公开(公告)号：US09685401B2

公开(公告)日：2017-06-20

申请号：US14815282

申请日：2015-07-31

Applicant: Invensas Corporation

Inventor： Cyprian Emeka Uzoh ,  Pezhman Monadgemi ,  Terrence Caskey ,  Fatima Lina Ayatollahi ,  Belgacem Haba ,  Charles G. Woychik ,  Michael Newman

IPC: H05K1/00 ,  H01L23/498 ,  H01L21/768 ,  H01L23/373 ,  H01L23/48 ,  H01L23/36 ,  H01L23/367

CPC classification number: H01L23/49827 ,  H01L21/76829 ,  H01L21/76898 ,  H01L23/36 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/3736 ,  H01L23/481 ,  H01L23/49838 ,  H01L23/49866 ,  H01L2924/00 ,  H01L2924/0002

Abstract: An interconnect element includes a semiconductor or insulating material layer that has a first thickness and defines a first surface; a thermally conductive layer; a plurality of conductive elements; and a dielectric coating. The thermally conductive layer includes a second thickness of at least 10 microns and defines a second surface of the interconnect element. The plurality of conductive elements extend from the first surface of the interconnect element to the second surface of the interconnect element. The dielectric coating is between at least a portion of each conductive element and the thermally conductive layer.

公开(公告)号：US09615456B2

公开(公告)日：2017-04-04

申请号：US14809570

申请日：2015-07-27

Applicant: Invensas Corporation

Inventor： Belgacem Haba ,  Ilyas Mohammed ,  Terrence Caskey ,  Reynaldo Co ,  Ellis Chau

IPC: H05K1/09 ,  H05K1/11 ,  H01L23/528 ,  H05K1/02 ,  H01L23/31 ,  H01L23/498 ,  H01L25/065 ,  H01L25/10 ,  H05K1/18 ,  H01L25/03 ,  H01L21/56 ,  H01L23/00

CPC classification number: H05K1/11 ,  H01L21/56 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/3157 ,  H01L23/49811 ,  H01L23/528 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/10126 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/1191 ,  H01L2224/13017 ,  H01L2224/13022 ,  H01L2224/13076 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13101 ,  H01L2224/1403 ,  H01L2224/14051 ,  H01L2224/14135 ,  H01L2224/16105 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/1703 ,  H01L2224/17051 ,  H01L2224/32225 ,  H01L2224/45012 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45101 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45624 ,  H01L2224/45655 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15322 ,  H01L2924/181 ,  H01L2924/19107 ,  H05K1/0298 ,  H05K1/181 ,  H05K1/185 ,  H05K2201/10515 ,  H05K2201/10977 ,  Y02P70/611 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/014

Abstract: A structure may include bond elements having bases joined to conductive elements at a first portion of a first surface and end surfaces remote from the substrate. A dielectric encapsulation element may overlie and extend from the first portion and fill spaces between the bond elements to separate the bond elements from one another. The encapsulation element has a third surface facing away from the first surface. Unencapsulated portions of the bond elements are defined by at least portions of the end surfaces uncovered by the encapsulation element at the third surface. The encapsulation element at least partially defines a second portion of the first surface that is other than the first portion and has an area sized to accommodate an entire area of a microelectronic element. Some conductive elements are at the second portion and configured for connection with such microelectronic element.

公开(公告)号：US09583475B2

公开(公告)日：2017-02-28

申请号：US14883977

申请日：2015-10-15

Applicant: Invensas Corporation

Inventor： Terrence Caskey ,  Ilyas Mohammed

IPC: H01L25/11 ,  H01L23/522 ,  H01L25/00 ,  H01L25/065 ,  H01L25/10 ,  H01L23/13 ,  H01L23/538 ,  H01L23/31 ,  H01L23/00 ,  H01L23/498

