公开(公告)号：US20130328219A1

公开(公告)日：2013-12-12

申请号：US13966636

申请日：2013-08-14

申请人： Invensas Corporation

发明人： Ellis Chau ,  Reynaldo Co ,  Roseann Alatorre ,  Philip Damberg ,  Wei-Shun Wang ,  Se Young Yang

IPC分类号： H01L23/00

CPC分类号： H01L24/85 ,  H01L21/4853 ,  H01L21/56 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/3677 ,  H01L23/4334 ,  H01L23/49517 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/06 ,  H01L24/16 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/78 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/45565 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/48997 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/851 ,  H01L2224/8518 ,  H01L2224/85399 ,  H01L2224/85951 ,  H01L2224/85986 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06558 ,  H01L2225/06562 ,  H01L2225/06565 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1029 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2225/1094 ,  H01L2924/00011 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/12042 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/1715 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/3511 ,  H05K3/3436 ,  H05K2201/10515 ,  H05K2201/1053 ,  Y10T29/49149 ,  Y10T29/49151 ,  H01L2224/45664 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076

摘要： A structure includes a substrate having a first region and a second region, the substrate also having a first surface and a second surface. Electrically conductive elements are exposed at the first surface within the second region. Wire bonds have bases bonded to respective ones of the conductive elements and ends remote from the substrate and remote from the bases. At least one of the wire bonds has a shape such that the wire bond defines an axis between the free end and the base thereof and such that the wire bond defines a plane. A bent portion of the at least one wire bond extends away from the axis within the plane. A dielectric encapsulation layer covers portions of the wire bonds such that unencapsulated portions, including the ends, of the wire bonds are defined by portions of the wire bonds that are uncovered by the encapsulation layer.

摘要翻译： 一种结构包括具有第一区域和第二区域的衬底，该衬底还具有第一表面和第二表面。 导电元件在第二区域内的第一表面露出。 引线键具有粘合到导电元件中的相应导电元件的基底并且远离基底并远离基底的基底。 线接合中的至少一个具有这样的形状，使得线接合限定自由端和其基部之间的轴线，并且使得线接合限定平面。 所述至少一个导线接合部的弯曲部分远离所述平面内的轴线延伸。 电介质封装层覆盖引线接合的部分，使得引线键合的包括末端的未封装部分由未被封装层覆盖的引线键的部分限定。

公开(公告)号：US08524529B2

公开(公告)日：2013-09-03

申请号：US13170208

申请日：2011-06-28

申请人： Meiquan Huang ,  Hejin Liu ,  Hanmin Zhang

发明人： Meiquan Huang ,  Hejin Liu ,  Hanmin Zhang

IPC分类号： H01L21/00

CPC分类号： H01L24/49 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/05599 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48475 ,  H01L2224/48992 ,  H01L2224/48997 ,  H01L2224/4917 ,  H01L2224/85385 ,  H01L2224/85399 ,  H01L2224/85951 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2224/48455 ,  H01L2924/20753

摘要： An electrical connection includes a first wire having one end stitch bonded to a surface, such as the lead finger of a lead frame or the connection pad of a substrate. A second wire has a first end attached to the surface on a first side of the first wire and a second end attached to the surface on a second, opposing side of the first wire. The second wire acts as a brace that prevents the first wire from lifting off of the surface. If necessary, a third wire can be added that, like the second wire, acts as a brace to prevent the first wire from lifting off of the surface.

摘要翻译： 电连接包括具有结合到表面的一个端部针迹的第一线，例如引线框架的引线指或基底的连接垫。 第二线具有附接到第一线的第一侧上的表面的第一端和附接到第一线的第二相对侧上的表面的第二端。 第二线作为支架，防止第一线从表面脱落。 如果需要，可以添加第三线，其与第二线相似，用作支架以防止第一线从表面上脱离。

公开(公告)号：US08508034B2

公开(公告)日：2013-08-13

申请号：US13362644

申请日：2012-01-31

申请人： Todd O. Bolken ,  Cary J. Baerlocher ,  Steven W. Heppler ,  Chad A. Cobbley

发明人： Todd O. Bolken ,  Cary J. Baerlocher ,  Steven W. Heppler ,  Chad A. Cobbley

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： H01L23/28 ,  B33Y80/00 ,  H01L21/4803 ,  H01L21/481 ,  H01L21/50 ,  H01L23/055 ,  H01L23/10 ,  H01L23/48 ,  H01L23/49861 ,  H01L24/48 ,  H01L24/49 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/484 ,  H01L2224/48997 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/85399 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/00011 ,  H01L2224/45099 ,  H01L2924/00

摘要： Various embodiments for molding tools for moisture-resistant image sensor packaging structures and methods of assembly are disclosed. Image sensor packages of the present invention include an interposer, a housing structure formed on the interposer for surrounding an image sensor chip, and a transparent cover. The housing structure may cover substantially all of the interposer chip surface. In another embodiment, the housing structure also covers substantially all of the interposer edge surfaces. The housing structure may also cover substantially all of the interposer attachment surface. An image sensor chip is electrically connected to the interposer with sealed wire bond connections or with sealed flip-chip connections. The housing structure may include runners that enable simultaneous sealing of the interior of the image sensor package and of the transparent cover.

