H01L2224/13006 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/14 ,  H01L2924/30107 ,  H01L2224/13099 ,  H01L2224/29099 ,  H01L2924/00014

摘要： A semiconductor device includes a semiconductor substrate, a plurality of wiring lines which are provided on one side of the semiconductor substrate and which have connection pad portions, and a plurality of columnar electrodes respectively provided on the connection pad portions of the wiring lines, each of the columnar electrodes including an outer peripheral surface and a top surface. An electromigration prevention film is provided on at least the surfaces of the wiring lines. A sealing film is provided around the outer periphery surfaces of the columnar electrodes.

摘要翻译： 半导体器件包括半导体衬底，设置在半导体衬底的一侧上并具有连接焊盘部分的多个布线，以及分别设置在布线的连接焊盘部分上的多个柱状电极， 柱状电极包括外周面和顶面。 至少在布线的表面上设置有电迁移膜。 在柱状电极的外周面上设置密封膜。

公开(公告)号：US20140151883A1

公开(公告)日：2014-06-05

申请号：US13692514

申请日：2012-12-03

申请人： SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

发明人： Phillip Celaya ,  James P. Letterman, JR. ,  Robert L. Marquis

IPC分类号： H01L23/48 ,  H01L21/78

CPC分类号： H01L21/78 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/05 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/10162 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/29099 ,  H01L2224/13099 ,  H01L2224/05599

摘要： A semiconductor component having wettable leadframe lead surfaces and a method of manufacture. A leadframe having leadframe leads is embedded in a mold compound. A portion of at least one leadframe lead is exposed and an electrically conductive material is formed on the exposed portion. The mold compound is separated to form singulated semiconductor components.

摘要翻译： 具有可湿性引线框引线表面的半导体部件和制造方法。 具有引线框引线的引线框架嵌入模具化合物中。 至少一个引线框引线的一部分被暴露，并且在暴露部分上形成导电材料。 分离模具化合物以形成单个半导体组分。

公开(公告)号：US08736083B2

公开(公告)日：2014-05-27

申请号：US12431766

申请日：2009-04-29

申请人： Sheng-Shu Yang ,  Hsiao-Ting Lee ,  Chao-Chyun An

发明人： Sheng-Shu Yang ,  Hsiao-Ting Lee ,  Chao-Chyun An

IPC分类号： H01L23/544

CPC分类号： H01L24/16 ,  H01L22/12 ,  H01L22/30 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/06102 ,  H01L2224/13011 ,  H01L2224/13015 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/13019 ,  H01L2224/13027 ,  H01L2224/1319 ,  H01L2224/1403 ,  H01L2224/14505 ,  H01L2224/14515 ,  H01L2224/16105 ,  H01L2224/81345 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/14 ,  H01L2924/15788 ,  H05K1/0269 ,  H05K3/323 ,  H05K2201/0133 ,  H05K2201/0367 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00 ,  H01L2924/00012

摘要： A bonding inspection structure is provided. The bonding inspection structure includes at least a elastic bump located on a substrate. At least an opening is formed in the top portion of the elastic bump. An inspection area of the top portion of the elastic bump is larger than an area of the opening.

摘要翻译： 提供接合检查结构。 接合检查结构至少包括位于基板上的弹性凸块。 至少在弹性凸块的顶部形成开口。 弹性凸块的顶部的检查区域大于开口的面积。

公开(公告)号：US08728867B2

公开(公告)日：2014-05-20

申请号：US13355792

申请日：2012-01-23

申请人： Kozo Shimizu ,  Keishiro Okamoto ,  Nobuhiro Imaizumi ,  Tadahiro Imada ,  Keiji Watanabe

发明人： Kozo Shimizu ,  Keishiro Okamoto ,  Nobuhiro Imaizumi ,  Tadahiro Imada ,  Keiji Watanabe

IPC分类号： H01L21/44

CPC分类号： H01L23/48 ,  H01L23/3128 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/04026 ,  H01L2224/05005 ,  H01L2224/05082 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05169 ,  H01L2224/05541 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/0603 ,  H01L2224/26175 ,  H01L2224/2745 ,  H01L2224/2746 ,  H01L2224/29019 ,  H01L2224/29036 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/2912 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/325 ,  H01L2224/32502 ,  H01L2224/32506 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/48644 ,  H01L2224/48744 ,  H01L2224/4903 ,  H01L2224/73265 ,  H01L2224/83193 ,  H01L2224/83194 ,  H01L2224/83801 ,  H01L2224/83851 ,  H01L2924/00013 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/13064 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/83439 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/0132 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/0665 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00

摘要： A manufacturing of a semiconductor device includes forming one of a layer with a first metal and the layer with a second metal on one of a semiconductor chip mounting area of a support plate and a back surface of the semiconductor chip; forming the other of the layer with the first metal and the layer with the second metal on an area corresponding to a part of the area, in which one of the layer with the first metal and the layer with the second metal, of the other one of the semiconductor chip mounting area and the back surface of the semiconductor chip; and forming a layer which includes an alloy with the first metal and the second metal after positioning the semiconductor chip in the semiconductor chip mounting area to bond the semiconductor chip with the semiconductor chip mounting area.

摘要翻译： 半导体器件的制造包括在支撑板的半导体芯片安装区域和半导体芯片的后表面中的一个上形成具有第一金属的层和具有第二金属的层; 在第一金属层和第二金属层之间形成与第一金属层和第二金属层之间的一个区域对应的区域的另一层 的半导体芯片安装区域和半导体芯片的背面; 以及在将所述半导体芯片定位在所述半导体芯片安装区域中之后，形成与所述第一金属和所述第二金属合金的层，以将半导体芯片与半导体芯片安装区域接合。