CPC classification number: H01L25/18 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/76802 ,  H01L21/76877 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3185 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/29 ,  H01L24/32 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/96 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/117 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05548 ,  H01L2224/05554 ,  H01L2224/05571 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/06155 ,  H01L2224/12105 ,  H01L2224/13023 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/14131 ,  H01L2224/27334 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48108 ,  H01L2224/48145 ,  H01L2224/4824 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2224/73217 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/82031 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/83005 ,  H01L2224/83192 ,  H01L2224/852 ,  H01L2224/92144 ,  H01L2224/92147 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06548 ,  H01L2225/06562 ,  H01L2225/06596 ,  H01L2225/1035 ,  H01L2225/1052 ,  H01L2225/1076 ,  H01L2225/1082 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/18162 ,  H01L2924/186 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2224/05552

Abstract: A microelectronic package may include a first microelectronic unit including a semiconductor chip having first chip contacts, an encapsulant contacting an edge of the semiconductor chip, and first unit contacts exposed at a surface of the encapsulant and electrically connected with the first chip contacts. The package may include a second microelectronic unit including a semiconductor chip having second chip contacts at a surface thereof, and an encapsulant contacting an edge of the chip of the second unit and having a surface extending away from the edge. The surfaces of the chip and the encapsulant of the second unit define a face of the second unit. Package terminals at the face may be electrically connected with the first unit contacts through bond wires electrically connected with the first unit contacts, and the second chip contacts through metallized vias and traces formed in contact with the second chip contacts.

Abstract translation: 微电子封装可以包括第一微电子单元，其包括具有第一芯片触点的半导体芯片，与半导体芯片的边缘接触的密封剂以及暴露在密封剂的表面处并与第一芯片触点电连接的第一单元触点。 封装可以包括第二微电子单元，其包括在其表面具有第二芯片触点的半导体芯片，以及与第二单元的芯片的边缘接触并且具有远离边缘延伸的表面的密封剂。 芯片的表面和第二单元的密封剂的表面限定了第二单元的面。 表面处的封装端子可以通过与第一单元触点电连接的接合线与第一单元触点电连接，并且第二芯片通过金属化通孔和与第二芯片触点接触形成的迹线接触。

公开(公告)号：US09398700B2

公开(公告)日：2016-07-19

申请号：US13924002

申请日：2013-06-21

Applicant: Invensas Corporation

Inventor： Cyprian Emeka Uzoh ,  Belgacem Haba ,  Charles G. Woychik ,  Michael Newman ,  Terrence Caskey

IPC: H05K3/30 ,  H05K1/18 ,  H01L23/00 ,  H01L25/065 ,  H01L25/00 ,  H01L21/56

CPC classification number: H01L24/13 ,  H01L21/563 ,  H01L23/564 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/02372 ,  H01L2224/0345 ,  H01L2224/03462 ,  H01L2224/03464 ,  H01L2224/0347 ,  H01L2224/03912 ,  H01L2224/03914 ,  H01L2224/0401 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05557 ,  H01L2224/05568 ,  H01L2224/05571 ,  H01L2224/05609 ,  H01L2224/05611 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05657 ,  H01L2224/05664 ,  H01L2224/10145 ,  H01L2224/1146 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/1147 ,  H01L2224/11903 ,  H01L2224/13024 ,  H01L2224/13025 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13157 ,  H01L2224/13164 ,  H01L2224/1319 ,  H01L2224/14517 ,  H01L2224/1601 ,  H01L2224/16057 ,  H01L2224/16058 ,  H01L2224/16104 ,  H01L2224/16105 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16503 ,  H01L2224/17505 ,  H01L2224/17517 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81001 ,  H01L2224/81007 ,  H01L2224/811 ,  H01L2224/81139 ,  H01L2224/8192 ,  H01L2224/83104 ,  H01L2224/9201 ,  H01L2224/9212 ,  H01L2225/06513 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2924/00014 ,  H05K1/181 ,  H05K3/30 ,  Y10T29/4913 ,  H01L2924/00012 ,  H01L2924/01015 ,  H01L2924/01074 ,  H01L2224/05552