摘要翻译： 公开了用于防潮图像传感器封装结构和组装方法的模制工具的各种实施例。 本发明的图像传感器封装包括插入件，形成在用于包围图像传感器芯片的插入件上的外壳结构和透明盖。 壳体结构可以覆盖基本上所有的插入器芯片表面。 在另一个实施例中，壳体结构还覆盖基本上所有插入器边缘表面。 壳体结构还可以覆盖基本上所有的插入件附接表面。 图像传感器芯片通过密封的引线接合连接或密封的倒装芯片连接电连接到插入器。 壳体结构可以包括能够同时密封图像传感器封装和透明盖的内部的流道。

公开(公告)号：US20130200514A1

公开(公告)日：2013-08-08

申请号：US13614125

申请日：2012-09-13

申请人： Doojin Kim ,  Youngsik Kim ,  Kitaik OH ,  Sungbok Hong

发明人： Doojin Kim ,  Youngsik Kim ,  Kitaik OH ,  Sungbok Hong

IPC分类号： H01L23/498

CPC分类号： H01L24/85 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/78 ,  H01L25/0657 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/4809 ,  H01L2224/48145 ,  H01L2224/48147 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48616 ,  H01L2224/48624 ,  H01L2224/48992 ,  H01L2224/48997 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85181 ,  H01L2224/85365 ,  H01L2224/85416 ,  H01L2224/85951 ,  H01L2224/85986 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/48455

摘要： A semiconductor package comprises a board including a board pad, a plurality of semiconductor chips mounted on the board, the semiconductor chips including chip pads. Bumps are disposed on the chip pads, respectively, and a wire is disposed between the chip pads and the bumps. The wire electrically connects the chip pads of the plurality of semiconductor chips and the board pad to each other.

公开(公告)号：US08492786B2

公开(公告)日：2013-07-23

申请号：US13412024

申请日：2012-03-05

申请人： Sunghee Won ,  Youngsu Chun

发明人： Sunghee Won ,  Youngsu Chun

IPC分类号： H01L33/00 ,  H01L21/82

CPC分类号： H01L33/62 ,  F21K9/27 ,  F21Y2113/13 ,  F21Y2115/10 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0753 ,  H01L2224/05609 ,  H01L2224/05623 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05669 ,  H01L2224/05671 ,  H01L2224/05676 ,  H01L2224/05679 ,  H01L2224/0568 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/4848 ,  H01L2224/48499 ,  H01L2224/48997 ,  H01L2224/4911 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/48455

摘要： A light emitting device package is disclosed. The light emitting device package includes a light emitting device disposed on a first lead frame, the light emitting device having an electrode pad on an upper surface thereof, a first wire to electrically interconnect a second lead frame spaced apart from the first lead frame and the electrode pad, and a first bonding ball disposed on the second lead frame, the first bonding ball spaced apart from a first contact point, which is in contact with the first wire and the second lead frame, wherein the first bonding ball is disposed between the first wire and the second lead frame to electrically interconnect the first wire and the second lead frame.

摘要翻译： 公开了一种发光器件封装。 发光器件封装包括设置在第一引线框架上的发光器件，所述发光器件在其上表面上具有电极焊盘，第一引线将与第一引线框架间隔开的第二引线框架和 电极焊盘和设置在第二引线框架上的第一焊接球，第一焊接球与第一接触点与第一焊丝和第二引线框架接触的第一接触点间隔开，其中第一接合球设置在 第一引线和第二引线框架，以使第一引线和第二引线框架电互连。

公开(公告)号：US20130113055A1

公开(公告)日：2013-05-09

申请号：US13729311

申请日：2012-12-28

申请人： Dai Nippon Printing Co., Ltd.