Abstract: Microelectronic assemblies and methods for making the same are disclosed herein. In one embodiment, a method of forming a microelectronic assembly comprises assembling first and second components to have first major surfaces of the first and second components facing one another and spaced apart from one another by a predetermined spacing, the first component having first and second oppositely-facing major surfaces, a first thickness extending in a first direction between the first and second major surfaces, and a plurality of first metal connection elements at the first major surface, the second component having a plurality of second metal connection elements at the first major surface of the second component; and plating a plurality of metal connector regions each connecting and extending continuously between a respective first connection element and a corresponding second connection element opposite the respective first connection element in the first direction.

Abstract translation: 本文公开了微电子组件及其制造方法。 在一个实施例中，形成微电子组件的方法包括组装第一和第二部件以使第一和第二部件的第一主表面彼此面对并且彼此隔开预定间隔，第一部件具有第一和第二相对 主表面，在第一和第二主表面之间沿第一方向延伸的第一厚度和在第一主表面处的多个第一金属连接元件，第二部件在第一主要部分具有多个第二金属连接元件 第二部件的表面; 以及电镀多个金属连接器区域，每个金属连接器区域在第一方向上在相应的第一连接元件和与相应的第一连接元件相对的相应的第二连接元件之间连续延伸。

公开(公告)号：US09355905B2

公开(公告)日：2016-05-31

申请号：US14722672

申请日：2015-05-27

Applicant: Invensas Corporation

Inventor： Cyprian Emeka Uzoh ,  Pezhman Monadgemi ,  Michael Newman ,  Charles G. Woychik ,  Terrence Caskey

IPC: H01L21/768 ,  H01L21/78 ,  H01L21/56 ,  H01L23/48 ,  H01L21/3105 ,  H01L21/683 ,  H01L23/00

CPC classification number: H01L21/76898 ,  H01L21/31053 ,  H01L21/561 ,  H01L21/6835 ,  H01L21/768 ,  H01L21/76841 ,  H01L21/76877 ,  H01L21/78 ,  H01L23/481 ,  H01L24/94 ,  H01L2221/68327 ,  H01L2221/68381 ,  H01L2924/0002 ,  H01L2924/12042 ,  H01L2924/00

Abstract: Methods of forming a microelectronic assembly and the resulting structures and devices are disclosed herein. In one embodiment, a method of forming a microelectronic assembly includes removing material exposed at portions of a surface of a substrate to form a processed substrate having a plurality of thinned portions separated by integral supporting portions of the processed substrate having a thickness greater than a thickness of the thinned portions, at least some of the thinned portions including a plurality of electrically conductive interconnects extending in a direction of the thicknesses of the thinned portions and exposed at the surface; and removing the supporting portions of the substrate to sever the substrate into a plurality of individual thinned portions, at least some individual thinned portions including the interconnects.

公开(公告)号：US09237648B2

公开(公告)日：2016-01-12

申请号：US13776035

申请日：2013-02-25

Applicant: Invensas Corporation

Inventor： Michael Newman ,  Cyprian Emeka Uzoh ,  Charles G. Woychik ,  Pezhman Monadgemi ,  Terrence Caskey

IPC: H05K7/10 ,  H05K7/12 ,  H05K1/11 ,  H05K3/40 ,  H01L23/14 ,  H01L23/498 ,  H01L21/48

CPC classification number: H01L21/486 ,  H01L23/147 ,  H01L23/49827 ,  H01L2224/13 ,  H01L2224/16225 ,  H05K1/111 ,  H05K3/0014 ,  H05K3/4038 ,  Y10T29/49117

Abstract: An interposer has conductive elements at a first side and terminals at a second side opposite therefrom, for connecting with a microelectronic element and a second component, respectively. The component includes a first element having a thermal expansion coefficient less than 10 ppm/° C., and an insulating second element, with a plurality of openings extending from the second side through the second element towards the first element. A conductive structure extending through the openings in the second element and through the first element electrically connects the terminals with the conductive elements.

Abstract translation: 插入件在第一侧具有导电元件，在与其相对的第二侧具有端子，用于分别与微电子元件和第二元件连接。 该组件包括具有小于10ppm /℃的热膨胀系数的第一元件和绝缘的第二元件，多个开口从第二侧延伸穿过第二元件朝向第一元件。 延伸穿过第二元件中的开口并通过第一元件的导电结构将端子与导电元件电连接。

公开(公告)号：US20150187673A1

公开(公告)日：2015-07-02

申请号：US14643264

申请日：2015-03-10

Applicant: Invensas Corporation

Inventor： Cyprian Emeka Uzoh ,  Charles G. Woychik ,  Terrence Caskey ,  Kishor V. Desai ,  Huailiang Wei ,  Craig Mitchell ,  Belgacem Haba

IPC: H01L23/34 ,  H01L21/768

CPC classification number: H01L23/34 ,  H01L21/76841 ,  H01L21/76883 ,  H01L21/76885 ,  H01L21/76898 ,  H01L23/147 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/05 ,  H01L24/10 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05558 ,  H01L2224/05567 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/1134 ,  H01L2224/1147 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13124 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13184 ,  H01L2224/13565 ,  H01L2224/32105 ,  H01L2924/00011 ,  H01L2924/01322 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2224/81805

Abstract: A microelectronic component with circuitry includes a substrate (possibly semiconductor) having an opening in a top surface. The circuitry includes a conductive via (possibly metal) in the opening. The opening has a first sidewall of a first material, and the conductive via has a second sidewall of a second material (possibly metal). At least at one side of the opening, the first and second sidewalls are spaced from each other at the top surface of the substrate but the first and second sidewalls meet below the top surface of the substrate at a meeting location. Between the meeting location and the top surface of the substrate, the first and second sidewalls are separated by a third material (possibly foam) which is a dielectric different from the first material. The third material lowers thermal stress in case of thermal expansion compared to a structure in which the third material were replaced with the second material.

Abstract translation: 具有电路的微电子部件包括在顶表面具有开口的衬底（可能的半导体）。 电路包括开口中的导电通孔（可能是金属）。 开口具有第一材料的第一侧壁，并且导电通孔具有第二材料（可能是金属）的第二侧壁。 至少在开口的一侧，第一和第二侧壁在基板的顶表面处彼此间隔开，但是第一和第二侧壁在会议位置处在基板的顶表面下面相交。 在会议位置和基板的顶表面之间，第一和第二侧壁由不同于第一材料的电介质的第三材料（可能是泡沫）隔开。 第三种材料与第三种材料被第二种材料替换的结构相比，在热膨胀的情况下降低了热应力。

公开(公告)号：US20150044820A1

公开(公告)日：2015-02-12

申请号：US14524280

申请日：2014-10-27

Applicant: Invensas Corporation

Inventor： Charles G. Woychik ,  Cyprian Emeka Uzoh ,  Michael Newman ,  Terrence Caskey

IPC: H01L21/48 ,  H01L23/31 ,  H01L23/00 ,  H01L21/56

CPC classification number: H01L27/14634 ,  H01L21/4846 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/56 ,  H01L21/561 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5384 ,  H01L24/11 ,  H01L24/16 ,  H01L24/17 ,  H01L24/80 ,  H01L24/81 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14636 ,  H01L27/1469 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2224/13 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/97 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/15788 ,  H01L2924/351 ,  H05K1/0298 ,  H01L2224/81 ,  H01L2924/00

Abstract: A microelectronic assembly including a dielectric region, a plurality of electrically conductive elements, an encapsulant, and a microelectronic element are provided. The encapsulant may have a coefficient of thermal expansion (CTE) no greater than twice a CTE associated with at least one of the dielectric region or the microelectronic element.