发明人： Takamasa Takano

IPC分类号： H01L29/84 ,  H01L21/02

CPC分类号： H01L29/84 ,  B81B7/0025 ,  B81B7/0054 ,  B81B7/007 ,  B81B2201/0235 ,  B81B2207/096 ,  B81B2207/115 ,  G01P15/0802 ,  G01P15/123 ,  G01P2015/0842 ,  H01L21/02 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/48992 ,  H01L2224/48997 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/8592 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2224/45099

摘要： A method for manufacturing a sensor device is provided. The method prevents corrosion of metal electrodes of a sensor due to outside air with high humidity and preventing the occurrence of warpage of the sensor due to resin sealing of the sensor, thereby reducing the influence on sensor characteristics, and provides the sensor device. The method includes arranging a sensor on a substrate, the sensor having a fixed part, a movable part positioned inside the fixed part, a flexible part connecting the fixed part and the movable part, and a plurality of metal electrodes, electrically connecting the plurality of metal electrodes of the sensor and a plurality of terminals of the substrate with bonding wires, and covering portions of the plurality of metal electrodes of the sensor connected to the bonding wires with a resin so that a part of the bonding wires between the plurality of metal electrodes and the plurality of terminals is exposed.

摘要翻译： 提供一种用于制造传感器装置的方法。 该方法防止由于高湿度的外部空气导致的传感器的金属电极的腐蚀，并且防止由于传感器的树脂密封而导致传感器发生翘曲，从而减少对传感器特性的影响，并提供传感器装置。 该方法包括将传感器布置在基板上，传感器具有固定部分，位于固定部分内部的可移动部分，连接固定部分和可移动部分的柔性部分，以及多个金属电极，电连接多个 传感器的金属电极和具有接合线的基板的多个端子，并且用树脂覆盖连接到接合线的传感器的多个金属电极的部分，使得多个金属之间的接合线的一部分 电极和多个端子被暴露。

公开(公告)号：US20130093087A1

公开(公告)日：2013-04-18

申请号：US13404408

申请日：2012-02-24

申请人： Ellis Chau ,  Reynaldo Co ,  Roseann Alatorre ,  Philip Damberg ,  Wei-Shun Wang ,  Se Young Yang

发明人： Ellis Chau ,  Reynaldo Co ,  Roseann Alatorre ,  Philip Damberg ,  Wei-Shun Wang ,  Se Young Yang

IPC分类号： H01L23/498

CPC分类号： H01L24/85 ,  H01L21/4853 ,  H01L21/56 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/3677 ,  H01L23/4334 ,  H01L23/49517 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/06 ,  H01L24/16 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/78 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/45565 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/48997 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/851 ,  H01L2224/8518 ,  H01L2224/85399 ,  H01L2224/85951 ,  H01L2224/85986 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06558 ,  H01L2225/06562 ,  H01L2225/06565 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1029 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2225/1094 ,  H01L2924/00011 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/12042 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/1715 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/3511 ,  H05K3/3436 ,  H05K2201/10515 ,  H05K2201/1053 ,  Y10T29/49149 ,  Y10T29/49151 ,  H01L2224/45664 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076

摘要： A microelectronic package can include wire bonds having bases bonded to respective ones of conductive elements exposed at a surface of a substrate. The wire bonds may have exterior edge surfaces disposed at an angle between 25° and 90° relative to the bases, and ends remote, e.g., opposite, from the bases, and remote from the ends which are connected to the bases. A dielectric encapsulation layer extends from the substrate and covers portions of the wire bonds such that covered portions of the wire bonds are separated from one another by the encapsulation layer, wherein unencapsulated portions of the wire bonds are defined by portions of the wire bonds that are uncovered by the encapsulation layer, the unencapsulated portions including the ends of the wire bonds.

摘要翻译： 微电子封装可以包括引线键合，其具有接合到在衬底的表面处暴露的导电元件的相应导电元件的基底。 线接合可以具有相对于基部以25°和90°之间的角度设置的外部边缘表面，并且远离基部远离，例如相反，并且远离连接到基部的端部。 电介质封装层从衬底延伸并覆盖引线接合的部分，使得引线键合的被覆部分通过封装层彼此分开，其中引线键合的未封装部分由引线键的部分限定， 被封装层覆盖的未包封部分包括引线的端部。

公开(公告)号：US08242594B2

公开(公告)日：2012-08-14

申请号：US12542154

申请日：2009-08-17

申请人： Chung-Pan Wu

发明人： Chung-Pan Wu

IPC分类号： H01L23/34 ,  H01L23/48 ,  H01L21/44

CPC分类号： H01L24/48 ,  H01L24/45 ,  H01L24/85 ,  H01L2224/05644 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45572 ,  H01L2224/45573 ,  H01L2224/45644 ,  H01L2224/45647 ,  H01L2224/45655 ,  H01L2224/45664 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2224/48475 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48992 ,  H01L2224/48997 ,  H01L2224/85051 ,  H01L2224/85205 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85455 ,  H01L2224/8585 ,  H01L2224/8592 ,  H01L2924/00015 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012

摘要： A chip package structure includes a circuit substrate, a chip, at least one bonding wire, and an adhesive layer. The circuit substrate has a bonding surface and at least one pad disposed on the bonding surface. The chip is disposed on the bonding surface of the circuit substrate and has an active surface away from the circuit substrate and at least one contact pad disposed on the active surface. The bonding wire is connected between the contact pad and the pad, such that the chip is electrically connected to the circuit substrate through the bonding wire. The bonding wire includes a copper layer, a nickel layer covering the copper layer, and a gold layer covering the nickel layer. The adhesive layer is disposed between the pad and the bonding wire and between the contact pad and the bonding wire and respectively covers two terminals of the bonding wire.