Abstract translation: 提供了包括电介质区域，多个导电元件，密封剂和微电子元件的微电子组件。 密封剂可以具有不大于与电介质区域或微电子元件中的至少一个相关联的CTE的两倍的热膨胀系数（CTE）。

公开(公告)号：US08884427B2

公开(公告)日：2014-11-11

申请号：US13828938

申请日：2013-03-14

Applicant: Invensas Corporation

Inventor： Charles G. Woychik ,  Cyprian Emeka Uzoh ,  Michael Newman ,  Terrence Caskey

IPC: H01L23/34 ,  H01L23/495 ,  H01L21/58 ,  H05K1/02

CPC classification number: H01L27/14634 ,  H01L21/4846 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/56 ,  H01L21/561 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5384 ,  H01L24/11 ,  H01L24/16 ,  H01L24/17 ,  H01L24/80 ,  H01L24/81 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14636 ,  H01L27/1469 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2224/13 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/97 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/15788 ,  H01L2924/351 ,  H05K1/0298 ,  H01L2224/81 ,  H01L2924/00

Abstract: A microelectronic assembly including a dielectric region, a plurality of electrically conductive elements, an encapsulant, and a microelectronic element are provided. The encapsulant may have a coefficient of thermal expansion (CTE) no greater than twice a CTE associated with at least one of the dielectric region or the microelectronic element.

Abstract translation: 提供了包括电介质区域，多个导电元件，密封剂和微电子元件的微电子组件。 密封剂可以具有不超过与电介质区域或微电子元件中的至少一个相关联的CTE的两倍的热膨胀系数（CTE）。

公开(公告)号：US20140212996A1

公开(公告)日：2014-07-31

申请号：US14243994

申请日：2014-04-03

Applicant: Invensas Corporation

Inventor： Terrence Caskey ,  Ilyas Mohammed

IPC: H01L25/11

CPC classification number: H01L25/18 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/76802 ,  H01L21/76877 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3185 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/29 ,  H01L24/32 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/96 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/117 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05548 ,  H01L2224/05554 ,  H01L2224/05571 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/06155 ,  H01L2224/12105 ,  H01L2224/13023 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/14131 ,  H01L2224/27334 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48108 ,  H01L2224/48145 ,  H01L2224/4824 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2224/73217 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/82031 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/83005 ,  H01L2224/83192 ,  H01L2224/852 ,  H01L2224/92144 ,  H01L2224/92147 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06548 ,  H01L2225/06562 ,  H01L2225/06596 ,  H01L2225/1035 ,  H01L2225/1052 ,  H01L2225/1076 ,  H01L2225/1082 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/18162 ,  H01L2924/186 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2224/05552

Abstract: A microelectronic package may include a first microelectronic unit including a semiconductor chip having first chip contacts, an encapsulant contacting an edge of the semiconductor chip, and first unit contacts exposed at a surface of the encapsulant and electrically connected with the first chip contacts. The package may include a second microelectronic unit including a semiconductor chip having second chip contacts at a surface thereof, and an encapsulant contacting an edge of the chip of the second unit and having a surface extending away from the edge. The surfaces of the chip and the encapsulant of the second unit define a face of the second unit. Package terminals at the face may be electrically connected with the first unit contacts through bond wires electrically connected with the first unit contacts, and the second chip contacts through metalized vias and traces formed in contact with the second chip contacts.

Abstract translation: 微电子封装可以包括第一微电子单元，其包括具有第一芯片触点的半导体芯片，与半导体芯片的边缘接触的密封剂以及暴露在密封剂的表面处并与第一芯片触点电连接的第一单元触点。 封装可以包括第二微电子单元，其包括在其表面具有第二芯片触点的半导体芯片，以及与第二单元的芯片的边缘接触并且具有远离边缘延伸的表面的密封剂。 芯片的表面和第二单元的密封剂的表面限定了第二单元的面。 表面处的封装端子可以通过与第一单元触点电连接的接合线与第一单元触点电连接，并且第二芯片通过金属化通孔和与第二芯片触点接触形成的迹线接触。