摘要翻译： 芯片封装结构包括电路基板，芯片，至少一个接合线和粘合剂层。 电路基板具有接合表面和设置在接合表面上的至少一个焊盘。 芯片设置在电路基板的接合表面上，并且具有远离电路基板的有源表面和设置在有源表面上的至少一个接触焊盘。 接合线连接在接触焊盘和焊盘之间，使得芯片通过接合线电连接到电路基板。 接合线包括铜层，覆盖铜层的镍层和覆盖镍层的金层。 粘合层设置在焊盘和接合线之间以及接触焊盘和接合线之间，并分别覆盖接合线的两个端子。

公开(公告)号：US20110186340A1

公开(公告)日：2011-08-04

申请号：US12991843

申请日：2010-07-21

申请人： Masafumi Kuramoto ,  Satoru Ogawa ,  Miki Niwa ,  Katsuaki Suganuma ,  Keun-Soo Kim

发明人： Masafumi Kuramoto ,  Satoru Ogawa ,  Miki Niwa ,  Katsuaki Suganuma ,  Keun-Soo Kim

IPC分类号： H05K1/18 ,  H01B1/22

CPC分类号： H01B1/22 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48097 ,  H01L2224/48247 ,  H01L2224/48997 ,  H01L2224/73265 ,  H01L2224/83439 ,  H01L2224/8384 ,  H01L2224/85205 ,  H01L2224/85951 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01058 ,  H01L2924/01063 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2924/00012 ,  H01L2224/48455

摘要： The object of the present invention is to provide a method for producing a conductive material that has a low electric resistivity and that is obtained using an inexpensive and stable conductive material composition. A conductive material having a low electric resistivity can be obtained by a method including the step of heating a conductive material composition that contains at least one of a full-cured or semi-cured thermosetting resin and a thermoplastic resin, as well as silver particles. Such a conductive material is a conductive material that includes fused silver particles, and thermosetting resin fine particles that have an average particle diameter of 0.1 μm to 10 μm both inclusive and are dispersed in the fused silver particles. Further, in such a conductive material is a conductive material that includes fused silver particles, and a thermoplastic resin welded among the fused silver particles.

摘要翻译： 本发明的目的是提供一种具有低电阻率且使用廉价且稳定的导电材料组合物获得的导电材料的制造方法。 可以通过包括加热含有全固化或半固化的热固性树脂和热塑性树脂中的至少一种的导电材料组合物以及银颗粒的方法来获得具有低电阻率的导电材料。 这种导电材料是包含熔融银颗粒的导电材料和平均粒径为0.1μm至10μm的热固性树脂细颗粒，并且分散在熔融银颗粒中。 此外，这种导电材料是包含熔融银颗粒的导电材料和在熔融银颗粒之间焊接的热塑性树脂。

公开(公告)号：US07906858B2

公开(公告)日：2011-03-15

申请号：US11436794

申请日：2006-05-17

申请人： Ingolf Wildner

发明人： Ingolf Wildner

IPC分类号： H01L29/41

CPC分类号： H01L24/85 ,  B23K20/004 ,  B23K2101/36 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48455 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48997 ,  H01L2224/78301 ,  H01L2224/85181 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2224/85951 ,  H01L2224/85986 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01032 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01R43/0207 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49179 ,  Y10T29/532 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A method for establishing an electrical connection between a first contact surface and a second contact surface, with a wire-bonding tool being used to provide a contact wire between the contact surfaces by bonding the contact wire to the first contact surface and subsequently leading it to the second contact surface, bonding it to the latter, and subsequently, separating it using the wire-bonding tool. After the contact wire has been separated from the second contact surface, the wire-bonding tool is used to provide the contact point with an additional contact securing element via the contact wire.

摘要翻译： 一种用于在第一接触表面和第二接触表面之间建立电连接的方法，线接合工具用于通过将接触线接合到第一接触表面并随后将其引导到 第二接触表面，将其粘合到后者，随后使用引线键合工具将其分离。 在接触线已经从第二接触表面分离之后，引线接合工具用于通过接触线向接触点提供附加接触固定元件。